EP0343690A2

Heat-latent, cationic polymerization initiator and resin compositions containing the same.

Abstract

Benzyl pyridinium or ammonium salts of a non-­nucleophilic anion are useful as a cationic polymerization initiator having a heat latency. A variety of resinous compositions containing this initiator is also disclosed.

EP0343690A2, drawing sheet 1
Sheet 1 of 28

Term

Term ended

Projected expiry passed 29 May 2009, 17.3 years ago.

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12 claims: 3 independent, 9 dependent

  1. 1
    A resinous composition comprising a film-forming resin capable of curing upon heating in the presence of a polymerization initiator and 0.01 to 10% by weight of the solid content of said resin of a compound of the formula:wherein R₁, R₂, R₃ and R₄ are each H, OH, halogen, an alkyl, an alkoxy, nitro, amino, an alkylamino, an alkanoyl, cyano, an alkoxycarbonyl or carbamoyl;R₅, R₆ and R₇ are each an alkyl, an alkenyl or phenyl which may be substituted with nitro, cyano, amino, halogen, an alkyl, an alkoxy or a dialkylamino, at least one of R₅, R₆ and R₇ being phenyl or the substituted phenyl;M is As, Sb, B or P;X is halogen;and n equals to the valency of the element M plus one.
  2. 2
    The resinous composition according to Claim 1, wherein said film-forming resin is a monomer or polymer having a cation polymerizable function, or a mixture thereof.
  3. 3
    The resinous composition according to Claim 2, wherein said cation polymerizable function is epoxide, cyclic imine, cyclic ether or vinyl.
  4. 4
    The resinous composition according to Claim 2, wherein said film-forming resin further contains a polyol.
  5. 5
    The resinous composition according to Claim 4, said polyol component is compounded in an amount corresponding to 1 to 100 mole % relative to said cation polymerizable function.
  6. 6
    The resinous composition according to Claim 1, wherein said film-forming resin is a mixture of a film-forming resin having a plurality of hydroxy groups and a melamine resin.
  7. 7
    The resinous composition according to Claim 6, wherein said melamine resin occupies from 5 to 50% of the solid content of said mixture.
  8. 8
    The resinous composition according to Claim 1, wherein said film-forming resin is a silicon resin having a plurality of alkoxysilyl groups.
  9. 9
    The resinous composition according to Claim 8 further comprising a polyol.
  10. 10
    The resinous composition according to Claim 9, wherein said polyol component is compounded in such an amount that the molar ratio of the hydroxy group to the alkoxysilyl group is 0.1 to 10.
  11. 11
    A compound of the formula:wherein R₁, R₂, R₃ and R₄ are each H, OH, halogen, an alkyl, an alkoxy, nitro, amino, an alkylamino, alkanoyl cyano, an alkoxycarbonyl or carbamoyl with the proviso that when R₄ is cyano at the 4-position on the pyridine ring, at least one of R₁, R₂ and R₃ cannot mean H, an alkyl or an alkoxy;M is As, Sb, B or P;X is halogen;and n equals to the valency of the element M plus one.
  12. 12
    A compound of the formula:wherein R₁, R₂ and R₃ are each H, OH, halogen an alkyl, an alkoxy, nitro, amino, an alkylamino, alkanoyl, cyano, an alkoxycarbonyl or carbamoyl;R₅, R₆ and R₇ are each an alkyl, an alkenyl or phenyl which may be substituted with nitro, amino, halogen, analkyl, an alkoxy or a dialkylamino, at least one of R₅, R₆ and R₇ being phenyl or the substituted phenyl;M is As, Sb, B or P;X is halogen;and n equals to the valency of the element M plus one.