EP1069207A3

In-situ etch method for for cleaning a CVD chamber

Abstract

In a method of performing an in-situ etch of a CVD chamber in a cold-wall type processing system for cleaning said chamber the walls of the chamber are heated to a temperature of between approximately 65°C and approximately 90°C and fluorine-based etching gas is injected into the chamber (104). An RF power to energize the etching gas is then supplied.

EP1069207A3, drawing sheet 1
Sheet 1 of 1

Term

Term ended

Projected expiry passed 28 December 2010, 15.7 years ago.

  1. Priority
  2. Filed
  3. Published
  4. Projected expiry
  5. Today

1 sheet

  1. Sheet 1