US20050103475A1

Integrated liquid cooling system for electrical components

Claim Score by NHIP

Abstract

A liquid cooling system includes a heat absorbing unit (4) defining a chamber therein for containing coolant, and a heat dissipation unit (2) comprising a liquid circulation module (20) in flow communication with the heat absorbing unit, and a plurality of cooling fins (27). The liquid circulation module comprises first and second hollow cooling bodies (21, 23) cooperatively defining a space therebetween to receive the cooling fins, and a pump (24) coupled to the second cooling body, so that the first and second cooling bodies, the pump, and the heat absorbing unit together forms a closed loop for circulation of the coolant.

US20050103475A1, drawing sheet 1 — Sheet 1 of 6

Term

Term ended

Projected expiry passed 19 August 2024, 2.1 years ago.

16 claims: 3 independent, 13 dependent

1
A liquid cooling system comprising:a heat absorbing unit defining a chamber therein for containing coolant;and a heat dissipation unit comprising a liquid circulation module in flow communication with the chamber, and a plurality of cooling fins, the liquid circulation module comprising first and second hollow cooling bodies cooperatively defining a space therebetween to sandwich the cooling fins therein, and a pump coupled to at least one of the first and second cooling bodies, so that the first and second cooling bodies, the pump, and the heat absorbing unit together forms a closed loop for circulation of the coolant.
10
A liquid cooling system comprising:a heat absorbing unit defining a chamber therein for containing coolant and a face for contacting a heat source;and a heat dissipation unit comprising: a liquid circulation module being in flow communication with the chamber;and a plurality of spaced cooling fins, the liquid circulation module comprising: at least one hollow cooling body, said cooling fins defining ends in thermal contact with said cooling body;and a pump communicating the cooling body with the chamber;wherein said liquid circulation module is formed as one unitary piece, and spatially discrete from said heat absorbing unit.
16
Broadest claimClaim Score 66, broad(NHIP)A method of removing heat from a heat source, comprising steps of:positioning a heat absorbing unit upon the heat source, said heat absorbing unit defining a chamber therein;positioning a heat dissipation unit spaced from said heat absorbing unit, providing said heat dissipation with a liquid circulation module in flow communication with the chamber, and a plurality of cooling fins, said liquid circulation module including at least one hollow cooling body and a pump communicating the cooling body with the chamber, positioning the cooling fins being in thermal contact with said cooling body;wherein said liquid circulation module is formed as one piece.

Independent claims3

27 paragraphs in 4 sections, as filed

BACKGROUND OF THE INVENTION

00011. Field of the Invention

0002The present invention relates generally to cooling systems, and more particularly to a liquid cooling system for rapidly cooling an electrical component such as a Central Processing Unit (CPU).

00032. Related Art

0004With the continuing development of computer electronics technology, new electronic packages such as the latest CPUs can perform more and more functions. Heat generated by these modern electronic packages has increased commensurately. The heat must be removed from the CPUs to prevent them becoming unstable or being damaged. The traditional cooling means such as combined heat sinks and cooling fans are increasingly unable to provide satisfactory cooling performance. Under such circumstances, cooling system using liquid cooling technology is thus developed for cooling the CPUs.

0005Chinese patent numbers 98248834.3 and 99210734.2 respectively disclose such a kind of cooling system. This kind of cooling system generally comprises a cooling base contact the CPU for absorbing heat generated by the CPU. The cooling base generally defines a cavity for receiving liquid coolant therein, and an inlet and an outlet both in communication with the cavity. The cooling system also comprises a heat sink and a pump arranged at proper places within a computer enclosure. A first tube connects the inlet of the cooling base and the pump, so that the coolant enters the cavity along the first tube. A second tube connects the outlet of the cooling base and the pump, so that the heated coolant exits from the cavity along the second tube. The second tube extends through the heat sink, whereupon heat of the heated coolant is transferred to the heat sink to radiate to ambient air. Thus, the heat of the CPU is continuously taken away by circulation of the coolant.

0006However, the cooling base, the tubes, the heat sink, and the pump are discrete components prior to attachment within the computer enclosure. Installation and removal of the cooling system can be troublesome and problematic. In addition, a large space for these discrete components is required. This militates against the trend of electrical devices becoming more and more smaller. Further, the coolant generally can not be completely cooled by passing the heat sink, due to a small contact area between the tube and the heat sink.

SUMMARY OF THE INVENTION

0007Accordingly, an object of the present invention is to provide a liquid cooling system which has an enhanced cooling performance.

0008Another object of the present invention is to provide a liquid cooling system which can be readily installed or removed to or from an electrical enclosure.

0009To achieve the above-mentioned objects, a liquid cooling system in accordance with a preferred embodiment of the present invention comprises a heat absorbing unit defining a chamber therein for containing coolant, and a heat dissipation unit comprising a liquid circulation module in flow communication with the heat absorbing unit, and a plurality of cooling fins. The liquid circulation module comprises first and second hollow cooling bodies cooperatively defining a space therebetween to receive the cooling fins, and a pump coupled to the second cooling body, so that the first and second cooling bodies, the pump, and the heat absorbing unit together forms a closed loop for circulation of the coolant.

0010Other objects, advantages and novel features of the present invention will be drawn from the following detailed description of the preferred embodiment of the present invention with attached drawings, in which:

BRIEF DESCRIPTION OF THE DRAWINGS

0011<figref idref="DRAWINGS">FIG. 1</figref> is an assembled, isometric view of a liquid cooling system in accordance with the preferred embodiment of the present invention, the liquid cooling system comprising a heat absorbing unit and a heat dissipation unit;

0012<figref idref="DRAWINGS">FIG. 2</figref> is an exploded, isometric view of the heat dissipation unit of the liquid cooling system of <figref idref="DRAWINGS">FIG. 1</figref>;

0013<figref idref="DRAWINGS">FIG. 3</figref> is an exploded, isometric view of a liquid circulation module of the heat dissipation unit of <figref idref="DRAWINGS">FIG. 2</figref>;

0014<figref idref="DRAWINGS">FIG. 4</figref> is a schematic view of a flow channel of one cooling body of the liquid circulation module of <figref idref="DRAWINGS">FIG. 3</figref>; and

0015<figref idref="DRAWINGS">FIG. 5</figref> is a schematic view of a liquid cooling system in accordance with an alternative embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

0016Referring to <figref idref="DRAWINGS">FIG. 1</figref>, a liquid cooling system in accordance with a preferred embodiment of the present invention comprises a heat absorbing unit 4 thermally contacting a heat generating component 6, and a heat dissipation unit 2 communicating with the heat absorbing unit 4 by two pipes 100, 200. The heat absorbing unit 4 defines a chamber (not labeled) therein filled with liquid. After absorbing heat from the heat generating component 6, the liquid flows into the heat dissipation unit 2 for dissipation.

0017Referring to <figref idref="DRAWINGS">FIG. 2</figref>, the heat dissipation unit 2 comprises a liquid circulation module 20 forming a space therein, a plurality of cooling fins 27 received in said space, and a cooling fan mounted on the cooling fins 27, to enhance cooling performance of the cooling fins 27. A cutout 272 is defined under the cooling fins 27.

0018Referring to <figref idref="DRAWINGS">FIG. 3</figref>, the liquid circulation module 20 comprises parallel first and second cooling bodies 21, 23, and a pump 24 coupled to the second cooling body 23. The first and second cooling bodies 21, 23 together form the space therebetween to sandwich the cooling fins 27 therein.

0019The first cooling body 21 comprises a first base 215 having a first bottom plate (not labeled) thermally attached to one side of the cooling fins 27, and two pair of opposite first side plates (not labeled) extending from the first bottom plate. A first sealing plate 210 is coupled to the first base 215, thereby forming an inner hollow portion in the first cooling body 21. A flow channel is formed in the hollow portion of the first cooling body 21, as will be described later by reference to <figref idref="DRAWINGS">FIG. 4</figref>. A through hole 216 is defined in the first bottom plate. An outlet port 217 is formed on one first side plate, in communication with the pipe 200.

0020Referring also to <figref idref="DRAWINGS">FIG. 4</figref>, the second cooling body 23 comprises a second base 235 having a second bottom plate 238 thermally attached to an opposite side of the cooling fins 27, and two pairs of second side plates 237 extending from the second bottom plate 238. A second sealing plate 230 is coupled to the second base 235, thereby forming an inner hollow portion in the second cooling body 23. Two kinds of parallel, equidistant heat exchange fins extend perpendicularly from the second bottom plate 238 of the second base 235, namely one first heat exchange fin 239a that locates at a middle of the second bottom plate 238, and a plurality of second heat exchange fins 239b arranged at opposite sides of the heat exchange fin 239a. One end of the first heat exchange fin 239a connects to one second side plate 237, and an opposite end of the first heat exchange fin 239a spaces an opposite second side plate 237 a distance. Both opposite ends of each second heat exchange fin 239b space the opposite second side plates 237 a distance respectively. A flow channel is thus formed in the hollow portion of the second cooling body 23 by the first and second heat exchange fins 239a, 239b. Understandably, the flow channel of the first cooling body 21 may be formed in the like manner. A through opening 232 is defined in the second sealing plate 230. A through hole 236 is defined in the second bottom plate 238, communicating with the through hole 216 of the first cooling body 21 by aduct 22.

0021The pump 24 has a generally cylindrical periphery, and forms an inlet port 242 and an exit port 241. The inlet portion 242 communicates with the pipe 100, and the exit port 241 communicates with the through opening 232 of the second sealing plate 230.

0022The second sealing plate 230 forms a pair of positioning blocks 231 thereon each having an arcuate bearing face, corresponding to an outer peripheral surface of the pump 24. When the pump 24 is placed on the positioning blocks 231, a mounting bracket 26 which covering the pump 24 is attached to the positioning blocks 231 to retain the pump 24 thereat. A fastening aperture 234 is defined in each positioning block 231 at an end thereof. The mounting bracket 26 is configured to be U-shaped, and comprises a pair of generally parallel walls 267, 268 together defining a space therebetween to receive the pump 24 therein. A slot 261 is defined in the mounting bracket 26, for exposure of the inlet port 242. A pair of through apertures 262 is defined in each wall 267, 268, corresponding to the fastening aperture 234 of the positioning block 231. Using fasteners, such as screws 263 to extend through the through apertures 262 into the fastening apertures 234, the mounting bracket 26 can be fixed to the second sealing plate 230. A pair of mounting posts 264 is formed at a free side of the each wall 267, 268.

0023A mounting frame 25 is provided adjacent the first cooling body 21. The mounting frame 25 comprises a base plate 252, and two upper arms 254 and two lower arms 256 perpendicularly extending from four respective corners of the base plate 252. The first cooling body 21 is thus effectively received between the upper and lower arms 254, 256. The upper arms 254 are less than the lower arms 256 in length. Two mounting posts 255 are formed on the upper arms 254 respectively. The mounting posts 255 of the mounting frame 25 and the mounting posts 264 of the mounting bracket 26 are used to mount the cooling fan 28 on the cooling fins 27. Two protrusions 258 are formed on the lower arms 256 respectively, for engaging with the cooling fins 27 at the cutout 272 thereof.

0024In operation of the liquid cooling system, the liquid coolant in the heat absorbing unit 4 absorbs heat from the heat generating component 6. Then the heated liquid coolant is pumped into the liquid circulation module 20 to conduct the heat to the cooling fins 27. The heat is finally radiated to ambient air with the help of the cooling fan 28. Thus, circulation of the liquid coolant can continuously take away the heat produced by the heat generating component 6.

0025In the present invention, the entire system is subdivided into heat absorbing unit 4 and heat dissipation unit 2. The liquid circulation module 20, the cooling fins 27, and the cooling fan 28 of the heat dissipation unit 2 are assembled together prior to attachment to a computer system. Installation or removal of the cooling system to or from the computer system is thus simplified.

0026<figref idref="DRAWINGS">FIG. 5</figref> illustrated a liquid cooling system according to an alternative embodiment of the present invention. The liquid cooling system of the alternative embodiment comprises parallel first, second and third cooling bodies 31, 32, 33. The first, second and third cooling bodies 31, 32, 33 of the alternative embodiment each has a similar structure with the first and second cooling bodies 21, 23 of the preferred embodiment. First and second set of cooling fins 34, 35 are sandwiched between the first and second cooling bodies 31, 32, and the second and third cooling bodies 32, 33 respectively. A pump 36 is attached to ends of the second and third cooling bodies 32, 33. Comparing to the preferred embodiment, since heat exchange area is increased, the cooling result is enhanced.

0027It is understood that the invention may be embodied in other forms without departing from the spirit thereof. The above-descinner walled examples and embodiments are to be considered in all respects as illustrative and not restrictive, and the invention is not to be limited to the details given above.

Contents4

Every citation, both ways

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3 members in 2 offices

This recordMember, by publication datePriority claim

Priority claims5

Priority claims
Document	Office	Kind	Date
92219096	Taiwan Province of China	U	2003-10-28
92219096	Taiwan Province of China	U	2003-10-28
92219096	Taiwan Province of China	–	2003-10-28
92219096	–	–	–
TW20030219096U	–	–	–

Members3

Family members, oldest first
Document	Office	Kind
TWM246989U	Taiwan Province of China	U	2004-10-11
US2005103475A1	United States of America	A1	2005-05-19
US7013959B2	United States of America	B2	2006-03-21

31 transactions on the USPTO file

Allowed after 2 non-final rejections.

Non-final rejections: 2
Final rejections: 0
RCEs: 0
Appeals: 0

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	Event	Code
2014-04-18	Expire PatentEXP.	EXP.
2006-03-21	Recordation of Patent Grant MailedPGM/	PGM/
2006-03-21	Patent Issue Date Used in PTA CalculationAllowedPTAC	PTAC
2006-03-01	Issue Notification MailedAllowedWPIR	WPIR
2006-01-27	Dispatch to FDCD1935	D1935
2006-01-26	Application Is Considered Ready for IssuePILS	PILS
2006-01-04	Issue Fee Payment VerifiedN084	N084
2006-01-04	Issue Fee Payment ReceivedIFEE	IFEE
2005-10-05	Mail Notice of AllowanceAllowedMN/=.	MN/=.
2005-10-03	Notice of Allowance Data Verification CompletedAllowedN/=.	N/=.
2005-09-19	Date Forwarded to ExaminerFWDX	FWDX
2005-09-14	Response after Non-Final ActionA...	A...
2005-06-14	Mail Non-Final RejectionNon-final rejectionMCTNF	MCTNF
2005-06-13	Non-Final RejectionNon-final rejectionCTNF	CTNF
2005-04-03	Date Forwarded to ExaminerFWDX	FWDX
2005-03-25	Response after Non-Final ActionA...	A...
2005-02-10	Mail Non-Final RejectionNon-final rejectionMCTNF	MCTNF
2005-02-07	Non-Final RejectionNon-final rejectionCTNF	CTNF
2005-01-31	IFW TSS Processing by Tech Center CompleteTSSCOMP	TSSCOMP
2005-01-31	Case Docketed to Examiner in GAUDOCK	DOCK
2004-10-22	Application Is Now CompleteCOMP	COMP
2004-10-21	Application Return from OIPEWROIPE	WROIPE
2004-10-21	Application Return TO OIPEROIPE	ROIPE
2004-10-21	Application Dispatched from OIPEOIPE	OIPE
2004-10-04	Cleared by OIPE CSRL194	L194
2004-09-16	IFW Scan & PACR Auto Security ReviewSCAN	SCAN
2004-08-19	Request for Foreign Priority (Priority Papers May Be Included)RQPR	RQPR
2004-08-19	Information Disclosure Statement (IDS) FiledM844	M844
2004-08-19	Information Disclosure Statement (IDS) FiledWIDS	WIDS
2004-08-19	Request for Foreign Priority (Priority Papers May Be Included)RQPR	RQPR
2004-08-19	Initial Exam Team nnIEXX	IEXX

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	Event	Code
2014-05-13	Lapsed due to failure to pay maintenance feeLapsedFP	FP
2014-04-21	Information on status: patent discontinuationPATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362STCH	STCH
2014-03-21	Lapse for failure to pay maintenance feesLapsedLAPS	LAPS
2013-11-01	Maintenance fee reminder mailedREMI	REMI
2009-09-08	Fee paymentFPAY	FPAY
2004-08-19	AssignmentAS	AS