EP0961319A3
Integrated flexible interconnection
Abstract
There is disclosed an integrated circuit with a plurality of flexible integrated bonding means. The integrated circuit of this invention has a plurality of bonding means, which extend beyond the boundary of the integrated circuit and are flexible beyond that boundary.

Term
Term ended
Projected expiry passed 27 May 2019, 7.3 years ago.
- Priority
- Filed
- Published
- Projected expiry
- Today
1 sheet
Sheet 1
Every citation, both ways
| Document | Relation | Office | Category | Cited during | Relevant claims |
|---|---|---|---|---|---|
| EP0348972A2 | Cites | European Patent Office (EPO) | A | Search report | 7 |
| EP0475223A2 | Cites | European Patent Office (EPO) | A | Search report | 7 |
| EP0740343A2 | Cites | European Patent Office (EPO) | Y | Search report | 7 |
| EP0749157A2 | Cites | European Patent Office (EPO) | Y | Search report | 7 |
| US3947952A | Cites | United States of America | X | Search report | 1 |
| US4011144A | Cites | United States of America | A | Search report | 1 |
| US4086375A | Cites | United States of America | Y | Search report | 3-6 |
| DE4226167A1 | Cites | Germany | Y | Search report | 7 |
| US4246595A | Cites | United States of America | X | Search report | 1-3 |
| US4783695A | Cites | United States of America | XY | Search report | 1,2 |
| US5277756A | Cites | United States of America | Y | Search report | 7 |
| US5452182A | Cites | United States of America | XY | Search report | 1-3 |
| PATENT ABSTRACTS OF JAPAN vol. 012, no. 007 (E - 571) 9 January 1988 (1988-01-09) | Non-patent | – | – | Search report | – |
4 members in 3 offices; this record represents the family
Priority claims10
| Document | Office | Kind | Date |
|---|---|---|---|
| 85763 | United States of America | – | |
| 8576398 | United States of America | A | |
| 8576398 | United States of America | A | |
| 85939 | United States of America | – | |
| 8593998 | United States of America | A | |
| 8593998 | United States of America | A | |
| 85763 | – | – | – |
| 85939 | – | – | – |
| US19980085763 | – | – | – |
| US19980085939 | – | – | – |
Members4
| Document | Office | Kind | |
|---|---|---|---|
| EP0961319A2 | European Patent Office (EPO) | A2 | |
| JP2000012607A | Japan | A | |
| US6107179A | United States of America | A | |
| EP0961319A3This record | European Patent Office (EPO) | A3 |
13 legal events, as the office reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | |
|---|---|---|
| Application deemed to be withdrawnWithdrawn18D | 18D | |
| Information on the status of an ep patent application or granted ep patentGrantedSTATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWNSTAA | STAA | |
| First examination report despatched17Q | 17Q | |
| Designation fees paidDE FR GBAKX | AKX | |
| Request for examination filed17P | 17P | |
| Designated contracting statesAK | AK | |
| Request for extension of the european patentAL;LT;LV;MK;RO;SIAX | AX | |
| Search report despatchedORIGINAL CODE: 0009013PUAL | PUAL | |
| Information provided on ipc code assigned before grant7H 01L 23/538 A, 7H 01L 23/482 BRIC1 | RIC1 | |
| Designated contracting statesAK | AK | |
| Designated contracting statesAK | AK | |
| Request for extension of the european patentAL;LT;LV;MK;RO;SIAX | AX | |
| Public reference made under article 153(3) epc to a published international application that has entered the european phaseORIGINAL CODE: 0009012PUAI | PUAI |
Numbers
- Publication
- 0961319
- Publication, DOCDB
- 0961319
- Publication, EPODOC
- EP0961319
- Application
- 99110300
- Application, DOCDB
- 99110300
- Application, EPODOC
- EP19990110300
Titles3
- German
- Integrierte, flexible Verbindung
- English
- Integrated flexible interconnection
- French
- Interconnexion integrée et souple
Classification
- CPC, 2
- H10W72/60
- H10W72/00
- IPC, 2
- H01L23 482
- H01L21 60
Designated states2
- Contracting states, 1
- Sweden
- Extension states, 1
- Slovenia