Method of forming ordered patterns of nanoscale objects

The present invention relates to a nanoscale structure manufactured by controlling the number, size, shape, direction, pattern, etc. of nanoscale objects, and a method for manufacturing the same.

One of the enthusiastic efforts of circuit designers of silicon integrated circuits is to reduce the size of chip space required for circuit components. By reducing the chip space used, the amount of power required to operate the chip is reduced, the temperature of the circuit is lowered, and the circuit can operate at a higher speed. Nanometer scale (1 x 10)^-9Meters), that is, several solutions for making nanoscale silicon integrated circuits have been proposed, but each has its limitations.

Numerous studies have been enthusiastically conducted on nanoscale objects, and many attempts have been made to control and form nanoscale objects. Proposed solutions include using anodized aluminum templates, patterning layers filled with directional block copolymers, self-assembled diblock copolymers, and nanoscale objects. However, these methods have major restrictions.

Nanoscale objects have been made using anodized aluminum templates. In this step, the aluminum layer is anodized to create an opening that penetrates the layer. The openings in the anodized aluminum are for providing a plurality of grid-like holes. These holes penetrate the aluminum template and penetrate to the underlying substrate. However, the anodizing of aluminum creates an unpredictable pattern of openings in the aluminum layer, so there is little control over where the openings and corresponding holes are provided. That is, the size, shape or arrangement of the openings is largely uncontrolled.

Another technique for making nanoscale objects utilizes diblock copolymers. When using diblock copolymers, the order of the pattern of openings is naturally controlled. However, this approach cannot provide regular patterns or spatially symmetric openings. It is difficult to incorporate into industrial structures that require a higher degree of order due to the inability to correlate distances and orientations and the random placement of nanoscale objects. Similar problems arise when using self-assembling copolymers. Templates made to use diblock copolymers or self-assembled copolymers cannot provide regular patterns or spatially symmetric opening arrangements.

Another method is the microsphere method, in which the surface of the substrate is occupied by nanoscale objects. When packed at high density, these objects abut against each other, creating a space for the objects to enter where they abut. The shape and size of the opening is determined by the space created in the gaps where these objects come into contact. Therefore, the range such as the shape of the generated opening is limited, and the orientation of the pattern cannot be controlled.

There is no available method for producing nanoscale structures that can control the number, size, shape, pattern, orientation and position of nanoscale objects (or structures) on the substrate. Therefore, there is a need for methods and systems for producing nanoscale structures with controlled numbers, sizes, shapes, patterns, orientations and positions on the substrate. If this is done, nanoscale structures, devices and circuits can be manufactured and chip space can be reduced. As described below, embodiments of the present invention achieve this in a unique and sophisticated manner.

<p> An object of the present invention is to provide a nanoscale structure manufactured by controlling the number, size, shape, orientation, pattern and position of nanoscale objects on a substrate, and a method for manufacturing the same.</p>

<p> In the structure according to one embodiment of the present invention and the method for producing the structure, the substrate has a template provided with a pattern having nanoscale features, and the template forms an opening. A template layer is provided, and a nanoscale object is controlled by the opening to form an assembly.</p>

For example, one embodiment of the present invention is directed to a nanoscale structure made using a method that allows control of the number, size, shape, orientation, pattern and position of nanoscale objects. Templates that help determine the position and orientation of nanoscale objects can be used to bring the desired nanoscale objects closer to the substrate surface. Objects can be placed in desired locations periodically, aperiodically, or in a predetermined pattern in a controllable manner. These structures can be used to make circuit components or other structures to manufacture devices or electronic circuits on a substrate. However, those skilled in the art will appreciate that nanoscale features can be implemented in various forms in useful applications without departing from the scope of the invention.

In one embodiment, a method of forming a structure using a template forming a pattern having nanoscale features on or around a substrate is disclosed. A resist layer with openings is formed in the template, which helps bring the nanoscale objects closer to the substrate surface around the template and is configured to control and assemble the nanoscale objects. As a result, the structure will have a predetermined number, size, shape, orientation, pattern and / or position of nanoscale features.

With reference to FIG. 1, the structure 100 to which the nanoscale object 120 is attached to the substrate 110 is shown. The number, size, shape, pattern, orientation and position of the nanoscale objects 120 on the substrate 110 can be controlled using a template (shown below) with openings corresponding to the nanoscale objects.

One way to create a template is to use a patterned mold. One way to make that mold is to use an electron beam or other device or process to add or remove material from the wafer, leaving the mold with predictable nanoscale features that correspond to a given pattern. It is a thing.

The pattern made in the mold is used, for example, to punch a template onto the surface of a wafer structure. The wafer structure may include a layer of resist on the substrate, or other material that accommodates the template pattern. After that, the mold is taken out and the template pattern is left in the resist layer on or above the substrate. The resist material that deviates from the desired template pattern and remains on the substrate can be removed by chemical cleaning or other steps. The resist layer on which the pattern is formed thus forms a template with a nanoscale pattern by mold. The template has an opening or other structure that houses the nanoscale object and is used as a guide for depositing the object in the opening and orienting the object around or in close proximity to the substrate surface. .. The template can be configured so that the nanoscale object grows through the opening. The nanoscale object can be placed on the substrate in the location and orientation determined by the template design. As a result, nanoscale patterns can be produced with predetermined position, orientation and aperiodic and periodic patterns. Once the nanoscale object is housed within the opening of the template, the template can be removed. Templates can be configured to be removed from the substrate without removing nanoscale objects. Alternatively, the template can be fastened onto the board.

FIGS. 2 to 12 show an example of how to prepare a mold, a template corresponding to the mold, and a resulting structure according to the present invention. The illustrated examples show a simplified embodiment of the invention, both in terms of method and structure. Other embodiments are also conceivable within the scope specified by the appended claims.

Reference to FIG. 2 shows a wafer 200 used to make a patterned mold with nanoscale features. In one embodiment, a mold having a pattern formed by using electron beam lithography, in which a mold is scraped from a suitable resist layer 230 with an electron beam 220, is formed on the wafer 200. The mold is made using a resist layer. Space 210 represents the first opening area of the mold pattern. The pattern formed into the mold by the electron beam is a pattern in which the shape of the opening and the structure has nanoscale features. In one embodiment, the type pattern is a regular pattern of nanoscale features. Molds can also be made by alternative means such as focused ion beam (FIB) or extreme ultraviolet (EUV) techniques.

According to one embodiment of the invention, the mold is used to make a "template" from a resist material that covers the entire surface of the substrate or a portion thereof. The mold is embossed into a resist material at high temperature and pressure using a process known in the art, such as "thermal imprint lithography". Then, when the mold is taken out and cooled, the resist material solidifies. In yet another embodiment, a process known in the art as a "step and flash" lithography method embosses the mold into a resist and UV curing solidifies the resist.

The mold can be made into a shape that is complementary to the desired template pattern. In one embodiment, the mold can be made, for example, by engraving the wafer in an inverted or complementary pattern. The desired template pattern has nanoscale features made within the template layer on the surface of the substrate. As the material of the wafer, any suitable material having sufficient rigidity for punching a pattern can be used as the material of the template. For example, the mold can be made of metal, silicon, silicon dioxide, plastic, glass or quartz, and the template can be made of a more malleable material commonly used as a photoresist on the substrate. .. Examples would be polymethylmethacrylate (PMMA) and resin-based resists formed by Clariant's AZ Electronic Materials and Shipley Novlak .

A number of "imprinting" methods can be used and the invention is not limited to any particular method. In one embodiment, the thermal imprint press-fits the mold into the "resist" layer at high temperature and high pressure. In the case of this application form, the resist does not have to be photosensitive, and a resist layer made of PMMA or the like may be used. Another technique, "step and flash" lithography, requires a photosensitive resist layer. In this technique, a transparent mold (eg quartz) is press-fitted into the resist layer while illuminating the light at a suitable wavelength and intensity through the mold. As with conventional photolithography, the exposed resist is crosslinked and insoluble in the developer chemicals. The advantage of the step-and-flash (SFIL) approach is that the imprint pressure is reduced and the temperature is significantly reduced, which allows the imprinting process to be repeated and the structures to be stacked vertically. .. The resist for step-and-flash is usually a low viscosity, photopolymerizable oregano silicone solution. Molecular Imprints sells a resist called MonoMat that works well in most applications.

Referring here to FIG. 3A, a completed mold 300 is shown with open spaces 210, 310, 320 and 330 representing areas of the pattern. In-mold teeth, such as tooth 340, can be used to emboss the indentations of the pattern to form a template. FIG. 3B shows a plan view of the mold 300, with tooth 340 shown as one of the nine teeth of the mold 300.

With reference to FIG. 4, the mold 300 is shown at a position where the pattern is punched out on the upper surface 430 of the resist layer 410 of the wafer structure 400. In the wafer structure 400, the resist layer 410 is formed on the substrate 420. During operation, the mold is press-fitted into the resist layer 410 to form a template. This operation is repeated, and many templates can be created.

Referring to FIG. 5, here, the resist layer 410 of FIG. 4 is shown, which is press-fitted into the template 500 and is interposed between the mold 300 and the substrate 420. Mold teeth 340, 520 and 530 are shown, but hidden in template 500 and shown by dashed lines. The resist layer 410 (shown in FIG. 4) is embossed in the area corresponding to the tooth location of the mold 300 in FIG.

With reference to FIG. 6, the mold 300 taken from the template / board structure 600 is shown. The template / board structure 600 is composed of a template 500 on the board 420. Template 500 contains a nanoscale pattern embossed by mold 300 on resist layer 410 (shown in FIG. 4). Vacancy 610, 620 and 630 are hidden in the template and are indicated by dashed lines. Voids are formed by teeth 340, 520 and 530 (shown in Figure 5). Six other voids are formed within the resist layer 410, but are not shown in this figure.

With reference to FIG. 7, a perspective view of the template / substrate structure 600 is shown, and all nine openings can be seen. You can also see the resist material 710 left in the template opening. The resist material left on the substrate 420 is out of the desired template shape and is removed from the template 500 and the substrate 420 by chemical cleaning 720. In another embodiment, the remaining resist material can be removed by other alternative means, such as short exposure to oxygen plasma.

Referring to FIG. 8, a template / substrate combination 800 composed of a template 500 mounted on a substrate 420 is shown after the remaining resist has been removed from the template opening. Template 500 provides a nanoscale pattern on substrate 420. In one embodiment, the template is used to create a regular pattern with nanoscale features on the substrate. In one embodiment, the nanoscale pattern of the openings is formed by evenly spaced openings, such as the opening 810. In other embodiments, the pattern can be formed into any desired structure, including periodic patterns, aperiodic patterns or other patterns. For example, the size of the template opening is typically 20 x 20 x 20 nanometers in volume, but can generally be 1-100 nanometers.

Referring to FIG. 9, a nanoscale object is introduced into template 500. As shown in the figure, template 500 is configured to accept nanoscale objects at the openings. Some nanoscale objects will enter the opening in Template 500. For example, a nanoscale object 910 enters the template opening 930. Other nanoscale objects, such as the nanoscale object 920, may remain on the outer surface of the template. In this embodiment, at least one of the nanoscale objects stays outside the opening. The nanoscale object will continue to be fed until all or nearly all openings in the template accept one nanoscale object. The nanoscale objects that remain outside the openings on the surface of the template 500 are then removed with a brush or by other suitable means such as chemical cleaning. In one embodiment, the nanoscale object is fed around the template so that it is in contact with or close to the substrate surface.

In the embodiment shown in FIG. 9, template 500 is used to incorporate individual nanoscale objects. These nanoscale objects may include, for example, nanowires, nanoparticles, nanorods, nanotubes, fullerenes, viral microparticles, polynucleic acids, polypeptides, proteins, DNA or liquids. As the liquid, a solvent or a mixture of all of the above can be used. For example, dispensing of nano-objects can be done in solution rather than in gas or vacuum. Also, the small (nano-sized) droplet itself can be a nano-object placed in the hole. Examples include other objects in liquid or liquid, such as water, liquid metal, and solution or suspension of molecules on a non-wet surface. In yet another embodiment, other materials can be deposited within the template created by imprint lithography. For example, in one embodiment, a thin film can be deposited in the template opening. The thin film can be configured to fuse when heated, thereby forming nanoparticles with a diameter significantly smaller than the size of the template opening. In another embodiment, the nanoscale object deposited in the template opening can be composed of a molecular membrane. The use of nanopatterned molecular membranes here includes the use of any of the molecular membranes that are adhered on a nanoscale. In yet another embodiment, an electroplated thin film can be used as the nanoscale object to deposit in the template opening. In yet another embodiment, the nanoscale object can consist of layers of organic or inorganic chemicals, including elements, mixtures, compounds or other substances. In another embodiment, the nanoscale object can be a molecule attached to a target molecule.

In the embodiment of FIG. 9, the opening of the opening 930 is cubic. However, in other embodiments, the template openings can be formed in a variety of shapes, including elongated, equiaxed, rectangular, cylindrical or other shaped openings. The size and shape of each template opening can be predetermined to be different from other template openings. The size and shape of each template opening can be selected depending on how the opening appears on the template surface and how the opening penetrates the resist layer to reach the substrate. The size and shape of the template openings can also be selected to accommodate nanoscale objects of a particular size and / or shape, or to accommodate multiple nanoscale objects. The size and shape of the template opening can also be selected to exclude nanoscale objects in a particular size range, for example, to allow small particles to enter but prevent large particles from entering.

The size, shape, and position of the template openings are further roughly aligned in a predetermined orientation, or roughly arranged in a square or any other predetermined arrangement to accommodate a predetermined number of nanoscale objects. Can be selected as. In yet another embodiment, the size and shape of the opening can be selected to accommodate the nanoscale object in a predetermined range of orientations. For example, a square template opening chosen so that the side length is about twice the diameter of the nanoparticles can be used to accommodate four nanoparticles in a square array. It is difficult to achieve an array of squares by other means, as objects of similar size will usually naturally line up on the coordinates arranged in a triangle. The size and shape of the openings can also be chosen to have a large number of steps, with different sized openings in different steps. Examples of them are shown below. The size and shape of the openings can be chosen to accommodate nanoscale objects in the various steps and / or layers within one opening.

In the embodiments shown in FIGS. 8 and 9, nine openings are shown within the template 500. However, the number of openings in the template is a design parameter and can be changed. In addition, the shape and position of each opening in the template is also a design parameter and can be changed individually.

In other embodiments, the size and shape of the template openings can be selected to accommodate multiple nanoscale objects, or a minimum or greater number of nanoscale objects. Nanoscale objects are placed on the template using well-known methods, including Langmuir-Brojet, self-assembling, vapor deposition, electroplating, electroless plating, dipping, spraying, physical or chemical bonding. be able to.

As can be seen in FIG. 10, once the opening 930 of the template 500 is filled with the object 910, the objects remaining on the surface of the template 500 are either chemically cleaned, scrubbed, or brushed. It can be removed by a process similar to. The brush 950 can be outside the template opening to remove the object from the surface and help the object enter the template 500 opening.

FIG. 11 shows the template 500 and the substrate 420 in which the opening 930 of the template 500 is once filled with the object 910 and the objects outside the opening are removed. Although it is shown that all openings are filled, in reality, not all openings are filled. The accuracy satisfied will depend on the actual form. In this embodiment, the nanoscale object naturally adheres to the substrate. In other embodiments, the adhesion of nanoscale objects to the substrate can be enhanced by using chemical bonds, adhesives or heat treatments.

Referring to FIG. 12, once the nanoscale object has entered the opening of the template 500, the template 500 can be removed, for example by chemical cleaning. Nanoscale objects such as the nanoscale object 910 remain on substrate 420 in the location and orientation determined by the template design. The nanoscale object remains in place due to the interaction between the nanoscale object and the substrate 420 and / or resist.

With reference to FIG. 13, a process according to an embodiment of the present invention is shown in FIG. 1000. This process provides a way to use templates to create regular patterns of nanoscale features on a substrate. Although this step is described in the sequence of steps shown in FIG. 13, embodiments of the present invention are not necessarily limited to this sequence. In step 1010, which is the start of the process, a layer of resist material is adhered to the surface of the substrate. A template is produced on the substrate using the resist layer. The resist layer can be any resist material suitable for use in imprint lithography. The example previously described in FIG. 4 provides a wafer structure 400 that includes a resist layer 410 on a substrate 420. Embodiments of the present invention are not limited to using a resist material for the template, but may be any material that can be configured to accommodate nanoscale objects.

The mold (eg, mold 300) is then embossed onto the resist layer in step 1020. As previously described in connection with FIG. 2, the wafer 200 is used in making a patterned mold with nanoscale features. A pattern of nanoscale features is formed in the mold. This pattern will be transferred to the resist layer. Embossing can be performed by a variety of methods, such as step-and-flash lithography.

The pattern of nanoscale features can be predetermined and can have many different shapes. In one embodiment, the pattern comprises at least one periodic pattern or at least one aperiodic pattern. In yet another embodiment, the pattern can be symmetrical or asymmetric, and can be a combination of various patterns.

Next, in step 1030, the imprint mold is released. FIG. 7 described above shows the template after the imprint mold is released. The illustrated template also shows the residual resist material left over in the early steps of the process.

In step 1040, the remaining resist material is selectively removed from the template opening, exposing the substrate. As a result, a template is formed with an opening and a template surface formed within the imprint resist layer. The openings have a nanoscale size and at least one of size, shape, orientation, pattern and position is arranged in a regular pattern. As shown in FIG. 8, template 500 exposes a selected portion of the surface of substrate 420. Only the rest of the resist layer is selectively removed from the substrate surface. In one embodiment, the openings are arranged in a regular pattern at least one of size, shape, orientation, path and position, but may also have a plurality of predetermined sizes or a plurality of predetermined shapes. it can. The openings may also be arranged in one or more predetermined orientations.

In step 1050, a group of nanoscale objects are fed to the template surface through the openings so that they are in close proximity and / or contact with the substrate surface. As described earlier, FIG. 9 shows the nanoscale objects supplied to the template 500. In one embodiment, the nanoscale object is fed around the template so that it is in contact with or close to the substrate surface. Some of the nanoscale objects will enter the openings in Template 500 and will be in close proximity to or in contact with the exposed substrate surface.

Once the object is deposited, linear growth of the nanoscale object begins on the substrate surface. The template opening serves as a guide for this growth. Nanoscale objects can be used to attach the molecules. In one embodiment, the nanoscale object is composed of layers of DNA, polynucleic acids, polypeptides, or chemicals. Layers of DNA, polynucleic acids, polypeptides, or chemicals can also be used for chemical sensing or as scaffolding materials to construct complex biomolecular structures. In one embodiment, a second group of nanoscale objects is deposited on the surface of the template. The first group of nanoscale objects can also have a different size than the second group of nanoscale objects. In one embodiment, the second group of nanoscale objects is fed around the template so as to contact or approach the first group of nanoscale objects.

The product produced as a result of step 1000 can be used as shown in FIG. 11 or the template can be removed from the substrate surface as shown in FIG. This process provides a method of creating nanoscale objects on a substrate in a regular pattern using templates. This method can also be applied to those described above. Using the structure produced as a result of step 1000, nanoscale circuit components can be manufactured as described below.

In the above embodiment, the nanoscale object (or structure) in FIG. 12 is a simple object. However, in other embodiments, the nanoscale objects produced can be made more complex. Therefore, according to the present invention, nanoscale circuit materials and components such as resistors, transistors, capacitors and other components can be formed and their number, size, shape, pattern, orientation and position are controlled. Can be done.

In one embodiment, one structure can be formed using nanoscale objects to provide a simple electrical connection to the substrate. In yet another embodiment, it is possible to form a structure that realizes an electrical function rather than a simple electrical connection. Examples include rectification, Coulomb interruption, switching, amplification, memory and impedance. It is possible to realize the electrical function of a nanoscale object in cooperation with any element to which the nanoscale object is connected or placed in close proximity.

An example of a nanoscale object made with a template is a nanoscale wire. Templates can be used to grow nanoscale wires from the surface of silicon in place. In this process, the seed material is supplied through the template to the silicon surface so that the seed material is exposed from the substrate surface. The catalyst is then used in a vacuum process to initiate the growth of the wire. In this process, the wire grows outward from the surface of the silicon substrate or approximately perpendicular to the surface of the substrate. During wire processing, dopants can be used to form p-type and n-type doped wires.

In yet another embodiment, the nanoscale objects produced by the template can be nanotubes. The seed material for growing the nanotubes can be planted on the substrate by placing the seed material in the opening of the template. The template can then be removed and the seed material of the tube to be grown can be left in place on the substrate. Since nanotubes have high conductivity, such structures can be effectively used as components of nanocircuits. When using the template, the nanotubes can be placed in place on the surface so that the growth of the nanotubes can be controlled locally.

Numerous templates can be made for various applications to nanoscale components. For example, templates with nanoscale openings can be made symmetrical, asymmetric, periodic, aperiodic or some other predetermined pattern. The nanoscale openings can also be modified. For example, the nanoscale openings in a template can have one or more predetermined sizes or shapes and can be arranged in one or more predetermined orientations. Referring to FIG. 14, an example 1400 of a template in which nanoscale openings have various sizes and patterns is shown. The object on the left side of FIG. 14 is not regular and has various shapes, sizes, orientations, spacings and arrangements that can be formed by the present invention. Formed by the present invention on the right side of template 1400, such as two vernier-like structures set in orthogonal orientation, and an array of two non-orthogonal circles (linear). There is a regular structure that can be done.

Figures 15-20 show the process of combining nanoscale features of various sizes on a single template. FIG. 15 shows a template with a periodic pattern formed by two different sized openings. Structure 1500 includes template 1510 on substrate 1520. Template 1510 provides a periodic pattern with openings of two different sizes. Larger openings, such as opening 1530, provide a large rectangular space within template 1510. A smaller opening, such as opening 1540, provides a small rectangular space within template 1510.

Referring to FIG. 16, a pair of nanoscale objects, each sized corresponding to the larger opening, contacts or approaches the substrate surface 1545 through the larger opening, such as the opening 1530. Supplied in template 1510. Some of the nanoscale objects will enter the openings in template 1510 on the substrate surface 1545. For example, one object 1550 is shown within the opening 1530, which is the larger opening. Other objects, such as object 1560, may remain on the template surface 1515. Continue feeding the object until all or nearly all of the larger openings in template 1510 are filled. Large objects, such as object 1560, that remain on template surface 1515 can then be removed from template surface 1515 with a brush 1570, as shown in FIG. The act of brushing also helps objects on the template surface 1515 to enter the open opening.

Referring to FIG. 18, a smaller group of nanoscale objects is fed to template 1510 so as to contact substrate surface 1545 through a smaller opening, such as opening 1540. Some of the nanoscale objects will enter the smaller opening of template 1510 on the substrate surface 1545. For example, one object 1590 is shown in the opening 1540, which is the smaller opening. Other objects, such as object 1580, may stay on the template surface 1515. The object can continue to be fed until all the smaller openings in template 1510 are filled. Small objects, such as object 1580, that remain on template surface 1515 can then be removed from template surface 1515 with a brush 1570, as shown in FIG. Like large objects, the brushing process may help small objects enter the smaller opening of template 1510. Referring to FIG. 20, template 1510 is shown in which all small openings, such as opening 1540, and the larger opening, such as opening 1530, are filled with objects. Template 1510 can then be removed (not shown). Alternatively, template 1510 can be left in place, as shown in Figure 20.

With reference to FIG. 21, a template for creating the structure shown in FIG. 1 is shown. Template 1600 is placed on board 110. Template 1600 contains openings that accommodate six nanoscale objects 120 in a generally straight line. In one embodiment, the structure can be used as a connecting link.

As yet another embodiment, FIG. 22 shows template 2000 and substrate 2010. Template 2000 contains three openings 2020, 2030 and 2040. Each opening can accommodate 10 nanoscale objects in three generally straight and generally parallel lines. Ten nanoscale objects 2050 are shown within opening 2020. FIG. 23 shows a properly placed object 2050, with template 2000 removed from substrate 2010 (shown in FIG. 22). The nanoscale object remains on substrate 2010 (shown in Figure 23). The nanoscale objects of the structure shown in FIG. 23 can be used as connections or wires, or can be crossed with other structures to form a grid.

Seeing Figure 24, another template 2100 is shown. Template 2100 includes three openings 2120, 2130 and 2140. The opening 2120 can accommodate 10 nanoscale objects in a generally straight line. The openings 2130 and 2140 can accommodate four nanoscale objects of large size relative to two generally straight lines. Assuming nanoscale objects of various sizes, such structures can be manufactured in the same manner as the structures shown in FIGS. 15-20.

In another embodiment, a template with nanoscale features is used to align the two structures. FIG. 25 is a side view of the two templates 2160 and 2170. These templates are equal in size and shape. Templates 2160 and 2170 both have openings 2165 and 2175, respectively. The nanoscale openings 2165 and 2175 are of equal size and are relatively co-located on templates 2160 and 2170. In other embodiments, the nanoscale openings have different sizes. Nanoscale openings 2165 and 2175 facing each other are shown. A nanoscale object 2180 is placed within the nanoscale opening 2165 of template 2160. The nanoscale object 2180 will act as a ball bearing, facilitating the alignment of the two templates 2160 and 2170.

FIG. 26 shows a template 2170 placed on top of a template 2160 with two nanoscale openings 2165 and 2175 (shown in FIG. 25) aligned to form the opening 2185. There is. When placing the template 2170 on top of the template 2160, the nanoscale object 2180 acts as a ball bearing. While moving the template 2170 on the template 2160, the nanoscale object 2180 facilitates alignment of both nanoscale openings 2165 and 2175 (shown in FIG. 25). As a result, the two templates can properly align their individual nanoscale openings. The nanoscale object 2180 holds the template 2170 and prevents the template 2170 from being out of alignment with the template 2160. As described, the role of ball bearings in nanoscale openings can be used to align various structures. Therefore, the nanoscale object acts as a ball bearing when one template aligns with the second template or another template. When the templates 2160 and 2170 are aligned, the nanoscale object 2180 will inevitably align the two nanoscale openings 2165 and 2175 in a straight line. In addition, the nanoscale object 2180 acts as an obstacle, preventing the template from shifting out of alignment, leaving the two nanoscale openings in a straight line. This feature can be used to align nanoscale openings with object-based structures.

Another useful application of the present invention is to achieve layering of nanoscale objects. For example, the size and shape of the nanoscale openings in the template can be configured to include layers arranged in different tiers. This feature will make it easier to layer nanoscale objects or materials in one template.

FIG. 27 provides, as an embodiment of the present invention, a cross-sectional view of a template with nanoscale openings capable of accommodating two differently sized nanoscale objects in different stages. Template 2200 features a nanoscale opening 2205. The lower tier of the nanoscale opening 2205 contains the nanoscale object 2210. The upper tier of the nanoscale opening 2205 contains the nanoscale object 2220. The upper tier of the nanoscale opening 2205 is larger than the lower tier and therefore contains a nanoscale object that is relatively larger than the lower tier of the nanoscale opening 2205. One reason this embodiment is useful is that it is easy to contain the smaller object first and the larger object later.

The material can be changed to fill each stage in the multi-stage nanoscale opening. This multi-stage feature within the nanoscale aperture can be applied in various fields such as semiconductor manufacturing. In semiconductor manufacturing, it is useful to layer various materials in a substrate. Although one nanoscale opening 2205 is shown in FIG. 27, many openings can be placed in one template. Two steps are shown within the nanoscale opening 2205, but in other embodiments, more steps can be provided within the individual nanoscale openings.

Another useful application of the embodiment of the invention is to use nanoscale openings in a template to bridge two layers in different stages of an electrical circuit. Filled with a conductive nanoscale object, the nanoscale opening can act as a via for making electrical connections through the template. The nanoscale object is then placed in a via created by the nanoscale openings in the template. It is also possible to separate the wires in different stages.

According to embodiments of the present invention, electronic devices can be connected by successfully arranging nanoscale objects. In one embodiment, a template with nanoscale features is used to make electrical connections between various electronic devices and devices. As shown in FIG. 28, template 2300 with nanoscale openings 2310 and 2320 is shown. Template 2300 is placed on the first group of wires 2330, 2340. The first group of wires 2330 and 2340 are arranged close to the first group of electronic elements (not shown). The first group of wires 2330 and 2340 are connected to the first group of electronic elements. The nanoscale openings 2310, 2320 are located on the first group of wires 2330, 2340. The nanoscale openings 2310 and 2320 contain conductive nanoscale objects 2360 and 2350, respectively. The conductive nanoscale objects 2350 and 2360 are in contact with the first group of wires 2330 and 2340, respectively. Conductive nanoscale objects 2350, 2360 can be projected from the upper surface of the template 2300 and electrically with wires or other components located opposite the first group of wires 2330, 2340 in the template. It is exposed to contact with.

A second group of wires 2370, 2380 is placed on the conductive nanoscale objects 2350, 2360. The second group of wires is located in close proximity to the second group of electronic components (not shown). In this embodiment, a technique for forming nanoscale vias is shown. The surface of the substrate is covered with wires, on which a template with nanoparticles on the through vias is provided, and finally a second group of wires is provided on it, through which the two groups of wires are provided. Structures that come into contact with each other are shown. Depending on the structure or application, circuit elements may be present in both the lower stage (s), the upper stage (s), and both, or not in any of the stages. is there. The first group of electronic elements is arranged in a different stage from the second group of electronic elements. The second group of wires 2370, 2380 are in contact with the conductive nanoscale objects 2350, 2360. The conductive nanoscale objects 2350, 2360 make electrical contact between the second group of wires 2370, 2380 and the first group of wires 2330, 2340. As a result, the first group of electronic elements is electrically connected to the second group of electronic elements. Therefore, according to embodiments of the present invention, templates with nanoscale features and structures can be used to connect electronic devices and devices. The nanoscale features of the template can include vias that penetrate the template. The via can be used to connect wires or electrical devices.

In another embodiment, the conductive nanoscale object placed within the template has an insulating oxide on its surface. Therefore, each connection configured in this way is a novel device that operates on the principle of Coulomb blocking. As another configuration for bringing the materials into contact, a template appropriately arranged in layers can also be used. Such devices carry current only at certain external voltages, are highly non-linear, and have stepped current-voltage characteristics. The device can be used as a transistor or threshold switch.

It has been shown that the present invention is used in a number of applications in various application forms. As described above, the present invention can be applied to various electrical technical fields. Another area where templates with nanoscale features are applied is in the field of biotechnology. FIG. 29 shows an embodiment of the present invention in which a template is used to construct a complex DNA structure. Template 2400 is used to create a pattern of nanoscale openings on substrate 2450. The surface of the substrate 2450 on which the template 2400 is placed can be made of various materials. An example of the surface material of the substrate 2450 is a resist material.

The size of the opening on template 2400 is nanoscale. Nanoscale objects 2410 are inserted into the nanoscale openings 2405, 2425 of the template. Unique linker molecules 2415 and 2435 are attached to nanoscale objects 2410 and 2430, respectively. Nanoscale objects 2410 and 2430 are linked to unique linker molecules 2415 and 2435, respectively. This embodiment demonstrates an application to scaffolding of DNA, where it is desirable to place the molecule accurately on the substrate. Another application would be to associate nanoscale objects with sensor receptors. The unique linker molecules 2415, 2435 facilitate the attachment of various structures to the nanoscale objects 2410, 2430. In one embodiment, this attachment is achieved by contacting the unique linker molecules 2415, 2435 with the nanoscale objects 2410, 2430, respectively. Upon contact, the nanoscale objects 2410, 2430 attach to the unique linker molecules 2415, 2435.

A unique linker molecule 2415 attached to the DNA oligomer 2420 is shown. Adhesion is created by the contact and attachment of the DNA oligomer 2420 and the unique linker molecule 2415. The structure can be further stacked using the DNA oligomer 2420 attached to the unique linker molecule 2415.

A unique linker molecule 2435 attached to the nanoscale object 2430 is shown. Further up in the figure, DNA oligomer 2440 is attached to the unique linker molecule 2435. The DNA oligomer 2440 to which the DNA template (scaffold) 2445 is attached is shown. A dimer is formed by combining DNA oligomer 2440 and DNA scaffold 2445. A dimer is a molecule consisting of two similar (but not necessarily exactly the same) subunits. In this embodiment, the oligomer can be accurately placed on the surface of the substrate. Such structures can be used to create more complex DNA structures and can also be applied to biological sensing.

In this way, linear or non-linear growth of nanoscale objects can be initiated on the substrate surface. Nanoscale objects can be used to attach molecules. In one embodiment, the nanoscale object is composed of layers of DNA, polynucleic acids, polypeptides, or organic substances. Layers of DNA, polynucleic acids, polypeptides, or chemicals can be used for further chemical sensing applications or as scaffolding materials for constructing complex biomolecular structures.

As described above, successful selection of nanoscale semiconductor and conductor materials can produce useful electronic components. Templates can be configured to arrange nanoscale objects in one-dimensional lines or to give the nanoscale objects a blanket (coating). These lines or blankets of fine particles can be configured to come into contact with other lines or blankets of nanoscale objects by overlapping or placing them in close proximity to other lines or blankets of fine particles. They can also be configured to come into contact by utilizing bridging contact with intermediate materials. Properly placed and optionally layered templates can be used for other configurations of material contact.

Depending on the embodiment of the present invention, a three-dimensional part or device can be manufactured using a template. By accurately placing a nanoscale object in place on a surface using various templates, different layers of the nanoscale object can be adhered onto the surface. It is also possible to stack separate layers made of fine particles or other materials to create three-dimensional parts or devices. When using templates, designers can adjust each layer individually to create electrical circuits or other applicable 3D components.

For example, a two-terminal device can be made by superimposing two materials with different electrical properties. In one embodiment, nanoscale objects or nanowires placed within the nanoscale openings in the template can be used to create vias that bridge two different stages in an electrical circuit. In another embodiment, the two-terminal device can be formed from a first layer of semiconductor material deposited by the template and a second layer of metal or conductive material deposited thereafter. With such materials, tunnel junctions or quantum dots can be made. The two-terminal device can be a diode such as a Schottky diode or a metal-semiconductor contact structure that produces rectification affected by the difference in charge density of the materials. One example is a Schottky diode with an aluminum / silicon interface. Another example is a compound having a metal / semiconductor interface, such as silicide. In another embodiment, materials with different magnetic properties can be used to form useful electrical structures. For example, magnetic nanowires made of Fe or Co can be produced and used as a magnetic storage medium.

Nanoimprint lithography is utilized in the methods and systems described above. Nanoimprint lithography has the ability to imprint or form nanoscale openings at any desired location on a layer, such as a photoresist. This capability will allow one of ordinary skill in the art to design complex, symmetric patterns, asymmetric patterns, or both. The methods and systems described provide a method of patterning a substrate with nanoscale features that can be used in later steps. According to the present invention, the number, size, shape, orientation, pattern and position of nanoscale objects can be controlled to produce nanoscale objects on a substrate.

The present invention has been described with reference to methods for producing nanoscale objects on a substrate by controlling the number, size, shape, pattern, orientation and position of nanoscale objects. The scope of the present invention extends to a process, a product, a structure, an apparatus, a system, a device or a method resulting from a certain process. However, those skilled in the art will appreciate that the present invention has broader utility. Other embodiments may also be implemented without departing from the spirit and scope of the invention.

<figref num="1">It is a figure of the structure by one Embodiment of this invention.</figref><figref num="2">It is a figure of the wafer manufactured by one Embodiment of this invention.</figref><figref num="3A">It is a side view of the mold by one Embodiment of this invention.</figref><figref num="3B">It is a top view of the mold according to one Embodiment of this invention.</figref><figref num="4">FIG. 5 is a diagram of a mold used for punching a pattern on a resist layer according to an embodiment of the present invention.</figref><figref num="5">It is a figure of the template interposed between the mold and the substrate by one Embodiment of this invention.</figref><figref num="6">It is a figure of the mold taken out from the structure by one Embodiment of this invention.</figref><figref num="7">FIG. 5 is a diagram of the remaining resist material removed from the template and substrate according to one embodiment of the present invention.</figref><figref num="8">It is a figure of the template attached to the substrate by one Embodiment of this invention.</figref><figref num="9">It is a figure of the nanoscale object deposited in the opening of the template by one Embodiment of this invention.</figref><figref num="10">FIG. 5 is a view of the surface of a brushed template according to an embodiment of the present invention.</figref><figref num="11">FIG. 5 is a diagram of a substrate and a template in which the openings of the template are filled with objects according to one embodiment of the present invention.</figref><figref num="12">It is a figure of the nanoscale object on the substrate by one Embodiment of this invention.</figref><figref num="13">It is a flow chart which shows the process for realizing the method of making a regular pattern of a nanoscale object on a substrate using a template.</figref><figref num="14">It is a figure of the template by one Embodiment of this invention.</figref><figref num="15">It is a figure of the template on the substrate by one Embodiment of this invention.</figref><figref num="16">FIG. 5 is a diagram of a nanoscale object supplied to a template on a substrate according to an embodiment of the present invention.</figref><figref num="17">FIG. 5 is a diagram of a substrate and a template in which a nanoscale object is brushed from a template according to an embodiment of the present invention.</figref><figref num="18">FIG. 5 is a diagram of a nanoscale object supplied to a template on a substrate according to an embodiment of the present invention.</figref><figref num="19">FIG. 5 is a diagram of a substrate and a template in which a nanoscale object is brushed from a template according to an embodiment of the present invention.</figref><figref num="20">FIG. 5 is a diagram of a substrate and a template in which the openings of the template are filled with objects according to one embodiment of the present invention.</figref><figref num="21">FIG. 6 is a diagram of a substrate and a template, wherein the template, according to one embodiment of the invention, includes one opening.</figref><figref num="22">FIG. 5 is a diagram of a substrate and a template according to an embodiment of the invention, wherein the template includes three openings.</figref><figref num="23">It is a figure of the nanoscale object on the substrate by one Embodiment of this invention.</figref><figref num="24">FIG. 5 is a diagram of a substrate and a template according to an embodiment of the invention, wherein the template includes three openings.</figref><figref num="25">It is a figure of the structure used for aligning two surfaces according to one Embodiment of this invention.</figref><figref num="26">It is a figure of the structure used for aligning two surfaces according to one Embodiment of this invention.</figref><figref num="27">FIG. 5 is a diagram of a structure according to an embodiment of the present invention having nanoscale openings capable of accommodating two differently sized nanoscale objects in different stages.</figref><figref num="28">FIG. 5 is a diagram of a structure used to create electrical connections between different stages of electronic devices according to an embodiment of the present invention.</figref><figref num="29">FIG. 5 is a diagram of a template used to construct a DNA structure according to an embodiment of the present invention.</figref>

Code description

100 structure 110, 420, 2010 boards 120, 910, 920, 2050, 2350 Nanoscale objects 200 wafers 220 electron beam 300 type 340 teeth 400 wafer structure 410 resist layer 500, 1510, 1600, 2000, 2100, 2400 templates 810, 930, 1530, 2020, 2120, 2310 openings 2330, 2340, 2370, 2380 wire