Nova Patents
EP1520892A3

Polishing composition

Abstract

A polishing composition of the present invention, to be used in polishing for forming wiring in a semiconductor device, includes: a specific surfactant; a silicon oxide; at least one selected from the group consisting of carboxylic acid and alpha-amino acid; a corrosion inhibitor; an oxidant; and water. This polishing composition is capable of suppressing the occurrence of the dishing.

EP1520892A3, drawing sheet 1
Sheet 1 of 1

Term

Term ended

Projected expiry passed 30 September 2024, 2 years ago.

  1. Priority
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1 sheet

  1. Sheet 1