Driving chip and display device having the same

The present invention relates to a drive chip and a display device having the drive chip, and more particularly to a drive chip capable of improving the coupling reliability between the drive chip and the display panel and a display device having the drive chip.

In general, various electronic devices such as mobile communication terminals, digital cameras, notebook-type personal computers, and monitors include display devices for displaying images. Various types can be used as the display device. However, due to the characteristics of the electronic device, a display device having a flat plate shape is mainly used, and a liquid crystal display device is particularly widely used.

Such a liquid crystal display device has the advantages of being thinner and lighter than other display devices, having low power consumption and low drive voltage, as one of the flat plate display devices that display images using liquid crystals. Widely used throughout the industry. A conventional liquid crystal display device includes a liquid crystal display panel for displaying an image and a drive chip for driving the liquid crystal display panel. The drive chip converts video data applied from the outside into a drive signal suitable for driving the liquid crystal display panel and applies the video data to the liquid crystal display panel at an appropriate timing. The drive chip that fulfills such a role can be connected to the liquid crystal display panel by various methods.

Recently, in order to reduce manufacturing costs and size, a chip-on-glass (COG) mounting method in which the drive chip is mounted directly on the liquid crystal display panel has been used. According to such a COG method, an anisotropic conductive film (hereinafter referred to as ACF) is interposed between the drive chip and the liquid crystal display panel and then crimped at a high temperature to cause the drive chip and the liquid crystal display panel. And electrically connect.

However, although such a COG method is effective for electrically connecting finely formed terminals, there is a risk that the drive chip will bend because the coupling process is performed at a high temperature. That is, after the high-temperature coupling step, when the driving chip is cooled to room temperature, the driving chip is bent due to the difference in the coefficient of thermal expansion between the driving chip and the liquid crystal display panel, and stress is induced at the same time. .. There is a problem that poor contact between the drive chip and the liquid crystal display panel occurs due to such bending and stress of the drive chip.

<p> Therefore, the present invention has taken into consideration such conventional problems, and an object of the present invention is to provide a drive chip capable of improving the coupling reliability between the drive chip and the liquid crystal display panel. Another object of the present invention is to provide a display device having the drive chip described above.</p>

<p> The drive chip for achieving the above-described object of the present invention includes a base body, an input terminal portion, and a first output terminal portion. The base body has a rectangular parallelepiped shape having a long side and a short side perpendicular to the long side. The input terminal portion projects from one surface of the base body and is formed at the first end portion along the long side. The first output terminal portion is formed along the long side at a second end portion separated by a predetermined distance in a direction in which the short side extends from the first end portion. The input terminal portion and the first output terminal portion are formed in a region where the distance from the center line passing through the center of the long side and perpendicular to the long side is 9d / 10 or less. Here, d is the distance from the center line to the short side.</p><p> Further, the drive chip for achieving the object of the present invention includes a base main body, an input terminal portion, a first output terminal portion and a dummy terminal portion. The base body has a long side and a short side perpendicular to the long side. The input terminal portion is formed at the first end portion of the base body along the long side. The first output terminal portion is formed along the long side at a second end portion separated from the first end portion by a predetermined distance. The dummy terminal portions are formed on both sides of the first output terminal portion along the long side.</p><p> Display devices for achieving other objects of the present invention include display panels and drive chips. The display panel includes a conductive line for transmitting an electric signal and a pad portion connected to an end of the conductive line. The drive chip is formed from a base body having a long side and a short side perpendicular to the long side, an input terminal portion formed at the first end portion of the base body along the long side, and the first end portion. A first output terminal portion formed along a long side is included at a second end portion separated by a predetermined distance. The input terminal portion and the first output terminal portion are formed in a region where the distance from the center line passing through the center of the long side and perpendicular to the long side is 9d / 10 or less. Here, d is the distance from the center line to the short side. The input terminal portion and the first output terminal portion are connected to the pad portion. According to such a drive chip and a display device having the same, the drive chip is bent by forming the input terminal portion and the output terminal portion formed on the drive chip in a region within a certain distance from the center line of the drive chip. It is possible to reduce poor contact due to.</p>

Hereinafter, a desirable embodiment of the present invention will be described in more detail with reference to the drawings. (Embodiment of Drive Chip) (Embodiment 1) FIG. 1 is a perspective view showing a drive chip according to the first embodiment of the present invention. As shown in FIG. 1, the drive chip 100 according to the embodiment of the present invention includes a base main body 110, an input terminal unit 120, and a first output terminal unit 130. The base body 110 is made of an insulating material, and the first and second long sides 110a and 110b of the base body 110 and the first and second short sides 110c, which are perpendicular to the first and second long sides 110a and 110b, It is formed in the shape of a rectangular parallelepiped as a whole in a rectangular shape having 110d. A semiconductor element (not shown) for converting a video signal input from the outside into a drive signal required for driving is provided inside the base main body 110.

The input terminal portion 120 has an input terminal protruding from the first surface of the base main body 110, and is formed at the first end portion along the first long side 110a. Input terminal 120 has n input terminals IT₁~ IT_nConsists of. Where n is a natural number greater than or equal to 2. n input terminals IT₁~ IT_nAre arranged in a row at the first end along the first long side 110a. The first output terminal portion 130 has a first output terminal protruding from the first surface of the base main body 110, and is formed at the second end portion along the second long side 110b. The second end is separated from the first end by a predetermined distance. The first output terminal 130 has m first output terminals OTA₁~ OTA_mConsists of. Here, m is a natural number greater than or equal to 2. m 1st output terminals OTA₁~ OTA_mAre arranged in two rows at the second end along the second long side 110b. Of the first output terminals of the first output terminal unit 130 arranged in two rows, the output terminals arranged in the first row are separated from each other for a certain period of time, and the output terminals arranged in the second row are the first. Correspondingly arranged between the output terminals arranged in a row. In the present embodiment, the first output terminal unit 130 has m first output terminals OTA.₁~ OTA_mAre arranged in two columns, but can be arranged in one column and, in some cases, in three or more columns.

The drive chip 100 having such a configuration is directly mounted on a display panel (not shown) for displaying an image through a COG process. When the drive chip 100 is heated during the COG process and cooled after the COG process, the difference in the coefficient of thermal expansion between the drive chip 100 and the display panel causes the drive chip 100 to bend, and at the same time, stress is induced. To. The stress received by the drive tip 100 can be divided into shear stress and normal stress, which can be simulated and inferred by suhir's Model. FIG. 2 is a graph showing the shear stress of the drive tip shown in FIG. 1, and FIG. 3 is a graph showing the normal stress of the drive tip shown in FIG. The graphs shown in FIGS. 2 and 3 show the case where the lengths of the first and second long sides 110a and 110b of the drive chip 100 are 20 mm. Further, in FIGS. 2 and 3, the vertical axis shows the shear stress (Pa) and the normal stress (Pa), respectively, and the horizontal axis passes through the centers of the first and second long sides 110a and 110b, respectively, and the first and second long sides. The distance (mm) from the line perpendicular to 110a and 110b (the center line of the drive chip 100) is shown. As shown in FIGS. 2 and 3, the shear stress received by the drive tip 100 hardly changes up to the portion where the distance from the center line of the drive tip 100 is about 8 mm, and is from the center line of the drive tip 100. When the distance is 8 mm or more, the shear stress changes. In particular, when the distance from the center line is 9 mm to 10 mm, the shear stress changes abruptly. This means that stress is concentrated on the first and second short sides 110c and 110d of the drive chip 100.

Further, the normal stress received by the drive tip 100 also changes sharply in the portion where the distance from the center line is 9 mm to 10 mm, similar to the shear stress, and the first and second short sides of the drive tip 100 are changed. It shows that stress is concentrated in the 110c and 110d sites. As shown in FIGS. 2 and 3, the stress that the drive chip 100 receives is concentrated on the first and second short sides 110c and 110d, thereby connecting the drive chip 100 and the display panel. Reliability problems may occur. FIG. 4 is a graph showing the contact resistance between the drive chip and the display panel shown in FIG. 1, where the vertical axis represents the contact resistance (Ω) and the horizontal axis is the distance from the center line of the drive chip ( mm) is shown. The graph shown in Figure 4 measures the contact resistance between the drive chip and the display panel after performing a reliability test at 85 ° C for 500 hours with the drive chip and display panel coupled. It is a graph.

As shown in FIG. 4, there is almost no change in the contact resistance until the distance from the center line of the drive chip 100 toward the first short side 110c is about 8 mm, and when the distance is about 8 mm or more, the contact resistance increases. To do. In particular, it can be seen that the contact resistance increases sharply at a distance of 9 mm or more. That is, assuming that the distance from the center line of the drive chip to the first short side 110c is d, the stress is concentrated in the region where the distance from the center line of the drive chip is between 9d / 10 and d. Therefore, in the drive chip 100 according to the present embodiment, the input terminal portion 120 and the first output terminal portion 130 are formed in the region where the stress is relatively low, so that the coupling reliability between the drive chip 100 and the display panel can be improved. Improve. FIG. 5 is a plan view showing one side of the drive chip shown in FIG. As shown in FIG. 5, an input terminal portion 120 and a first output terminal portion 130 are formed on one surface of the base main body 110.

The input terminal portion 120 is formed at the first end portion along the first long side 110a. A part of the input terminal portion 120 is formed in a region where the distance from the center line is 9d / 10 or less in the direction from the center line toward the first short side 110c. Further, the remaining portion of the input terminal portion 120 is formed in a region where the distance from the center line is 9d / 10 or less in the direction from the center line toward the second short side 110d. Here, d is the distance from the center line to the first or second short sides 110c and 110d. The first output terminal portion 130 is formed at a second end portion separated from the first end portion by a predetermined distance along the second long side 110b. A part of the first output terminal portion 130 is formed in a region where the distance from the center line is 9d / 10 or less in the direction from the center line toward the first short side 110c. Further, the remaining portion of the first output terminal portion 130 is formed in a region where the distance from the center line is 9d / 10 or less in the direction from the center of the second long side 110b toward the second short side 110d. .. That is, m first output terminals OTA included in the first output terminal unit 130₁~ OTA_mOf these, the first output terminal OTA located closest to the first short side 110c₁Is formed so as to be separated from the first short side 110c by a distance d / 10 or more, and is the first output terminal OTA located closest to the second short side 110d._mIs formed so as to be separated from the second short side 110d by a distance d / 10 or more.

(Embodiment 2) FIG. 6 is a plan view showing a drive chip according to another embodiment of the present invention. As shown in FIG. 6, the drive chip 200 according to the second embodiment of the present invention includes a base body 210, an input terminal unit 220, a first output terminal unit 230, a second output terminal unit 240, and a third output terminal unit 250. .. The base main body 210, the input terminal portion 220, and the first output terminal portion 230 have the same structure as the base main body 110, the input terminal portion 120, and the first output terminal portion 130 of the drive chip 100 shown in FIG. Duplicate explanations will be omitted. The second output terminal portion 240 projects from one surface of the base body 210 to the same height as the first output terminal portion 230, and is formed at the third end portion perpendicular to the first end portion along the first short side 210c. To. The second output terminal unit 240 has a second output terminal OTB.₁~ OTB_aConsists of. Where a is a natural number greater than or equal to 2. a second output terminal OTB₁~ OTB_aAre arranged in two rows at the third end along the first short side 210c. The second output terminal portion 240 passes through the centers of the first and second long sides 210a and 210b in the direction from the center of the first and second long sides 210a and 210b toward the first short side 210c, and passes through the centers of the first and second long sides 210a and 210b. It is formed in a region where the distance from the line perpendicular to the second long sides 210a and 210b (the center line of the drive chip 200) is 9d / 10 or less. That is, the second output terminal portion 240 is formed so as to be separated from the first short side 210c by a distance d / 10 or more.

The third output terminal portion 250 projects from one surface of the base body 210 to the same height as the second output terminal portion 240, and is separated from the third end portion by a predetermined distance along the second short side 210d at the fourth end portion. Is formed. The third output terminal part 250 has b third output terminals OTC.₁~ OTC_bConsists of. Where b is a natural number greater than or equal to 2. b 3rd output terminals OTC₁~ OTC_bAre arranged in two rows at the fourth end along the second short side 210d. The third output terminal portion 250 is formed in a region where the distance from the center line is 9d / 10 or less in the direction from the center line toward the second short side 210b. That is, the third output terminal portion 250 is formed so as to be separated from the second short side 210d by a distance d / 10 or more. In the present embodiment, the second and third output terminal portions 240 and 250 are the second and third output terminal OTBs.₁~ OTB_a, OTC₁~ OTC_bAre arranged in two columns each, but can be arranged in one column, and in some cases can be arranged in three or more columns.

(Embodiment 3) FIG. 7 is a plan view showing a drive chip according to a third embodiment of the present invention. As shown in FIG. 7, the drive chip 300 according to still another embodiment of the present invention includes a base body 310, an input terminal 320, a first output terminal 330, and first and second dummy terminals 340a and 340b. .. In the present embodiment, the base body 310, the input terminal 320, and the first output terminal 330 are the same as the base body 110, the input terminal 120, and the first output terminal 130 of the drive chip 100 shown in FIG. Since it has a structure, its duplicate description will be omitted. The first dummy terminal portion 340a projects from one surface of the base body 310 to the same height as the first output terminal portion 330, and extends from one side of the first output terminal portion 330 along the second long side 310b. It is formed in the region on the short side 310c side. The first dummy terminal portion 340a has a plurality of first dummy terminals DT.₁Consists of. Multiple first dummy terminals DT₁Is the first output terminal OTA along the second long side 310b.₁~ OTA_mIt is arranged in two columns in the same way as. The first dummy terminal portion 340a is formed in a region where the distance from the first short side 310c is d / 10 or less.

The second dummy terminal portion 340b projects from one surface of the base body 310 to the same height as the first dummy terminal portion 340a, and extends from the other side of the first output terminal portion 330 along the second long side 310b. It is formed in the region on the short side 310b side. The second dummy terminal portion 340b has a plurality of second dummy terminals DT.₂Consists of. Multiple second dummy terminals DT₂Is the first output terminal OTA along the second long side 310b₁~ OTA_mIt is arranged in two columns in the same way as. The second dummy terminal portion 340b is formed in a region where the distance from the second short side 310d is d / 10 or less. 1st and 2nd dummy terminals DT₁, DT₂No electrical signal is applied to. 1st and 2nd dummy terminals DT₁, DT₂Is the first output terminal OTA₁~ OTA_mIt is formed in the same shape as, but can also be formed in a different shape. As described above, the drive chip 300 according to the further embodiment of the present invention includes the first and second dummy terminal portions 340a and 340b formed in the region where the stress is concentrated. Since the first and second dummy terminal portions 340a and 340b play a role of buffering the stress applied to the drive chip 300, the reliability of the connection between the drive chip and the display panel can be improved.

(Embodiment 4) FIG. 8 is a plan view showing a drive chip according to a fourth embodiment of the present invention. As shown in FIG. 8, the drive chip 400 according to the further embodiment of the present invention includes a base body 410, an input terminal unit 420, a first output terminal unit 430, a second output terminal unit 440, and a third output terminal unit 450. , 3rd and 4th dummy terminals 460a and 460b are included. In the present embodiment, the base main body 410, the input terminal portion 420, the first, second and third output terminal portions 430, 440, 450 are the base main body 210 and the input terminal portion 220 of the drive chip 200 shown in FIG. , 1st, 2nd and 3rd output terminals have the same structure as 230, 240 and 250, so the overlapping description thereof will be omitted. The third dummy terminal portion 460a projects from one surface of the base main body 410 to the same height as the second output terminal portion 440, and is formed between the first short side 410c and the second output terminal portion 440. That is, the third dummy terminal portion 460a is formed in a region where the distance from the first short side 410c where stress is concentrated is d / 10 or less. The third dummy terminal portion 460a has a plurality of third dummy terminals DT.₃Consists of. 3rd dummy terminal DT₃No electrical signal is applied to.

The fourth dummy terminal portion 460b projects from one surface of the base main body 410 to the same height as the third output terminal portion 450, and is formed between the second short side 410d and the third output terminal portion 450. That is, the fourth dummy terminal portion 460b is formed in a region where the distance from the second short side 410d where stress is concentrated is d / 10 or less. The 4th dummy terminal part 460b has a plurality of 4th dummy terminals DT.₄Consists of. 4th dummy terminal DT₄3rd dummy terminal DT₃No electrical signal is applied as in. 3rd and 4th dummy terminals DT₃, DT₄Can be formed in two rows, but can also be formed in one or more rows. The various embodiments of the drive chip according to the present invention have been described above. Hereinafter, the display device having the drive chip described above will be described.

(Embodiment of Display Device) (Embodiment 5) FIG. 9 is a perspective view showing a display device according to a fifth embodiment of the present invention, and FIG. 10 is an enlarged view of a pad portion of the first substrate shown in FIG. It is a partially enlarged view. As shown in FIGS. 9 and 10, the display device 500 according to an embodiment of the present invention includes a drive chip 200 and a display panel 600. In the present embodiment, the drive chip 200 is the same as the drive chip 200 shown in FIG. 6, and therefore the overlapping description thereof will be omitted. The display panel 600 includes a first substrate 610, a second substrate 620 that is coupled to face the first substrate 610, and a liquid crystal (not shown) interposed between the first substrate 610 and the second substrate 620. It is a liquid crystal display panel including. The first substrate 610 includes a plurality of conductive lines 612 for transmitting electric signals, and a pad portion 614 for connecting the conductive lines 612 and the drive chip 200.

The conductive line 612 includes an input line 612a and a first output line 612b. The input line 612a is connected to a flexible printed circuit board (not shown) for input of an external input signal. The first output line 612b is a gate line (not shown) extending in the first direction on the first substrate 610 and a data line extending in the second direction orthogonal to the first direction and intersecting with the gate line (FIG.). (Not shown) and are connected respectively. The conductive line 612 can further include a second output line 612c and a third output line 612d. The second and third output lines 612c and 612d are connected to the gate line and the data line together with the first output line 612b. The pad section 614 is an input pad IP.₁~ IP_nAnd 1st output pad OPA₁~ OPA_mincluding.

Input pad IP₁~ IP_nIs electrically connected to the input line 612a on the first substrate 610. Input pad IP₁~ IP_nDrives the input signal input from the outside through the input line 612a. Input terminal IT of chip 200₁~ IT_nInput terminal IT to input to₁~ IT_nIs formed so as to have a one-to-one correspondence with. 1st output pad OPA₁~ OPA_mIs electrically connected to the first output line 612b on the first board 610. 1st output pad OPA₁~ OPA_mIn order to apply the output signal output from the drive chip 200 to the gate line and the data line through the first output line 612b, the first output terminal OTA₁~ OTA_mIs formed so as to have a one-to-one correspondence with. Pad section 614 is the second output pad OPB₁~ OPB_aAnd 3rd output pad OPC₁~ OPC_bCan be further included. 2nd output pad OPB₁~ OPB_aIs the input pad IP₁~ IP_nAnd 1st output pad OPA₁~ OPA_mAnd the input pad IP₁~ IP_nAnd 1st output pad OPA₁~ OPA_mIt is formed in a region adjacent to one side and is connected to the second output line 612c. 2nd output pad OPB₁~ OPB_aIs the second output terminal OTB₁~ OTB_aIt is formed in a one-to-one correspondence for connection with.

3rd output pad OPC₁~ OPC_bIs the input pad IP₁~ IP_nAnd 1st output pad OPA₁~ OPA_mSecond output pad OPB₁~ OPB_aAnd input pad IP so that it is placed a predetermined distance away₁~ IP_nAnd 1st output pad OPA₁~ OPA_mIt is formed in the area adjacent to the other side of the and is connected to the third output line 612d. 3rd output pad OPC₁~ OPC_bIs the 3rd output terminal OTC₁~ OTC_bIt is formed in a one-to-one correspondence for connection with. The drive chip 200 is coupled to the pad portion 614 having such a structure. FIG. 11 is a cross-sectional view cut along the line II ́ in FIG. As shown in FIG. 11, the drive chip 200 is mounted on the pad portion 614 of the first substrate 610 by the COG process (the input pad IP and the first output pad OPA of the pad portion 614 are shown in FIG. 11). Will be done. That is, the drive chip 200 is coupled to the first substrate 610 by providing an anisotropic conductive film 700 between the drive chip 200 and the first substrate 610 and then applying an appropriate temperature and pressure from the outside. ..

The anisotropic conductive film 700 is composed of an adhesive resin 710 and a plurality of conductive particles 720 irregularly distributed in the adhesive resin 710. The conductive particles 720 have a small spherical shape. Conductive particles 720 located between the input terminal IT and the input pad IP and between the first output terminal OTA and the first output pad OPA are connected to each other by the pressure applied from the outside, and the input terminal IT and the input pad are connected to each other. The IP and the 1st output terminal OTA and the 1st output pad OPA are electrically connected to each other.

The adhesive resin 710 is made of a thermosetting resin and is cured by heat applied from the outside to fix the drive chip 200 to the first substrate 610. Although not shown, the second output terminal OTB and the second output pad OPB, and the third output terminal OTC and the third output pad OPC are also the same as the first output terminal OTA and the first output pad OPB described above. It is electrically connected by conductive particles 720 arranged between the 2 output terminal OTB and the 2nd output pad OPB and between the 3rd output terminal OTC and the 3rd output pad OPC. In the present embodiment, the display panel has been described by taking a liquid crystal display panel as an example, but as the display panel 600, various display panels such as a plasma display panel PDP and an organic EL display can also be adopted as the display panel of the present invention. it can.

According to such a drive chip of the present invention and a display device having the same, the input terminal and the output terminal of the drive chip are formed in a region excluding the edge region near the short side where stress is concentrated. Therefore, the coupling reliability between the drive chip and the display panel can be improved. Although the above description has been made in detail with reference to the examples of the present invention, the present invention is not limited to this, and any person having ordinary knowledge in the technical field to which the present invention belongs can keep the idea and spirit of the present invention. , The present invention can be modified or modified.

<figref num="1">It is a perspective view which shows the drive chip by 1st Embodiment of this invention.</figref><figref num="2">It is a graph which shows the shear stress of the drive tip shown in FIG.</figref><figref num="3">It is a graph which shows the normal stress of the drive tip shown in FIG.</figref><figref num="4">It is a graph which shows the contact resistance between a drive chip and a display panel shown in FIG.</figref><figref num="5">It is a top view which shows one side of the drive chip shown in FIG.</figref><figref num="6">It is a top view which shows the drive chip by 2nd Embodiment of this invention.</figref><figref num="7">It is a top view which shows the drive chip by the 3rd Embodiment of this invention.</figref><figref num="8">It is a top view which shows the drive chip according to 4th Embodiment of this invention.</figref><figref num="9">It is a perspective view which shows the display device by 5th Embodiment of this invention.</figref><figref num="10">It is an enlarged view of the pad part of the 1st substrate shown in FIG.</figref><figref num="11">It is a cross-sectional view cut along the line II ́ in Fig. 9.</figref>

Code description

100 Drive chip 110 Base body 110a 1st long side 110b 2nd long side 110c 1st short side 110d 2nd short side 120 Input terminal 130 1st output terminal 200, 300, 400 Drive chip 210, 410 Base body 220, 320, 420 Input terminal 230, 330, 430 1st output terminal 240, 440 2nd output terminal 250, 450 3rd output terminal 310 Base body 340a 1st dummy terminal 340b 2nd dummy terminal 460a 3rd Dummy terminal 460b 4th dummy terminal 600 Display panel 610 1st board 612 Conductive line 614 Pad 620 2nd board