Liquid cooling apparatus

Liquid-cooled heat sink

<p>Cooling unit. . . 2</p><p>Heat absorption unit. . . 4</p><p>Heating electronic components. . . 6</p><p>Coolant circulation device. . . 20</p><p>The first heat sink. . . 21, 31</p><p>The first sealing cover. . . 210</p><p>The first heat dissipation base. . . 215</p><p>Through hole. . . 216, 232, 236</p><p>Liquid outlet. . . 217</p><p>catheter. . . twenty two</p><p>The second heat sink. . . 23, 32</p><p>The second sealing cover. . . 230</p><p>Positioning block. . . 231</p><p>Screw holes. . . 234</p><p>The second cooling base. . . 235</p><p>Side wall. . . 237, 238</p><p>Heat exchange fins. . . 239a, 239b</p><p>Pump body. . . 24, 36</p><p>Outlet port. . . 241</p><p>Inlet port. . . 242</p><p>Bracket. . . 25</p><p>The base. . . 252</p><p>Upper arm. . . 254</p><p>Lower arm. . . 256</p><p>Mounting holes. . . 255, 264</p><p>Protruding. . . 258</p><p>Pump body mounting frame. . . 26</p><p>Slot. . . 261</p><p>perforation. . . 262</p><p>screw. . . 263</p><p>The wall. . . 267, 268</p><p>Heat sink group. . . 27</p><p>gap. . . 272</p><p>Cooling fan. . . 28</p><p>The third heat sink. . . 33</p><p>The first heat sink group. . . 34</p><p>The second heat sink group. . . 35</p><p>Inlet pipe. . . 100</p><p>Outlet pipe. . . 200</p>

The first figure is the assembly diagram of the liquid-cooled heat sink of the present invention, which mainly includes a heat absorption unit and a heat dissipation unit.

The second figure is a three-dimensional exploded view of the heat dissipation unit in the first figure. The heat dissipation unit includes a cooling liquid circulation device, a heat dissipation fin group and a heat dissipation fan.

The third figure is a perspective exploded view of the cooling liquid circulation device in the second figure.

The fourth figure is a schematic diagram of the flow channel in the second heat sink of the cooling liquid circulation device in the third figure.

The fifth figure is a schematic diagram of another embodiment of the liquid-cooled heat sink of the present invention.

[Technical field to which the new model belongs]

This creation is about a heat sink, especially a liquid-cooled heat sink used to cool electronic components.

[Prior Art]

With the continuous development of electronic technology, the operating frequency and speed of electronic components are also increasing. However, high frequency and high speed will cause more and more heat generated by electronic components, and the temperature will become higher and higher, which seriously threatens the performance and stability of electronic components during operation. In order to ensure the normal operation of electronic components, electronic components must be Effective heat dissipation. However, conventional air-cooled heat sinks are increasingly difficult to meet the heat dissipation needs of high-frequency and high-speed electronic components. For this reason, 2 liquid-cooled heat dissipation systems are gradually being adopted by the industry. For related technologies, please refer to Mainland Patent No. 98248834.3 and No. 99210734.2 .

With reference to the above-mentioned patents, it is not difficult to see that the conventional water cooling systems are connected by a series of discretely arranged bucket elements. One is extremely inconvenient to install and disassemble, and the other takes up a lot of space, which is less suitable for the current trend of computer miniaturization. Therefore, due to the large number of connections between the channels of the chambers and the scattered arrangement of the functional components, it is inconvenient to disassemble and assemble, and the vibration generated during disassembly and assembly and the operation of the host is likely to cause damage to the pipeline interface, resulting in leakage, and its consequences It is hard to estimate.

The creator puts forward this creation in view of this.

[content]

The purpose of this creation is to provide a liquid-cooled heat sink with high integration and good heat dissipation effect.

The above objective is achieved by the following technical means: a liquid-cooled heat dissipation device, which includes a heat absorption unit and a heat dissipation unit. The heat absorption unit is provided with a cavity for storing cooling liquid. The heat dissipation unit communicates with the cavity of the heat absorption unit through a liquid inlet pipe and a liquid outlet pipe. The heat dissipation unit includes a cooling liquid circulation device, a heat sink group in close contact with the cooling liquid circulation device, and a heat sink installed on the cooling liquid circulation device. The cooling fan on one side of the radiating fin group, the cooling liquid circulation device includes a first radiating body, a second radiating body connected with the first radiating body, and a pump body fixed to the second radiating body. The cooling fluid transfers heat to the first heat sink and the second heat sink during the circulation process, and the first heat sink and the second heat sink then transfer heat to the heat sink group, which is assisted by the heat sink fan Dissipate heat into the air.

In the liquid-cooled heat sink of this invention, the cooling liquid transfers heat to multiple heat sinks during the flow process, which increases the contact area with the heat sink group, so the heat dissipation effect is significantly enhanced. In addition, the heat dissipation unit of this creation integrates the heat sink, the heat sink, the pump body and the fan, and the structure is compact, which is convenient for users to use.

[Implementation mode]

The liquid-cooled heat sink of the invention will be described in further detail below in conjunction with the accompanying drawings.

Please refer to the first figure, which is a schematic diagram of the liquid-cooled heat sink of the present invention. The liquid-cooled heat sink includes a heat-absorbing unit 4 in close contact with the heat-generating electronic component 6 and a heat-dissipating unit 2, the heat-absorbing unit 4 and the heat-dissipating unit 2 Connect through the liquid inlet pipe 100 and the liquid outlet pipe 200. The heat absorption unit 4 is used for absorbing the heat generated by the heating electronic component 6, and is provided with a cavity (not shown) for storing cooling liquid. After the cooling liquid absorbs the heat of the heat absorption unit 4, it circulates in the heat dissipation unit 2 so as to transfer the heat to the heat dissipation unit 2 and dissipate it into the air.

Referring to the second figure, the heat dissipation unit 2 includes a cooling liquid circulating device 20, two cooling fin groups 27 in contact with the cooling liquid circulating device 20, and a cooling fan 28 located on one side of the cooling fin group 27. The heat sink set 27 is assembled by a plurality of heat sinks, and a notch 272 is provided at the bottom thereof. The cooling liquid transfers heat to the cooling liquid circulating device 20 during the flow of the cooling liquid. The cooling liquid circulating device 20 then transfers the heat to the heat sink set 27. With the aid of the cooling fan 28, the heat sink set 27 radiates the heat to the air. middle.

Continuing to refer to the third figure, the coolant circulation device 20 includes a first radiator 21, a second radiator 23 parallel to the first radiator 21, and a pump body 24 fixed on the second radiator 23 . A space is formed between the first radiating body 21 and the second radiating body 23, and the radiating fin group 27 is accommodated in the space, and the two sides of the radiating fin group 27 are connected to the first radiating body 21 and the second radiating body. 23 Close contact to allow good heat transfer between the two.

The first heat dissipation body 21 includes a first heat dissipation base 215 and a first sealing cover 210. The first heat dissipation base 215 has a bottom wall (not numbered) and a pair of side walls (not numbered). The bottom wall is in close contact with one side of the heat sink set 27, such as by welding, to facilitate heat conduction. The bottom wall is provided with a through hole 216, one of the side walls is provided with a liquid outlet 217, and the liquid outlet 217 is connected to the liquid outlet pipe 200. The first heat sink 21 is provided with a flow channel, which allows the cooling liquid to enter from the through hole 216 and flow out from the liquid outlet 217. The specific structure is described in detail later.

The second heat dissipation body 23 includes a second heat dissipation base 235 and a second sealing cover 230. The second heat dissipation base 235 has a bottom wall (as shown in the fourth figure), and the bottom wall is in close contact with the other side of the heat sink set 27, such as by welding, to facilitate heat conduction. The second sealing cover 230 is provided with a through hole 232, and the through hole 216 on the bottom wall corresponding to the bottom wall of the first heat dissipation base 215 is also provided with a through hole 236 (as shown in the fourth figure), the through holes 216 , 236 are connected through a conduit 22. The second heat dissipating body 23 is provided with a flow channel. The flow path allows the cooling liquid to enter the second heat dissipating body 23 from the through hole 232, and flow out from the through hole 236, and then flow into the first heat dissipating body through the duct 22 Inside the base 21. The flow channel of the second heat dissipation base 23 can be configured the same as the flow channel of the first heat dissipation body 21, as shown in the fourth figure in detail.

The second sealing cover 230 is provided with a pair of positioning blocks 231, and each of the pair of positioning blocks 231 is provided with a concave surface for positioning the pump body 24. After the pump body 24 is positioned, a pump body mounting frame 26 is used to fix it. The pump body 24 has an inlet port 242 and an outlet port 241, the inlet port 242 is connected to the inlet pipe 100, and the outlet port 241 communicates with the second sealing cover 230 of the second heat sink 23 The holes 232 are connected, so that the cooling liquid enters the pump body 24 from the liquid inlet port 242, flows out from the liquid outlet port 241, and then enters the second heat sink 23.

The pump body mounting frame 26 is substantially U-shaped and includes two substantially parallel wall portions 267 and 268. A space for receiving the pump body 24 is formed between the two wall portions 267 and 268. The pump body mounting frame 26 has a slot 261 corresponding to the liquid inlet port 242 of the pump body 24 to allow the liquid inlet port 242 to be exposed. The pump body mounting frame 26 is provided with a pair of through holes 262 on the two wall portions 267, 268, and the positioning block 231 of the second sealing cover 230 of the second heat sink 23 is provided with a pair of through holes 262. The screw hole 234 can be fixed to the pump body mounting frame 26 by using the screw 263 to pass through the corresponding holes 262 and the screw hole 234 to fix the pump body 24. The wall 267 of the pump body mounting frame 26 is further provided with two mounting holes 264 at the end. A bracket 25 is provided adjacent to the first heat sink 21. The bracket 25 includes a base plate 252, and a pair of upper arms 254 and a pair of lower arms 256 extending from the four corners of the base plate 252. The substrate 252 is attached to the first sealing cover 210 of the first heat sink 21, and the pair of upper arms 254 are shorter than the pair of lower arms 256. A protrusion 258 is provided at each end of the pair of lower arms 256, and the protrusions 258 are matched with the notches 272 of the heat sink assembly 27. A mounting hole 255 is provided at each end of the pair of upper arms 254, and the mounting hole 255 of the pair of upper arms 254 and the mounting hole 264 of the pump body mounting frame 26 are used to fix the cooling fan 28.

As shown in the fourth figure, the second heat sink 23 is taken as an example to introduce a possible flow channel. The second heat dissipation base 235 includes two opposite side walls 237 and 238. A plurality of parallel heat exchange fins extend on the bottom wall of the second heat dissipation base 235. The heat exchange fins are divided into two types: 239a and 239b. There are multiple pieces of 239a, and each piece is not in contact with the two side walls 237, 238, so as to allow the cooling liquid to flow through the gap between the heat exchange fin 239a and the two side walls 237, 238. There is only one heat exchange fin 239b, which is arranged in the center of all heat exchange fins. One end of the heat exchange fin 239b is in contact with the side wall 238, and the other end is not in contact with the side wall 237. The top edges of the heat exchange fins 239a and 239b are in sealing contact with the second sealing cover 230. If welding is adopted, a flow channel extending in the direction of the arrow in the figure is formed. The cooling liquid enters the through hole 232 and then advances along the flow path to the through hole 236. The first heat sink 21 can also be provided with a plurality of similar heat exchange fins on the bottom wall to form a flow channel.

Please refer to the fifth figure, which is a schematic diagram of another embodiment of this creation. This embodiment adds a heat sink and a heat sink set on the basis of the first embodiment, which can enhance the heat exchange performance. It mainly includes the first, second and third heat sinks 31, 32, 33, and one is sandwiched there. A first heat sink group 34 between the first and second heat sinks 31, 32, a second heat sink group 35 sandwiched between the second and third heat sinks 32, 33, and a second heat sink group 35 mounted on the first heat sink. The pump body 36 on the side of the second and third heat sinks 32 and 33. The working principle is the same as that of the first embodiment, that is, the cooling liquid transfers heat to the first, second, and third heat sinks 31, 32, 33 during the flow of the coolant, and the first, second, and third heat sinks 31 , 32, 33 then transfer the heat to the first and second heat sink groups 34, 35, and then dissipate to the air. In the second embodiment, if you want to install a fan: just install a device similar to the bracket 25 in the first embodiment on both sides of the first heat sink group 34, and on the side of the second heat sink group 35 There is already a mounting frame for installing the pump body 36 on the side, so only a bracket needs to be provided on the other side of the second heat sink group 35.

In summary, this creation meets the requirements of a new patent, and Yan filed a patent application in accordance with the law. The above is only a preferred embodiment of this creation. For those who are familiar with the technique of this case, the equivalent modifications or changes made in accordance with the spirit of this creation should be covered by the following patent applications.

Schematic description

The first figure is the assembly diagram of the liquid-cooled heat sink of the present invention, which mainly includes a heat absorption unit and a heat dissipation unit.

The second figure is a three-dimensional exploded view of the heat dissipation unit in the first figure. The heat dissipation unit includes a cooling liquid circulation device, a heat dissipation fin group and a heat dissipation fan.

The third figure is a perspective exploded view of the cooling liquid circulation device in the second figure.

The fourth figure is a schematic diagram of the flow channel in the second heat sink of the cooling liquid circulation device in the third figure.

The fifth figure is a schematic diagram of another embodiment of the liquid-cooled heat sink of the present invention.

Symbol description of main components

Cooling unit. . . 2

Heat absorption unit. . . 4

Heating electronic components. . . 6

Coolant circulation device. . . 20

The first heat sink. . . 21, 31

The first sealing cover. . . 210

The first heat dissipation base. . . 215

Through hole. . . 216, 232, 236

Liquid outlet. . . 217

catheter. . . twenty two

The second heat sink. . . 23, 32

The second sealing cover. . . 230

Positioning block. . . 231

Screw holes. . . 234

The second cooling base. . . 235

Side wall. . . 237, 238

Heat exchange fins. . . 239a, 239b

Pump body. . . 24, 36

Outlet port. . . 241

Inlet port. . . 242

Bracket. . . 25

The base. . . 252

Upper arm. . . 254

Lower arm. . . 256

Mounting holes. . . 255, 264

Protruding. . . 258

Pump body mounting frame. . . 26

Slot. . . 261

perforation. . . 262

screw. . . 263

The wall. . . 267, 268

Heat sink group. . . 27

gap. . . 272

Cooling fan. . . 28

The third heat sink. . . 33

The first heat sink group. . . 34

The second heat sink group. . . 35

Inlet pipe. . . 100

Outlet pipe. . . 200