TW264498B

Polymeric compositions for medical packaging and devices.

Abstract

Multi-component polymer composition used to manufacture objects. In particular, a polymer composition containing a heat-resistant polymer; a radio frequency ("RF") sensitive polymer; a compatibilizing polymer; the composition has physical properties within the following range; a<40,000 psi; b >=70; c<30%; d>1.0; e<0.1%; f<0.1%; g>=0.05; h<=60%; i=0; where a is the basis The mechanical modulus of the composition measured by ASTM D-882; b is the percentage recovery of the length of the composition after the initial 20% deformation; c is the composition with a thickness of 9 mils, measured according to ASTM D-1003 The optical turbidity; d is the loss tangent of the composition measured at 1 Hz at the melt processing temperature; e is the elemental halogen content based on the weight of the composition; f is the low molecular weight water-soluble part content in the composition% ; G is the dielectric loss of the composition between 1 to 60MHz and 25 to 250°C; h is the potential of the sample measured at 121°C under a load of 27 psi for a 1-inch long composition; and, i represents the composition After straining to about 100% elongation (twice the thickness of the length) at a moderate rate of about 20 inches (50 minutes) per minute, it shows that there is no strain whitening phenomenon and record whether there is strain whitening (table 1) ) Or no strain whitening (shown as 0).

Term

No projected expiry on record.

  1. Priority
  2. Filed
  3. Granted
  4. Today

23 claims: 22 independent, 1 dependent

  1. 1
    A polymer-based composition used to make objects, comprising:high melting temperature and high flexibility poly-α-ene, the amount of which is 45-60% by weight of the composition;radio frequency ("RF" ) Sensitive polymer, the amount of which is 30-45% by weight of the composition, selected from ethylene copolymers with 50-85% ethylene content and comonomers selected from the following combinations: acrylic acid, methacrylic acid , Ester derivatives of acrylic acid and alcohols with 1-10 carbons, ester derivatives of methacrylic acid and alcohols with 1-10 carbons, vinyl acetate and vinyl alcohol;compatibilization polymerization of the balance of the compound It is a styrene/ethylene/butylene/styrene ("SEBS") block copolymer, and the composition has physical properties within the following range: a=70%;c1.0;e=0.05;h<=60%;i=0;where: a is measured according to ASTM D-882 The obtained composition has a mechanical modulus;b is the percentage recovery of the length of the composition after the initial 20% deformation;c is the composition with a thickness of 9 mils according to ASTM Optical turbidity measured by D-1003;d is the loss tangent value of the composition measured at 1 Hz at melt processing temperature;e is the elemental halogen content based on the weight of the composition;f is the low molecular weight water-soluble content of the composition Percentage content;g is the dielectric loss of the composition between 1 to 60MHz and 25 to 250°C;h is the creep change of the sample measured at 121°C under a load of 27 psi with a one-inch strip of composition;and i After the composition is strained to 100% elongation (twice the original length) at a moderate speed of 20 inches (50 cm) per minute, it shows no strain whitening. 一種用以製造成物件的以聚合物為基質之組合物,包含:高熔化溫度和高撓性聚α-烯,其量為該組合物的45-60%重量百分比;無線電頻率(“RF”)感受性聚合物,其量為組成物的30-45%重量百分比,選自具有50-85%乙烯含量與選自下列組合中的共單體之乙烯共聚物之中者:丙烯酸,甲基丙烯酸,丙烯酸與具1-10個碳的醇之酯衍生物,甲基丙烯酸與具1-10個碳的醇之酯衍生物,乙酸乙烯酯和乙烯醇;一組合物平衡量之相容化聚合物,其為苯乙烯/乙烯/丁烯/苯乙烯(“SEBS”)嵌段共聚物,及該組合物具有下列範圍內之物理性質:a=70%;c1.0;e=0.05;h<=60%;i=0;其中:a為根據ASTM D-882測得之組合物所具機械模數;b為在初始20%形變後,組合物長度的百分回復率;c為9密爾厚度的組合物根據ASTM D-1003測得之光學濁度;d為組合物在熔融加工溫度以1Hz測得之損失角正切值;e為以組合物重量計之元素態鹵素含量;f為組合物所含低分子量水溶物含量百分比;g為組合物在1至60MHz及25至250℃溫度間的介電損失;h為用一吋長的組合物條在27psi荷重下於121℃測得之樣品潛變;且i為組合物在20吋(50公分)每分的中等速度下應變到100%伸長率(原長度的兩倍)後,顯示出沒有應變加白現象。
  2. 2
    The composition described in item 1 of the scope of the patent application, wherein the poly alpha ene has a high melting temperature higher than 130° C. and is highly flexible, and its modulus is lower than 20,000 psi. 如申請專利範圍第1項所述之組合物,其中該聚α烯具有高於130℃的高熔化溫度且為高度撓性者,其模數低於20,000psi。
  3. 3
    The composition described in item 1 of the scope of the patent application, wherein the RF-sensitive polymer is selected from segments containing polyurethane, polyester, polyurea, polyimide, polyimide and polyamide, etc. Among the copolymer combinations. 如申請專利範圍第1項所述之組合物,其中該RF感受性聚合物係選自含有聚胺基甲酸酯,聚酯,聚脲,聚醯亞胺,聚碸和聚醯胺等節段的共聚物組合之中者。
  4. 4
    The composition described in item 1 of the scope of patent application, wherein the styrene-ethylene-butylene-styrene block copolymer is functionalized with maleic anhydride. 如申請專利範圍第1項所述之組合物,其中該苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物為經順丁烯二酸酐官能化過的。
  5. 5
    The composition described in item 1 of the scope of patent application, wherein the RF susceptible polymer is an ethylene/methyl acrylate copolymer with a methyl acrylate content in the range of 20-40%. 如申請專利範圍第1項所述之組合物,其中該RF感受性聚合物為具有丙烯酸甲酯含量在20-40%範圍內之乙烯/丙烯酸甲酯共聚物。
  6. 6
    A polymer-based composition used to make an object, comprising:a low modulus radio frequency ("RF") susceptible polymer, the modulus of which is less than 30,000 psi, and the amount is 30 of the composition -45% by weight, selected from ethylene copolymers with 50-85% ethylene content and comonomers selected from the following combinations: acrylic acid, methacrylic acid, acrylic acid and alcohols with 1-10 carbons Ester derivatives, ester derivatives of methacrylic acid and alcohols with 1-10 carbons and vinyl acetate alcohol;temperature-resistant polymer, the amount of which is 30-50% by weight of the composition, selected from the following combinations Among them: polyamide, polyimide, polyurethane, polypropylene, and polymethylpentene;a balanced amount of compatibilizing polymer, which is styrene/ethylene/butene/ Styrene ("SEBS") block copolymer;the composition has physical properties within the following range: a=70%;c1.0;e=0.05;h<=60%;i=0;where: a is the mechanical modulus of the composition measured according to ASTM D-882;b is the After the initial 20% deformation, the percentage recovery of the length of the composition;c is the composition of 9 mil thickness according to ASTM Optical turbidity measured by D-1003;d is the loss tangent value of the composition measured at 1 Hz at melt processing temperature;e is the elemental halogen content based on the weight of the composition;f is the low molecular weight water-soluble content of the composition Content percentage;g is the dielectric loss of the composition between 1 to 60MHz and 25 to 250°C;h is the sample creep measured at 121°C under a load of 27 psi with a one-inch strip of composition;and i After the composition is strained to 100% elongation (twice the original length) at a moderate speed of 20 inches (50 cm) per minute, it shows no strain whitening. 一種用以製成物件的以聚合物為基質之組合物,其包含:低模數無線電頻率(“RF”)感受性聚合物,其模數值低於30,000psi,其量為組合物的30-45%重量百分比,選自具有50-85%乙烯含量與選自下列組合中的共單體之乙烯共聚物之中者:丙烯酸,甲基丙烯酸,丙烯酸與具1-10個碳的醇之酯衍生物,甲基丙烯酸與具1-10個碳的醇之酯衍生物和乙酸乙烯酯醇;耐溫性聚合物,其量為組合物的30-50%重量百分比,選自下列所組合之中者:聚醯胺,聚醯亞胺,聚胺基甲酸酯,聚丙烯,和聚甲基戊烯;一平衡量之相容化聚合物,其為苯乙烯/乙烯/丁烯/苯乙烯(“SEBS”)嵌段共聚物;該組合物具有下列範圍內之物理性質:a=70%;c1.0;e=0.05;h<=60%;i=0;其中:a為根據ASTM D-882測得之組合物所具機械模數;b為在初始20%形變後,組合物長度的百分回復率;c為9密爾厚度的組合物根據ASTM D-1003測得之光學濁度;d為組合物在熔融加工溫度以1Hz測得之損失角正切值;e為以組合物重量計之元素態鹵素含量;f為組合物所含低分子量水溶物含量百分比;g為組合物在1至60MHz及25至250℃溫度間的介電損失;h為用一吋長的組合物條在27psi荷重下於121℃測得之樣品蠕變;且i為組合物在20吋(50公分)每分的中等速度下應變到100%伸長率(原長度的兩倍)後,顯示出沒有應變加白現象。
  7. 7
    The composition described in item 6 of the scope of the patent application, wherein the RF-sensitive polymer is selected from segments containing polyurethane, polyester, polyurea, polyimide, polyimide and polyamide, etc. Among the copolymer combinations. 如申請專利範圍第6項所述之組合物,其中該RF感受性聚合物係選自含有聚胺基甲酸酯,聚酯,聚脲,聚醯亞胺,聚碸和聚醯胺等節段的共聚物組合之中者。
  8. 8
    The composition described in item 6 of the scope of the patent application, wherein the RF susceptible polymer is an ethylene/methyl acrylate copolymer with a methyl acrylate content of 20-40%. 如申請專利範圍第6項所述之組合物,其中該RF感受性聚合物為具有丙烯酸甲酯含量在20-40%之間的乙烯/丙烯酸甲酯共聚物。
  9. 9
    The composition described in item 6 of the scope of patent application, wherein the heat-resistant polymer is polypropylene. 如申請專利範圍第6項所述之組合物,其中該耐熱性聚合物為聚丙烯。
  10. 10
    The composition according to item 6 of the scope of patent application, wherein the styrene-ethylene-butylene-styrene block copolymer is functionalized with maleic anhydride. 如申請專利範圍第6項所述之組合物,其中該苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物為經順丁烯二酸酐官能化過的。
  11. 11
    A polymer-based composition used to manufacture objects, which comprises:polypropylene-based polyolefin, the amount of which is 40-55% by weight of the composition;non-polypropylene-based polyolefin Olefin, whose amount is 25-40% by weight of the composition, is selected from the following combinations: polyethylene, polyethylene copolymer, polybutene-1, polybutene-1 copolymer;radio frequency ("RF") The susceptible polymer, the amount of which is 5-10% by weight of the composition, is selected from the group consisting of polyurethane, polyester, polyurea, polyimide, polyimide and polyamide Among the copolymer combinations of equal segments;a compatibilizing polymer with a balance of composition;which is a styrene/ethylene/butylene/styrene ("SEBS") block copolymer;and the composition has Physical properties within the following range: a=70%;c1.0;e=0.05 ;H<=60%;i=0;where: a is the mechanical modulus of the composition measured according to ASTM D-882;b is the percentage recovery rate of the length of the composition after the initial 20% deformation;c 9 mil thickness composition according to ASTM Optical turbidity measured by D-1003;d is the loss tangent value of the composition measured at 1 Hz at melt processing temperature;e is the elemental halogen content based on the weight of the composition;f is the low molecular weight water-soluble content of the composition Content percentage;g is the dielectric loss of the composition between 1 to 60MHz and 25 to 250°C;h is the sample creep measured at 121°C under a load of 27 psi with a one-inch strip of composition;and i After the composition is strained to 100% elongation (twice the original length) at a moderate speed of 20 inches (50 cm) per minute, it shows no strain whitening. 一種用以製造成物件的以聚合物為基質之組合物,其包含:以聚丙烯為基質之聚烯,其量為該組合物的40-55%重量百分比;非以聚丙烯為基質之聚烯烴,其量為組合物的25-40%重量百分比,係選自下列所成組合之中者:聚乙烯,聚乙烯共聚物,聚丁烯-1,聚丁烯-1共聚物;無線電頻率(“RF”)感受性聚合物,其量為組成物的5-10%重量百分比,係選自含有聚胺基甲酸酯,聚酯,聚脲,聚醯亞胺,聚碸和聚醯胺等節段的共聚物組合之中者;一組合物平衡量之相容化聚合物;其為苯乙烯/乙烯/丁烯/苯乙烯(“SEBS”)嵌段共聚物;及該組合物具有下列範圍內之物理性質:a=70%;c1.0;e=0.05;h<=60%;i=0;其中:a為根據ASTM D-882測得之組合物所具機械模數;b為在初始20%形變後,組合物長度的百分回復率;c為9密爾厚度的組合物根據ASTM D-1003測得之光學濁度;d為組合物在熔融加工溫度以1Hz測得之損失角正切值;e為以組合物重量計之元素態鹵素含量;f為組合物所含低分子量水溶物含量百分比;g為組合物在1至60MHz及25至250℃溫度間的介電損失;h為用一吋長的組合物條在27psi荷重下於121℃測得之樣品蠕變;且i為組合物在20吋(50公分)每分的中等速度下應變到100%伸長率(原長度的兩倍)後,顯示出沒有應變加白現象。
  12. 12
    The composition described in item 11 of the scope of patent application, wherein the non-polypropylene-based polyolefin is ultra-low density polyethylene. 如申請專利範圍第11項所述之組合物,其中該非以聚丙烯為基質之聚烯為超低密度聚乙烯。
  13. 13
    The composition described in item 11 of the scope of patent application, wherein the non-polypropylene-based polyene is polybutene-1. 如申請專利範圍第11項所述之組合物,其中該非以聚丙烯為基質之聚烯為聚丁烯-1。
  14. 14
    The composition described in item 11 of the scope of patent application, wherein the styrene-ethylene-butylene-styrene block copolymer is functionalized with maleic anhydride. 如申請專利範圍第11項所述之組合物,其中該苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物為經順丁烯二酸酐官能化過的。
  15. 16
    The composition described in item 11 of the scope of patent application, wherein the RF-sensitive polymer is selected from the following combinations:aliphatic polyamides obtained by condensation reaction of diamines having 2-13 carbon atoms Amines, aliphatic polyamides obtained by condensation reaction of diacids with 2-13 carbon atoms, polyamides obtained by condensation reaction of dimer fatty acids, and copolymers containing amides, etc. 如申請專利範圍第11項所述之組合物,其中該RF感受性聚合物係選自下列所成組合之中者:由具有2-13個碳原子的二胺經縮合反應所得之脂族聚醯胺,由具有2-13個碳原子的二酸經縮合反應所得之脂族聚醯胺,由二體物脂肪酸經縮合反應所得之聚醯胺,及含醯胺共聚物等。
  16. 17
    The composition described in item 11 of the scope of patent application, wherein the RF polymer is a dimer fatty acid polyamide. 如申請專利範圍第11項所述之組合物,其中該RF聚合物為二體物脂肪酸聚醯胺。
  17. 18
    A polymer-based composition used to make objects, which comprises:polypropylene polymer, the content of which is 40-55% of the weight of the composition;non-polypropylene-based polyolefin, the content of which is 25-40% by weight of the composition;dimer fatty acid polyamide, the content of which is 5-10% by weight of the composition;and a balance of styrene/ethylene/butene/styrene ("SEBS") Block copolymers. 一種用以製造成物件的以聚合物為基質之組合物,其包含:聚丙烯聚合物,其含量為該組合物重量的40-55%;非以聚丙烯為基質之聚烯烴,其含量為該組合物重量的25-40%;二體物脂肪酸聚醯胺,其含量為該組合物重量5-10%;及一平衡量之苯乙烯/乙烯/丁烯/苯乙烯(“SEBS”)嵌段共聚物。
  18. 19
    The composition described in item 18 of the scope of patent application, wherein the non-polypropylene-based polyolefin is polyethylene. 如申請專利範圍第18項所述之組合物,其中該非以聚丙烯為基質之聚烯為聚乙烯。
  19. 20
    The composition described in item 18 of the scope of patent application, wherein the non-polypropylene-based polyene is polybutene-1. 如申請專利範圍第18項所述之組合物,其中該非以聚丙烯為基質之聚烯為聚丁烯-1。
  20. 21
    The composition described in item 18 of the scope of patent application, wherein the SEBS block copolymer is functionalized with maleic anhydride. 如申請專利範圍第18項所述之組合物,其中該SEBS嵌段共聚物係經順丁烯二酸酐官能化過者。
  21. 22
    A polymer-based composition used to make an object, which comprises:syndiotactic polypropylene polymer, the content of which is 40-55% of the weight of the composition;non-polypropylene-based polyolefin, which The content is 25-40% of the weight of the composition;the content of dimer fatty acid polyamide is 5-10% of the weight of the composition;and the balance of the composition is styrene/ethylene/butene/benzene Ethylene ("SEBS") block copolymer. 一種用以製造成物件的以聚合物為基質之組合物,其包含:間規聚丙烯聚合物,其含量為該組合物重量的40-55%;非以聚丙烯為基質之聚烯,其含量為該組合物重量的25-40%;二體物脂肪酸聚醯胺,其含量為該組合物重量的5-10%;及,一組合物平衡量之苯乙烯/乙烯/丁烯/苯乙烯(“SEBS”)嵌段共聚物。
  22. 23
    A polymer-based composition for manufacturing an object, comprising:a flexible thermal deformation-resistant polyene having a melting point higher than 130°C and a modulus lower than 20,000 psi;the content of the polyene It is 45-60% of the weight of the composition;the ethylene/methyl acrylate copolymer has a methyl acrylate content of 20-40%;the content of the ethylene/methyl acrylate copolymer is 30-45% of the weight of the composition ;And, a styrene/ethylene/butylene/styrene block copolymer of the balance of the composition. 一種用以製造成物件的以聚合物為基質之組合物,其包含:撓性抗熱變形聚烯,其具有高於130℃的熔點及低於20,000psi的模數;該聚烯的含量為該組合物重量的45-60%;乙烯/丙烯酸甲酯共聚物,其丙烯酸甲酯含量為20-40%;該乙烯/丙烯酸甲酯共聚物的含量為該組合物重量的30-45%;及,一組合物平衡量之苯乙烯/乙烯/丁烯/苯乙烯嵌段共聚物。
Independent claims22