EP0343690B1

Heat-latent, cationic polymerization initiator and resin compositions containing the same.

Abstract

This record has no abstract on file.

EP0343690B1, drawing sheet 1
Sheet 1 of 42

Term

Term ended

Expired 29 May 2009, 17.3 years ago.

  1. Priority
  2. Filed
  3. Granted
  4. Expired
  5. Today

12 claims: 3 independent, 9 dependent

  1. 1
    A resinous composition comprising a film-forming resin capable of curing upon heating in the presence of a polymerization initiator and 0.01 to 10% by weight of the solid content of said resin of a compound of the formula:wherein R₁, R₂, R₃ and R₄ are each H, OH, halogen, an alkyl, an alkoxy, nitro, amino, an alkylamino, an alkanoyl, cyano, an alkoxycarbonyl or carbamoyl;R₅, R₆ and R₇ are each an alkyl, an alkenyl or phenyl which may be substituted with nitro, cyano, amino, halogen, an alkyl, an alkoxy or a dialkylamino, at least one of R₅, R₆ and R₇ being phenyl or the substituted phenyl;M is As, Sb, B or P;X is halogen;and    n equals to the valency of the element M plus one.
  2. 2
    The resinous composition according to Claim 1, wherein said film-forming resin is a monomer or polymer having a cation polymerizable function, or a mixture thereof.
  3. 3
    The resinous composition according to Claim 2, wherein said cation polymerizable function is epoxide, cyclic imine, cyclic ether or vinyl.
  4. 4
    The resinous composition according to Claim 2, wherein said film-forming resin further contains a polyol.
  5. 5
    The resinous composition according to Claim 4, said polyol component is compounded in an amount corresponding to 1 to 100 mole % relative to said cation polymerizable function.
  6. 6
    The resinous composition according to Claim 1, wherein said film-forming resin is a mixture of a film-forming resin having a plurality of hydroxy groups and a melamine resin.
  7. 7
    The resinous composition according to Claim 6, wherein said melamine resin occupies from 5 to 50% of the solid content of said mixture.
  8. 8
    The resinous composition according to Claim 1, wherein said film-forming resin is a silicon resin having a plurality of alkoxysilyl groups.
  9. 9
    The resinous composition according to Claim 8 further comprising a polyol.
  10. 10
    The resinous composition according to Claim 9, wherein said polyol component is compounded in such an amount that the molar ratio of the hydroxy group to the alkoxysilyl group is 0.1 to 10.
  11. 11
    A compound of the formula:wherein R₁, R₂ and R₃ are each H, OH, halogen, alkyl, alkoxy, nitro or amino and R₄ is halogen or alkanoyl;M is As, Sb, B or P;X is halogen;and    n equals to the valency of the element M plus one.
  12. 12
    A compound of the formula:wherein R₁, R₂ and R₃ are each H, OH, halogen, alkyl, alkoxy, nitro or amino;R₅, R₆ and R₇ are each alkyl, alkenyl or phenyl which may be substituted with nitro, amino, halogen, alkyl, alkoxy or a dialkylamino, at least one of R₅, R₆ and R₇ being phenyl or substituted phenyl;M is As, Sb, B or P;X is halogen;and    n equals to the valency of the element M plus one.