ATE444568T1
Power surface mount light emitting die package
Abstract
This record has no abstract on file.
Term
Term ended
Projected expiry passed 20 October 2024, 1.9 years ago.
- Priority
- Filed
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- Projected expiry
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99 members in 11 offices
Priority claims2
| Document | Office | Kind | Date |
|---|---|---|---|
| 69235103 | United States of America | A | |
| 2004034768 | United States of America | W |
Members99
| Document | Office | Kind | |
|---|---|---|---|
| US2004041222A1 | United States of America | A1 | |
| CA2496937A1 | Canada | A1 | |
| WO2004023522A2 | World Intellectual Property Organization (WIPO) | A2 | |
| AU2003276860A1 | Australia | A1 | |
| AU2003276860A8 | Australia | A8 | |
| US2004079957A1 | United States of America | A1 | |
| TW200406897A | Taiwan Province of China | A | |
| WO2004023522A3 | World Intellectual Property Organization (WIPO) | A3 | |
| CA2549822A1 | Canada | A1 | |
| WO2005043627A1 | World Intellectual Property Organization (WIPO) | A1 | |
| EP1537603A2 | European Patent Office (EPO) | A2 | |
| KR20050061464A | Republic of Korea | A | |
| TW200522395A | Taiwan Province of China | A | |
| CN1679168A | China | A | |
| JP2005538550A | Japan | A | |
| EP1680816A1 | European Patent Office (EPO) | A1 | |
| EP1537603A4 | European Patent Office (EPO) | A4 | |
| CN1871710A | China | A | |
| EP1680816A4 | European Patent Office (EPO) | A4 | |
| JP2007509505A | Japan | A | |
| US2007138497A1 | United States of America | A1 | |
| US7244965B2 | United States of America | B2 | |
| US2007181901A1 | United States of America | A1 | |
| US2007200127A1 | United States of America | A1 | |
| US7264378B2 | United States of America | B2 | |
| KR20070090071A | Republic of Korea | A | |
| EP1537603B1 | European Patent Office (EPO) | B1 | |
| AT400896T | Austria | T | |
| ATE400896T1 | Austria | T1 | |
| EP1953825A2 | European Patent Office (EPO) | A2 | |
| DE60322074D1 | Germany | D1 | |
| CN100414698C | China | C | |
| EP1953825A3 | European Patent Office (EPO) | A3 | |
| EP1680816B1 | European Patent Office (EPO) | B1 | |
| AT444568T | Austria | T | |
| ATE444568T1This record | Austria | T1 | |
| DE602004023409D1 | Germany | D1 | |
| EP2139051A1 | European Patent Office (EPO) | A1 | |
| US7659551B2 | United States of America | B2 | |
| US7775685B2 | United States of America | B2 | |
| TWI331380B | Taiwan Province of China | B | |
| US2010301372A1 | United States of America | A1 | |
| JP4602345B2 | Japan | B2 | |
| KR20110020950A | Republic of Korea | A | |
| KR20110026006A | Republic of Korea | A | |
| KR20110026007A | Republic of Korea | A | |
| KR20110026008A | Republic of Korea | A | |
| KR20110026009A | Republic of Korea | A | |
| CN1871710B | China | B | |
| US2011121345A1 | United States of America | A1 | |
| JP2011129945A | Japan | A | |
| JP2011129946A | Japan | A | |
| JP2011129947A | Japan | A | |
| JP2011129948A | Japan | A | |
| JP2011129949A | Japan | A | |
| JP2011129950A | Japan | A | |
| US7976186B2 | United States of America | B2 | |
| JP2011139087A | Japan | A | |
| JP4731906B2 | Japan | B2 | |
| US2011186895A1 | United States of America | A1 | |
| US2011186896A1 | United States of America | A1 | |
| US2011186897A1 | United States of America | A1 | |
| CN102148316A | China | A | |
| KR101082145B1 | Republic of Korea | B1 | |
| KR101082169B1 | Republic of Korea | B1 | |
| KR101082235B1 | Republic of Korea | B1 | |
| KR101082304B1 | Republic of Korea | B1 | |
| KR101088928B1 | Republic of Korea | B1 | |
| TW201210061A | Taiwan Province of China | A | |
| TW201210062A | Taiwan Province of China | A | |
| TW201212297A | Taiwan Province of China | A | |
| US8167463B2 | United States of America | B2 | |
| US8188488B2 | United States of America | B2 | |
| KR101160037B1 | Republic of Korea | B1 | |
| US2012235199A1 | United States of America | A1 | |
| KR20120132567A | Republic of Korea | A | |
| KR101244075B1 | Republic of Korea | B1 | |
| TWI392105B | Taiwan Province of China | B | |
| TW201320385A | Taiwan Province of China | A | |
| KR20130056339A | Republic of Korea | A | |
| EP1953825B1 | European Patent Office (EPO) | B1 | |
| US8530915B2 | United States of America | B2 | |
| TW201338194A | Taiwan Province of China | A | |
| KR101314986B1 | Republic of Korea | B1 | |
| US8608349B2 | United States of America | B2 | |
| US8622582B2 | United States of America | B2 | |
| KR101386846B1 | Republic of Korea | B1 | |
| US8710514B2 | United States of America | B2 | |
| EP2139051B1 | European Patent Office (EPO) | B1 | |
| JP5520241B2 | Japan | B2 | |
| JP5520242B2 | Japan | B2 | |
| JP5520243B2 | Japan | B2 | |
| US2014284643A1 | United States of America | A1 | |
| JP5629601B2 | Japan | B2 | |
| JP5746877B2 | Japan | B2 | |
| TWI495143B | Taiwan Province of China | B | |
| CN102148316B | China | B | |
| TWI538255B | Taiwan Province of China | B | |
| TWI550897B | Taiwan Province of China | B |
Numbers
- Application
- 4795871
Titles2
- English
- HOUSING FOR HIGH POWER SURFACE MOUNTED LIGHT EMISSION CHIP
- German
- GEHÄUSE FÜR OBERFLÄCHENMONTIERTEN LICHTEMISSIONSCHIP HOHER LEISTUNG
Classification
- CPC, 13
- H10H20/856
- H10H20/85
- H10H20/8506
- H10H20/853
- H10H20/858
- H10H20/8581
- H10H20/8582
- H10H20/8585
- H10H20/855
- H10H20/857
- H10W90/754
- H10W90/756
- H10H20/852
- IPC, 8
- H10D62 864
- H01L33 48
- H01L33 54
- H01L33 58
- H01L33 60
- H01L33 62
- H01L33 64
- H10D62 86