Power surface mount light emitting die package

The present invention discloses a light emitting chip package. The chip package includes a substrate, a reflecting plate and a lens. Material of the substrate may be made of a thermally conductive but electrically insulating, made of one or both thermally and electrically conductive material. In the embodiment wherein the substrate is made of a conductive material, the substrate further comprises an electrically insulating formed on the conductive material, the thermal conductivity of the material. Said substrate having a mounting pad for connection to a Light Emitting Diode (LED) of track cable. The reflection plate coupled to the substrate and substantially surrounds the mounting pad. The lens substantially covering the mounting pad. The substrate (acting as a bottom heat sink) and the reflector plate (acting as a top heat sink) heat during the operation of both generated by the LED from the LED to absorb. The reflector plate includes a reflective surface for the light from the LED is guided along a desired direction.