TWM555960U

Photographing module and its molded photosensitive component and electronic equipment

Abstract

A camera module and its molded photosensitive component and electronic equipment, wherein the molded photosensitive component of the camera module includes at least one supporting element, at least one photosensitive element, at least one circuit board, at least one set of leads, and at least one molded Pedestal. The two ends of each group of the leads are respectively connected to the non-photosensitive area of each photosensitive element and each of the circuit boards, and each of the module bases respectively includes a molded body and a light window, When the molding process is performed by a molding die to shape the molded body, each of the supporting elements is used to prevent the inner surface of the molding die from pressing on the lead, wherein the photosensitive element The photosensitive area corresponds to the light window.

TWM555960U, drawing sheet 1 — Sheet 1 of 55

Term

No projected expiry on record.

112 claims: 110 independent, 2 dependent

1
一攝像模組的模塑感光組件，其特徵在於，包括：由第一介質形成的至少一支承元件；至少一感光元件；至少一線路板；至少一組引線，其中每組所述引線的兩端分別被連接於每個所述感光元件的晶片連接件和每個所述線路板的線路板連接件；以及由第二介質形成的至少一模塑基座，其中每個所述模塑基座分別包括一模塑主體和具有至少一光窗，其中在藉由一成型模具進行模塑工藝以使所述模塑主體成型時，所述支承元件用於保護所述感光元件和所述引線，其中所述感光元件的感光區域對應於所述光窗。
2
如申請專利範圍第1項所述的模塑感光組件，其中每個所述支承元件分別包括一框形的支承主體和具有一通孔，所述支承主體包覆所述感光元件的非感光區域的至少一部分，所述感光元件的感光區域對應於所述通孔，其中所述支承主體具有一頂表面、一內側面以及一外側面，所述支承主體的所述頂表面向內和向外分別延伸以連接於所述內側面和所述外側面，所述內側面形成所述通孔，其中在進行模塑工藝時，所述成型模具的所述壓合面與所述支承主體的所述頂表面接觸。
3
如申請專利範圍第2項所述的模塑感光組件，其中所述感光元件的非感光區域包括一晶片內側部、一晶片連接部以及一晶片外側部，其中所述感光元件的所述晶片連接件被設置於所述晶片連接部，所述晶片內側部和所述晶片外側部分別位於所述晶片連接部的內側和外側，其中所述支承主體包覆所述感光元件的所述晶片內側部的至少一部分。
4
如申請專利範圍第2項所述的模塑感光組件，其中所述感光元件的非感光區域包括一晶片內側部、一晶片連接部以及一晶片外側部，其中所述感光元件的所述晶片連接件被設置於所述晶片連接部，所述晶片內側部和所述晶片外側部分別位於所述晶片連接部的內側和外側，其中所述支承主體包覆所述感光元件的所述晶片內側部的至少一部分和所述晶片連接部的至少一部分。
5
如申請專利範圍第2項所述的模塑感光組件，其中所述感光元件的非感光區域包括一晶片內側部、一晶片連接部以及一晶片外側部，其中所述感光元件的所述晶片連接件被設置於所述晶片連接部，所述晶片內側部和所述晶片外側部分別位於所述晶片連接部的內側和外側，其中所述支承主體包覆所述感光元件的所述晶片內側部的至少一部分、所述晶片連接部和所述晶片外側部的至少一部分。
6
如申請專利範圍第2項所述的模塑感光組件，其中所述感光元件的非感光區域包括一晶片內側部、一晶片連接部以及一晶片外側部，其中所述感光元件的所述晶片連接件被設置於所述晶片連接部，所述晶片內側部和所述晶片外側部分別位於所述晶片連接部的內側和外側，其中所述支承主體包覆所述感光元件的所述晶片連接部的至少一部分和所述晶片外側部的至少一部分。
7
如申請專利範圍第2項所述的模塑感光組件，其中所述感光元件的非感光區域包括一晶片內側部、一晶片連接部以及一晶片外側部，其中所述感光元件的所述晶片連接件被設置於所述晶片連接部，所述晶片內側部和所述晶片外側部分別位於所述晶片連接部的內側和外側，其中所述支承主體包覆所述感光元件的所述晶片外側部的至少一部分。
8
如申請專利範圍第2項所述的模塑感光組件，其中所述感光元件的非感光區域包括一晶片內側部、一晶片連接部以及一晶片外側部，其中所述感光元件的所述晶片連接件被設置於所述晶片連接部，所述晶片內側部和所述晶片外側部分別形成於所述晶片連接部的內側和外側，其中所述支承主體包覆所述感光元件的所述晶片連接部的至少一部分。
9
如申請專利範圍第1項所述的模塑感光組件，其中每個所述支承元件分別包括一框形的支承主體和具有一通孔，所述支承主體包覆所述線路板的邊緣區域的至少一部分，所述感光元件的感光區域對應於所述通孔，其中所述支承主體具有一頂表面、一內側面以及一外側面，所述支承主體的所述頂表面向內和向外分別延伸以連接於所述內側面和外側面，所述內側面形成所述通孔，其中在進行模塑工藝時，所述成型模具的所述壓合面和所述支承主體的所述頂表面接觸。
10
如申請專利範圍第9項所述的模塑感光組件，其中所述支承主體進一步包覆所述感光元件的至少一部分。
11
如申請專利範圍第9項所述的模塑感光組件，其中所述線路板的所述邊緣區域包括一線路板內側部、一線路板連接部以及一線路板外側部，其中所述線路板的所述線路板連接件被設置於所述線路板連接部，所述線路板內側部和所述線路板外側部分別位於所述線路板連接部的內側和外側，其中所述感光元件的非感光區域包括一晶片內側部、一晶片連接部以及一晶片外側部，其中所述感光元件的所述晶片連接件被設置於所述晶片連接部，所述晶片內側部和所述晶片外側部分別位於所述晶片連接部的內側和外側，其中所述支承主體包覆所述線路板內側部的至少一部分和所述晶片外側部的至少一部分。
12
如申請專利範圍第9項所述的模塑感光組件，其中所述線路板的所述邊緣區域包括一線路板內側部、一線路板連接部以及一線路板外側部，其中所述線路板的所述線路板連接件被設置於所述線路板連接部，所述線路板內側部和所述線路板外側部分別位於所述線路板連接部的內側和外側，其中所述感光元件的非感光區域包括一晶片內側部、一晶片連接部以及一晶片外側部，其中所述感光元件的所述晶片連接件被設置於所述晶片連接部，所述晶片內側部和所述晶片外側部分別位於所述晶片連接部的內側和外側，其中所述支承主體包覆所述線路板內側部的至少一部分、所述晶片外側部和所述晶片連接部的至少一部分。
13
如申請專利範圍第9項所述的模塑感光組件，其中所述線路板的所述邊緣區域包括一線路板內側部、一線路板連接部以及一線路板外側部，其中所述線路板的所述線路板連接件被設置於所述線路板連接部，所述線路板內側部和所述線路板外側部分別位於所述線路板連接部的內側和外側，其中所述感光元件的非感光區域包括一晶片內側部、一晶片連接部以及一晶片外側部，其中所述感光元件的所述晶片連接件被設置於所述晶片連接部，所述晶片內側部和所述晶片外側部分別位於所述晶片連接部的內側和外側，其中所述支承主體包覆所述線路板內側部的至少一部分、所述晶片外側部、所述晶片連接部和所述晶片內側部的至少一部分。
14
如申請專利範圍第9項所述的模塑感光組件，其中所述線路板的所述邊緣區域包括一線路板內側部、一線路板連接部以及一線路板外側部，其中所述線路板的所述線路板連接件被設置於所述線路板連接部，所述線路板內側部和所述線路板外側部分別位於所述線路板連接部的內側和外側，其中所述感光元件的非感光區域包括一晶片內側部、一晶片連接部以及一晶片外側部，其中所述感光元件的所述晶片連接件被設置於所述晶片連接部，所述晶片內側部和所述晶片外側部分別位於所述晶片連接部的內側和外側，其中所述支承主體包覆所述線路板連接部的至少一部分、所述線路板內側部和所述晶片外側部的至少一部分。
15
如申請專利範圍第9項所述的模塑感光組件，其中所述線路板的所述邊緣區域包括一線路板內側部、一線路板連接部以及一線路板外側部，其中所述線路板的所述線路板連接件被設置於所述線路板連接部，所述線路板內側部和所述線路板外側部分別位於所述線路板連接部的內側和外側，其中所述感光元件的非感光區域包括一晶片內側部、一晶片連接部以及一晶片外側部，其中所述感光元件的所述晶片連接件被設置於所述晶片連接部，所述晶片內側部和所述晶片外側部分別位於所述晶片連接部的內側和外側，其中所述支承主體包覆所述線路板外側部的至少一部分、所述線路板連接部、所述線路板內側部和所述晶片外側部的至少一部分。
16
如申請專利範圍第9項所述的模塑感光組件，其中所述線路板的所述邊緣區域包括一線路板內側部、一線路板連接部以及一線路板外側部，其中所述線路板的所述線路板連接件被設置於所述線路板連接部，所述線路板內側部和所述線路板外側部分別位於所述線路板連接部的內側和外側，其中所述感光元件的非感光區域包括一晶片內側部、一晶片連接部以及一晶片外側部，其中所述感光元件的所述晶片連接件被設置於所述晶片連接部，所述晶片內側部和所述晶片外側部分別位於所述晶片連接部的內側和外側，其中所述支承主體包覆所述線路板連接部的至少一部分、所述線路板內側部、所述晶片外側部和所述晶片連接部的至少一部分。
17
如申請專利範圍第9項所述的模塑感光組件，其中所述線路板的所述邊緣區域包括一線路板內側部、一線路板連接部以及一線路板外側部，其中所述線路板的所述線路板連接件被設置於所述線路板連接部，所述線路板內側部和所述線路板外側部分別位於所述線路板連接部的內側和外側，其中所述感光元件的非感光區域包括一晶片內側部、一晶片連接部以及一晶片外側部，其中所述感光元件的所述晶片連接件被設置於所述晶片連接部，所述晶片內側部和所述晶片外側部分別位於所述晶片連接部的內側和外側，其中所述支承主體包覆所述線路板連接部的至少一部分、所述線路板內側部、所述晶片外側部、所述晶片連接部和所述晶片內側部的至少一部分。
18
如申請專利範圍第9項所述的模塑感光組件，其中所述線路板的所述邊緣區域包括一線路板內側部、一線路板連接部以及一線路板外側部，其中所述線路板的所述線路板連接件被設置於所述線路板連接部，所述線路板內側部和所述線路板外側部分別位於所述線路板連接部的內側和外側，其中所述感光元件的非感光區域包括一晶片內側部、一晶片連接部以及一晶片外側部，其中所述感光元件的所述晶片連接件被設置於所述晶片連接部，所述晶片內側部和所述晶片外側部分別位於所述晶片連接部的內側和外側，其中所述支承主體包覆所述線路板外側部的至少一部分、所述線路板連接部、所述線路板內側部、所述晶片外側部和所述晶片連接部的至少一部分。
19
如申請專利範圍第9項所述的模塑感光組件，其中所述線路板的所述邊緣區域包括一線路板內側部、一線路板連接部以及一線路板外側部，其中所述線路板的所述線路板連接件被設置於所述線路板連接部，所述線路板內側部和所述線路板外側部分別位於所述線路板連接部的內側和外側，其中所述感光元件的非感光區域包括一晶片內側部、一晶片連接部以及一晶片外側部，其中所述感光元件的所述晶片連接件被設置於所述晶片連接部，所述晶片內側部和所述晶片外側部分別位於所述晶片連接部的內側和外側，其中所述支承主體包覆所述線路板外側部的至少一部分、所述線路板連接部、所述線路板內側部、所述晶片外側部、所述晶片連接部和所述晶片內側部的至少一部分。
20
如申請專利範圍第2項至19項中任一所述的模塑感光組件，其中所述模塑主體包覆所述支承主體的所述外側面。
21
如申請專利範圍第20項所述的模塑感光組件，其中所述模塑主體進一步包覆所述支承主體的所述頂表面的至少一部分。
22
如申請專利範圍第1項至19項中任一所述的模塑感光組件，其中所述支承元件的高度高於或者等於所述引線向上突起的高度。
23
如申請專利範圍第1項至19項中任一所述的模塑感光組件，其中所述支承元件的高度低於所述引線向上突起的高度。
24
如申請專利範圍第1項至19項中任一所述的模塑感光組件，其中所述支承元件具有彈性。
25
如申請專利範圍第1項至19項中任一所述的模塑感光組件，其中所述支承元件具有粘性。
26
如申請專利範圍第24項所述的模塑感光組件，其中所述支承元件的邵氏硬度的範圍為A50-A80，彈性模量範圍為0.1Gpa-1Gpa。
27
一攝像模組的模塑感光組件，其特徵在於，包括：至少一感光元件；至少一線路板；至少一組引線，其中每組所述引線的兩端分別連接於每個所述感光元件的晶片連接件和每個所述線路板的線路板連接件；至少一支承元件，其中每個所述支承元件被設置包覆每組所述引線的至少一部分；以及至少一模塑基座，其中每個所述模塑基座分別包括一模塑主體和具有至少一光窗，其中所述模塑主體在成型後包覆所述線路板的邊緣區域和所述支承元件的至少一部分，每個所述感光元件的感光區域分別對應於每個所述模塑基座的所述光窗。
28
如申請專利範圍第27項所述的模塑感光組件，其中所述支承元件包括一支承主體和一通孔，所述支承主體具有一頂表面、一內側面以及一外側面，所述支承主體的所述頂表面向內和向外分別延伸以連接於所述內側面和所述外側面，所述內側面形成所述通孔，其中所述支承主體被設置包覆所述引線的至少一部分，所述感光元件對應於所述通孔，所述模塑主體包覆所述支承主體的所述外側面。
29
如申請專利範圍第28項所述的模塑感光組件，其中所述模塑基座進一步包括所述支承主體的所述頂表面的至少一部分。
30
一帶有模塑感光組件的攝像模組，其特徵在於，包括：至少一光學鏡頭；和至少一模塑感光組件，其中每個所述模塑感光組件分別進一步包括：由第一介質形成的一支承元件；一感光元件；一線路板；一組引線，其中每個所述引線的兩端分別被連接於所述感光元件的晶片連接件和所述線路板的線路板連接件；以及由第二介質形成的一模塑基座，其中所述模塑基座包括一模塑主體和具有一光窗，其中在藉由一成型模具進行模塑工藝以使所述模塑主體成型時，所述支承元件用於阻止所述成型模具的壓合面施壓於所述引線，其中所述感光元件的感光區域對應於所述光窗，其中每個所述光學鏡頭分別被設置於每個所述模塑感光組件的所述感光元件的感光路徑。
31
如申請專利範圍第30項所述的攝像模組，進一步包括至少一驅動器，其中每個所述光學鏡頭分別被組裝於每個所述驅動器，每個所述驅動器分別被組裝於每個所述模塑感光組件的所述模塑主體的頂表面。
32
如申請專利範圍第30項或31項所述的攝像模組，進一步包括至少一濾光元件，其中每個所述濾光元件分別被設置於每個所述光學鏡頭和每個所述模塑感光組件的所述感光元件之間。
33
如申請專利範圍第32項所述的攝像模組，其中每個所述濾光元件分別被組裝於每個所述模塑感光組件的所述模塑主體的頂表面。
34
如申請專利範圍第33項所述的攝像模組，其中所述模塑主體的頂表面具有一內側表面和一外側表面，其中所述內側表面所在的平面低於所述外側表面所在的平面，以使所述模塑主體形成一凹槽，所述濾光元件被組裝於所述模塑主體的所述內側表面並且位於所述凹槽，所述驅動器被組裝於所述模組主體的所述外側表面。
35
如申請專利範圍第32項所述的攝像模組，進一步包括至少一支持件，其中每個所述濾光元件被組裝於每個所述支持件，每個所述支持件被組裝於所述模塑主體的頂表面，以使每個所述濾光元件分別被設置於每個所述光學鏡頭和每個所述模塑感光組件的所述感光元件之間。
36
一帶有模塑感光組件的攝像模組，其特徵在於，包括：至少一光學鏡頭；和至少一模塑感光組件，其中每個所述模塑感光組件分別進一步包括：一感光元件；一線路板；一組引線，其中每個所述引線的兩端分別連接於所述感光元件的晶片連接件和所述線路板的線路板連接件；一支承元件，其中所述支承元件被設置包覆每個所述引線的至少一部分；以及一模塑基座，其中所述模塑基座包括一模塑主體和具有一光窗，其中所述模塑主體在成型後包覆所述線路板的邊緣區域和所述支承元件的至少一部分，每個所述感光元件的感光區域分別對應於所述模塑基座的所述光窗，其中每個所述光學鏡頭分別被設置於每個所述模塑感光組件的所述感光元件的感光路徑。
37
如申請專利範圍第36項所述的攝像模組，其中所述攝像模組是定焦攝像模組或變焦攝像模組。
38
一電子設備，其特徵在於，包括：一電子設備本體；和至少一攝像模組，其中每個所述攝像模組分別被設置於所述電子設備本體，以用於獲取圖象，其中每個所述攝像模組分別進一步包括至少一光學鏡頭和至少一模塑感光組件，所述模塑感光組件包括一支承元件，一感光元件，一線路板，一組引線和一模塑基座，其中每個所述引線的兩端分別被連接於所述感光元件的晶片連接件和所述線路板的線路板連接件，其中所述模塑基座包括一模塑主體和具有一光窗，其中在藉由一成型模具進行模塑工藝以使所述模塑主體成型時，所述支承元件用於阻止所述成型模具的壓合面施壓於所述引線，其中所述感光元件的感光區域對應於所述光窗，其中每個所述光學鏡頭分別被設置於每個所述模塑感光組件的所述感光元件的感光路徑。
39
一模塑感光組件，其特徵在於，包括：由第一介質形成的至少一支承元件；至少一線路板，其中每個所述線路板分別具有至少一晶片貼裝區域；至少兩感光元件，其中每個所述感光元件分別被貼裝於每個所述線路板的每個所述晶片貼裝區域；至少兩組引線，其中每組所述引線的兩端分別被連接於每個所述感光元件的晶片連接件和每個所述線路板的線路板連接件；以及由第二介質形成的一模塑基座，其中所述模塑基座包括一模塑主體和具有至少兩光窗，其中在所述模塑主體成型時，所述支承元件保護所述引線、所述線路板和所述感光元件，在所述模塑主體成型後，所述模塑主體至少與每個所述線路板的一部分一體地結合，並且每個所述感光元件的感光區域分別對應於所述模塑基座的每個所述光窗。
40
如申請專利範圍第39項所述的模塑感光組件，其中所述模塑感光組件包括兩個所述支承元件、一個所述線路板、兩個所述感光元件以及兩組所述引線，並且所述線路板具有兩個所述晶片貼裝區域。
41
如申請專利範圍第39項所述的模塑感光組件，其中所述模塑感光組件包括兩個所述支承元件、兩個所述線路板、兩個所述感光元件以及兩組所述引線，並且每個所述線路板分別具有一個所述晶片貼裝區域。
42
如申請專利範圍第39項所述的模塑感光組件，進一步包括至少一電子元器件，其中所述線路板具有一邊緣區域，所述邊緣區域和所述晶片貼裝區域一體地成型，每個所述電子元器件分別被貼裝於所述邊緣區域，其中所述支承元件位於所述電器元器件和所述感光元件的所述感光區域之間。
43
如申請專利範圍第39項至42項中任一所述的模塑感光組件，其中所述支承元件包括一框形的支承主體和具有一通孔，所述支承主體被設置於所述感光元件的所述感光區域的外部，所述感光元件的所述感光區域對應於所述通孔，其中所述模塑主體包覆所述支承主體的一部分。
44
如申請專利範圍第43項所述的模塑感光組件，其中所述支承主體具有一頂表面、一內側面以及一外側面，所述頂表面分別向內和向外延伸以連接於所述內側面和所述外側面，所述內側面形成所述通孔，其中所述模塑主體至少包覆所述支承主體的所述外側面。
45
如申請專利範圍第43項所述的模塑感光組件，其中所述支承主體具有一頂表面、一內側面以及一外側面，所述頂表面分別向內和向外延伸以連接於所述內側面和所述外側面，所述內側面形成所述通孔，其中所述模塑主體包覆所述支承主體的所述外側面和所述頂表面的至少一部分。
46
如申請專利範圍第45項所述的模塑感光組件，其中所述感光元件的非感光區域包括一晶片內側部、一晶片連接部以及一晶片外側部，所述晶片連接件被設置於所述晶片連接部，所述晶片內側部和所述晶片外側部分別位於所述晶片連接部的兩側，其中所述支承主體包覆所述感光元件的所述晶片內側部的至少一部分。
47
如申請專利範圍第45項所述的模塑感光組件，其中所述感光元件的非感光區域包括一晶片內側部、一晶片連接部以及一晶片外側部，所述晶片連接件被設置於所述晶片連接部，所述晶片內側部和所述晶片外側部分別位於所述晶片連接部的兩側，其中所述支承主體包覆所述感光元件的所述晶片連接部的至少一部分。
48
如申請專利範圍第45項所述的模塑感光組件，其中所述感光元件的非感光區域包括一晶片內側部、一晶片連接部以及一晶片外側部，所述晶片連接件被設置於所述晶片連接部，所述晶片內側部和所述晶片外側部分別位於所述晶片連接部的兩側，其中所述支承主體包覆所述感光元件的所述晶片外側部的至少一部分。
49
如申請專利範圍第45項所述的模塑感光組件，其中所述感光元件的非感光區域包括一晶片內側部、一晶片連接部以及一晶片外側部，所述晶片連接件被設置於所述晶片連接部，所述晶片內側部和所述晶片外側部分別位於所述晶片連接部的兩側，其中所述支承主體包覆所述感光元件的所述晶片內側部的至少一部分和所述晶片連接部的至少一部分。
50
如申請專利範圍第45項所述的模塑感光組件，其中所述感光元件的非感光區域包括一晶片內側部、一晶片連接部以及一晶片外側部，所述晶片連接件被設置於所述晶片連接部，所述晶片內側部和所述晶片外側部分別位於所述晶片連接部的兩側，其中所述支承主體包覆所述感光元件的所述晶片連接部的至少一部分和所述晶片外側部的至少一部分。
51
如申請專利範圍第45項所述的模塑感光組件，其中所述感光元件的非感光區域包括一晶片內側部、一晶片連接部以及一晶片外側部，所述晶片連接件被設置於所述晶片連接部，所述晶片內側部和所述晶片外側部分別位於所述晶片連接部的兩側，其中所述支承主體包覆所述感光元件的所述晶片內側部的至少一部分、所述晶片連接部和所述晶片外側部的至少一部分。
52
如申請專利範圍第45項所述的模塑感光組件，其中所述線路板的所述邊緣區域包括一線路板內側部、一線路板連接部以及一線路板外側部，所述線路板連接件被設置於所述線路板連接部，所述線路板內側部和所述線路板外側部分別位於所述線路板連接部的兩側，其中所述支承主體包覆所述線路板的所述線路板內側部的至少一部分。
53
如申請專利範圍第45項所述的模塑感光組件，其中所述線路板的所述邊緣區域包括一線路板內側部、一線路板連接部以及一線路板外側部，所述線路板連接件被設置於所述線路板連接部，所述線路板內側部和所述線路板外側部分別位於所述線路板連接部的兩側，其中所述支承主體包覆所述線路板的所述線路板連接部的至少一部分。
54
如申請專利範圍第45項所述的模塑感光組件，其中所述線路板的所述邊緣區域包括一線路板內側部、一線路板連接部以及一線路板外側部，所述線路板連接件被設置於所述線路板連接部，所述線路板內側部和所述線路板外側部分別位於所述線路板連接部的兩側，其中所述支承主體包覆所述線路板的所述線路板外側部的一部分。
55
如申請專利範圍第45項所述的模塑感光組件，其中所述線路板的所述邊緣區域包括一線路板內側部、一線路板連接部以及一線路板外側部，所述線路板連接件被設置於所述線路板連接部，所述線路板內側部和所述線路板外側部分別位於所述線路板連接部的兩側，其中所述支承主體包覆所述線路板的所述線路板內側部的至少一部分和所述線路板連接部的至少一部分。
56
如申請專利範圍第45項所述的模塑感光組件，其中所述線路板的所述邊緣區域包括一線路板內側部、一線路板連接部以及一線路板外側部，所述線路板連接件被設置於所述線路板連接部，所述線路板內側部和所述線路板外側部分別位於所述線路板連接部的兩側，其中所述支承主體包覆所述線路板的所述線路板連接部的至少一部分和所述線路板外側部的一部分。
57
如申請專利範圍第45項所述的模塑感光組件，其中所述線路板的所述邊緣區域包括一線路板內側部、一線路板連接部以及一線路板外側部，所述線路板連接件被設置於所述線路板連接部，所述線路板內側部和所述線路板外側部分別位於所述線路板連接部的兩側，其中所述支承主體包覆所述線路板的所述線路板內側部的至少一部分、所述線路板連接部和所述線路板外側部的一部分。
58
如申請專利範圍第45項所述的模塑感光組件，其中所述感光元件的非感光區域包括一晶片內側部、一晶片連接部以及一晶片外側部，所述晶片連接件被設置於所述晶片連接部，所述晶片內側部和所述晶片外側部分別位於所述晶片連接部的兩側，其中所述線路板的所述邊緣區域包括一線路板內側部、一線路板連接部以及一線路板外側部，所述線路板連接件被設置於所述線路板連接部，所述線路板內側部和所述線路板外側部分別位於所述線路板連接部的兩側，其中所述支承主體包覆所述線路板的所述線路板內側部的至少一部分以及所述感光元件的所述晶片外側部的至少一部分。
59
如申請專利範圍第45項所述的模塑感光組件，其中所述感光元件的非感光區域包括一晶片內側部、一晶片連接部以及一晶片外側部，所述晶片連接件被設置於所述晶片連接部，所述晶片內側部和所述晶片外側部分別位於所述晶片連接部的兩側，其中所述線路板的所述邊緣區域包括一線路板內側部、一線路板連接部以及一線路板外側部，所述線路板連接件被設置於所述線路板連接部，所述線路板內側部和所述線路板外側部分別位於所述線路板連接部的兩側，其中所述支承主體包覆所述線路板的所述線路板內側部和所述線路板連接部的至少一部分以及所述感光元件的所述晶片外側部的至少一部分。
60
如申請專利範圍第45項所述的模塑感光組件，其中所述感光元件的非感光區域包括一晶片內側部、一晶片連接部以及一晶片外側部，所述晶片連接件被設置於所述晶片連接部，所述晶片內側部和所述晶片外側部分別位於所述晶片連接部的兩側，其中所述線路板的所述邊緣區域包括一線路板內側部、一線路板連接部以及一線路板外側部，所述線路板連接件被設置於所述線路板連接部，所述線路板內側部和所述線路板外側部分別位於所述線路板連接部的兩側，其中所述支承主體包覆所述線路板的所述線路板內側部、所述線路板連接部和所述線路板外側部的一部分以及所述感光元件的所述晶片外側部的至少一部分。
61
如申請專利範圍第58項所述的模塑感光組件，其中所述支承主體進一步包覆所述感光元件的所述晶片連接部的至少一部分。
62
如申請專利範圍第59項所述的模塑感光組件，其中所述支承主體進一步包覆所述感光元件的所述晶片連接部的至少一部分。
63
如申請專利範圍第60項所述的模塑感光組件，其中所述支承主體進一步包覆所述感光元件的所述晶片連接部的至少一部分。
64
如申請專利範圍第61項所述的模塑感光組件，其中所述支承主體進一步包覆所述感光元件的所述晶片內側部的至少一部分。
65
如申請專利範圍第62項所述的模塑感光組件，其中所述支承主體進一步包覆所述感光元件的所述晶片內側部的至少一部分。
66
如申請專利範圍第63項所述的模塑感光組件，其中所述支承主體進一步包覆所述感光元件的所述晶片內側部的至少一部分。
67
一陣列攝像模組，其特徵在於，包括：至少兩光學鏡頭；以及一模塑感光組件，其中所述模塑感光組件進一步包括：由第一介質形成的至少一支承元件；至少一線路板，其中每個所述線路板分別具有至少一晶片貼裝區域；至少兩感光元件，其中每個所述感光元件分別被貼裝於每個所述線路板的每個所述晶片貼裝區域；至少兩組引線，其中每組所述引線的兩端分別被連接於每個所述感光元件的晶片連接件和每個所述線路板的線路板連接件；以及由第二介質形成的一模塑基座，其中所述模塑基座包括一模塑主體和具有至少兩光窗，其中在所述模塑主體成型時，所述支承元件保護所述引線、所述線路板和所述感光元件，在所述模塑主體成型後，所述模塑主體至少與每個所述線路板的一部分一體地結合，並且每個所述感光元件的感光區域分別對應於所述模塑基座的每個所述光窗，每個所述光學鏡頭分別被設置於每個所述感光元件的感光路徑，以藉由所述光窗為所述光學鏡頭和所述感光元件提供一光線通路。
68
如申請專利範圍第67項所述的陣列攝像模組，進一步包括至少兩驅動器，其中每個所述光學鏡頭分別被組裝於每個所述驅動器，每個所述驅動器分別被組裝於所述模塑主體的頂表面。
69
如申請專利範圍第67項所述的陣列攝像模組，進一步包括至少一驅動器和至少一鏡筒，每個所述光學鏡頭分別被組裝於每個所述驅動器和每個所述鏡筒，其中每個所述驅動器和每個所述鏡筒分別位於所述模塑主體的頂表面的不同位置。
70
如申請專利範圍第67項所述的陣列攝像模組，進一步包括至少兩鏡筒，其中每個所述鏡筒分別一體地形成於所述模塑主體的頂表面，每個所述光學鏡頭分別被組裝於每個所述鏡筒；或者進一步包括至少兩鏡筒，其中至少一個所述鏡筒一體地形成於所述模塑主體的頂表面，另外的所述鏡筒被貼裝於所述模塑主體的頂表面，每個所述光學鏡頭分別被組裝於每個所述鏡筒；或者所述陣列攝像模組包括貼裝於所述模塑主體的頂表面的兩個鏡筒，每個所述光學鏡頭分別被組裝於每個所述鏡筒。
71
如申請專利範圍第68項所述的陣列攝像模組，進一步包括至少一濾光元件，其中每個所述濾光元件分別被組裝於所述模塑主體的頂表面，以使每個所述濾光元件被保持在每個所述光學鏡頭和每個所述感光元件之間。
72
如申請專利範圍第71項所述的陣列攝像模組，其中所述模塑主體的頂表面具有至少兩內側表面和一外側表面，其中每個所述濾光元件分別被組裝於所述模塑主體的每個所述內側表面，每個所述驅動器分別被組裝於所述模塑主體的所述外側表面的不同位置。
73
如申請專利範圍第72項所述的陣列攝像模組，其中所述模塑主體的所述內側表面所在的平面低於所述外側表面所在的平面，以形成所述模塑主體的至少一凹槽，其中每個所述濾光元件分別位於每個所述凹槽。
74
如申請專利範圍第67項至72項中任一所述的陣列攝像模組，其中所述支承元件包括一框形的支承主體和具有一通孔，所述支承主體被設置於所述感光元件的所述感光區域的外部，所述感光元件的所述感光區域對應於所述通孔，其中所述模塑主體包覆所述支承主體的一部分。
75
如申請專利範圍第74項所述的陣列攝像模組，其中所述支承主體包覆所述線路板的邊緣區域的一部分。
76
如申請專利範圍第74項所述的陣列攝像模組，其中所述支承主體包覆所述感光元件的非感光區域的至少一部分。
77
如申請專利範圍第74項所述的陣列攝像模組，其中所述支承主體同時包覆所述線路板的邊緣區域的一部分和所述感光元件的非感光區域的至少一部分。
78
如申請專利範圍第67項所述的陣列攝像模組，進一步包括至少一支持件和至少一濾光元件，其中每個所述濾光元件被組裝於每個所述支持件，每個所述支持件分別被組裝於所述模塑主體的頂表面，以使每個所述濾光元件被保持在每個所述光學鏡頭和每個所述感光元件之間。
79
一電子設備，其特徵在於，包括：一電子設備本體；和如申請專利範圍第67項至78項中任一所述的一個所述陣列攝像模組，其中所述陣列攝像模組被設置於所述電子設備本體，以用於獲取圖象。
80
一攝像模組，其特徵在於，包括：至少一線路板；至少一光學鏡頭；至少一保護框；至少一感光晶片，其中所述保護框被凸起地設置於所述感光晶片的感光區域的外周側；以及至少一一體封裝支架，其中所述一體封裝支架被設置包裹所述線路板和所述感光晶片的非感光區域，以使所述一體封裝支架、所述線路板和所述感光晶片結合為一體，其中所述光學鏡頭被設置於所述感光晶片的感光路徑，其中所述感光晶片與所述線路板被導通連接。
81
如申請專利範圍第80項所述的攝像模組，其中所述保護框的內側邊的尺寸大於或者等於所述感光晶片的感光區域的尺寸。
82
如申請專利範圍第81項所述的攝像模組，其中所述保護框的外側邊的尺寸小於或者等於所述感光晶片的尺寸。
83
如申請專利範圍第80項所述的攝像模組，其中所述保護框具有彈性。
84
如申請專利範圍第80項所述的攝像模組，進一步包括一膠合層，其中所述膠合層被設置於所述保護框和所述感光晶片的感光區域的外周側之間，以藉由所述膠合層連接所述保護框和所述感光晶片的感光區域的外周側。
85
如申請專利範圍第80項所述的攝像模組，其中所述一體封裝支架進一步被設置包裹所述保護框的外側面。
86
如申請專利範圍第80項至85項中任一所述的攝像模組，進一步包括一鏡頭支撐體，其中所述鏡頭支撐體被設置於所述一體封裝支架，所述光學鏡頭被設置於所述鏡頭支撐體。
87
如申請專利範圍第86項所述的攝像模組，其中所述鏡頭支撐體與所述一體封裝支架一體地形成。
88
如申請專利範圍第86項所述的攝像模組，其中所述鏡頭支撐體是一馬達，並且所述馬達與所述線路板被導通連接。
89
如申請專利範圍第80項至85項中任一所述的攝像模組，進一步包括一濾光元件，其中所述濾光元件被設置於所述一體封裝支架的頂部，以使所述濾光元件位於所述感光晶片和所述光學鏡頭之間。
90
如申請專利範圍第86項所述的攝像模組，進一步包括一濾光元件，其中所述濾光元件被設置於所述一體封裝支架的頂部，以使所述濾光元件位於所述感光晶片和所述光學鏡頭之間。
91
一攝像模組，其特徵在於，包括：至少一線路板；至少一光學鏡頭；至少一保護框；至少一感光晶片；至少一濾光元件，其中所述濾光元件被重疊地設置於所述感光晶片，所述保護框被設置於所述濾光元件的外周側；以及至少一一體封裝支架，其中所述一體封裝支架被設置包覆所述濾光元件的外周側和所述線路板，以使所述一體封裝支架，所述濾光元件、所述感光晶片和所述線路板結合為一體，其中所述光學鏡頭被設置於所述感光晶片的感光路徑，所述感光晶片與所述線路板導通連接。
92
如申請專利範圍第91項所述的攝像模組，其中所述保護框的內側邊的尺寸大於或者等於所述感光晶片的感光區域的尺寸，以使所述保護框不會遮擋所述感光晶片的感光區域。
93
如申請專利範圍第92項所述的攝像模組，其中所述保護框具有彈性。
94
如申請專利範圍第93項所述的攝像模組，進一步包括一膠合層，其中所述膠合層被設置於所述保護框和所述濾光元件之間，以藉由所述膠合層連接所述保護框和所述濾光元件的外周側。
95
如申請專利範圍第91項至94項中任一所述的攝像模組，其中所述一體封裝支架進一步被設置包裹所述保護框的外側面。
96
如申請專利範圍第91項至94項中任一所述的攝像模組，進一步包括一鏡頭支撐體，其中所述鏡頭支撐體被設置於所述一體封裝支架，所述光學鏡頭被設置於所述鏡頭支撐體。
97
如申請專利範圍第95項所述的攝像模組，進一步包括一鏡頭支撐體，其中所述鏡頭支撐體被設置於所述一體封裝支架，所述光學鏡頭被設置於所述鏡頭支撐體。
98
如申請專利範圍第96項所述的攝像模組，其中所述鏡頭支撐體與所述一體封裝支架一體地形成。
99
一攝像模組，其特徵在於，包括：至少一線路板；至少一光學鏡頭；至少一阻隔元件；至少一感光晶片，其中所述阻隔元件被凸起地設置於所述感光晶片的感光區域的外周側；以及至少一一體封裝支架，其一體地包覆於所述線路板和所述感光晶片的非感光區域，所述一體封裝支架、所述感光晶片和所述線路板結合為一體，其中所述光學鏡頭被設置於所述感光晶片的感光路徑，所述感光晶片與所述線路板導通連接。
100
如申請專利範圍第99項所述的攝像模組，進一步包括一鏡頭支撐體，其中每個所述鏡頭支撐體被設置於所述一體封裝支架，所述光學鏡頭被設置於所述鏡頭支撐體。
101
如申請專利範圍第100項所述的攝像模組，其中所述一體封裝支架一體地延伸以形成所述鏡頭支撐體。
102
如申請專利範圍第99項所述的攝像模組，進一步包括至少一馬達，所述馬達被設置於所述一體封裝支架和與所述線路板導通連接，所述光學鏡頭被設置於所述馬達。
103
如申請專利範圍第100項至102項中任一所述的攝像模組，進一步包括至少一濾光元件，所述濾光元件被設置於所述一體封裝支架的頂部。
104
如申請專利範圍第100項至102項中任一所述的攝像模組，進一步包括一組阻容器件，所述阻容器件分別被貼裝於所述線路板，所述一體封裝支架包裹所述阻容器件。
105
如申請專利範圍第100項至102項中任一所述的攝像模組，其中所述阻隔元件藉由膠水固化形成。
106
如申請專利範圍第105項所述的攝像模組，其中形成所述阻隔元件的膠水在固化以後進一步地具有粘性，從而用來粘附所述攝像模組內部的灰塵。
107
如申請專利範圍第105項所述的攝像模組，其中由膠水固化形成的所述阻隔元件具有彈性。
108
如申請專利範圍第105項所述的攝像模組，其中所述一體封裝支架包覆於所述阻隔元件的外周面。
109
一攝像模組，其特徵在於，包括：至少一線路板；至少一光學鏡頭；至少一阻隔元件；至少一感光晶片；至少一濾光元件，其中所述濾光元件被重疊於所述感光晶片，其中所述阻隔元件被設置於所述濾光元件的外邊緣；以及一一體封裝支架，其中所述一體封裝支架包裹所述濾光元件的外部區域和所述線路板，以在所述一體封裝支架成型後，所述一體封裝支架、所述濾光元件、所述感光晶片和所述線路板一體結合，其中所述光學鏡頭被設置於所述感光晶片的感光路徑，所述感光晶片與所述線路板導通連接。
110
如申請專利範圍第109項所述的攝像模組，進一步包括一鏡頭支撐體，其中所述鏡頭支撐體被設置於所述一體封裝支架，所述光學鏡頭被設置於所述鏡頭支撐體。
111
如申請專利範圍第109項所述的攝像模組，進一步包括至少一馬達，所述馬達被設置於所述一體封裝支架並與所述線路板導通連接，所述光學鏡頭被設置於所述馬達。
112
如申請專利範圍第109項至111項中任一所述的攝像模組，其中所述濾光元件是紅外截止濾光片或者全透光譜濾光片。

Independent claims112

505 paragraphs, as filed

Camera module and its moulded photosensitive component and electronic equipment

This creation provides a camera module and its molded photosensitive component and electronic equipment, especially a camera module and its molded photosensitive component and electronic equipment.

In recent years, camera modules used to acquire images have become more and more commonly used in personal electronics, automotive, medical, etc., for example, camera modules have become the standard for portable electronic devices such as smart phones and tablet computers. One of the accessories. Camera modules used in portable electronic devices can not only capture images, but also help portable electronic devices realize instant video calls and other functions. With the development trend of portable electronic devices becoming thinner and lighter and users have higher and higher requirements for the imaging quality of camera modules, more stringent requirements are placed on the overall size of the camera module and the imaging capabilities of the camera module. In other words, the development trend of portable electronic devices requires camera modules to further improve and strengthen imaging capabilities on the basis of reduced size.

As we all know, the improvement of the imaging capability of the camera module is based on the configuration of the camera module with a photosensitive element with a larger imaging area and more passive electronic components such as driving resistors and capacitors. It is precisely because the camera module needs It is configured with a photosensitive element with a larger imaging area and more passive electronic components, requiring the camera module to be able to reduce the size of the camera module only by improving the packaging process. The commonly used camera module packaging process is COB (Chip On Board) packaging process, that is, the circuit board, photosensitive element, bracket, etc. of the camera module are made separately, and then the passive electronic components, photosensitive element and bracket are sequentially Encapsulated on the circuit board, in order to ensure the imaging quality of the camera module, it is necessary to fill glue between every two components, for example, fill glue between the bracket and the circuit board to seal the bracket It is installed on the circuit board, and the bracket and the circuit board are leveled by glue. Therefore, the COB packaging process causes the size of the camera module to be unable to be effectively reduced, and the packaging efficiency of the camera module is relatively low.

In order to solve this problem, the molding process is introduced into the field of camera modules. The molding process allows the camera module to be integrally molded on the circuit board during the manufacturing process. In this way, not only can it effectively reduce The size of the camera module can also reduce the assembly error of the camera module to improve the imaging quality of the camera module. Nevertheless, there are still many defects in directly introducing the molding process into the field of camera modules.

First of all, the photosensitive element of the camera module is mounted on the circuit board and electrically connected to the photosensitive element and the circuit board through leads. Normally, both ends of the lead are soldered to the photosensitive element and the circuit board respectively, and are limited by the wire bonding process and the lead itself. After the two ends of the lead are welded to the photosensitive element and the wire board, they are curved upward and protrude from the upper surface of the photosensitive element. During the molding process of the camera module, the pressing surface of the upper mold of the mold is formed. It will contact the protruding part of the lead and cause the lead to deform under pressure. Once the lead is deformed, it is difficult for the lead to return to its original state after the upper mold of the forming mold is removed. Secondly, when the molding material used to form the stent is added to the molding space of the molding die and solidified in the molding space to form the stent, the deformed lead is wrapped inside the stent to maintain the deformed state, and the deformed lead The ability to transmit electrical signals between the photosensitive element and the circuit board will be greatly reduced, so that it will have a relatively large impact on the imaging capability and imaging efficiency of the camera module. More importantly, when the lead is deformed by the pressing surface of the upper die, the direction and degree of the deformation of the lead are uncontrollable. Therefore, adjacent leads may contact each other after being deformed. This leads to a short circuit, which in turn leads to an increase in the product defect rate of the camera module. In addition, after the photosensitive element is mounted on the circuit board, there will be a gap between the photosensitive element and the circuit board. During the molding process, the fluid-like molding material will enter the gap formed between the photosensitive element and the circuit board. So that the photosensitive element and the line The attachment relationship of the road board is changed, and once the attachment relationship between the photosensitive element and the circuit board is changed, it will inevitably cause the photosensitive element to tilt, which affects the imaging quality of the camera module.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the molded photosensitive component provides a supporting element, which can avoid a molding die during the molding process. An upper mold presses the lead wires used to connect the photosensitive element and the circuit board, thereby preventing the lead wires from deforming under pressure.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein during the molding process, the upper mold of the molding mold is closed with the lower mold to make the pressure of the upper mold When the mating surface is in contact with the top surface of the supporting element, the supporting element can support the upper mold upward to prevent the upper mold from directly pressing on the lead, thereby preventing the lead from deforming under pressure.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein during the molding process, the upper mold of the molding mold is closed with the lower mold to make the When the pressing surface of the upper mold is in contact with the top surface of the support element, the support element can support the upper mold upward to reserve a safe distance between the lead and the pressing surface of the upper mold, Therefore, the pressing surface of the upper mold is prevented from directly contacting the lead.

An object of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the supporting element is formed of a material with elasticity, so that the upper mold of the molding mold presses the support The top surface of the element, the support element can absorb the impact force generated when the pressing surface of the upper mold contacts the top surface of the support element, thereby avoiding the forming mold When the upper mold and the lower mold of the tool are closed, the photosensitive element, the circuit board, the lead wire and the electronic components are damaged.

An object of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the supporting element is formed of a material with elasticity, so that the upper mold of the molding mold presses the support Component, the top surface of the supporting component can be deformed to avoid a gap between the top surface of the supporting component and the pressing surface of the upper mold, thereby forming a mold in the photosensitive component. When the plastic base is formed, the phenomenon of "flash" at a position of the light window of the molded base is avoided, thereby helping to ensure the yield rate of the camera module when it is packaged, and to ensure the quality of the camera module. Image quality.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the supporting element is formed of a flexible material, so that the upper mold of the molding mold presses the support When components, the top surface of the support element can be deformed to avoid a gap between the top surface of the support element and the pressing surface of the upper mold, thereby avoiding being used to form the molded base The molding material enters through the contact position of the top surface of the supporting element and the pressing surface of the upper mold to contaminate or damage the photosensitive area of the photosensitive element. That is to say, during the molding process, the supporting element makes the photosensitive area of the photosensitive element in a closed environment.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the supporting element is formed of a hard material, and the pressing surface of the upper mold of the forming mold is provided with a covering film, when When the pressing surface of the upper mold is pressed against the top surface of the supporting element, the covering film is located between the pressing surface of the upper mold and the top surface of the supporting element. On the one hand, the covering The film can prevent the formation of a seam between the pressing surface of the upper mold and the supporting element On the other hand, the cover film can prevent the photosensitive element, the circuit board, the lead, and the electronic components from being damaged when the upper mold and the lower mold of the molding mold are closed.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the supporting element is arranged along the non-photosensitive area of the photosensitive element, so that the supporting element is The element can prevent the molding material from entering the photosensitive area of the photosensitive element through the contact position of the support element and the non-photosensitive area of the photosensitive element, thereby contaminating or damaging the photosensitive area of the photosensitive element.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the supporting element is arranged to cover the connection position of the lead and the photosensitive element and the lead and the circuit board During the molding process, the supporting element isolates each connection position and the molding material, so that each connection position is more reliable.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the supporting element is located in a molding space formed on the upper mold and the lower mold of the molding mold, so as to When the molding material is added to the molding space and solidified to form the molding base, the supporting element can prevent the fluid-like molding material from impacting the lead.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the supporting element pre-fixes the circuit board and the photosensitive element so as to be When the molding material is added to the molding space and solidified to form the molding base, the supporting element can keep the photosensitive element and the circuit board from shifting.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the supporting element is arranged to cover at least a part of the non-photosensitive area of the photosensitive element, so as to avoid the molding process. The molding material is in contact with the photosensitive area of the photosensitive element to prevent the photosensitive area of the photosensitive element from being contaminated or damaged.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the supporting element is arranged to simultaneously cover at least a part of the photosensitive element and the circuit board, so as to be supported by the supporting element. The element closes the gap formed between the photosensitive element and the circuit board, so that during the molding process, the fluid-like molding material is prevented from entering between the photosensitive element and the circuit board.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the supporting element is arranged to cover the lead, so that when the camera module is subsequently used, stray light can be avoided. The internal generation of the camera module affects the imaging quality of the camera module.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the supporting element has viscosity, and before the molded base is formed, the supporting element can be attached to the electronic components. Pollutants such as solder powder generated when the device is installed on the circuit board can prevent these pollutants from contaminating the photosensitive area of the photosensitive element and causing stains.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the two ends of the lead are respectively connected to the chip connector of the photosensitive element and the circuit board connector of the circuit board The top surface of the supporting element is higher than the chip connector of the photosensitive element, so that the chip connector of the photosensitive element will not be damaged when the molding process is performed by the molding die.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the supporting element covers the chip connector of the photosensitive element, so as to avoid the The molding material contacts the wafer connector of the photosensitive element, thereby protecting the wafer connector of the photosensitive element.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the supporting element is arranged outside the wafer connector of the photosensitive element to avoid The molding material contacts the wafer connector of the photosensitive element, thereby protecting the wafer connector of the photosensitive element.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the camera module provides a bracket, and the bracket has at least two mounting channels for assembling the driver of the optical lens or The lens holder is respectively assembled in each of the mounting channels of the bracket to maintain the coaxiality of each optical lens by the bracket, thereby forming an array camera module.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the camera module provides at least one filter element, and the filter element is held between the photosensitive element and the optical device. Between the lenses, the filter element is used to filter stray light entering the array camera module from the optical lens, so as to improve the imaging quality of the array camera module.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the camera module provides a protective frame, the protective frame is arranged on the outer peripheral side of the photosensitive area of the photosensitive element, so as to When an integrated package bracket is molded, the protective frame prevents the molding material used to form the integrated package bracket from damaging the photosensitive area of the photosensitive element.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein when the integrated packaging bracket is molded, the protective frame prevents "flash" from appearing on the inner side of the integrated packaging bracket condition.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the protective frame is arranged on the outer peripheral side of the filter element, and when the integral packaging bracket is molded, the protective frame The frame prevents "flash" from appearing on the inside of the integrated package bracket.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the protective frame is protrudingly arranged on the outer peripheral side of the photosensitive area of the photosensitive element for molding the integrated package The molding die of the bracket presses on the protective frame to prevent the molding die from directly contacting the photosensitive element by the protective frame, so as to prevent the photosensitive area of the photosensitive element from being damaged or being damaged by pressure. Scratched.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the protective frame has elasticity to provide cushioning capacity, and can fully contact the molding die after the protective frame is pressed. The photosensitive area of the photosensitive element is separated from the external environment by the sealing function, so as to prevent the photosensitive area of the photosensitive element from being damaged during the molding of the integrated package bracket.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the protective frame has elasticity to provide buffering capacity, thereby reducing the flatness requirements of the camera module and reducing The assembly requirements of the various mechanisms of the camera module.

One purpose of the present creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the protective frame is overlapped and arranged on the photosensitive element after molding, so as to improve the manufacturing efficiency of the camera module.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the upper mold surface of the forming mold is provided with at least one cover film, and the upper mold of the forming mold is applied When pressed, the cover film can also provide further protection to the photosensitive element. In addition, the cover film can also reduce the difficulty of demolding and increase the sealing performance to prevent "flashing".

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the part of the molding die corresponding to the photosensitive area of the photosensitive element can be concavely designed so that the photosensitive element There is a safe distance between the area and the forming mold, so as to further reduce the influence on the photosensitive element.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the protective frame is covered with a protective film to facilitate the placement of the protective frame on the photosensitive element. In addition, the The protective film can also isolate the photosensitive area of the photosensitive element from the external environment.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the camera module provides at least one blocking element, wherein the blocking element is arranged on the outer periphery of the photosensitive area of the photosensitive element Side, wherein the integrated package bracket wraps the non-photosensitive area of the circuit board and the photosensitive element after molding, so that the blocking element prevents the The molding material of the integrated packaging bracket flows to the photosensitive area of the photosensitive element during the molding process of the integrated packaging bracket.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the blocking element protrudes from the photosensitive element, so that the surface of the upper mold of the forming mold is separated from the blocking element. In other words, the blocking element can provide a buffering effect and prevent the surface of the upper mold of the forming mold from directly contacting the photosensitive element, so as to protect the photosensitive area of the photosensitive element from being affected by the forming mold. The upper mold is damaged when pressure is applied.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the blocking element can prevent the molding material from flowing from the non-sensitive area of the photosensitive element to the photosensitive area, and the integrated package After the bracket is formed, the blocking element can avoid the occurrence of "flash" of the integrated package bracket on the side facing the photosensitive element, so as to improve the product yield of the camera module.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the barrier element may also have elasticity, so that the barrier element can be formed in accordance with the upper mold formed on the mold The gap between the photosensitive element and the photosensitive element is deformed, so that the barrier element isolates the photosensitive area of the photosensitive element from the external environment, and further, in the process of forming the integral packaging bracket by the molding material, the molding The material does not enter the photosensitive area of the photosensitive element from the gap between the upper mold formed on the forming mold and the photosensitive element, so as to ensure the reliability of the camera module when it is manufactured.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the blocking element has viscosity for adhering contaminants such as dust, so as to reduce the photosensitive area of the photosensitive element. Blemish spots to improve the imaging quality of the camera module.

One purpose of this creation is to provide a camera module and its molded photosensitive component and electronic equipment, wherein the camera module includes at least one filter element, the blocking element is disposed on the filter element, and the integrated The packaging bracket wraps the outer area of the circuit board and the filter element after molding, so that the integrated packaging bracket, the filter element, the photosensitive element and the circuit board are integrated, and the barrier The element prevents the molding material from entering the effective working area inside the filter element and prevents it from being damaged during molding.

The present invention provides a molded photosensitive component of a camera module, which includes: at least one supporting element formed by a first medium; at least one photosensitive element; at least one circuit board; The ends are respectively connected to the wafer connector of each of the photosensitive elements and the circuit board connector of each of the circuit boards; and at least one molded base formed by a second medium, wherein each of the molded bases The holders respectively include a molded body and have at least one light window, wherein when the molded body is molded by a molding die, the supporting element is used to protect the photosensitive element and the lead , Wherein the photosensitive area of the photosensitive element corresponds to the light window.

According to an embodiment of the present invention, each of the support elements respectively includes a frame-shaped support body and has a through hole, and the support body covers at least a part of the non-photosensitive area of the photosensitive element. The photosensitive area corresponds to the through hole, wherein the supporting body has a top surface, an inner side surface, and an outer side surface, and the top surface of the supporting body extends inwardly and outwardly to be connected to the inner side surface, respectively And the outer side surface, the inner side surface forms the through hole, wherein During the molding process, the pressing surface of the molding die is in contact with the top surface of the supporting body.

According to an embodiment of the present invention, the non-photosensitive area of the photosensitive element includes an inner part of a chip, a connecting part of a chip, and an outer part of a chip, wherein the chip connecting member of the photosensitive element is disposed on the The chip connection part, the chip inner part and the chip outer part are respectively located inside and outside of the chip connection part, wherein the supporting body covers at least a part of the chip inner part of the photosensitive element.

According to an embodiment of the present invention, the non-photosensitive area of the photosensitive element includes a chip inner part, a chip connection part, and a chip outer part, wherein the chip connector of the photosensitive element is disposed on the The chip connection part, the chip inside part and the chip outside part are respectively located inside and outside the chip connection part, wherein the support body covers at least a part of the chip inside part of the photosensitive element and the At least a part of the wafer connection part.

According to an embodiment of the present invention, the non-photosensitive area of the photosensitive element includes a chip inner part, a chip connection part, and a chip outer part, wherein the chip connector of the photosensitive element is disposed on the The chip connection part, the chip inner part and the chip outer part are respectively located inside and outside of the chip connection part, wherein the support body covers at least a part of the chip inner part of the photosensitive element, the At least a part of the wafer connection part and the outer part of the wafer.

According to an embodiment of the present invention, the non-photosensitive area of the photosensitive element includes a chip inner part, a chip connection part, and a chip outer part, wherein the chip connector of the photosensitive element is disposed on the Chip connection part, the inside part of the chip and the outside part of the chip are respectively Located inside and outside the wafer connection part, wherein the support body covers at least a part of the wafer connection part and at least a part of the outside part of the wafer of the photosensitive element.

According to an embodiment of the present invention, the non-photosensitive area of the photosensitive element includes a chip inner part, a chip connection part, and a chip outer part, wherein the chip connector of the photosensitive element is disposed on the The chip connection part, the chip inner part and the chip outer part are respectively located inside and outside the chip connection part, wherein the support body covers at least a part of the chip outer part of the photosensitive element.

According to an embodiment of the present invention, the non-photosensitive area of the photosensitive element includes a chip inner part, a chip connection part, and a chip outer part, wherein the chip connector of the photosensitive element is disposed on the The wafer connecting portion, the wafer inner portion and the wafer outer portion are respectively formed on the inner side and the outer side of the wafer connecting portion, wherein the supporting body covers at least a part of the wafer connecting portion of the photosensitive element.

According to an embodiment of the present invention, each of the support elements respectively includes a frame-shaped support body and has a through hole, and the support body covers at least a part of the edge area of the circuit board. The area corresponds to the through hole, wherein the support body has a top surface, an inner side surface, and an outer side surface, and the top surface of the support body extends inwardly and outwardly to connect to the inner side surface and The outer side surface, the inner side surface forms the through hole, wherein the pressing surface of the forming mold contacts the top surface of the supporting body during the molding process.

According to an embodiment of the present invention, the supporting body further covers at least a part of the photosensitive element.

According to an embodiment of the present creation, the edge area of the circuit board includes an inner side of the circuit board, a circuit board connection portion, and an outer side of the circuit board, wherein the line of the circuit board The circuit board connector is provided on the circuit board connection part, the inner side of the circuit board and the outer side of the circuit board are respectively located inside and outside of the circuit board connection, wherein the non-photosensitive element of the photosensitive element The area includes a chip inner part, a chip connection part, and a chip outer part, wherein the chip connector of the photosensitive element is disposed on the chip connection part, and the chip inner part and the chip outer part are respectively located The inside and outside of the chip connection part, wherein the support body covers at least a part of the inside part of the circuit board and at least a part of the outside part of the chip.

According to an embodiment of the present creation, the edge area of the circuit board includes an inner side of the circuit board, a connecting portion of the circuit board, and an outer side of the circuit board, wherein the circuit board connector of the circuit board is provided In the circuit board connection portion, the inner side portion of the circuit board and the outer portion of the circuit board are respectively located inside and outside the circuit board connection portion, wherein the non-photosensitive area of the photosensitive element includes an inner side portion of a chip , A chip connection portion and a chip outer portion, wherein the chip connection piece of the photosensitive element is disposed on the chip connection portion, and the chip inner portion and the chip outer portion are respectively located on the chip connection portion The inner side and the outer side, wherein the supporting body covers at least a part of the inner side of the circuit board, the outer side of the chip and at least a part of the connecting portion of the chip.

According to an embodiment of the present creation, the edge area of the circuit board includes an inner side of the circuit board, a connecting portion of the circuit board, and an outer side of the circuit board, wherein the circuit board connector of the circuit board is provided In the circuit board connection portion, the inner side portion of the circuit board and the outer portion of the circuit board are respectively located inside and outside the circuit board connection portion, wherein the non-photosensitive area of the photosensitive element includes an inner side portion of a chip , A chip connecting portion and a chip outer portion, wherein the chip connecting piece of the photosensitive element is disposed on the chip connecting portion, and the chip inner portion and the chip outer portion are respectively located on the chip connecting portion Inside and outside, wherein the supporting body covers the circuit At least a part of the inner side portion of the board, the outer side portion of the wafer, the connecting portion of the wafer, and at least a portion of the inner side portion of the wafer.

According to an embodiment of the present creation, the edge area of the circuit board includes an inner side of the circuit board, a connecting portion of the circuit board, and an outer side of the circuit board, wherein the circuit board connector of the circuit board is provided In the circuit board connection portion, the inner side portion of the circuit board and the outer portion of the circuit board are respectively located inside and outside the circuit board connection portion, wherein the non-photosensitive area of the photosensitive element includes an inner side portion of a chip , A chip connection portion and a chip outer portion, wherein the chip connection piece of the photosensitive element is disposed on the chip connection portion, and the chip inner portion and the chip outer portion are respectively located on the chip connection portion Inside and outside, wherein the support body covers at least a part of the circuit board connection part, at least a part of the circuit board inner part and the chip outer part.

According to an embodiment of the present creation, the edge area of the circuit board includes an inner side of the circuit board, a connecting portion of the circuit board, and an outer side of the circuit board, wherein the circuit board connector of the circuit board is provided In the circuit board connection portion, the inner side portion of the circuit board and the outer portion of the circuit board are respectively located inside and outside the circuit board connection portion, wherein the non-photosensitive area of the photosensitive element includes an inner side portion of a chip , A chip connection portion and a chip outer portion, wherein the chip connection piece of the photosensitive element is disposed on the chip connection portion, and the chip inner portion and the chip outer portion are respectively located on the chip connection portion Inside and outside, wherein the support body covers at least a part of the outer part of the circuit board, the connecting part of the circuit board, the inner part of the circuit board, and at least a part of the outer part of the chip.

According to an embodiment of the present creation, the edge area of the circuit board includes an inner side of the circuit board, a connecting portion of the circuit board, and an outer side of the circuit board, wherein the circuit board connector of the circuit board is provided At the circuit board connection part, the inner side of the circuit board and the outer side of the circuit board The side parts are respectively located inside and outside the circuit board connection part, wherein the non-photosensitive area of the photosensitive element includes a chip inner part, a chip connection part and a chip outer part, wherein the photosensitive element The chip connector is provided on the chip connection part, the chip inner part and the chip outer part are respectively located inside and outside the chip connection part, wherein the support body covers at least the circuit board connection part At least a part, the inner part of the circuit board, the outer part of the chip, the connecting part of the chip, and at least a part of the inner part of the chip.

According to an embodiment of the present creation, the edge area of the circuit board includes an inner side of the circuit board, a connecting portion of the circuit board, and an outer side of the circuit board, wherein the circuit board connector of the circuit board is provided In the circuit board connection portion, the inner side portion of the circuit board and the outer side portion of the circuit board are respectively located inside and outside the circuit board connection portion, wherein the non-photosensitive area of the photosensitive element includes an inner side portion of a chip , A chip connection portion and a chip outer portion, wherein the chip connection piece of the photosensitive element is disposed on the chip connection portion, and the chip inner portion and the chip outer portion are respectively located on the chip connection portion Inside and outside, wherein the support body covers at least a part of the outer part of the circuit board, the connecting part of the circuit board, the inner part of the circuit board, the outer part of the chip, and at least a part of the chip connecting part.

According to an embodiment of the present creation, the edge area of the circuit board includes an inner side of the circuit board, a connecting portion of the circuit board, and an outer side of the circuit board, wherein the circuit board connector of the circuit board is provided In the circuit board connection portion, the inner side portion of the circuit board and the outer portion of the circuit board are respectively located inside and outside the circuit board connection portion, wherein the non-photosensitive area of the photosensitive element includes an inner side portion of a chip , A chip connecting portion and a chip outer portion, wherein the chip connecting piece of the photosensitive element is disposed on the chip connecting portion, and the chip inner portion and the chip outer portion are respectively located on the chip connecting portion Inside and outside, wherein the supporting body covers the circuit At least a part of the board outer portion, the wiring board connection portion, the wiring board inner portion, the chip outer portion, the chip connection portion, and at least a portion of the chip inner portion.

According to an embodiment of the present invention, the molded body covers the outer side surface of the supporting body.

According to an embodiment of the present creation, the molded body further covers at least a part of the top surface of the supporting body.

According to an embodiment of the present creation, the height of the supporting element is higher than or equal to the height of the upward protrusion of the lead.

According to an embodiment of the present creation, the height of the support element is lower than the height of the upward protrusion of the lead.

According to an embodiment of the present creation, the supporting element has elasticity.

According to an embodiment of the present creation, the supporting element has adhesiveness.

According to an embodiment of the present creation, the Shore hardness of the supporting element is in the range of A50-A80, and the elastic modulus is in the range of 0.1Gpa-1Gpa.

The present invention further provides a molded photosensitive component of a camera module, which includes: at least one photosensitive element; at least one circuit board; at least one set of leads, wherein the two ends of each set of leads are respectively connected to each of the photosensitive elements The chip connector and the circuit board connector of each of the circuit boards; at least one supporting element, wherein each of the supporting elements is arranged to cover at least a part of each group of the leads; and At least one molded base, wherein each of the molded bases respectively includes a molded body and has at least one light window, wherein the molded body covers the edge area of the circuit board and the At least a part of the supporting element, and the photosensitive area of each photosensitive element respectively corresponds to the light window of each molded base.

According to an embodiment of the present creation, the supporting element includes a supporting body and a through hole, the supporting body has a top surface, an inner side surface, and an outer side surface, and the top surface of the supporting body faces inward and outward. The outer side respectively extends to be connected to the inner side surface and the outer side surface, the inner side surface forms the through hole, wherein the support body is configured to cover at least a part of the lead, and the photosensitive element corresponds to the Through holes, the molded body covers the outer side surface of the supporting body.

According to an embodiment of the present creation, the molded base further includes at least a part of the top surface of the supporting body.

When molding, the supporting element is used to prevent the pressing surface of the molding die from pressing on the lead, wherein the photosensitive area of the photosensitive element corresponds to the light window, and each of the optical lenses is provided separately The photosensitive path of the photosensitive element in each of the molded photosensitive components.

According to an embodiment of the present creation, the camera module further includes at least one driver, wherein each of the optical lenses is assembled to each of the drivers, and each of the drivers is assembled to each of the modules. The top surface of the molded body of the photosensitive component is molded.

According to an embodiment of the present creation, the camera module further includes at least one filter element, wherein each of the filter elements is respectively disposed on each of the optical lens and each of the molded photosensitive components. Between the photosensitive elements.

According to an embodiment of the present creation, each of the filter elements is respectively assembled on the top surface of the molded body of each of the molded photosensitive components.

According to an embodiment of the present invention, the top surface of the molded body has an inner side surface and an outer side surface, wherein the plane on which the inner side surface is located is lower than the plane on which the outer side surface is located, so that the molded body A groove is formed, the filter element is assembled on the inner surface of the molded body and located in the groove, and the driver is assembled on the outer surface of the molded body.

According to an embodiment of the present creation, the camera module further includes at least one supporting member, wherein each of the filter elements is assembled to each of the supporting members, and each of the supporting members is assembled to the mold. The top surface of the main body is molded so that each of the filter elements is respectively disposed between each of the optical lenses and the photosensitive elements of each of the molded photosensitive components.

This creation further provides a camera module with a molded photosensitive component, which includes: at least one optical lens; and At least one molded photosensitive component, wherein each of the molded photosensitive components further includes: a photosensitive element; a circuit board; A set of leads, wherein two ends of each lead are respectively connected to the chip connector of the photosensitive element and the circuit board connector of the circuit board; A supporting element, wherein the supporting element is arranged to cover at least a part of each of the leads; and A molded base, wherein the molded base includes a molded body and has a light window, wherein the molded body covers the edge area of the circuit board and at least a part of the supporting element after molding , The photosensitive area of each photosensitive element corresponds to the light window of the molded base, and each of the optical lenses is respectively disposed on the photosensitive element of each molded photosensitive element Sensitivity path.

According to an embodiment of the present creation, the camera module is a fixed-focus camera module or a zoom camera module.

The present creation further provides an electronic device, which includes: an electronic device body; and at least one camera module, wherein each of the camera modules is respectively disposed on the electronic device body for capturing images, wherein each Each of the camera modules further includes at least one optical lens and at least one molded photosensitive component, and the molded photosensitive component includes a supporting element, a photosensitive element, a circuit board, a set of leads, and a molded base, The two ends of each lead are respectively connected to the chip connector of the photosensitive element and the circuit board connector of the circuit board, wherein the molded The base includes a molded body and has a light window, wherein when the molded body is molded by a molding die, the supporting element is used to prevent the pressing surface of the molding die from applying Pressed against the lead, wherein the photosensitive area of the photosensitive element corresponds to the light window, and wherein each of the optical lenses is respectively arranged on the photosensitive path of the photosensitive element of each of the molded photosensitive components.

The present invention further provides a method for manufacturing a molded photosensitive component, wherein the manufacturing method includes the following steps: (a) connecting a photosensitive element and a circuit board through a set of leads; (b) connecting the photosensitive element and the circuit The plate is placed on an upper mold or a lower mold of a forming mold; (c) during the clamping of the upper mold and the lower mold, the upper mold is supported upward by a supporting element to prevent the upper mold The pressing surface of each group of the leads is pressed; and (d) a fluid-like molding material is added to a molding space formed between the upper mold and the lower mold to solidify the molding material Then a molded base is formed, wherein the molded base includes a molded body and has at least one light window, wherein the molded body covers at least a part of the edge area of the circuit board and the supporting element At least part of.

According to an embodiment of the present creation, in the step (c), when the pressing surface of the upper mold presses the top surface of the supporting body, the top surface of the supporting body produces Deform to make the pressing surface of the upper mold closely fit the top surface of the supporting body, so that the photosensitive area of the photosensitive element is in a sealed environment, wherein in the step (d) , The supporting body prevents the molding material from entering the sealed environment, so that the molding material is solidified Then, the molded body covering the outer side surface of the supporting body is formed, and the light window is formed on the inner side surface of the supporting body.

The present invention further provides a manufacturing method of a molded photosensitive component, wherein the manufacturing method includes the following steps: (A) connecting a photosensitive element and a circuit board through a set of leads; Cover the leads to form a semi-finished molded photosensitive component; (C) place the semi-finished molded photosensitive component on an upper mold or a lower mold of a molding mold, wherein the upper mold and the lower mold are combined During the molding process, the supporting element supports the upper mold upward to prevent the pressing surface of the upper mold from pressing the lead; and (D) is formed between the upper mold and the lower mold A fluid-like molding material is added to a molding space of the, to form a molding base after the molding material is cured, wherein the molding base includes a molded body and a light window, the molded body At least a part of the edge area of the circuit board and the supporting element is covered, and the photosensitive area of the photosensitive element corresponds to the light window.

The present invention further provides a method for manufacturing a molded photosensitive component, wherein the manufacturing method includes the following steps: (h) mounting a photosensitive element on a circuit board, and conducting the photosensitive element and the photosensitive element through at least one set of leads Circuit board; (i) The photosensitive element and the circuit board are pre-fixed by a supporting element to produce a semi-finished molded photosensitive component, and the supporting element is prevented from between the photosensitive element and the circuit board Create a gap (j) Place the semi-finished molded photosensitive component on an upper mold or a lower mold of a forming mold, so that when the upper mold and the lower mold are closed, the upper mold and the lower mold Forming a ring-shaped molding space between; and (k) adding a fluid-like molding material into the molding space to form the molded base after the molding material is cured, wherein the molded base includes a molded body and a light window, The molded body covers the edge area of the circuit board and at least a part of the supporting element, and the photosensitive area of the photosensitive element corresponds to the light window.

The present invention further provides a manufacturing method of a molded photosensitive component, wherein the manufacturing method includes the following steps: (H) a chip connector of a photosensitive element and a circuit board connector of a circuit board through a set of leads; (I) ) Place the photosensitive element and the circuit board in an upper mold or a lower mold of a forming mold, so that when the upper mold and the lower mold are closed, the upper mold and the lower mold A ring-shaped molding space is formed between them; (J) When a fluid-like molding material is added to the molding space, a support element located in the molding space reduces the molding material by blocking the molding material. The impact of the molding material on the lead; and (K) forming a molded base after the molding material is cured, wherein the molded base includes a molded body and a light window, The molded body covers at least a part of the edge area of the circuit board, the supporting element and the non-photosensitive area of the photosensitive element.

The present invention further provides a molded photosensitive component, which includes: at least one supporting element formed by a first medium; At least one circuit board, wherein each of the circuit boards has at least one chip mounting area; at least two photosensitive elements, wherein each of the photosensitive elements is respectively mounted on each of the chips of each of the circuit boards Mounting area; at least two sets of leads, wherein both ends of each set of leads are respectively connected to the chip connector of each photosensitive element and the circuit board connector of each circuit board; and a second medium A molded base is formed, wherein the molded base includes a molded body and has at least two light windows, wherein when the molded body is molded, the supporting element protects the lead and the circuit board With the photosensitive element, after the molded body is formed, the molded body is integrally combined with at least a part of each of the circuit boards, and the photosensitive area of each photosensitive element corresponds to the mold, respectively Each of the light windows of the plastic base.

According to an embodiment of the present creation, the molded photosensitive component includes two supporting elements, one circuit board, two photosensitive elements, and two sets of leads, and the circuit board has two sockets. The chip mounting area.

According to an embodiment of the present creation, the molded photosensitive component includes two supporting elements, two circuit boards, two photosensitive elements, and two sets of leads, and each circuit board is separately There is one chip mounting area.

According to an embodiment of the present creation, the molded photosensitive component further includes at least one electronic component, wherein the circuit board has an edge area, the edge area and the chip mounting area are integrally formed, each The electronic components are respectively mounted on the edge area, wherein the supporting element is located between the electrical component and the photosensitive area of the photosensitive element.

According to an embodiment of the present invention, the supporting element includes a frame-shaped supporting body and having a through hole, the supporting body is arranged outside the photosensitive area of the photosensitive element, and the photosensitive element The photosensitive area corresponds to the through hole, wherein the molded body covers a part of the supporting body.

According to an embodiment of the present creation, the supporting body has a top surface, an inner side surface, and an outer side surface, and the top surface respectively extends inwardly and outwardly to be connected to the inner side surface and the outer side surface, so The inner side surface forms the through hole, and the molded body covers at least the outer side surface of the supporting body.

According to an embodiment of the present creation, the supporting body has a top surface, an inner side surface, and an outer side surface, and the top surface respectively extends inwardly and outwardly to be connected to the inner side surface and the outer side surface, so The inner side surface forms the through hole, wherein the molded body covers at least a part of the outer side surface and the top surface of the support body.

According to an embodiment of the present invention, the non-photosensitive area of the photosensitive element includes an inner side of the chip, a connecting portion of the chip, and an outer side of the chip. Part and the outer part of the wafer are respectively located on both sides of the connecting part of the wafer, wherein the supporting body covers at least a part of the inner part of the wafer of the photosensitive element.

According to an embodiment of the present invention, the non-photosensitive area of the photosensitive element includes an inner side of the chip, a connecting portion of the chip, and an outer side of the chip. And the chip outer portion are respectively located on both sides of the chip connecting portion, wherein the supporting body covers at least a part of the chip outer portion of the photosensitive element.

According to an embodiment of the present invention, the non-photosensitive area of the photosensitive element includes an inner side of the chip, a connecting portion of the chip, and an outer side of the chip. Part and the chip outer part are respectively located on both sides of the chip connection part, wherein the support body covers at least a part of the chip inner part of the photosensitive element, the chip connection part and the chip outer part At least part of.

According to an embodiment of the present creation, the edge area of the circuit board includes an inner side portion of the circuit board, a circuit board connection portion, and an outer side portion of the circuit board, and the circuit board connector is arranged on the circuit board connection The inner part of the circuit board and the outer part of the circuit board are respectively located on both sides of the circuit board connection part, wherein the supporting body covers a part of the outer part of the circuit board of the circuit board.

According to an embodiment of the present creation, the edge area of the circuit board includes an inner side portion of the circuit board, a circuit board connection portion, and an outer side portion of the circuit board, and the circuit board connector is arranged on the circuit board connection Part, the inner part of the circuit board and the outer part of the circuit board are respectively located in the On both sides of the circuit board connection part, the support body covers at least a part of the inner side of the circuit board and at least a part of the circuit board connection part of the circuit board.

According to an embodiment of the present creation, the edge area of the circuit board includes an inner side portion of the circuit board, a circuit board connection portion, and an outer side portion of the circuit board, and the circuit board connector is arranged on the circuit board connection Part, the inner part of the circuit board and the outer part of the circuit board are respectively located on both sides of the circuit board connection part, wherein the supporting body covers at least a part of the inner part of the circuit board of the circuit board, and The circuit board connecting portion and a part of the outer side of the circuit board.

According to an embodiment of the present invention, the non-photosensitive area of the photosensitive element includes an inner side of the chip, a connecting portion of the chip and an outer side of the chip, and the chip connecting member is arranged on the connecting portion of the chip, and the inner side of the chip Part and the outer part of the chip are respectively located on both sides of the connecting part of the chip, wherein the edge area of the circuit board includes an inner part of a circuit board, a circuit board connection part and an outer part of the circuit board. The board connector is provided on the circuit board connection portion, the inner side portion of the circuit board and the outer side portion of the circuit board are respectively located on both sides of the circuit board connection portion, wherein the support body covers the circuit board At least a part of the inner side of the wiring board and at least a part of the outer side of the wafer of the photosensitive element.

According to an embodiment of the present invention, the non-photosensitive area of the photosensitive element includes an inner part of a chip, a connecting part of a chip and an outer part of a chip, and the chip connecting member is arranged on the The chip connection part, the chip inner part and the chip outer part are respectively located on both sides of the chip connection part, wherein the edge area of the circuit board includes a circuit board inner part, a circuit board connection part, and a circuit board connection part. The circuit board outer part, the circuit board connector is arranged at the circuit board connection part, the circuit board inner part and the circuit board outer part are respectively located on both sides of the circuit board connection part, wherein the support The main body covers at least a part of the inner side of the circuit board and the connecting part of the circuit board and at least a part of the outer side of the chip of the photosensitive element.

According to an embodiment of the present invention, the non-photosensitive area of the photosensitive element includes an inner side of the chip, a connecting portion of the chip, and an outer side of the chip. Part and the outer part of the chip are respectively located on both sides of the connecting part of the chip, wherein the edge area of the circuit board includes an inner part of the circuit board, a circuit board connection part and an outer part of the circuit board. The board connector is provided on the circuit board connection portion, the inner side portion of the circuit board and the outer side portion of the circuit board are respectively located on both sides of the circuit board connection portion, wherein the support body covers the circuit board The inner part of the circuit board, the connecting part of the circuit board, a part of the outer part of the circuit board, and at least a part of the outer part of the chip of the photosensitive element.

According to an embodiment of the present invention, the supporting body further covers at least a part of the chip connecting portion of the photosensitive element.

The present invention further provides an array camera module, which includes: at least two optical lenses; and a molded photosensitive component, wherein the molded photosensitive component further includes: at least one supporting element formed by a first medium; at least one circuit board , Wherein each of the circuit boards has at least one chip mounting area; At least two photosensitive elements, wherein each of the photosensitive elements is respectively mounted on each of the chip mounting areas of each of the circuit boards; At least two sets of leads, wherein the two ends of each set of leads are respectively connected to the chip connector of each photosensitive element and the circuit board connector of each circuit board; and A molded base formed by a second medium, wherein the molded base includes a molded body and has at least two light windows, wherein when the molded body is molded, the supporting element protects the lead, The circuit board and the photosensitive element, after the molded main body is formed, the molded main body is integrally combined with at least a part of each of the circuit boards, and the photosensitive area of each photosensitive element corresponds to In each of the light windows of the molded base, each of the optical lenses is respectively disposed on the light-sensing path of each of the light-sensitive elements, so that the light window serves as the optical lens and the The photosensitive element provides a light path.

According to an embodiment of the present creation, the array camera module further includes at least two drivers, wherein each of the optical lenses is assembled to each of the drivers, and each of the drivers is assembled to the mold. The top surface of the main body.

According to an embodiment of the present creation, the array camera module further includes at least one driver and at least one lens barrel, and each of the optical lenses is assembled to each of the drivers and each of the lens barrels, wherein each Each of the drivers and each of the lens barrels are respectively located at different positions on the top surface of the molded body.

According to an embodiment of the present creation, the array camera module further includes at least two lens barrels, wherein each of the lens barrels is integrally formed on the top surface of the molded body, and each of the optical lenses is separately Assembled in each of the lens barrels; or further comprising at least two lens barrels, wherein at least one of the lens barrels is integrally formed on the top surface of the molded body, and the other lens barrels are mounted On the top surface of the molded body, each of the optical lenses is respectively assembled to each of the lens barrels; or the array camera module includes two mirrors attached to the top surface of the molded body Each of the optical lenses is assembled to each of the lens barrels.

According to an embodiment of the present invention, the array camera module further includes at least one filter element, wherein each of the filter elements is respectively assembled on the top surface of the molded body, so that each of the filter elements The optical element is held between each of the optical lenses and each of the photosensitive elements.

According to an embodiment of the present creation, the top surface of the molded body has at least two inside surfaces and an outside surface, wherein each of the filter elements is respectively assembled on each of the inside surfaces of the molded body , Each of the drivers are respectively assembled at different positions on the outer surface of the molded body.

According to an embodiment of the present creation, the plane on which the inner surface of the molded body is located is lower than the plane on which the outer surface is located to form at least one groove of the molded body, wherein each filter The light elements are respectively located in each of the grooves.

According to an embodiment of the present invention, the supporting body covers a part of the edge area of the circuit board.

According to an embodiment of the present creation, the supporting body covers at least a part of the non-photosensitive area of the photosensitive element.

According to an embodiment of the present creation, the supporting body simultaneously covers a part of the edge area of the circuit board and at least a part of the non-photosensitive area of the photosensitive element.

According to an embodiment of the present creation, the array camera module further includes at least one support and at least one filter element, wherein each filter element is assembled to each support, and each support Pieces are respectively assembled on the top surface of the molded body so that each of the filter elements is held between each of the optical lenses and each of the photosensitive elements.

The present creation further provides an electronic device, which includes: an electronic device body; and at least one array camera module, wherein the array camera module is disposed on the electronic device body for capturing images, wherein the The array camera module includes: at least two optical lenses; and a molded photosensitive component, wherein the molded photosensitive component further includes: at least one supporting element formed by a first medium; at least one circuit board, wherein each of the circuit boards Each board has at least one chip mounting area; at least two photosensitive elements, wherein each photosensitive element is mounted on each chip mounting area of each circuit board; at least two sets of leads, wherein each The two ends of the set of leads are respectively connected to the chip connector of each of the photosensitive elements and the circuit board connector of each of the circuit boards; and a molded base formed by a second medium, wherein the The molded base includes a molded body and has at least two light windows, wherein when the molded body is molded, the supporting element protects the lead, the circuit board and the photosensitive element, and the molded body After the main body is formed, the molded main body is At least it is integrated with a part of each of the circuit boards, and the photosensitive area of each photosensitive element corresponds to each of the light windows of the molded base, and each of the optical lenses is respectively provided The photosensitive path of each photosensitive element is used to provide a light path for the optical lens and the photosensitive element through the light window.

The present invention further provides a camera module, which includes: at least one circuit board; at least one optical lens; at least one protection frame; at least one photosensitive chip, wherein the protection frame is convexly arranged on the photosensitive area of the photosensitive chip And at least one integrated packaging bracket, wherein the integrated packaging bracket is set to wrap the non-photosensitive area of the circuit board and the photosensitive chip, so that the integrated packaging bracket, the circuit board and the The photosensitive chip is combined into one body, wherein the optical lens is arranged on the photosensitive path of the photosensitive chip, and the photosensitive chip and the circuit board are conductively connected.

According to an embodiment of the present creation, the size of the inner side of the protective frame is greater than or equal to the size of the photosensitive area of the photosensitive wafer.

According to an embodiment of the present creation, the size of the outer side of the protective frame is smaller than or equal to the size of the photosensitive wafer.

According to an embodiment of the present creation, the protection frame is flexible.

According to an embodiment of the present creation, the camera module further includes a glue layer, wherein the glue layer is arranged on the outer peripheral side of the photosensitive area of the protective frame and the photosensitive wafer In between, the protective frame and the outer peripheral side of the photosensitive area of the photosensitive wafer are connected by the glue layer.

According to an embodiment of the present creation, the integrated packaging bracket is further configured to wrap the outer surface of the protective frame.

According to an embodiment of the present creation, the camera module further includes a lens supporting body, wherein the lens supporting body is arranged on the integrated packaging bracket, and the optical lens is arranged on the lens supporting body.

According to an embodiment of the present creation, the lens support body is integrally formed with the integrated packaging bracket.

According to an embodiment of the present creation, the lens support body is a motor, and the motor and the circuit board are conductively connected.

According to an embodiment of the present invention, the camera module further includes a filter element, wherein the filter element is arranged on the top of the integrated package bracket, so that the filter element is located on the photosensitive chip and Between the optical lenses.

This creation further provides a camera module, which includes: at least one circuit board; at least one optical lens; at least one protective frame; at least one photosensitive chip; At least one filter element, wherein the filter element is overlapped and arranged on the photosensitive chip, and the protective frame is arranged on the outer peripheral side of the filter element; and At least an integrated package support, wherein the integrated package support is arranged to cover the outer peripheral side of the filter element and the circuit board, so that the integrated package support, the filter element, the photosensitive chip and the The circuit board is integrated into one body, wherein the optical lens is arranged on the photosensitive path of the photosensitive chip, and the photosensitive chip is conductively connected to the circuit board.

According to an embodiment of the present invention, the size of the inner side of the protection frame is greater than or equal to the size of the photosensitive area of the photosensitive wafer, so that the protection frame does not block the photosensitive area of the photosensitive wafer.

According to an embodiment of the present creation, the protection frame is flexible.

According to an embodiment of the present invention, the camera module further includes a glue layer, wherein the glue layer is disposed between the protective frame and the filter element to connect the glue layer to the The outer peripheral side of the protective frame and the filter element.

According to an embodiment of the present creation, the integrated packaging bracket is further configured to wrap the outer surface of the protective frame.

According to an embodiment of the present creation, the lens support body is integrally formed with the integrated packaging bracket.

The present invention further provides a method for manufacturing a camera module, wherein the manufacturing method includes the following steps: (a) conductively connect at least one photosensitive chip and at least one circuit board; (b) provide at least one protection frame, wherein the protection The frame is arranged on the outer peripheral side of the photosensitive area of the photosensitive wafer; (c) pressure is applied to the protective frame by the pressing surface of the upper mold of a forming mold to isolate the photosensitive area and the non-sensitive area of the photosensitive wafer (D) The non-photosensitive area of the circuit board and the photosensitive wafer is wrapped by the molding material added to the molding die to form an integrated with the photosensitive wafer and the circuit board after the molding material is cured And (e) providing at least one optical lens, wherein the optical lens is arranged on the photosensitive path of the photosensitive chip to form the camera module.

According to an embodiment of the present creation, in the step (b), a protective film is provided on the upper part of the protective frame so that the protective film corresponds to the photosensitive area of the photosensitive wafer, and in the step (d) After that, the protective film is removed from the protective frame.

According to an embodiment of the present creation, in the above method, a groove is provided at a position of the upper mold of the forming mold corresponding to the photosensitive area, so that in the step (c), the upper mold Keep a safe distance between the pressing surface of the photosensitive wafer and the photosensitive area of the photosensitive wafer.

According to an embodiment of the invention, a covering film is provided on the pressing surface of the upper mold of the forming mold.

According to an embodiment of the present creation, in the step (d), the molding material further wraps the outer side surface of the protective frame to form a contact with the photosensitive wafer and the circuit board after the molding material is cured. The integrated package bracket integrated with the protection frame.

According to an embodiment of the present creation, before the step (e), it further includes the step of: mounting at least one filter element on the top of the integrated package holder, and keeping the filter element on the Between the photosensitive wafer and the optical lens.

According to an embodiment of the present creation, before the step (e), it further includes the step: according to an embodiment of the present creation, in the step (b), on the outer peripheral side of the photosensitive area of the photosensitive wafer and A glue layer is formed between the protective frames to connect the protective frame and the outer peripheral side of the photosensitive wafer through the glue layer.

According to an embodiment of the present creation, in the step (b), a glue layer is formed between the outer peripheral side of the photosensitive area of the photosensitive wafer and the protective frame to connect the glue layer Protect the frame and the outer peripheral side of the photosensitive wafer.

According to an embodiment of the present invention, in the above method, glue is applied on the outer peripheral side of the photosensitive area of the protective frame and/or the photosensitive wafer to form the glue layer after the glue is cured.

According to an embodiment of the present creation, in the above method, the glue is cured by heat or UV light.

The present invention further provides a method for manufacturing a camera module, wherein the manufacturing method includes the following steps: (A) conductively connect at least one photosensitive chip and at least one circuit board; (B) overlay a filter element on the Photosensitive wafer; (C) providing at least one protection frame, wherein the protection frame is arranged on the outer peripheral side of the filter element; (D) pressing the protection frame through the pressing surface of the upper mold of a forming mold , In order to isolate the inner area and the outer peripheral side of the filter element; (E) wrap the circuit board and the outer peripheral side of the filter element by the forming material added to the forming mold, so that the forming material After curing, an integrated package holder integrated with the filter element, the photosensitive chip and the circuit board is formed; and (F) at least one optical lens is provided, wherein the optical lens is arranged on the photosensitive chip The photosensitive path to make the camera module.

According to an embodiment of the present creation, in the step (E), the molding material further includes the outer side surface of the protective frame, so as to form a contact with the photosensitive wafer and the circuit board after the molding material is cured. , The integrated packaging bracket in which the filter element and the protective frame are integrated.

According to an embodiment of the present invention, in the above method, the forming material is a fluid material or a granular material.

This creation further provides a camera module, which includes: At least one circuit board; at least one optical lens; at least one blocking element; at least one photosensitive chip, wherein the blocking element is convexly arranged on the outer peripheral side of the photosensitive area of the photosensitive chip; and at least one integrated package support, It is integrally covered on the non-photosensitive area of the circuit board and the photosensitive chip, the integrated package bracket, the photosensitive chip and the circuit board are combined into one body, wherein the optical lens is arranged on the photosensitive chip. The photosensitive path of the wafer, the photosensitive wafer is conductively connected to the circuit board.

According to an embodiment of the present creation, the camera module further includes a lens support, wherein each of the lens supports is arranged on the integrated packaging bracket, and the optical lens is arranged on the lens supports.

According to an embodiment of the present creation, the integrated packaging bracket extends integrally to form the lens support body.

According to an embodiment of the present creation, the camera module further includes at least one motor, the motor is arranged on the integrated packaging bracket and is electrically connected to the circuit board, and the optical lens is arranged on the motor.

According to an embodiment of the present creation, the camera module further includes at least one filter element, and the filter element is disposed on the top of the integrated package bracket.

According to an embodiment of the present creation, the camera module further includes a set of container blocking members, the container blocking members are respectively mounted on the circuit board, and the integrated packaging bracket wraps the container blocking member.

According to an embodiment of the present invention, the barrier element is formed by curing glue.

According to an embodiment of the present creation, the glue forming the barrier element further has viscosity after curing, so as to adhere to the dust inside the camera module.

According to an embodiment of the present creation, the barrier element formed by curing glue has elasticity.

According to an embodiment of the present creation, the integrated packaging bracket is wrapped around the outer peripheral surface of the blocking element.

The present invention further provides a camera module, which includes: at least one circuit board; at least one optical lens; at least one blocking element; at least one photosensitive chip; at least one filter element, wherein the filter element is overlapped with the photosensitive Chip, wherein the blocking element is disposed on the outer edge of the filter element; and an integrated package holder, wherein the integrated package holder wraps the outer area of the filter element and the circuit board to be placed on the After the integrated package support is formed, the integrated package support, the filter element, the photosensitive chip and the circuit board are integrated, wherein the optical lens is arranged on the photosensitive path of the photosensitive chip, and the photosensitive The chip is conductively connected to the circuit board.

According to an embodiment of the present creation, the camera module further includes at least one motor, the motor is arranged on the integrated package bracket and is electrically connected to the circuit board, and the optical lens is arranged on the motor.

According to an embodiment of the present creation, the filter element is an infrared cut filter or a full transmission spectrum filter.

The present invention further provides a method for manufacturing a camera module, wherein the manufacturing method includes the following steps: (a) conductively connect at least one photosensitive chip to at least one circuit board; (b) connect the circuit board and the photosensitive chip Placed in a forming mold; (c) providing a barrier element between the bottom surface of the upper mold of the forming mold and the photosensitive wafer, wherein the barrier element is located on the outer peripheral side of the photosensitive area of the photosensitive wafer; d) The non-photosensitive area of the circuit board and the photosensitive wafer is wrapped by the molding material added to the molding die to form an integrated combination with the photosensitive wafer and the circuit board after the molding material is cured An integrated package bracket; and (e) providing at least one optical lens, wherein the optical lens is arranged on the photosensitive path of the photosensitive chip to manufacture the camera module.

According to an embodiment of the present creation, an inner groove is provided in the region of the upper mold of the forming mold corresponding to the photosensitive wafer.

According to an embodiment of the present creation, a covering film is provided on the pressing surface of the upper mold of the forming mold.

According to an embodiment of the present creation, in the step (d), the molding material covers the circuit board, the non-photosensitive area of the photosensitive wafer outside the barrier element, and the outer periphery of the barrier element noodle.

According to an embodiment of the present creation, before step (e), further steps are included: At least one filter element is mounted on the top of the integrated package support and held between the photosensitive chip and the optical lens.

According to an embodiment of the present invention, in the above method, glue is applied along the outer edge of the photosensitive wafer to form the barrier element on the outer edge of the photosensitive wafer after the glue is cured.

According to an embodiment of the present creation, in the above-mentioned method, the glue applying step adopts painting glue or spray glue.

According to an embodiment of the present creation, in the above method, the integrated package bracket is made by injection molding or molding process.

According to an embodiment of the present creation, in the above method, the glue is cured by heat or UV light.

According to an embodiment of the present creation, the camera module is a fixed-focus camera module or a zoom camera module.

The present invention further provides a method for manufacturing a camera module, wherein the manufacturing method includes the following steps: (A) conductively connect at least one photosensitive chip to at least one circuit board; (B) overlay a filter element on the Photosensitive wafer; (C) placing the circuit board, the photosensitive wafer and the filter element in a forming mold; (D) providing a blocking element between the pressing surface of the upper mold of the forming mold and the filter, wherein the blocking element is located at the outer edge of the filter; (E) Wrap the outer edges of the circuit board and the filter element by the forming material added to the forming mold, to form a contact with the filter element, the photosensitive wafer, and the filter element after the forming material is cured An integrated package bracket integrated with the circuit board; and (F) At least one optical lens is provided, wherein the optical lens is arranged on the photosensitive path of the photosensitive chip to manufacture the camera module.

10, 10A, 10C, 10D, 10EOptical lens100, 100A, 100C, 100D, 100Eforming mold101, 101A, 101C, 101D, 101EUpper mold1011, 1011A, 1011C, 1011D, 1011EPressing surface102, 102A Lower mold103,103AForming space104A, 104Ccovering film105CGroove20, 20Amolded photosensitive component200Electronic equipment body21, 21A, 21C, 21D, 21EPhotosensitive element211, 211Achip connector212, 212ASensitive area213, 213ANon-photosensitive area2131, 2131AInside of chip2132, 2132AChip connection part2133, 2133AOutside of chip22, 22A, 22C, 22D, 22EPCB221, 221ACircuit board connector222, 222AChip mounting area223, 223AEdge area2231, 2231AInner side of circuit board2232, 2232ACircuit board connection part2233, 2233AOutside of circuit board23, 23AMolded base231, 231Alight window232, 232AMolded body233,223AInside surface234, 234AOutside surface235,235AGroove24, 24Alead241AChip connector242ACircuit board connection terminal25,25ASupporting element2501, 2501ATop surface2502, 2502AInner side2503, 2503AOuter side251, 251ASupporting body252, 252AThrough hole26, 26AElectronic components30, 30A, 30EDrive300C, 300DProtection frame40, 40A, 40D, 40EFilter element400C, 400D, 400EOne package bracket410CPlacement platform50ABracket500C, 500D, 500Elens support51AInstallation space60, 60Alens tube600C,600DGlue layer70,70ASupport700CProtective film800EBarrier element801EOuter peripheral surface

FIG. 1 is a schematic diagram of one of the manufacturing steps of a camera module according to a preferred embodiment of the present invention, wherein the photosensitive element of the camera module is mounted on the circuit board, and the non-sensitive area of the photosensitive element It is connected to the circuit board through a set of leads.

2A and 2B are schematic diagrams of the second manufacturing step of the camera module according to the above-mentioned preferred embodiment created according to the present invention, wherein a supporting element of the camera module is arranged in the non-photosensitive area of the photosensitive element .

3A is a schematic diagram of the third manufacturing step of the camera module according to the above-mentioned preferred embodiment created according to the present invention, in which the circuit board, the photosensitive element and the supporting element are placed on a molding die Between the mold and the lower mold, and the upper mold presses the supporting element.

3B is a schematic diagram of a modified embodiment of the third manufacturing step of the camera module according to the above-mentioned preferred embodiment created according to the present invention, in which the circuit board, the photosensitive element and the supporting element are placed on one A covering film is provided between an upper mold and a lower mold of the forming mold, and between the pressing surface of the upper mold and the supporting element.

4 is a schematic diagram of the fourth step of manufacturing the camera module according to the above-mentioned preferred embodiment created according to the present invention, in which the molding material used to form a molded base of the camera module is added to form the camera module A molding space between the upper mold and the lower mold.

5 is a schematic diagram of the fifth manufacturing step of the camera module according to the above-mentioned preferred embodiment created according to the present invention, wherein the molding material is cured to form the molded base.

6 is a schematic diagram of the sixth manufacturing step of the camera module according to the above-mentioned preferred embodiment created according to the present invention, wherein a filter element of the camera module is assembled on the molded base.

7 is a schematic diagram of the seventh manufacturing step of the camera module according to the above-mentioned preferred embodiment created according to the present invention, wherein an optical lens of the camera module is assembled in a driver, and the driver is assembled in the The base is molded to obtain the camera module.

FIG. 8 is a schematic diagram of a modified implementation of the camera module according to the above-mentioned preferred embodiment created according to the present invention.

FIG. 9A is a schematic diagram of a first modified implementation of a molded photosensitive component of the camera module according to the above-mentioned preferred embodiment created according to the present invention.

FIG. 9B is a schematic diagram of a second modified implementation of the molded photosensitive component of the camera module according to the above-mentioned preferred embodiment created according to the present invention.

FIG. 9C is a schematic diagram of a third modified implementation of the molded photosensitive component of the camera module according to the above-mentioned preferred embodiment created according to the present invention.

10A is a schematic diagram of a fourth modified implementation of the molded photosensitive element of the camera module according to the above-mentioned preferred embodiment created according to the present invention.

10B is a schematic diagram of a fifth modified implementation of the molded photosensitive component of the camera module according to the above-mentioned preferred embodiment created according to the present invention.

FIG. 11 is a schematic diagram of a sixth modified implementation of the molded photosensitive component of the camera module according to the above-mentioned preferred embodiment created according to the present invention.

FIG. 12 is a schematic diagram of another modified implementation of the camera module according to the above-mentioned preferred embodiment created according to the present invention.

FIG. 13 is a schematic diagram of another modified implementation of the camera module according to the above-mentioned preferred embodiment created according to the present invention.

Fig. 14 is a schematic block diagram of an electronic device with the aforementioned camera module of the present invention.

15 is a schematic perspective view of one of the manufacturing steps of an array camera module according to a preferred embodiment of the present invention, wherein the photosensitive element of the array camera module is mounted on the chip mounting area of the circuit board, And the wafer connector of the photosensitive element and the circuit board connector of the circuit board are connected by a set of leads, wherein the circuit board is an integrated circuit board.

16 is a perspective sectional view of the second manufacturing step of the array camera module according to the above-mentioned preferred embodiment created according to the present invention, wherein a supporting body of the array camera module is arranged to cover the photosensitive element At least a part of the non-photosensitive area to form a semi-finished molded photosensitive component.

FIG. 17A is a three-dimensional cross-sectional schematic diagram of the third step of manufacturing the array camera module according to the above-mentioned preferred embodiment created according to the present invention, in which the semi-finished product of the molded photosensitive component is placed on an upper mold and a lower mold of a molding mold. Between the molds, and the pressing surface of the upper mold is in contact with the top surface of the supporting body.

FIG. 17B is a schematic perspective cross-sectional view of a modified embodiment of the third manufacturing step of the array camera module according to the above preferred embodiment created according to the present invention, in which a cover film is provided on the pressing surface of the upper mold, When the pressing surface of the upper mold is applied to the top surface of the supporting body, the covering film is located between the pressing surface of the upper mold and the top surface of the supporting body.

FIG. 18 is a three-dimensional cross-sectional schematic diagram of the fourth step of manufacturing the array camera module according to the above-mentioned preferred embodiment created according to the present invention, in which molding materials are added to form the molding between the upper mold and the lower mold space.

19 is a perspective sectional view of the fifth step of manufacturing the array camera module according to the above-mentioned preferred embodiment created according to the present invention, wherein a molded photosensitive material of the array camera module is formed after the molding material is cured Components.

20 is a three-dimensional cross-sectional schematic view of the sixth manufacturing step of the array camera module according to the above-mentioned preferred embodiment created according to the present invention, in which a filter element of the array camera module is assembled on the mold base The top surface of the seat.

FIG. 21 is a three-dimensional cross-sectional view of the seventh manufacturing step of the array camera module according to the above preferred embodiment created according to the present invention, in which an optical lens of the array camera module is assembled in a driver, and the driver Are assembled on the top surface of the molded base.

FIG. 22 is a three-dimensional cross-sectional view of the eighth step of manufacturing the array camera module according to the above-mentioned preferred embodiment created according to the present invention, wherein each of the drivers is respectively mounted on a bracket of the array camera module Each installation space forms the array camera module.

FIG. 23 is a three-dimensional schematic diagram of the array camera module of the above-mentioned preferred embodiment created according to the present invention.

FIG. 24 is a three-dimensional schematic diagram of a first modified implementation of the array camera module according to the above-mentioned preferred embodiment created according to the present invention.

FIG. 25 is a schematic perspective cross-sectional view of a second modified implementation of the array camera module of the above-mentioned preferred embodiment created according to the present invention.

FIG. 26 is a three-dimensional cross-sectional schematic diagram of a third modified implementation of the array camera module according to the above-mentioned preferred embodiment created according to the present invention.

FIG. 27A is a schematic three-dimensional cross-sectional view of a fourth modified implementation of the array camera module according to the above-mentioned preferred embodiment created according to the present invention.

FIG. 27B is a schematic perspective cross-sectional view of a fifth modified implementation of the array camera module according to the above-mentioned preferred embodiment created according to the present invention.

28A is a perspective view of a first modified embodiment of the semi-finished molded photosensitive component of the array camera module according to the above-mentioned preferred embodiment created according to the present invention, wherein the supporting body covers the circuit board At least a part of the edge area and at least a part of the non-photosensitive area of the photosensitive element, the wafer connecting portion, and the wafer inner portion.

28B is a perspective view of a second modified embodiment of the semi-finished molded photosensitive component of the array camera module of the above-mentioned preferred embodiment created according to the present invention, wherein the supporting body covers the circuit board At least a part of the edge area and at least a part of the chip connection part and the chip outer part of the non-photosensitive area of the photosensitive element.

28C is a perspective view of a third modified embodiment of the semi-finished molded photosensitive component of the array camera module of the above-mentioned preferred embodiment created according to the present invention, wherein the supporting body covers the circuit board At least a part of the edge region and at least a part of the outer side of the wafer of the non-photosensitive region of the photosensitive element.

28D is a perspective view of a fourth modified embodiment of the semi-finished molded photosensitive component of the array camera module of the above-mentioned preferred embodiment created according to the present invention, wherein the supporting body covers the circuit board At least part of the edge area.

28E is a perspective view of a fifth modified embodiment of the semi-finished molded photosensitive component of the array camera module of the above-mentioned preferred embodiment created according to the present invention, wherein the supporting body covers the circuit board At least part of the edge area.

29 is a cross-sectional view of a modified embodiment of the molded photosensitive element of the array camera module according to the above-mentioned preferred embodiment created according to the present invention, wherein the molded base covers the outer surface of the supporting body .

FIG. 30 is a schematic diagram of a three-dimensional cross-sectional view of an array camera module according to another preferred embodiment of the present invention.

FIG. 31 is a schematic diagram of a three-dimensional cross-sectional view of an array camera module according to another preferred embodiment of the present invention.

FIG. 32 is a schematic diagram of a three-dimensional cross-sectional view of an array camera module according to another preferred embodiment of the present invention.

FIG. 33 is a schematic diagram of an electronic device with the array camera module of the above-mentioned preferred embodiment of the present creation.

FIG. 34A is a schematic diagram of the internal structure of a camera module according to a preferred embodiment created according to the present invention after being cut along the middle position.

FIG. 34B is a schematic diagram of the internal structure of the camera module according to a modified embodiment of the above-mentioned preferred embodiment created according to the present invention, which is cut along the middle position.

35 is a three-dimensional schematic diagram of the structural relationship between the circuit board, the photosensitive element, and the protective frame of the camera module according to the above-mentioned preferred embodiment of the novel.

36A is a schematic cross-sectional view of step 1 of a manufacturing process of the camera module according to the above-mentioned preferred embodiment created according to the present invention.

36B is a schematic cross-sectional view of step 2 of the above-mentioned manufacturing process of the above-mentioned camera module of the above-mentioned preferred embodiment created according to the present invention.

36C is a schematic cross-sectional view of step 3 of the above-mentioned manufacturing process of the above-mentioned camera module of the above-mentioned preferred embodiment created according to the present invention.

36D is a schematic cross-sectional view of step 4 of the above-mentioned manufacturing process of the above-mentioned camera module of the above-mentioned preferred embodiment created according to the present invention.

36E is a schematic cross-sectional view of step 5 of the above-mentioned manufacturing process of the above-mentioned camera module of the above-mentioned preferred embodiment created according to the present invention.

36F is a schematic cross-sectional view of step 6 of the above-mentioned manufacturing process of the above-mentioned camera module of the above-mentioned preferred embodiment created according to the present invention.

FIG. 37A is a schematic cross-sectional view of a modified embodiment of step 3 of the above-mentioned manufacturing process of the above-mentioned preferred embodiment of the camera module created according to the present invention.

FIG. 37B is a schematic cross-sectional view of a modified embodiment of step 4 of the above-mentioned manufacturing process of the above-mentioned camera module of the above-mentioned preferred embodiment created according to the present invention.

FIG. 38 is a schematic cross-sectional view of another modified embodiment of step 4 of the above-mentioned manufacturing process of the above-mentioned camera module of the above-mentioned preferred embodiment created according to the present invention.

FIG. 39A is a schematic cross-sectional view of step 1 of another manufacturing process of the camera module of the above-mentioned preferred embodiment created according to the present invention.

FIG. 39B is a schematic cross-sectional view of step 2 of the above-mentioned manufacturing process of the above-mentioned camera module of the above-mentioned preferred embodiment created according to the present invention.

FIG. 39C is a schematic cross-sectional view of step 3 of the above-mentioned manufacturing process of the above-mentioned camera module of the above-mentioned preferred embodiment created according to the present invention.

FIG. 39D is a schematic cross-sectional view of step 4 of the above-mentioned manufacturing process of the above-mentioned camera module of the above-mentioned preferred embodiment created according to the present invention.

FIG. 39E is a schematic cross-sectional view of step 5 of the above-mentioned manufacturing process of the above-mentioned camera module of the above-mentioned preferred embodiment created according to the present invention.

FIG. 39F is a schematic cross-sectional view of step 6 of the above-mentioned manufacturing process of the above-mentioned camera module of the above-mentioned preferred embodiment created according to the present invention.

FIG. 39G is a schematic cross-sectional view of step 7 of the above-mentioned manufacturing process of the above-mentioned camera module of the above-mentioned preferred embodiment created according to the present invention.

FIG. 40 is a schematic diagram of the internal structure of another preferred embodiment of the camera module created according to the present invention after being cut along the middle position.

FIG. 41 is a three-dimensional schematic diagram of the structural relationship among the circuit board, the photosensitive element, the filter element and the protective frame of the camera module according to the new above-mentioned preferred embodiment.

42A is a schematic cross-sectional view of step 1 of a manufacturing process of the camera module of the above preferred embodiment created according to the present invention.

42B is a schematic cross-sectional view of step 2 of the above-mentioned manufacturing process of the above-mentioned camera module of the above-mentioned preferred embodiment created according to the present invention.

42C is a schematic cross-sectional view of step 3 of the above-mentioned manufacturing process of the above-mentioned camera module of the above-mentioned preferred embodiment created according to the present invention.

42D is a schematic cross-sectional view of step 4 of the above-mentioned manufacturing process of the above-mentioned camera module of the above-mentioned preferred embodiment created according to the present invention.

42E is a schematic cross-sectional view of step 5 of the above-mentioned manufacturing process of the above-mentioned camera module of the above-mentioned preferred embodiment created according to the present invention.

42F is a schematic cross-sectional view of step 6 of the above-mentioned manufacturing process of the above-mentioned camera module of the above-mentioned preferred embodiment created according to the present invention.

FIG. 42G is a schematic cross-sectional view of step 7 of the above-mentioned manufacturing process of the above-mentioned camera module of the above-mentioned preferred embodiment created according to the present invention.

FIG. 43 is a schematic diagram of the internal structure of a camera module according to a preferred embodiment created according to the present invention after being cut along the middle position.

FIG. 44 is a schematic diagram of the internal structure of another preferred embodiment of the camera module created according to the present invention after being cut along the middle position.

Fig. 45 is a partial enlarged schematic diagram of Fig. 44 at the S position.

FIG. 46 is a schematic diagram of the internal structure of another preferred embodiment of the camera module created according to the present invention after being cut along the middle position.

Fig. 47 is a partial enlarged schematic diagram of Fig. 44 at the position S'.

FIG. 48 is a schematic diagram of step 1 of a manufacturing process of the camera module of the above-mentioned preferred embodiment created according to the present invention.

FIG. 49 is a schematic diagram of step 2 of the above-mentioned manufacturing process of the above-mentioned camera module of the above-mentioned preferred embodiment created according to the present invention.

50 is a schematic diagram of step 3 of the above-mentioned manufacturing process of the above-mentioned camera module of the above-mentioned preferred embodiment created according to the present invention.

FIG. 51 is a schematic diagram of step 1 of another manufacturing process of the camera module of the above-mentioned preferred embodiment created according to the present invention.

FIG. 52 is a schematic diagram of step 2 of the above-mentioned manufacturing process of the above-mentioned camera module of the above-mentioned preferred embodiment created according to the present invention.

FIG. 53 is a schematic diagram of step 3 of the above-mentioned manufacturing process of the above-mentioned camera module of the above-mentioned preferred embodiment created according to the present invention.

FIG. 54 is a schematic diagram of step 1 of another manufacturing process of the camera module according to the above-mentioned preferred embodiment created according to the present invention.

FIG. 55 is a schematic diagram of step 2 of the above-mentioned manufacturing process of the above-mentioned camera module of the above-mentioned preferred embodiment created according to the present invention.

FIG. 56 is a schematic structural diagram of another preferred embodiment of the manufacturing process of the camera module according to the above preferred embodiment created according to the present invention.

In order to fully understand the purpose, features and effects of this creation, we will use the following specific examples and accompanying drawings to give a detailed description of this creation. The description is as follows: The following description is used to disclose the creation so that those skilled in the art can realize the creation. The preferred embodiments in the following description are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the creation defined in the following description can be applied to other implementation solutions, modified solutions, improved solutions, equivalent solutions, and other technical solutions that do not deviate from the spirit and scope of the creation.

Those skilled in the art should understand that in the disclosure of this creation, the terms "vertical", "horizontal", "upper", "lower", "front", "rear", "left", "right", " The orientation or positional relationship indicated by "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the creation and The description is simplified, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore the above-mentioned terms should not be understood as a limitation of this creation.

It can be understood that the term "a" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, and in another embodiment, the number of the element The number can be more than one, and the term "one" cannot be understood as a restriction on the number.

With reference to Figures 1 to 7 of the accompanying drawings of the description of this creation, a camera module according to a preferred embodiment of this creation is illustrated, wherein the camera module includes at least one optical lens 10 and at least one molded photosensitive component 20 . Each of the molded photosensitive components 20 further includes a photosensitive element 21, a circuit The board 22, a molded base 23, and a set of leads 24, both ends of each lead 24 respectively extending to be connected to the non-photosensitive area of each photosensitive element 21 and each of the circuit boards 22, Each molding base 23 is at least integrally molded on each circuit board 22, so that the molding base 23 and the circuit board 22 form an integrated structure, and each optical lens 10 The photosensitive path of the photosensitive element 21 of each of the molded photosensitive elements 20 is respectively provided. The light reflected by the object enters the interior of the camera module from each of the optical lenses 10, and is subsequently received by each of the photosensitive elements 21 and photoelectrically converted, so as to obtain an image associated with the object.

It is worth mentioning that the photosensitive element 21 has a set of chip connectors 211, and the circuit board 22 has a set of circuit board connectors 221, wherein both ends of each lead 24 can be connected to the Each of the wafer connector 211 of the photosensitive element 21 and each of the circuit board connector 221 of the circuit board 22 connects the photosensitive element 21 and the circuit board 22 in the above-mentioned manner. In an example of this creation, each of the chip connector 211 of the photosensitive element 21 and each of the circuit board connector 221 of the circuit board 22 may be a connection pad, that is, the photosensitive element 21 Each of the chip connector 211 and each of the circuit board connectors 221 of the circuit board 22 may be in the shape of a disk, so as to connect the two ends of each lead 24 to the photosensitive member respectively. Each of the chip connectors 211 of the element 21 and each of the circuit board connectors 221 of the circuit board 22. In another example of this creation, each of the chip connector 211 of the photosensitive element 21 and each of the circuit board connector 221 of the circuit board 22 may be spherical, for example, solder paste or other The soldering material is spotted on the photosensitive element 21 and the circuit board 22 to form the chip connector 211 of the photosensitive element 21 and the circuit board connector 221 of the circuit board 22, respectively. Nevertheless, the shapes of the chip connector 211 of the photosensitive element 21 and the circuit board connector 221 of the circuit board 22 do not limit the content and scope of this creation.

The photosensitive element 21 includes a photosensitive area 212 and a non-photosensitive area 213, wherein the photosensitive area 212 and the non-photosensitive area 213 of the photosensitive element 21 are integrally formed, and the photosensitive area 212 is located in the photosensitive area 213. In the middle of the element 21, the non-photosensitive area 213 is located outside the photosensitive element 21, and the non-photosensitive area 213 surrounds the photosensitive area 212 once. After the light reflected by the object enters the interior of the camera module from the optical lens 10, it can be received by the photosensitive area 212 of the photosensitive element 21 and photoelectrically converted to obtain an image associated with the object.

Those skilled in the art can understand that, each of the wafer connectors 211 of the photosensitive element 21 is disposed in the non-photosensitive area 213 of the photosensitive element 21. In addition, the non-photosensitive area 213 of the photosensitive element 21 has a chip inner portion 2131, a chip connecting portion 2132, and a chip outer portion 2133, wherein the chip inner portion 2131 surrounds the photosensitive area 212 once. The two sides of the chip connection portion 2132 respectively extend and are connected to the chip inner portion 2131 and the chip outer portion 2133. That is, the non-photosensitive area 213 from the position where the wafer connector 211 is provided to the position of the edge of the photosensitive area 212 is defined as the wafer inner side 2131, and the non-photosensitive area The area of 213 where the wafer connector 211 is provided is defined as the wafer connector 2132, and the non-photosensitive area 213 is from the position where the wafer connector 211 is provided to the outer edge of the photosensitive element 21 The area of the position is defined as the outer side portion 2133 of the wafer. In other words, from the top view of the photosensitive element 21, the photosensitive element 21 is the outer side portion 2133, the connecting portion 2132, the inner side portion 2131, and the photosensitive area of the wafer in order from the outside to the inner portion. 212.

In addition, the circuit board 22 includes a flat chip mounting area 222 and an edge area 223, wherein the edge area 223 is integrally formed with the chip mounting area 222, and the edge area 223 is located on the chip. Around the mounting area 222. The chip mounting area 222 is used for mounting the photosensitive element 21, and the circuit board connector 221 is disposed in the edge area 223. The line The edge area 223 of the board 22 has a circuit board inner portion 2231, a circuit board connection portion 2232, and a circuit board outer portion 2233, wherein the circuit board inner portion 2231 surrounds the chip mounting area 222 once, the The two sides of the circuit board connection portion 2232 respectively extend and are connected to the circuit board inner portion 2231 and the circuit board outer portion 2233. In other words, the edge area 223 from the position where the circuit board connector 221 is provided to the position of the edge of the chip mounting area 222 is defined as the inner side portion 2231 of the circuit board, and the The area of the edge region 223 where the circuit board connector 221 is provided is defined as the circuit board connector 2232, and the edge region 223 is from the position where the circuit board connector 221 is provided to the edge region 223 The area of the position of the outer edge of is defined as the outer portion 2233 of the circuit board. In other words, from the top view of the circuit board 22, the circuit board 22 is the circuit board outer portion 2233, the circuit board connecting portion 2232, the circuit board inner portion 2231, and the circuit board from the inside to the outside. Mentioned chip mounting area 222. The type of the lead 24 is not limited in the camera module of this creation. For example, in a specific example, the lead 24 can be implemented as a gold wire, that is, the lead 24 can be The photosensitive element 21 and the circuit board 22 are connected together, so that after the photosensitive element 21 converts an optical signal into an electrical signal, the electrical signal can be further transmitted to the circuit board 22 through the lead 24. Those skilled in the art can understand that, in other examples of the camera module, the lead 24 can also be implemented as a silver wire, a copper wire, etc., which can realize the electrical signal between the photosensitive element 21 and The circuit boards 22 are made of materials that are transferred between them.

In addition, in an example, the camera module may be implemented as a fixed-focus camera module, wherein the camera module makes the optical lens 10 through a lens mount assembled on the molded base 23 It is held in the light-receiving path of the light-receiving element 21.

In another example, the camera module can be implemented as a zoom camera module, wherein the camera module is adjusted by changing the distance between the optical lens 10 and the photosensitive element 21. Adjust the focal length of the camera module. Specifically, in the example shown in FIG. 7, the camera module further includes at least one driver 30, wherein each of the optical lenses 10 is correspondingly disposed on each of the drivers 30, and each The drivers 30 are respectively assembled on each of the molded bases 23, and each of the drivers 30 are electrically connected to each of the circuit boards 22 to transmit power and control signals on the circuit boards 22 After the driver 30, the driver 30 can drive the optical lens 10 to move along the photosensitive path of the photosensitive element 21, thereby adjusting the focal length of the camera module. In other words, the optical lens 10 is drivably disposed on the driver 30.

It is worth mentioning that the type of the driver 30 is not limited in the camera module of this creation. For example, in a specific example, the driver 30 can be implemented as any driver capable of driving a motor, such as a voice coil motor. The optical lens 10 generates a shifted driver along the photosensitive path of the photosensitive element 21, wherein the driver 30 can receive electrical energy and control signals to be in a working state.

Further, referring to FIG. 7, the camera module further includes at least one filter element 40, wherein each of the filter elements 40 is assembled on each of the molded bases 23, and each of the filter elements 40 The filter elements 40 are respectively located in the light-sensing path of each light-sensing element 21. The light reflected by the object enters the interior of the camera module from the optical lens 10, and is filtered by the filter element 40 before being received by the photosensitive element 21 and photoelectrically converted. That is to say, the filter element 40 can filter the stray light in the light reflected by the object that enters the camera module from the optical lens 10, such as the infrared part. In this way, the stray light can be changed. The imaging quality of the camera module.

Those skilled in the art can understand that in different examples of the camera module, the filter element 40 can be implemented in different types, for example, the filter element 40 can be implemented as an infrared cut filter. Filter, full transmission spectrum filter and other filters or a combination of multiple filters, for example, the filter element 40 can be implemented as a combination of an infrared cut filter and a full transmission spectrum filter Together, that is, the infrared cut filter and the full transmission spectrum filter can be switched to be selectively located on the photosensitive path of the photosensitive element 21, for example, the In the case of a camera module, the infrared cut-off filter can be switched to the light-sensing path of the photosensitive element 21, so that the infrared cut-off filter can filter the light that enters the camera module and is reflected by the object. Infrared, when the camera module is used in a dark environment such as night, the full transmission spectrum filter can be switched to the photosensitive path of the photosensitive element 21 to allow the camera module to enter the camera module. Part of the infrared light reflected by the object is transmitted through.

As shown in FIG. 7, the molded photosensitive component 20 of the camera module further includes a supporting element 25, wherein before the molded base 23 is molded, the supporting element 25 is disposed on the photosensitive element. The non-photosensitive area 213 of the element 21 is such that after the molding base 23 is molded, the mold base 23 covers the circuit board 22, the non-photosensitive area 213 and the photosensitive element 21 A part of the supporting element 25 to form the molded photosensitive component 20, wherein the supporting element 25 can effectively improve the product yield of the camera module and improve the imaging quality of the camera module. In the following description, the features and advantages of the supporting element 25 will be further explained and disclosed.

Further, the supporting element 25 has a top surface 2501, an inner side surface 2502, and an outer side surface 2503, wherein two sides of the top surface 2501 are connected to the inner side surface 2502 and the outer side surface 2503, respectively. It is worth mentioning that the side of the supporting element 25 facing the photosensitive element 21 is defined as the inner side 2502 of the supporting element 25, and a side of the supporting element 25 facing the circuit board 22 The side is defined as the outer side 2503 of the support element 25.

Referring to FIG. 7, the molded photosensitive component 20 of the camera module further includes a plurality of electronic components 26, wherein each of the electronic components 26 can be attached by a process such as SMT (Surface Mount Technology) Installed on the edge area 223 of the circuit board 22. Preferably, Each of the electronic components 26 is mounted on the outer portion 2233 of the circuit board of the edge area 223. The photosensitive element 21 and each of the electronic components 26 may be mounted on the same side or the opposite side of the circuit board 22. For example, in a specific example, the photosensitive element 21 and each of the electronic components The devices 26 are mounted on the same side of the circuit board 22, and the photosensitive elements 21 are mounted on the chip mounting area 222 of the circuit board 22, and each of the electronic components 26 is mounted At the edge area 223 of the circuit board 22. After the molded base 23 is integrally molded on the circuit board 22, the molded base 23 covers each of the electronic components 26 to isolate adjacent ones by the molded base 23 The electronic component 26 is separated from the electronic component 26 and the photosensitive element 21, so that, in the camera module of the present creation, even when the distance between the adjacent electronic components 26 is relatively short , The molded base 23 can also prevent the adjacent electronic components 26 from contacting or interfering with each other, and the manner in which the molded base 23 covers the electronic components 26 can also prevent the electronic components from being generated Contaminants on the surface of the component 26 contaminate the photosensitive area 212 of the photosensitive element 21, thereby reducing the volume of the camera module and improving the imaging quality of the camera module. In other words, the camera module of the present creation uses the molding base 23 to cover the electronic components 26, so that a small area of the circuit board 22 can be mounted with more electronic components. Components 26. It is worth mentioning that the types of the electronic components 26 include, but are not limited to, resistors, capacitors, and driving devices.

In addition, those skilled in the art can understand that although a single camera module is used as an example in FIGS. 1 to 7 to disclose the manufacturing steps of the camera module and the molded photosensitive component 20 In the example shown in FIG. 8, the camera module can also be implemented as a dual-lens camera module or an array camera module, and the present creation is not limited in this respect.

In the examples shown in FIGS. 1 to 7, the manufacturing steps of the camera module and the manufacturing steps of the molded photosensitive component 20 are described.

As shown in FIG. 1, the photosensitive element 21 is mounted on the wafer mounting area 222 of the circuit board 22, and each of the wafer connectors of the non-photosensitive area 213 of the photosensitive element 21 211 and the edge area 223 of the circuit board 22 each of the circuit board connectors 221 are connected by a set of the leads 24. In addition, each of the electronic components 26 is mounted on the outer side portion 2233 of the circuit board of the edge area 223 of the circuit board 22. That is to say, the two ends of a set of the lead wires 24 are respectively connected to the photosensitive element 21 and the circuit board 22, wherein each lead wire 24 protrudes from the photosensitive element 21 in an upward arc shape. Upper surface. It is understandable that, limited by the wiring process of using the lead 24 to connect the photosensitive element 21 and the circuit board 22 and the characteristics of the lead 24, both ends of the lead 24 are connected to the After each of the chip connectors 211 of the non-photosensitive area 213 of the photosensitive element 21 and the edge regions 223 of the circuit board 22 each of the circuit board connectors 221, the leads 24 need to be displayed. It protrudes in an arc shape from the upper surface of the photosensitive element 21. In addition, keeping the curvature of each lead 24 in a smooth state helps to ensure the ability of the lead 24 to transmit the electrical signal between the photosensitive element 21 and the circuit board 22. Wherein, each of the leads 24 is arranged between the photosensitive element 21 and the circuit board 22, for example, each of the leads 24 may be equally spaced. Those skilled in the art can understand that during the manufacturing process of the camera module and the process of using the camera module, keeping each lead 24 in the initial state is beneficial to ensure that the The lead 24 has the ability to transmit the electrical signal between the photosensitive element 21 and the circuit board 22, thereby ensuring the imaging quality of the camera module.

It is worth mentioning that, in the camera module of this creation, the wiring direction of the lead 24 is not limited. For example, the wiring direction of the lead 24 can be from the photosensitive element 21 to the circuit board 22, It can also be from the circuit board 22 to the photosensitive element 21.

Those skilled in the art can understand that, although the photosensitive element 21 is mounted on the circuit board 22 as an example in FIG. In the manufacturing steps of the molded photosensitive component 20 of the camera module, in another example, a plurality of the photosensitive elements 21 can also be mounted on different positions of the circuit board 22 to make double Lens camera module or array camera module. In another example, a plurality of the circuit boards 22 can also be spliced together to form a circuit board imposition, and then each photosensitive element 21 is mounted on the The circuit board 22 at the corresponding position of the circuit board imposition is to separate the circuit board imposition later. This creation is not restricted in this regard.

Referring to FIGS. 2A and 2B, the supporting element 25 is disposed in the non-photosensitive area 213 of the photosensitive element 21 to be formed by the photosensitive element 21, the circuit board 22, and the supporting element 25 A semi-finished product of a molded photosensitive component, wherein the supporting element 25 is arranged to cover the wafer inner portion 2131 of the non-photosensitive area 213 of the photosensitive element 21, the wafer connecting portion 2232, and the wafer outer portion 2233 . In other words. The supporting element 25 can cover a part of each of the leads 24, so that in the subsequent process of making the camera module and in the process of molding the photosensitive component 20, the supporting element 25 can cover all the wires. The lead 24 is used to improve the imaging quality of the camera module by protecting the good electrical properties of the lead 24. Those skilled in the art can understand that, in this embodiment of the camera module created by the present invention, the supporting element 25 covers the chip connector 211 of the photosensitive element 21.

Further, the supporting element 25 includes a frame-shaped supporting body 251 and a through hole 252, wherein the supporting body 251 is disposed in the non-photosensitive area 213 of the photosensitive element 21, so that the photosensitive element The photosensitive area 212 of 21 corresponds to the through hole 252 of the supporting element 25, so that the supporting body 251 can protect the photosensitive element 21 during the molding process. The photosensitive area 212. The molded base 23 covers the outer side surface 2503 of the supporting body 251 and at least a part of the top surface 2501 after molding. It is worth mentioning that the inner side surface 2502 of the supporting element 25 is used to form the through hole 252 of the supporting element 25.

Preferably, the supporting body 251 covers the inner side portion 2131 of the wafer of the photosensitive element 21, the connecting portion 2132 and the outer side portion 2133 of the wafer, that is, the supporting body 251 can cover The chip connector 211, so that the supporting body 251 can prevent the connection position of the lead 24 and the chip connector 211 from contacting the molding material used to form the mold base 23, so as to avoid the lead 24 is detached from the wafer connector 211. It is understandable that when the supporting body 251 covers the connection position of the lead 24 and the chip connector 211, the supporting body 251 can isolate the connection position of the lead 24 and the chip connector 211 And the molding material, so as to prevent the molding material from causing deformation of the end of the lead 24 for connecting the wafer connector 211 or the lead 24 from being removed from the wafer connector 211 during the molding process. Fall off. In one embodiment, the supporting body 251 may be formed by placing glue on the non-photosensitive area 213 of the photosensitive element 21 and forming the glue after curing, so that the supporting body 251 has elasticity. After the supporting body 251 is formed, the inner side surface 2502 of the supporting body 251 forms the through hole 252, and the photosensitive area 212 of the photosensitive element 21 corresponds to the through hole 252. In addition, the support body 251 formed of glue may also have adhesiveness for subsequent adhesion of contaminants such as dust, so as to prevent these contaminants from polluting the photosensitive area 212 of the photosensitive element 21 and causing the The photosensitive area 212 of the photosensitive element 21 has stains to further ensure the imaging quality of the camera module. For example, the supporting body 251 is arranged between the photosensitive area 212 of the photosensitive element 21 and the electronic component 26, so as to be generated when the electronic component 26 is mounted on the circuit board 22. Contaminants such as solder powder will be The support body 251 adheres, so as to prevent these contaminants such as solder powder from contaminating the photosensitive area 212 of the photosensitive element 21.

Preferably, the supporting body 251 may be coated on the non-photosensitive area 213 of the photosensitive element 21 with glue in a glue state and formed after the glue is cured, so as to prevent the glue from being coated on the photosensitive element. The non-photosensitive area 213 of 21 then flows and pollutes the photosensitive area 212 of the photosensitive element 21. In other words, the glue has good plasticity and self-setting properties before being cured to form the supporting body 251, so as to prevent the glue from being coated on the non-photosensitive area 213 of the photosensitive element 21 and deforming during curing. Those skilled in the art can understand that by coating the non-photosensitive area 213 of the photosensitive element 21 with glue in a glue state, the support body 251 formed by the glue can cover the lead 24 , And avoid damaging the lead 24 during the process of applying glue on the non-photosensitive area 213 of the photosensitive element 21.

Referring to FIG. 3A, during the molding process, the molding material is cured by a molding die 100 to form the molding base 23 that is at least integrally molded on the circuit board 22 through such a In this way, the size of the camera module can be reduced and the assembly error of the camera module can be reduced, thereby making the structure of the camera module more compact and improving the imaging quality of the camera module.

Specifically, the forming mold 100 includes an upper mold 101 and a lower mold 102, wherein at least one of the upper mold 101 and the lower mold 102 can be moved so that the upper mold 101 and the lower mold 102 can be moved. The lower mold 102 can be subjected to a mold clamping operation, and at least one molding space 103 is formed between the upper mold 101 and the lower mold 102, wherein the molding base 23 is added to the molding by the molding material The space 103 is formed after curing. For example, in one embodiment, the lower mold 102 is usually fixed, and the upper mold 101 can move relative to the lower mold 102 along the guide post, so that the upper mold 101 faces the lower mold 102. When being moved, the mold is closed, so that the upper mold 101 and The forming space 103 is formed between the lower mold 102, and the mold is drawn when the upper mold 102 moves away from the lower mold 102. Or in another example, the upper mold 101 is fixed, and the lower mold 102 can move relative to the upper mold 101 along the guide post, so that the lower mold 102 faces the upper mold 101. When the mold is moved, the mold is clamped, so that the molding space 103 is formed between the lower mold 102 and the upper mold 101, and the mold is drawn when the lower mold 102 moves away from the upper mold 101.

The photosensitive element 21 and the circuit board 22 are connected by a set of the leads 24, and the non-photosensitive area 213 of the photosensitive element 21 is formed on the supporting body 251 to cover the lead 24 A part of the semi-finished molded photosensitive component is formed, the semi-finished molded photosensitive component is placed on the lower mold 102 of the molding mold 100, and the upper mold 101 and/or the upper mold 101 of the molding mold 100 are operated. The lower mold 101, so that the upper mold 101 and the lower mold 102 are closed, thereby forming the molding space 103 between the upper mold 101 and the lower mold 102, and the photosensitive element 21, the The circuit board 22 and the supporting element 25 respectively partially contact the molding space 103 of the molding mold 100, wherein the pressing surface 1011 of the upper mold 101 is in contact with the top surface 2501 of the supporting body 251 The supporting body 251 supports the upper mold 101 upward to prevent the pressing surface 1011 of the upper mold 101 from being pressed against the lead 24. For example, in this specific example of this creation such as shown in FIG. 7, the outside of the circuit board 22, the non-photosensitive area of the photosensitive element 21, and a part of the supporting element 25 are located on all parts of the molding die 100. The molding space 103, so that after the molding base 23 is molded in the molding space 103, the molding base 23 covers the outside of the circuit board 22, the non-photosensitive area of the photosensitive element 21, and Part of the supporting element 25.

Therefore, those skilled in the art can understand that the molding space 103 of the molding die 100 may be a ring-shaped space, so as to form a ring-shaped space after the molding material is added to the molding space 103 and cured. The molded base 23.

It is worth mentioning that the supporting body 251 has elasticity, so that when the molding mold 100 is performing a mold clamping operation, the pressing surface 1011 of the upper mold 101 of the molding mold 100 is in contact with the The impact force generated at the moment of the top surface 2501 of the supporting body 251 is absorbed by the supporting body 251 to prevent the impact force from being further transmitted to the photosensitive element 21, thereby preventing the photosensitive element 21 from being damaged or preventing the photosensitive element 21 from being damaged. The photosensitive element 21 is displaced relative to the circuit board 22 due to force. Those skilled in the art can understand that the way in which the supporting body 251 absorbs the impact force and prevents the impact force from being further transmitted to the photosensitive element 21 can also ensure that the photosensitive element 21 is attached to the photosensitive element 21. The flatness of the circuit board 22 is not affected, thereby ensuring the imaging quality of the camera module.

It is worth mentioning that the Shore hardness of the supporting body 251 ranges from A50 to A80, and the elastic modulus ranges from 0.1 Gpa to 1 Gpa.

Preferably, in the example of the present creation such as that shown in FIG. 7, the height of the supporting body 251 can be implemented to be higher than or equal to the height of the upward protrusion of the lead 24 so as to be used in the forming mold 100. During the mold clamping operation, when the pressing surface 1011 of the upper mold 101 of the forming mold 100 is in contact with the top surface 2501 of the supporting body 251, the supporting body 251 can support the upper The mold 101 prevents the upper mold 101 from pressing on the lead 24. For example, in an example, the height of the support body 251 is equal to the height of the upward protrusion of the lead 24, so that when the upper mold 101 and the lower mold 102 of the forming mold 100 are clamped, The supporting body 251 supports the upper mold 101 upward so that although the pressing surface 1011 of the upper mold 101 can contact the lead 24, the pressing surface 1011 of the upper mold 101 is not It is possible to apply pressure to the lead 24. In another example, the height of the supporting body 251 is higher than the height of the upward protrusion of the lead 24, so that the upper mold 101 and the lower mold 102 of the forming mold 100 are clamped. When the support body 251 supports the upper mold 101 upwards, so that the pressing surface 1011 of the upper mold 101 does not contact the lead 24, thereby avoiding the pressing surface of the upper mold 101 1011 presses on the lead 24. In other words, the supporting body 251 can support the upper mold 101 upward to reserve a safe distance between the pressing surface 1011 of the upper mold 101 and the lead 24.

In addition, the support body 251 has elasticity. After the upper mold 101 and the lower mold 102 of the molding mold 100 are clamped, the pressing surface 1011 of the upper mold 101 and the The top surface 2501 of the supporting body 251 contacts and presses the top surface 2501 of the supporting body 251, wherein the pressing surface 1011 of the upper mold 101 is applied to the top surface of the supporting body 251 The pressure of 2501 can cause slight deformation of the supporting body 251 to prevent a gap between the pressing surface 1011 of the upper mold 101 and the top surface 2501 of the supporting body 251. That is, the upper mold 101 of the molding mold 100 can be closely attached to the supporting body 251, so that the photosensitive area of the photosensitive element 21 corresponding to the through hole 252 of the supporting element 25 It is in a sealed environment to prevent the molding material from entering the sealed environment and polluting the photosensitive area of the photosensitive element 21 during the molding process.

Figure 3B shows a modified embodiment of the molded photosensitive component 20 of the present creation in this process, wherein the supporting element 25 may be made of a hard material, that is, when the supporting element 25 is The supporting body 251 is formed on at least a part of the non-photosensitive area 213 of the photosensitive element 21, and the pressing surface 1011 of the upper mold 101 of the forming mold 100 presses the supporting body 251 When the top surface 2501 is used, the supporting body 251 will not be deformed to ensure the good electrical properties of the lead 24, thereby ensuring the yield rate of the camera module in the subsequent process and further ensuring that the camera module The imaging quality of the group.

It is worth mentioning that the Shore hardness of the supporting body 251 is greater than D70, and the elastic modulus is greater than 1 Fpa.

The forming mold 100 further includes a cover film 106, so that when the upper mold 101 and the lower mold 102 are closed, the cover film 106 is located on the pressing surface 1011 and the upper mold 101. Between the top surface 2501 of the supporting body 251, preferably, before the upper mold 101 and the lower mold 102 are closed, the cover film 106 may be set on the upper mold 101 The pressing surface 1011. The covering film 106 is provided between the pressing surface 1011 of the upper mold 101 and the supporting body 251, on the one hand, it can prevent the pressing surface 1011 of the upper mold 101 and the supporting body There is a gap between 251. On the other hand, the cover film 106 can absorb the impact force generated when the upper mold 101 and the lower mold 102 are closed, thereby avoiding the upper mold 101 and the lower mold 102 The photosensitive element 21, the circuit board 22 and the lead 24 are damaged during mold clamping.

Referring to FIG. 4, after the fluid-like molding material is added to the molding space 103 of the molding die 100, the molding material fills the entire molding space 103, which is formed on the photosensitive element 21 The supporting body 251 of the non-photosensitive area 213 can prevent the molding material from entering the photosensitive element 21 at the contact position of the supporting body 251 and the non-photosensitive area 213 of the photosensitive element 21 The photosensitive region 212, in addition, the support body 251 is deformed to prevent a gap between the pressing surface 1011 of the upper mold 101 and the top surface 2501 of the support body 251, which can prevent the The molding material enters the sealed environment at the contact position of the top surface 2501 of the support body 251 and the pressing surface 1011 of the upper mold 101, and can avoid "flash" after the molding material is cured The phenomenon.

It is worth mentioning that the fluid-like molding material involved in this creation can be a liquid material or a solid particle material or a mixed material of liquid and solid particles. It is understandable that no matter Whether the molding material is implemented as a liquid material, a solid particulate material, or a mixed material of liquid and solid particles, which can be solidified to form a composite material after being added to the molding space 103 of the molding die 100Model base23. Said molded base 23. For example, in this specific example of this creation, the fluid-like molding material is implemented as a thermosetting material such as a liquid, wherein the molding material is solidified after being added to the molding space 103 of the molding die 100 to form the molding material.Model base23. Said molded base 23. It is worth mentioning that when the fluid-shaped molding material is added to the molding space 103 of the molding die 100, the solidification method of the fluid-shaped molding material does not limit the content and scope of this creation.

Referring to FIG. 5, the supporting body 251 is arranged along the non-photosensitive area 213 of the photosensitive element 21, after the molding material is added to the molding space 103 of the molding die 100, The supporting body 251 can prevent the molding material from entering the photosensitive area 212 of the photosensitive element 21, so that after the molding material is cured to form the molded base 23, the molded base 23 is further A light window 231 is formed to correspond to the photosensitive area 212 of the photosensitive element 21, so that in the following, the light window 231 of the molded base 23 allows light to pass through to be affected by the photosensitive element 21 The photosensitive area 212 receives and performs photoelectric conversion. That is, the molding material added to the molding space 103 of the molding die 100 is cured to form a molded body 232 of the molding base 23 and in the middle of the molding base 23 The light window 231 is formed. In other words, the molded base 23 includes the molded body 232 and has the light window 231, which provides a light path for the optical lens 10 and the photosensitive element 21 to be reflected by the object. After the light from the optical lens 10 enters the interior of the camera module, the light passes through the light window 231 of the molded base 23 and is received by the photosensitive area 212 of the photosensitive element 21 and undergoes photoelectric conversion. .

It is worth mentioning that after the molding base 23 is formed, the molding base 23 covers each of the electronic components 26, so that each of the electronic components 26 is isolated by the molding base 23. Electronic components The electronic component 26 is separated from the photosensitive element 21 by the molded base 23. In this way, even when the adjacent electronic components 26 are close to each other, the molded base The base 23 can also prevent the adjacent electronic components 26 from contacting, and the molded base 23 can also prevent the contaminants generated by the electronic components 26 from polluting the photosensitive area of the photosensitive element 21 to improve the The imaging quality of the camera module.

Referring to FIG. 6, the filter element 40 is assembled on the top surface of the molded base 23, so that the filter element 40 closes the light window 231 of the molded base 23, Therefore, the light entering the inside of the camera module from the optical lens can be further filtered by the filter element 40 to improve the imaging quality of the camera module.

Further, the top surface of the molded base 23 forms an inner side surface 233 and an outer side surface 234. In one example, the inner side surface 233 and the outer side surface 234 of the molded base 23 are located at In the same plane, so that the top surface of the molded base 23 forms a flat plane, wherein the filter element 40 is assembled on the inner surface 233 of the molded base 23, and the driver 30 Either the lens holder is assembled on the outer surface 234 of the molded base 23, or the optical lens 10 is directly assembled on the outer surface 234 of the molded base 23. In another example, the plane where the inner surface 233 of the molded base 23 is located may be lower than the plane where the outer surface 234 is located, so that the top surface of the molded base 23 forms a step shape. The surface of the molded base 23, that is, the plane where the inner surface 233 of the molded base 23 is located is lower than the plane where the outer surface 234 is located to form a groove 235 of the molded base 23, which is assembled in the molded base 23 The filter element 40 on the inner surface 233 of the molded base 23 is accommodated in the groove 235 of the molded base 23, and the driver 30 is assembled to the molded base 23 of the outer surface 234, so as to be assembled to the driver 30 The optical lens 10 is further held in the light-sensing path of the light-sensing element 21, as shown in FIG. 7, so that the camera module is manufactured.

With reference to Figure 9A, it is the first modified embodiment of the camera module created by this invention, which is different from the above-mentioned embodiment of the camera module created by this invention. Each of the lead wires 24 of the plastic photosensitive component 20 is completely covered inside the supporting body 251.

Specifically, the supporting body 251 covers at least a part of the chip inner portion 2131, the chip connection portion 2132, the chip outer portion 2133, the circuit board inner portion 2231, the circuit board connection portion 2232 And at least a part of the outer portion 2233 of the circuit board, so that the support body 251 not only covers the extension of the lead 24, but also covers the lead 24 and the photosensitive element 21. The connection position of the chip connector 211 and the connection position of the circuit board connector 221 covering the lead 24 and the circuit board 22 are used to pre-fix the lead 24 by the supporting body 251. Therefore, when the molding base 23 is formed by the subsequent molding process, in the process that the upper mold 101 and the lower mold 102 of the molding mold 100 are closed, all of the upper mold 101 The pressing surface 1011 is in contact with the top surface 2501 of the supporting body 251 to prevent the pressing surface 1011 of the upper mold 101 from directly pressing the lead 24, thereby preventing the lead 24 from being stressed. And deformed or damaged.

In addition, the lead 24 is completely covered inside the support body 251, so that the support body 251 can prevent being added to the molding space 103 formed between the upper mold 101 and the lower mold 102 The molding material is in direct contact with the lead 24 to prevent the high-temperature and fast-flowing molding material from damaging the lead 24. Preferably, the supporting body 251 has good heat insulation to prevent the supporting body 251 from transferring the temperature of the molding material to the lead 24. More preferably, the height of the supporting body 251 is higher than the height of the protruding part of the lead 24, so that the During the molding process, the supporting body 251 supports the upper mold 101 upward to reserve a safe distance between the pressing surface 1011 of the upper mold 101 and the protruding portion of the lead 24.

In addition, the support body 251 covers the chip outer portion 2133 of the photosensitive element 21 and the circuit board inner portion 2231 of the circuit board 22, so that the support body 251 covers the photosensitive element 21 and the mounting position of the circuit board 22. In this way, the support body 251 can not only pre-fix the photosensitive element 21 and the circuit board 22, so that the support body 251 can prevent various parts of the photosensitive element 21 and the circuit board 22 from shifting due to uneven force, and the supporting body 251 can also prevent the molding material from contacting the photosensitive element 21 and the The mounting position of the circuit board 22 ensures the flatness of the photosensitive element 21 and improves the imaging quality of the camera module.

Those skilled in the art can understand that the supporting body 251 is arranged along the mounting position of the photosensitive element 21 and the circuit board 22, so that the supporting body 251 is in a box shape, thereby During the molding process, the supporting body 251 can prevent the molding material from entering the photosensitive area 212 of the photosensitive element 21, so that the molding material is cured to form the edge covering the circuit board 22 The molded body 232 of the area 223 and the outer side surface 2503 of the supporting body 251, and the light window 231 is formed in the middle of the molded body 232. The photosensitive area of the photosensitive element 21 212 corresponds to the light window 231 of the molded base 23 so that the light window 231 provides a light path for the optical lens 10 and the photosensitive element 21. Preferably, the molded body 232 covers at least a part of the edge area 223 of the circuit board 22, the outer side surface 2503 of the supporting body 251, and the top surface 2501 after molding.

In the second modified embodiment of the camera module of the present creation shown in FIG. 9B, the supporting body 251 covers the outer side portion 2133 of the chip of the photosensitive element 21 and the circuit board 22, at least a part of the circuit board inner portion 2231, the circuit board connecting portion 2232, and the circuit board outer portion 2233. That is, in the example of the camera module shown in FIG. 9B, the supporting body 251 may not cover the wafer connecting portion 2132 of the photosensitive element 21. In the third embodiment of the camera module of the present creation shown in FIG. 9C, the supporting body 251 covers the chip connecting portion 2132 and the chip outer portion 2133 of the photosensitive element 21 and The circuit board inner side 2231 and the circuit board connecting portion 2232 of the circuit board 22. That is to say, in the embodiment of the camera module of the present creation shown in FIG. 9C, the supporting body 251 may not cover the chip inner portion 2131 of the photosensitive element 21 and the circuit The outer portion 2233 of the circuit board of the board 22. That is to say, in the several modified embodiments of the camera module shown in FIGS. 9A, 9B, and 9C, the supporting body 251 can simultaneously cover the photosensitive element 21 and the circuit board. 22, so that the photosensitive element 21 and the circuit board 22 are pre-fixed by the support body 251, and the support body 251 prevents the photosensitive element 21 and the circuit board 22 from attaching There is a gap in the mounting position, so that during the molding process, the supporting body 251 can prevent the photosensitive element 21 and the circuit board 22 from shifting due to uneven forces, and the supporting body 251 can prevent the molding material from entering between the photosensitive element 21 and the circuit board 22 to ensure the flatness of the photosensitive element 21.

Referring to FIG. 10A, it is a fourth modified embodiment of the camera module created by the present invention, in which the supporting body 251 covers the inner side portion 2231 of the edge area 22 of the circuit board 22 At least a part of the circuit board connection portion 2232 and at least a portion of the circuit board outer portion 2233, that is, the support body 251 covers the circuit board connection member 221 of the circuit board 22 for molding During the molding process, on the one hand, the supporting body 251 is used to pre-fix the lead 24, and on the other hand, the supporting body 251 prevents the lead 24 and the circuit board connector 221 from contacting the molding material. This prevents the lead 24 from falling off the circuit board connector 221.

Referring to FIG. 10B, it is a fifth modified embodiment of the camera module created by the present invention, in which the supporting body 251 only covers the inner side portion 2131 of the wafer of the photosensitive element 21 for molding During the process, the supporting body 251 prevents the molding material from entering the photosensitive area 212 of the photosensitive element 21, so that after the molding material is cured, the edge area 223 covering the circuit board 22 and the The die outer portion 2133 of the photosensitive element 21 and the molded body 232 of the wafer connecting portion 2132 form the light window 231 at a position corresponding to the photosensitive region 212 of the photosensitive element 21.

Referring to FIG. 11, it is a sixth modified embodiment of the camera module of the present creation. The difference from the above-mentioned embodiment of the present creation is that the molded body 232 does not cover the supporting body after molding. 251 of the top surface 2501. For example, in this specific example shown in FIG. 11, the molded body 232 covers the edge area 223 of the circuit board 22 and the outer side surface 2503 of the supporting body 251 after molding.

It is worth mentioning that, although the supporting body 251 is shown in FIGS. 1 to 11 in which the height of the support body 251 is higher than the height of the protruding part of each lead 24, the camera model of this creation In other examples of the group, the height of the supporting body 251 may also be equal to the height of the protruding portion of each lead 24, or in other examples, the height of the supporting body 251 may also be lower than the height of each The height of the protruding part of the lead 24, as long as the pressing surface 1011 of the upper mold 101 of the forming mold 100 is in contact with the top surface of the supporting body 251 during the molding process, and the upper The pressing surface of the mold 101 does not directly apply pressure to each of the leads 24.

FIG. 12 shows a modified embodiment of the camera module, in which the filter element 40 is not directly assembled to the molded body 232, but at least one support 70 is provided by the camera module. , The filter element 40 is assembled to the support 70, and then the support 70 is assembled On the top surface of the molded body 232, so that the filter element 40 is held between the optical lens 10 and the photosensitive element 21, in this way, the filter element 40 can be reduced Size to reduce the height of the camera module.

Further, the top surface of the molded body 232 may be a flat surface, so that after the molded base 23 is formed, the support 70 is first assembled on the top surface of the molded body 232, and then The driver 30 or the lens barrel 60 is assembled to the support 70. In other words, the driver 30 or the lens barrel 60 may not be directly assembled on the top surface of the molded body 232 but assembled on the support 70.

FIG. 13 shows another modified embodiment of the camera module, in which a groove 235 is formed on the top surface of the molded body 232, which is assembled on the top surface of the molded body 232. The supporting member 70 is accommodated in the groove 235 to further reduce the height dimension of the camera module. At this time, the driver 30 or the lens barrel 60 can be directly assembled to the molded body 232 The top surface.

Nevertheless, those skilled in the art can understand that in other examples of the camera module created in this invention, the optical lens 10 may also be directly assembled on the top surface of the molded body 232 or the The optical lens 10 can also be directly assembled on the top surface of the support 70. According to another aspect of the present creation, the present creation further provides a method for manufacturing a molded photosensitive component 20, wherein the manufacturing method includes the following steps: (a) a photosensitive element 21 and a circuit board 22 are connected through a set of leads 24; (b) Place the photosensitive element 21 and the circuit board 22 on an upper mold 101 or a lower mold 102 of a forming mold 100; (c) During the clamping of the upper mold 101 and the lower mold 102, the upper mold 101 is supported upward by a supporting element 25 to prevent the pressing surface 1011 of the upper mold 101 from being pressed against each Group the lead 24; and (d) Add a fluid-like molding material to a molding space 103 formed between the upper mold 101 and the lower mold 102 to form a molding base 23 after the molding material is cured, wherein The molded base 23 includes a molded body 232 and a light window 231, wherein the molded body 232 covers at least a part of the edge area 223 of the circuit board 22 and at least a part of the supporting element 25.

The present invention further provides a manufacturing method of a molded photosensitive component 20, wherein the manufacturing method includes the following steps: (A) connecting a photosensitive element 21 and a circuit board 22 through a set of leads 24; (B) using a supporting element 25 at least partially encapsulate the lead 24 to form a semi-finished molded photosensitive component; (C) place the semi-finished molded photosensitive component on an upper mold 101 or a lower mold 102 of a molding mold 100, wherein In the process of closing the upper mold 101 and the lower mold 102, the supporting element 25 supports the upper mold 101 upward to prevent the pressing surface 1011 of the upper mold 101 from pressing the lead 24; and ( D) Add a fluid-like molding material to a molding space 103 formed between the upper mold 101 and the lower mold 102 to form a molding base 23 after the molding material is cured, wherein the The molded base 23 includes a molded body 232 and a light window 231. The molded body 232 covers the edge area 223 of the circuit board 22 and at least a part of the supporting element 25, and the photosensitive element 21 The photosensitive area 212 corresponds to the light window 231.

The present invention further provides a manufacturing method of a molded photosensitive component, wherein the manufacturing method includes the following steps: (h) attaching a photosensitive element 21 to a circuit board 22, and conducting the photosensitive element through at least one set of leads 24 21 and the circuit board 22; (i) The photosensitive element 21 and the circuit board 22 are pre-fixed by a supporting element 25 to make a semi-finished molded photosensitive component, and the supporting element 25 prevents A gap is formed between the photosensitive element 21 and the circuit board 22; (j) The semi-finished molded photosensitive component is placed on an upper mold 101 or a lower mold 102 of a forming mold 100, so that the upper mold 101 and the substrate When the lower mold 102 is closed, an annular molding space 103 is formed between the upper mold 101 and the lower mold 102; and (k) a fluid-like molding material is added to the molding space 103 to After the molding material is cured, the molded base 23 is formed, wherein the molded base 23 includes a molded body 232 and a light window 231, and the molded body 23 covers the circuit board 22 At least a part of the edge area 223 and the supporting element 25, and the photosensitive area 212 of the photosensitive element 21 corresponds to the light window 231.

This creation further provides a manufacturing method of a molded photosensitive component, wherein the manufacturing method includes the following steps: (H) a chip connector 211 connected to a photosensitive element 21 and a circuit board connection of a circuit board 22 through a set of leads 24 Piece 221; (1) Place the photosensitive element 21 and the circuit board 22 in an upper mold 101 or a lower mold 102 of a molding mold 100 to close the upper mold 101 and the lower mold 102 At this time, an annular molding space 103 is formed between the upper mold 101 and the lower mold 102; (J) When a fluid molding material is added to the molding space 103, a support element 25 located in the molding space 103 reduces the impact of the molding material by blocking the molding material. The influence caused by the lead 24; and (K) A molded base 23 is formed after the molding material is cured, wherein the molded base 23 includes a molded body 232 and a light window 231, wherein the molded body 232 covers the At least a part of the edge area 223 of the circuit board 22, the supporting element 25 and the non-photosensitive area 213 of the photosensitive element 21.

As shown in FIG. 14, the present creation further provides an electronic device, wherein the electronic device includes an electronic device body 200 and at least one camera module, wherein each of the camera modules is respectively disposed on the electronic device body 200, to obtain graphics, wherein each of the camera modules 200 further includes at least one optical lens 10 and at least one molded photosensitive component 20, the molded photosensitive component 20 includes a supporting element 25, a photosensitive element 21. A circuit board 22, a set of leads 24 and a molded base 23, wherein both ends of each lead 24 are respectively connected to the chip connector 211 of the photosensitive element 21 and the circuit board 22 The circuit board connector 221, wherein the molded base 23 includes a molded body 232 and has a light window 231, wherein when the molded body 232 is formed by a molding die 100 through a molding process, The supporting element 25 is used to prevent the pressing surface 1011 of the forming mold 100 from pressing the lead 24, wherein the photosensitive area 212 of the photosensitive element 21 corresponds to the light window 231, and each of the optical The lens 10 is respectively arranged on the photosensitive path of the photosensitive element 21 of each of the molded photosensitive components 20.

Referring to FIGS. 15 to 23 of the accompanying drawings of the description of this creation, an array camera module according to a preferred embodiment of this creation is illustrated, wherein the array camera module includes at least two optical lenses 10A and a molded photosensitive component 20A, wherein the molded photosensitive component 20A further includes at least two photosensitive elements 21A, a circuit board 22A, a molded base 23A, and at least two sets of leads 24A.

Each photosensitive element 21A includes a set of wafer connectors 211A, a photosensitive area 212A, and a non-sensitive area 213A, wherein the photosensitive area 212A and the non-sensitive area 213A are integrally formed, and the photosensitive area 212A Located in the middle of the photosensitive element 21A, the non-photosensitive area 213A is located outside the photosensitive element 21A, and the non-photosensitive area 213A surrounds the photosensitive area 212A once, and the chip connector 211A is disposed on the Non-photosensitive area 213A.

Correspondingly, the circuit board 22A includes at least two sets of circuit board connectors 221A, at least two flat chip mounting areas 222A, and an edge area 223A, wherein the edge area 223A and each of the chip mounting areas 222A are integrated The edge area 223A is located around each of the chip mounting areas 222A, and the circuit board connector 221A is disposed in the edge area 223A.

Each of the leads 24A has a chip connection end 241A and a circuit board connection end 242A, respectively, wherein the lead 24A is curvedly extended between the chip connection end 241A and the circuit board connection end 242A.

Each of the photosensitive elements 21A is respectively mounted on each of the chip mounting areas 222A of the circuit board 22A, wherein the chip connection end 241A of the lead 24A is connected to all of the photosensitive elements 21A The chip connector 211A, the circuit board connection end 242A of the lead 24A is connected to the circuit board connector 221A of the circuit board 22A, and the molded base 23A is at least connected to the circuit board 22A The edge regions 223A are integrally combined to form the molded photosensitive component 20A, wherein each of the optical lenses 10A is respectively disposed on each photosensitive element of the molded photosensitive component 20A The inside of the module is subsequently received by the photosensitive area 212A of each photosensitive element 21A and undergoes photoelectric conversion, so as to obtain an image associated with the object.

In an example of the array camera module created in the present invention, the chip connector 211A of the photosensitive element 21A and the circuit board connector 221A of the circuit board 22A may be connecting pads, that is, The chip connector 211A of the photosensitive element 21A and the circuit board connector 221A of the circuit board 22A may have a disk shape for connecting the chip connector 241A of the lead 24A to the The chip connector 211A of the photosensitive element 21A and the circuit board connection end 242A of the lead 24A are connected to the circuit board connector 221A of the circuit board 22A in the array camera module of the present invention In another example, the chip connector 211A of the photosensitive element 21A and the circuit board connector 221A of the circuit board 22A may be respectively spherical, for example, solder paste or other soldering materials are dotted on the The non-photosensitive area 213A of the photosensitive element 21A and the edge area 223A of the circuit board 22A respectively form the chip connector 211A of the photosensitive element 21A and the circuit board connection of the circuit board 22A Piece 221A. Nevertheless, those skilled in the art should understand that the chip connector 211A of the photosensitive element 21A and the circuit board connector 221A of the circuit board 22A do not constitute an influence on the content and scope of this creation. The limitation is that, in other examples, the chip connector 211A of the photosensitive element 21A and the circuit board connector 221A of the circuit board 22A may also have other shapes not mentioned above.

The non-photosensitive area 213A of the photosensitive element 21A further has a chip inner portion 2131A, a chip connection portion 2132A, and a chip outer portion 2133A chip outer portion 2133AA, wherein the chip connector 211A is disposed on the chip connection The chip inner portion 2131A surrounds the photosensitive area 212A, and the two sides of the chip connecting portion 2132A respectively extend and are connected to the chip inner portion 2131A and the chip outer portion 2133AA. In other words, in this creation In the non-photosensitive area 213A, the area from the position where the wafer connector 211A is provided to the edge position of the photosensitive area 212A is defined as the wafer inner portion 2131A, and the non-photosensitive area 213A is The area where the wafer connector 211A is provided is defined as the wafer connector 2132A, and the area of the non-photosensitive area 213A from the position where the wafer connector 211A is provided to the outer edge of the photosensitive element 21A is defined as The chip outer portion 2133A is the chip outer portion 2133AA. In other words, from the top view of the photosensitive element 21A, the photosensitive element 21A is the photosensitive area 212A, the inner part 2131A of the wafer, the connecting part 2132A, and the outer part of the wafer in order from the inside to the outside. 2133A chip outer part 2133AA.

Similarly, the edge area 223A of the circuit board 22A further has a circuit board inner portion 2231A, a circuit board connection portion 2232A, and a circuit board outer portion 2233A, wherein the circuit board connector 221A is disposed on the The circuit board connection portion 2232A, the circuit board inner portion 2231A surrounds the chip mounting area 222A, and both sides of the circuit board connection portion 2232A respectively extend and are connected to the circuit board inner portion 2231A and the circuit board Outer part 2233A. That is to say, in this creation, the edge position of the edge area 223A from the position where the circuit board connector 221A is provided to the edge position of the chip mounting area 222A is defined as the circuit board inner side 2231A, and The area of the edge area 223A where the circuit board connector 221A is provided is defined as the circuit board connector 2232A. The area of the outer edge of the board 22A is defined as the outer portion 2233A of the circuit board. It is worth mentioning that in this embodiment of the array camera module created by the present invention, the circuit board 22A is an integrated circuit board. Preferably, each of the chip mounting areas 222A is arranged symmetrically. At both ends of the circuit board 22A, the circuit board 22A forms a symmetrical structure.

In addition, the type of the lead 24A is not limited in the array camera module of the present creation. For example, in a specific example, the lead 24A can be implemented as a gold wire, that is, the lead 24A can be implemented by a gold wire. The photosensitive element 21A and the circuit board 22A are connected together, so that after the photosensitive area 212A of the photosensitive element 21A converts the optical signal into an electrical signal, the electrical signal can pass through the lead 24A It is further transmitted to the circuit board 22A. Those skilled in the art can understand that in other examples of the array camera module created in this invention, the lead 24A can also be implemented as a silver wire, a copper wire, etc., which can realize the electrical signal in the The photosensitive element 21A and the circuit board 22A are made of materials transferred between them.

The array camera module may be a fixed-focus camera module or a zoom camera module. For example, the array camera module may have an optical zoom capability under the premise that the height is controlled, so as to improve the The imaging quality of the array camera module. Specifically, in the example of the array camera module shown in FIG. 21, the array camera module further includes at least two drivers 30A, wherein each optical lens 10A is assembled in each The driver 30A and each of the drivers 30A are respectively assembled on the top surface of the molded base 23A, so that each of the optical lenses 10A is held in each of the molded photosensitive components 20A, respectively. The light-receiving path of the light-receiving element 21A. Each driver 30A is electrically connected to the circuit board 22A, so that after the circuit board 22A transmits power and control signals to each driver 30A, each driver 30A can drive each driver 30A separately. The optical lens 10A moves back and forth along the photosensitive path of each photosensitive element 21A, thereby adjusting the focal length of the array camera module. In other words, the optical lens 10A can be driven and disposed on the driver 30A.

It is worth mentioning that the type of the driver 30A is not limited in the array camera module of the present creation. For example, in a specific example, the driver 30A can be implemented as For example, a voice coil motor or any other driver capable of driving the optical lens 10A to shift along the photosensitive path of the photosensitive element 21A, wherein the driver 30A can receive electric power and control signals to be in an operating state.

With further reference to FIG. 21, the array camera module further includes at least one filter element 40A. For example, in an illustrative example of this creation, the array camera module may include one filter element 40A, wherein the filter element 40A is assembled on the top surface of the molded base 23A to The different positions of the filter element 40A correspond to the light-receiving path of each light-receiving element 21A, respectively. In another illustrative example, the array camera module may include at least two of the filter elements 40A, wherein each of the filter elements 40A is respectively assembled on the top surface of the molded base 23A , So that each of the filter elements 40A corresponds to the photosensitive path of each of the photosensitive elements 21A, that is, each of the photosensitive elements 21A and each of the filter elements 40A of the array camera module There is a one-to-one correspondence with each of the optical lenses 10A.

When the array camera module is used, the light reflected by the object enters the inside of the array camera module from the optical lens 10A, and is filtered by the filter element 40A before being filtered by the photosensitive element 21A receives and performs photoelectric conversion. In other words, the filter element 40A can filter the stray light from the light reflected by the object that enters the array camera module from the optical lens 10A, such as the infrared part. In this way, Improve the imaging quality of the array camera module.

In addition, the filter element 40A can be directly assembled on the top surface of the molded base 23A, or the filter element 40A can be assembled on a support first, and then the support can be assembled on In this way, the top surface of the molded base 23A can reduce the size of the filter element 40A, so as to reduce the manufacturing cost of the array camera module.

Those skilled in the art can understand that in different examples of the array camera module, the filter element 40A can be implemented in different types, for example, the filter element 40A can be implemented as an infrared cut filter. A light sheet, a full transmission spectrum filter and other filters or a combination of multiple filters, for example, the filter element 40A can be implemented as a combination of an infrared cut filter and a full transmission spectrum filter, That is, the infrared cut filter and the full transmission spectrum filter can be switched to be selectively located on the photosensitive path of the photosensitive element 21A, for example, the array imaging is used in an environment with sufficient light such as daytime. In the case of a module, the infrared cut-off filter can be switched to the photosensitive path of the photosensitive element 21A, so that the infrared cut-off filter filters the light reflected by the object into the array camera module Infrared, when the array camera module is used in a dark environment such as night, the full transmission spectrum filter can be switched to the photosensitive path of the photosensitive element 21A to allow entry into the array camera module Part of the infrared light reflected by the object is transmitted through.

Referring to FIGS. 22 and 23, the array camera module further includes a bracket 50A, wherein the bracket 50A has at least two installation spaces 51A, and each of the installation spaces 51A is connected to two of the bracket 50A. The sides, that is, each of the installation spaces 51A may respectively form a channel. Each of the drivers 30A is installed in each of the mounting spaces 51A of the bracket 50A, so that each of the drivers 30A is maintained in a stable state through the bracket 50A, thereby ensuring that each driver 30A is assembled in each The coaxiality of each optical lens 10A of the driver 30A increases the strength of the array camera module to further improve the imaging quality of the array camera module.

Preferably, after each driver 30A is installed in each installation space 51A of the bracket 50A, some filling is filled between the inner walls of the housing and the bracket 50A of each driver 30A. So that each of the drivers 30A is mounted on each of the brackets 50A There will be no shaking after installing the space 51A. More preferably, the filler filled between the housing of each driver 30A and the inner wall of the bracket 50A may be glue.

The molded photosensitive component 20A further includes at least one supporting element 25A, so that the supporting element 25A protects the lead 24A and the photosensitive element 21A during the molding process. In this example of the present creation, the number of the supporting elements 25A is implemented as a minimum of two. Preferably, the number of the supporting elements 25A is the same as the number of the photosensitive elements 21A. Before the molding base 23A is formed, each of the supporting elements 25A is set to cover each of the photosensitive elements 21A. The non-photosensitive area 213A is such that after the molding base 23A is molded, the mold base 23A covers the edge area 223A of the circuit board 22A and the non-photosensitive element 21A A part of the photosensitive area 213A and a part of the supporting member 25A form the molded photosensitive element 20A. The supporting element 25A can effectively increase the product yield of the array camera module and improve the imaging quality of the array camera module. In other examples of the present creation, the number of the supporting element 25A can also be implemented as one, which will be further explained later.

Each supporting body 251A supporting element 25A includes a frame-shaped supporting body 251A and having a through hole 252A, wherein the supporting body 251A is configured to cover at least a part of the non-photosensitive area 213A of the photosensitive element 21A The photosensitive area 212A of the photosensitive element 21A corresponds to the through hole 252A of the supporting element 25A. Preferably, the supporting body 251A covers at least a part of the chip inner portion 2131A of the non-photosensitive area 213A of the photosensitive element 21A, the chip connecting portion 2132A, and the chip outer portion 2133A of the chip outer portion At least part of 2133AA. Further, the supporting body 251A has a top surface 2501A, an inner side surface 2502A, and an outer side surface 2503A, wherein both sides of the top surface 2501A extend inwardly and outwardly to connect to the inner side surface 2502A and the inner side surface 2502A. The outer side 2503A. In this creation, the orientation of the supporting body 251A One side of the photosensitive area 212A is defined as the inner side 2502A of the supporting body 251A, and the side of the supporting body 251A facing the edge area 223A of the circuit board 22A is defined as the supporting body The outer side 2503A of 251A. In this embodiment, the molded base 23A covers at least a part of the outer side surface 2503A and the top surface 2501A of the supporting body 251A after molding.

In addition, the molded photosensitive component 20A of the array camera module further includes a plurality of electronic components 26A, wherein each of the electronic components 26A can be passed through, for example, SMT (Surface Mount Technology) process is mounted on the edge area 223A of the circuit board 22A. Preferably, each of the electronic components 26A is mounted on the outer portion 2233A of the circuit board of the edge area 223A. The photosensitive element 21A and each of the electronic components 26A may be mounted on the same side or the opposite side of the circuit board 22A. For example, in a specific example, the photosensitive element 21A and each of the electronic components The device 26A is mounted on the same side of the circuit board 22A, and the photosensitive element 21A is mounted on the chip mounting area 222A of the circuit board 22A, and each of the electronic components 26A is mounted At the edge area 223A of the circuit board 22A. After the molding base 23A is integrally molded on the edge area 223A of the circuit board 22A, the molding base 23A covers each of the electronic components 26A, so as to be molded by the molding base 23A. The base 23A isolates the adjacent electronic components 26A and isolates the electronic components 26A and the photosensitive element 21A, so that in the array camera module of the present invention, even the adjacent electronic components When the distance between the devices 26A is relatively short, the molded base 23A can also prevent the adjacent electronic components 26A from contacting or interfering with each other, and the manner in which the molded base 23A covers the electronic components 26A also It is possible to avoid pollutants generated on the surface of the electronic component 26A from polluting the photosensitive area 212A of the photosensitive element 21A, thereby reducing the volume of the array camera module and improving the imaging quality of the array camera module. In other words, the array camera module of this creation passes all The molding base 23A covers the electronic components 26A so that the circuit board 22A with a small area can be mounted with more electronic components 26A. It is worth mentioning that the types of the electronic components 26A include, but are not limited to, resistors, capacitors, and driving devices.

Referring to Figures 15 to 23, although in the following description of this creation, the array camera module is implemented as a dual-lens camera module as an example to further clarify the features and advantages of the array camera module of this creation Those skilled in the art can understand that, in a modified embodiment of the array camera module of the present creation shown in FIG. 24, the array camera module may also include more optical lenses. 10A.

The manufacturing process of the molded photosensitive component 20A of the array camera module is described in the examples shown in FIGS. 15 to 19, and the examples shown in FIGS. 20 to 22 are further described with The manufacturing process of the array camera module of the molded photosensitive component 20A.

Referring to FIG. 15, the two photosensitive elements 21A are respectively mounted on the two chip mounting areas 222A of the circuit board 22A in a one-to-one correspondence, wherein a set of the photosensitive elements 21A is The chip connector 211A and the two sets of circuit board connectors 222 of the circuit board 22A are respectively connected by a set of the leads 24A. Each of the electronic components 26A is respectively mounted on the edge area 233 of the circuit board 22A. Preferably, each of the electronic components 26A is respectively mounted on the outer portion 2233A of the circuit board of the edge area 223A. More preferably, each of the electronic components 26A is spaced apart from each other, so that after the array camera module is manufactured, each of the electronic components 26A will not interfere with each other.

Limited by the wire bonding process of the lead 24A and the characteristics of the lead 24A itself, the chip connection end 241A and the circuit board connection end 242A of the lead 24A are respectively connected to all the photosensitive elements 21A. The chip connector 211A and the circuit board connector of the circuit board 22A After 221A, the lead 24A protrudes upward so as to be higher than the upper surface of the photosensitive element 21A. Those skilled in the art can understand that, during the manufacturing process of the array camera module and the process of being used, keeping each lead 24A in the initial state is beneficial to ensure the good electrical performance of the lead 24A. And guarantee the imaging quality of the array camera module.

Referring to FIG. 16, each supporting body 251A is provided to cover at least a part of the non-photosensitive area 213A of each photosensitive element 21A, wherein the photosensitive area 212A of each photosensitive element 21A corresponds to The through hole 252A of each support element 25A is formed by each support element 25A, each photosensitive element 21A, the circuit board 22A, and each set of the leads 24A to form a mold Semi-finished photosensitive components. In this example of the array camera module of the present invention, the supporting body 251A covers at least a part of the chip outer portion 2133A of the photosensitive element 21A, the chip connecting portion 2132A, and the chip inner portion At least part of 2133. In other words, the supporting body 251A can cover the chip connection end 241A of the lead 24A and the connection position of the chip connection piece 211A of the photosensitive element 21A, so that during the molding process, the The supporting body 251A can prevent the chip connection end 241A of the lead 24A and the connection position of the chip connector 211A of the photosensitive element 21A from contacting the molding material used to form the molded base 23A, thereby avoiding The chip connection end 241A of the lead 24A is detached from the chip connection member 211A of the photosensitive element 21A.

It can be understood that the supporting body 251A covers the chip connection end 241A of the lead 24A and the connection position of the chip connector 211A of the photosensitive element 21A, so that the supporting body 251A can isolate The chip connecting end 241A of the lead 24A and the chip connecting piece 211A of the photosensitive element 21A and the molding material are thus avoided during the molding process. The molding material causes the chip connection end 241A of the lead 24A to deform or the chip connection end 241A of the lead 24A to fall off the chip connection 211A.

In addition, the support body 251A covers a part of each of the leads 24A, so that each of the leads 24A is pre-fixed by the support body 251A to prevent each of the leads 24A during the molding process. 24A is deformed, and the supporting body 251A can especially prevent the adjacent leads 24A from contacting and causing a short circuit due to deformation, thereby ensuring the yield rate of the array camera module after it is manufactured.

In one embodiment, the supporting body 251A can be formed by placing glue on the non-photosensitive area 213A of the photosensitive element 21A and forming after the glue is cured, so that the supporting body 251A has elasticity. After the supporting body 251A is formed, the inner surface 2502A of the supporting body 251A forms the through hole 252A of the supporting element 25A, and the photosensitive area 212A of the photosensitive element 21A corresponds to the through hole 252A. In addition, the support body 251A formed of glue has adhesiveness for adhering contaminants such as dust, so as to prevent these contaminants from polluting the photosensitive area 212A of the photosensitive element 21A, so as to avoid the photosensitive area 212A of the photosensitive element 21A. The photosensitive area 212A of the element 21A has dirty spots, thereby further ensuring the imaging quality of the array camera module. For example, the supporting body 251A is formed between the electronic component 26A and the photosensitive area 212A of the photosensitive element 21A, so that it is generated when the electronic component 26A is mounted on the circuit board 22A. Contaminants such as solder powder will be adhered to the supporting body 251A to prevent these contaminants such as solder powder from contaminating the photosensitive area 212A of the photosensitive element 21A.

Preferably, the supporting body 251A can be formed by coating glue in a glue state on the non-photosensitive area 213A of the photosensitive element 21A and forming it after the glue is cured, so as to prevent the glue from being coated on the photosensitive element 21A. After the non-photosensitive area 213A of the element 21A flows, it pollutes the sensor. The light-sensitive area 212A of the light element 21A occurs. In other words, the glue has good plasticity and self-setting properties before being cured to form the supporting body 251A, so as to prevent the glue from being deformed when being coated on the non-photosensitive area 213A of the photosensitive element 21A and curing. Those skilled in the art can understand that after the chip connection end 241A of the lead 24A is set to be connected to the chip connection member 211A of the photosensitive element 21A, glue in a glue state is applied to After the non-photosensitive area 213A of the photosensitive element 21A, the chip connection end 241A of the lead 24A can be covered, and the supporting body 251A covering the lead 24A is formed after the glue is cured, thereby avoiding The lead 24A is damaged during the molding process of the supporting body 251A.

Referring to FIG. 17A, during the molding process, the molding material is cured to form the molding base 23A through a molding die 100A. In this way, the size and size of the array camera module can be reduced. The assembly error of the array camera module is reduced, so that the structure of the array camera module is more compact and the imaging quality of the array camera module is improved.

Specifically, the forming mold 100A includes an upper mold 101A and a lower mold 102A, wherein at least one of the upper mold 101A and the lower mold 102A can be moved so that the upper mold 101A and the lower mold 102A can be moved. The lower mold 102A can be subjected to a mold clamping operation, and at least two molding spaces 103A communicating with each other are formed between the upper mold 101A and the lower mold 102A, wherein the molding base 23A is formed by the molding material. It is added to the molding space 103A and formed after curing.

For example, in one embodiment, the lower mold 102A may be fixed, and the upper mold 101A can move relative to the lower mold 102A along the guide post, so that the upper mold 101A faces the lower mold 102A. The mold is closed when the direction is moved, and when the upper mold 101A is moved away from the lower mold 102A, the mold is drawn. When the upper mold 101A and the lower mold 102A are closed, the upper mold 101A Each of the molding spaces 103A is formed between the lower mold 102A and the lower mold 102A. In another In an embodiment, the upper mold 101A may be fixed, and the lower mold 102A can move relative to the upper mold 101A along the guide post to be moved in the direction of the lower mold 102A toward the upper mold 101A The mold is closed at the time, and the mold is drawn when the lower mold 102A moves away from the upper mold 101A.

After placing the semi-finished molded photosensitive component on the upper mold 101A and/or the lower mold 102A, the upper mold 101A and the lower mold 102A are operated to close the mold to make the semi-finished molded photosensitive component Located in each of the molding spaces 103A formed in the upper mold 101A and the lower mold 102A, wherein the pressing surface 1011A of the upper mold 101A presses the top surface 2501A of the support body 251A to The upper mold 101A is supported upward by the supporting body 251A, so as to prevent the pressing surface 1011A of the upper mold 101A from directly pressing the lead 24A, so as to protect the lead 24A during the molding process. It is not damaged, wherein at least the edge area 223A of the circuit board 22A in the semi-finished molded photosensitive component corresponds to the molding space 103A.

It is worth mentioning that each of the molding spaces 103A is ring-shaped, and the adjacent molding spaces 103A communicate with each other, so that when the molding material is added to the molding space 103A and after the molding material is cured The molded base 23A is formed.

Preferably, the supporting body 251A has elasticity, so that when the forming mold 100A is mold-operated, the pressing surface 1011A of the upper mold 101A is pressed against the top of the supporting body 251A. The impact force generated at a moment on the surface 2501A is absorbed by the supporting body 251A to prevent the impact force from being further transmitted to the photosensitive element 21A, thereby preventing the photosensitive element 21A from being damaged or preventing the photosensitive element 21A from being subjected to force. This causes a displacement relative to the circuit board 22A. Those skilled in the art can understand that the way in which the support body 251A absorbs the impact force and prevents the impact force from being further transmitted to the photosensitive element 21A can also ensure the feeling. The flatness of the optical element 21A mounted on the circuit board 22A is not affected, thereby improving the product yield of the array camera module.

Preferably, in an example, the height of the supporting body 251A can be implemented to be higher than the height of the upward protrusion of the lead 24A, so that when the molding mold 100A is performing a mold clamping operation, the upper mold 101A The pressing surface 1011A can directly press the top surface 2501A of the support body 251A, so as to support the upper mold 101A upward by the top surface 2501A of the support body 251A to prevent the upper mold 101A. The pressing surface 1011A of the mold 101A is pressed against the lead 24A. In other words, a safety distance is reserved between the lead 24A and the pressing surface 1011A of the upper mold 101A. In another example, the height of the support body 251A is equal to the height of the upward protrusion of the lead 24A, so that when the molding die 100A is clamped, the pressing surface 1011A of the upper mold 101A can It is in contact with the lead 24A, but the pressing surface 1011A of the upper mold 101A cannot press the lead 24A.

In addition, the supporting body 251A has elasticity. After the molding die 101 is clamped, the pressing surface 1011A of the upper mold 101A presses the top surface 2501A of the supporting body 251A, So that the top surface 2501A of the supporting body 251A is slightly deformed to prevent the pressing surface 1011A of the upper mold 101A and the top surface 2501A of the supporting body 251A from being slightly deformed. Gap. That is to say, the pressing surface 1011A of the upper mold 101A and the top surface 2501A of the supporting body 251A are closely attached to each other, so that the portion corresponding to the through hole 252A of the supporting element 25A The photosensitive area 212A of the photosensitive element 21A is in a sealed environment, so that during the molding process, the molding material will not enter the sealed environment to prevent the molding material from polluting the photosensitive area of the photosensitive element 21A. Area 212A. It is worth mentioning that the Shore hardness of the supporting body 251A ranges from A50 to A80, and the elastic modulus ranges from 0.1 Gpa to 1 Gpa.

In addition, during the molding process, the pressing surface 1011A of the upper mold 101A and the top surface 2501A of the supporting body 251A are closely attached to prevent the molding material from entering the sealed environment, thereby After the molding base 23A is formed, the phenomenon of "flash" can be avoided, so as to ensure the product yield of the array camera module.

FIG. 17B shows a modified embodiment of the molded photosensitive component 20A of the array camera module of the present creation in this process, wherein the supporting body 251A may also be supported by a hard material, that is to say When the pressing surface 1011A of the upper mold 101A is pressed against the top surface 2501A of the supporting body 251A, the supporting body 251A may not be deformed, so as to ensure the good quality of the lead 24A Electrical properties, thereby ensuring the subsequent product yield of the camera module and further ensuring the imaging quality of the camera module. It is worth mentioning that the Shore hardness of the supporting body 251A is greater than D70, and the elastic modulus is greater than 1 Fpa.

The molding mold 100A further includes a cover film 104A, wherein the cover film 104A is overlapped and arranged on the pressing surface 1011A of the upper mold 101A, so that when the molding mold 100A is performing a mold clamping operation, The cover film 104A is located between the pressing surface 1011A of the upper mold 101A and the top surface 2501A of the supporting body 251A, so that the photosensitive area 212A of the photosensitive element 21A is in the sealed state. environment.

It is worth mentioning that the covering film 104A located on the pressing surface 1011A of the upper mold 101A and the top surface 2501A of the supporting body 251A can prevent the upper mold 101A from being placed on the top surface 2501A. There is a gap between the pressing surface 1011A and the top surface 2501A of the supporting body 251A. On the other hand, the cover film 104A can absorb the pressing surface 1011A of the upper mold 101A to press on the support The impact force generated by the top surface 2501A of the main body 251A can prevent the impact force from damaging the photosensitive element 21A, the circuit board 22A, and the lead 24A.

In addition, the arrangement of the cover film 104A facilitates the removal of the molding die 100A after the molding base 23A is molded.

Referring to FIG. 18, after the fluid-like molding material is added to each molding space 103A of the molding die 100A, the molding material fills the entire area of each molding space 103A, wherein the molding material is formed in all the molding spaces 103A. The supporting body 251A of at least a part of the non-photosensitive area 213A of the photosensitive element 21A can prevent the molding material from entering the sealed environment. Specifically, the support body 251A can prevent the molding material from entering the sealed environment from the contact position of the support body 251A and the non-photosensitive area 213A of the photosensitive element 21A, and can also prevent the molding The material enters the sealed environment from the contact position of the top surface 2501A of the supporting body 251A and the pressing surface 1011A of the upper mold 101A.

It is worth mentioning that the fluid-like molding material involved in this creation can be a liquid material or a solid particle material or a mixed material of liquid and solid particles. It is understandable that whether the molding material is implemented as a liquid material or is It is implemented as a solid particle material or as a mixed material of liquid and solid particles, which can be solidified to form the molding base 23A after being added to the molding space 103A of the molding mold 100A. For example, in this specific example of this creation, the fluid-like molding material is implemented as a thermosetting material such as a liquid, wherein the molding material is solidified after being added to the molding space 103A of the molding die 100A to form the molding material. The molded base 23A. It is worth mentioning that when the fluid-like molding material is added to the molding space 103A of the molding die 100A, the solidification method of the fluid-like molding material does not limit the content and scope of the creation.

19, when the molding material is added to the molding space 103A, the supporting body 251A prevents the molding material from entering the photosensitive area 212A of the photosensitive element 21A, so that the molding material is cured to After forming the molded base 23A, the molded base 23A At least two light windows 231A are further formed, and each light window 231A corresponds to the photosensitive area 212A of each photosensitive element 21A and each optical lens 10A, and the light window 231A is the The optical lens 10A and the photosensitive element 21A provide a light path. The molding material is cured to form a molded body 232A of the molded base 23A. In this embodiment, the molded body 232A covers the edge area 223A of the circuit board 22A and the At least a portion of the outer side surface 2503A and the top surface 2501A of the main body 251A are supported to form the molded photosensitive component 20A. In other words, the molded base 23A includes one molded body 232A and at least two light windows 231A, and the filter element 40A and the driver 30A are subsequently assembled to the molded body respectively. The top surface of 232A is such that the optical lens 10A assembled in the driver 30A is held in the photosensitive path of the photosensitive element 21A.

It is worth mentioning that the molded body 232A integrated with the edge area 223A of the circuit board 22A further covers each of the electronic components 26A, thereby isolating phases by the molded body 232A. Adjacent to the electronic component 26A and isolate the electronic component 26A from the photosensitive element 21A by the molded main body 232A. In this way, even when the distance between the adjacent electronic components 26A is relatively short The molded body 232A can also prevent the adjacent electronic components 26A from contacting or interfering with each other, and the molded body 232A can also prevent pollutants generated by the electronic components 26A from polluting the photosensitive element 21A. The photosensitive area 212A can further improve the imaging quality of the camera module.

In addition, in this creation, the molded body 232A covers each of the electronic components 26A to avoid the mutual interference of the adjacent electronic components 26A, so that the distance between the adjacent electronic components 26A can be further reduced. Therefore, even on the circuit board 22A with a smaller area, a larger number of the electronic components 26A can be attached to minimize the size of the array camera module. Under the premise of the size, the imaging quality of the array camera module is improved. In addition, in this creation, the molded body 232A covers each electronic component 26A to isolate the electronic component 26A and the photosensitive element 21A, so that even the photosensitive element 21A and the electronic component are separated from each other. When the component 26A is close, the photosensitive component 21A and the electronic component 26A will not interfere with each other, so that the circuit board 22A with a smaller area can be attached to the circuit board 22A with a larger size. The photosensitive element 21A in the photosensitive area 212A improves the imaging quality of the array camera module.

Preferably, the molded body 232A has good heat insulation, so that during the process of using the array camera module, the heat generated by the photosensitive element 21A during photoelectric conversion will not be transferred to the The electronic components 26A ensure the reliability of the array camera module when it is used.

20 and 21, the filter element 40A is assembled on the top surface of the molded base 23A, so that the filter element 40A closes the light window 231A of the molded base 23A Therefore, the subsequent light entering the array camera module from the optical lens 10A can be further filtered by the filter element 40A to improve the imaging quality of the array camera module. As described above, although the two filter elements 40A are taken as an example in FIG. 20 to illustrate the features and advantages of the array camera module of the present invention, those skilled in the art can understand that The array camera module may also include one filter element 40A. After the filter element 40A is assembled on the top surface of the molded base 23A, each filter element 40A simultaneously seals each The light window 231A makes the photosensitive area 212A of each photosensitive element 21A correspond to different positions of the filter element 40A, respectively.

Further, the top surface of the molded base 23A includes at least two inner sides 233A and an outer side surface 234A, wherein in one example, each of the inner side surfaces 233A and the outer side surface The side surfaces 234A are in the same plane, so that the top surface of the molded base 23A forms a complete plane, and each of the filter elements 40A is respectively assembled on each of the molded bases 23A. The inner surface 233A is used to close each light window 231A by each filter element 40A, and each driver 40 is assembled to the outer surface 234A of the molded base 23A. The filter element 40A is located between the optical lens 10A assembled in the driver 30A and the photosensitive area 212A of the photosensitive element 21A. In another example, the plane of each inner surface 233A is lower than the plane of the outer surface 234A to form at least two grooves 235A of the molded base 23A, that is, the molded base The top surface of the seat 23A is stepped, and the filter element 40A assembled on the inner surface 233A of the molded base 23A is located in the groove 235A of the molded base 23A.

Referring to FIG. 22, each of the drivers 30A of the array camera module is installed in each of the mounting spaces 51A of the bracket 50A, and then filled in each of the drivers 30A with fillers such as glue. Between the housing and the inner wall of the bracket 50A to ensure that when the array camera module is installed or used, each driver 30A will not shake, so that the bracket 50A ensures that they are assembled separately The coaxiality of each optical lens 10A of each driver 30A, and the bracket 50A can also strengthen the structure of the array camera module to improve the stability of the array camera module. It is worth mentioning that, in one embodiment, the driver 30A may only be disposed in the installation space 51A of the bracket 50A, so that the bracket 50A covers at least a part of the driver 30A, and in another In an embodiment, the bracket 50A may further cover at least a part of the molded base 23A, and the present invention is not limited in this respect.

Figure 25 shows a second modified implementation of the array camera module, which is different from the implementation of the above-mentioned preferred embodiment of this creation. The array camera module includes two of the circuits. The board 22A, wherein each of the circuit boards 22A includes a chip mounting area 222A and an edge area 223A, wherein each of the photosensitive elements 21A is mounted on each of the circuit boards 22A. In the chip mounting area 222A, when a molding process is performed to form the molded base 23A, the molded body 232A of the molded base 23A and the molded body 232A of each of the circuit boards 22A At least a part of the edge region 223A is integrally combined. That is to say, in this embodiment of the array camera module of the present invention, the circuit board 22A is a split circuit board.

FIG. 26 shows a third modified embodiment of the array camera module, wherein the array camera module includes at least one lens barrel 60A and at least one driver 30A, wherein the lens barrel 60A extends integrally On the top surface of the molded base 23A, the driver 30A is assembled on the top surface of the molded base 23A, and the lens barrel 60A and the driver 30A are respectively used to assemble the optical lens 10A. Preferably, the lens barrel 60A and the molding base 23A are integrally molded by a molding process. For example, when the array camera module is implemented as a dual-lens camera module, the array camera module includes one driver 30A and one lens barrel 60A.

FIG. 27A shows a fourth modified embodiment of the array camera module, wherein the array camera module includes at least two lens barrels 60A, and each of the lens barrels 60A extends integrally with each other. On the top surface of the base base 23, each of the optical lenses 10A is respectively assembled to each of the lens barrels 60A. Preferably, each of the lens barrels 60A is connected to the molded base 23A. It is integrally molded by a molding process.

FIG. 27B shows a fifth modified embodiment of the array camera module, wherein the array camera module includes at least two lens barrels 60A, wherein after the molded photosensitive component 20A is formed, each Each of the lens barrels 60A is assembled at different positions on the top surface of the molded base 23A, and each of the optical lenses 10A is assembled to each of the lens barrels 60A, so that each of the optical The lens 10A is held in the light-receiving path of each of the light-receiving elements 21A, respectively. It is worth mentioning that the lens barrel 60A may be a threaded lens barrel or a threadless lens barrel, and the present invention is not limited in convenience here.

In addition, the two embodiments of the array camera module shown in FIG. 27A and FIG. 27B are only exemplary descriptions. In other examples, at least one of the lens barrel 60A can be combined with the molded lens. The base 23A is integrally molded by a molding process, and the other lens barrel 60A can be assembled on the top surface of the molded base 23A. For example, when the array camera module is implemented as a dual-lens camera module, one lens barrel 60A can be integrally molded with the molding base 23A through a molding process, and the other lens barrel 60A can be Assembled on the top surface of the molded base 23A to facilitate focusing.

FIG. 28A shows a first modified embodiment of the molded photosensitive component 20A of the array camera module, in which the supporting body 251A covers a part of the edge area 223A of the circuit board 22A and At least a part of the chip outer portion 2133A, the chip outer portion 2133AA, the chip connecting portion 2132A, and the chip inner portion 2131A of the non-photosensitive area 213A of the photosensitive element 21A are used for the molding base 23A After molding, the molded body of the molded base 23A covers a part of the edge area 223A of the circuit board 22A and the outer side surface 2503A and the top surface 2501A of the supporting body 251A. At least part of it.

It is worth mentioning that the supporting body 251A can cover all of the leads 24A, so as to realize the fixation of each lead 24A before the molding base 23A is formed, so as to perform the molding process. In the process, the supporting body 251A can prevent the lead 24A from contacting the molding material, thereby preventing the lead 24A from being deformed by the impact force generated by the molding material added to the molding space 103A. In addition, the supporting body 251A may also have good heat insulation performance, so that after the molding material is added to the molding space 103A, the molding material is cured. During the process, heat will not be transferred to the lead 24A through the supporting body 251A, so as to further ensure the good electrical properties of the lead 24A.

In addition, the supporting body 251A is simultaneously formed on a part of the edge area 223A of the circuit board 22A and at least a part of the non-photosensitive area 213A of the photosensitive element 21A, so as to realize the photosensitive element 21A and the photosensitive element 21A. The circuit board 22A is fixed, so that during the molding process, the supporting body 251A can prevent the photosensitive element 21A and the circuit board 22A from shifting during the closing of the molding mold 100A, so as to The flatness of the photosensitive element 21A is ensured.

In addition, the supporting body 251A is simultaneously formed on a part of the edge area 223A of the circuit board 22A and at least a part of the non-photosensitive area 213A of the photosensitive element 21A, so that the supporting body 251A prevents There is a gap between the mounting position of the photosensitive element 21A and the circuit board 22A, so that during the molding process, the support body 251A can prevent the molding material from entering the photosensitive element 21A and the Between the circuit boards 22A to ensure the flatness of the mounting of the photosensitive element 21A, thereby further improving the imaging quality of the array camera module.

FIG. 28B shows a second modified embodiment of the molded photosensitive component 20A of the array camera module of the present creation, wherein the supporting body 251A covers the edge area 223A of the circuit board 22A Part of the photosensitive element 21A and at least a part of the chip outer portion 2133A and the chip connecting portion 2132A of the non-photosensitive area 213A, so that after the mold base 23A is molded, the mold base The molded body 232A of the seat 23A covers a part of the edge area 223A of the circuit board 22A and at least a part of the outer side surface 2503A and the top surface 2501A of the supporting body 251A.

Similarly, FIG. 28C shows a third modified embodiment of the molded photosensitive component 20A of the array camera module of the present creation, wherein the supporting body 251A covers the circuit A portion of the edge area 223A of the plate 22A and at least a portion of the chip outer portion 2133A of the non-photosensitive area 213A of the photosensitive element 21A, so that after the molding base 23A is molded, the molding The molded body 232A of the base 23A covers a part of the edge area 223A of the circuit board 22A and at least a part of the outer side surface 2503A and the top surface 2501A of the supporting body 251A.

Those skilled in the art can understand that in the two embodiments of the molded photosensitive element 20A shown in FIG. 28B and FIG. 28C, the supporting body 251A may not cover the photosensitive element 21A. The wafer inner portion 2131A of the non-photosensitive area 213A, so that the size of the wafer inner portion 2131A of the photosensitive element 21A can be made smaller, so that the photosensitive element 21A of the same size can have a smaller size. With a large amount of light, in this way, the imaging quality of the array camera module can be improved under the premise of controlling the size of the array camera module.

In addition, the supporting body 251A may not cover the inner side portion 2131A of the wafer of the photosensitive element 21A, so that the glue is applied to a part of the non-photosensitive area 213A of the photosensitive element 21A, and the glue is cured Before forming the supporting body 251A, the glue is far away from the photosensitive area 212A of the photosensitive element 21A, so even when the glue flows, the glue will only flow to the inside of the wafer of the photosensitive element 21A The portion 2131A does not flow to the photosensitive area 212A of the photosensitive element 21A, thereby preventing the photosensitive area 212A of the photosensitive element 21A from being contaminated. In other words, the inner side portion 2131A of the wafer can reserve a safe distance between the supporting body 251A and the photosensitive area 212A of the photosensitive element 21A.

FIG. 28D shows a fourth modified embodiment of the molded photosensitive component 20A of the array camera module of the present creation, wherein the supporting body 251A covers the edge area 223A of the circuit board 22A Part of the molded base 23A after molding, the molded base 23A The molded body 232A covers another part of the edge area 223A of the circuit board 22A and at least a part of the outer side surface 2503A and the top surface 2501A of the supporting body 251A.

FIG. 28E shows a fifth modified embodiment of the molded photosensitive component 20A of the array camera module of the present creation, wherein the number of the supporting element 25A may be one, and the supporting element 25A is The supporting body 251A covers a part of the edge area 223A of the circuit board 22A, so that the photosensitive area 212A of each photosensitive element 21A simultaneously corresponds to the through hole 252A of the supporting element 25A , So that after the molded base 23A is molded, the molded body 232A of the molded base 23A covers another part of the edge area 223A of the circuit board 22A and the supporting body 251A The outer side surface 2503A and at least a part of the top surface 2501A.

In the two embodiments of the molded photosensitive element 20A of the array camera module of the present creation shown in FIGS. 28D and 28E, the supporting body 251A may not cover the photosensitive element 21A. Any position of the non-photosensitive area 213A, so that the supporting body 251A is far away from the photosensitive area 212A of the photosensitive element 21A, so as to avoid being used to form the supporting body 251A during the molding process of the supporting body 251A Glue or other materials from the surface contaminate the photosensitive area 212A of the photosensitive element 21A. Preferably, in the two embodiments of the molded photosensitive component 20A of the array camera module of the present creation shown in FIGS. 28D and 28E, the supporting body 251A may cover the lead 24A and the connection position of the circuit board connector 221A of the circuit board 22A, so that during the molding process, the support body 251A can prevent the molding material from contacting the lead 24A and the circuit board 22A The connection position of the circuit board connector 221A is to prevent the lead 24A from deforming and falling off.

Those skilled in the art can understand that although the various embodiments of the molded photosensitive component 20A of the array camera module are shown in FIGS. 28A to 28E, they are only used for To illustrate the features and advantages of the creation by an example, the supporting body 251A can cover the circuit board outer portion 2233A, the circuit board connecting portion 2232A, and the circuit board inner portion of the circuit board 22A according to needs. 2231A and at least a part of at least one of the chip outer portion 2133A, the chip connecting portion 2132A, and the chip inner portion 2131A of the photosensitive element 21A. For example, the supporting body 251A may cover a part of the circuit board connection portion 2232A of the circuit board 22A, or may cover the entire circuit board connection portion 2232A. Therefore, although the position where the supporting body 251A is set to be covered will not be repeated in the following description of this creation, those skilled in the art can understand that the scope of the array camera module of this creation can include The supporting body 251A is configured to cover any position and any combination of the edge area 223A of the circuit board 22A and the non-photosensitive area 213A of the photosensitive element 21A.

In addition, FIG. 29 shows another modified embodiment of the molded photosensitive component 20A of the array camera module of the present creation, wherein the pressing surface 1011A of the upper mold 101A and the supporting body At least a portion of the top surface 2501A of the 251A contacts, so that after the molded base 23A is molded, the molded body 232A may further cover at least a portion of the top surface 2501A of the support body 251A.

It is worth mentioning that, according to an embodiment created by this invention, the array camera module includes at least two of the optical lenses 10A and one of the molded photosensitive components 20A, wherein each of the optical lenses 10A is set separately On the photosensitive path of each photosensitive element 21A of the molded photosensitive element 20A, as described in the foregoing in this creation. In another embodiment, referring to FIG. 30, the array camera module may also include at least two optical lenses 10A, one of the molded photosensitive components 20A, and at least one additional photosensitive element 21B, each of which is The additional photosensitive element 21B is assembled on the circuit board 22A of the molded photosensitive element 20A, and each of the optical lenses 10A is respectively disposed at the circuit board 22A. The photosensitive path of each photosensitive element 21A and each additional photosensitive element 21B of the molded photosensitive component 20A is formed to form the array camera module. In addition, the array camera module further includes at least one additional bracket 27B and at least one additional driver 30B or at least one additional lens barrel 60B, wherein each of the additional brackets 27B is assembled to all of the molded photosensitive components 20A. The circuit board 22A, each of the additional driver 30B or each of the additional lens barrels 60B are respectively assembled on the circuit board 22A, and each of the optical lens 10A is respectively assembled on the driver 30A or the mirror Barrel 60A or the additional driver 30B or the additional lens barrel 60B so that each of the optical lenses 10A is held on each of the photosensitive elements 21A and each of the additional lens of the molded photosensitive assembly 20A, respectively The light-receiving path of the light-receiving element 21B. In addition, the additional photosensitive element 21B may not be mounted on the circuit board 22A of the molded photosensitive component 20A, but the array camera module provides an additional circuit board 22B for mounting For each of the additional photosensitive elements 21B.

FIG. 31 shows another modified embodiment of the array camera module, in which the filter element 40A is not directly assembled to the molded body 232A of the molded base 23A, but is made of The array camera module further provides at least one support 70A. Each filter element 40A can be assembled to each support 70A, and then each support 70A is assembled to the molding. The top surface of the main body 232A so that each of the filter elements 40A is held between each of the optical lens 10A and each of the photosensitive elements 21A. In this way, the filter elements 40A can be reduced. To reduce the manufacturing cost of the array camera module.

It is worth mentioning that, in one embodiment, the number of the support 70A is the same as the number of the filter element 40A, that is, the support 70A and the filter element 40A match one by one. For example, when the number of the filter element 40A is one, the number of the support 70A is also one. In another embodiment, the number of the support 70A, the number of the filter element 40A and the The number of the optical lenses 10A is the same. For example, in the example shown in FIG. 21, the number of the supporting members 70A, the number of the filter elements 40A, and the number of the optical lenses 10A are all two.

In another embodiment, the number of the support member 70A may also be inconsistent with the number of the filter element 40A. For example, the number of the support member 70A may be only one, and the number of the filter element 40A may vary. There are more than one, wherein each of the filter elements 40A can be assembled at different positions of the support 70A.

With further reference to FIG. 31, the top surface of the molded body 232A of the molded base 23A is a flat surface, so that after the molded base 23A is molded, the support 70A is assembled on the The top surface of the main body 232A is molded, and then the driver 30A or the lens barrel 60A is assembled to the support 70A. That is, the driver 30A or the lens barrel 60A may not be directly assembled on the top surface of the molded body 232A, but assembled on the support 70A.

FIG. 32 shows another modified embodiment of the array camera module, in which at least one groove 235A is formed on the top surface of the molded body 232A, which is assembled on the top of the molded base 23A2. The support 70A on the surface is accommodated in the groove 235A to further reduce the height dimension of the array camera module. At this time, the driver 30A or the lens barrel 60A can be directly assembled in the The top surface of the main body 232A is molded.

Nevertheless, those skilled in the art can understand that in other examples of the array camera module created in this invention, the optical lens 10A may also be directly assembled on the top surface of the molded body 232A or be It is directly assembled on the top surface of the support 70A.

Referring to FIG. 33, this creation further provides an electronic device with an array camera module, wherein the electronic device with an array camera module includes an electronic device body 200 and at least one array camera module. Column camera modules, wherein each of the array camera modules is respectively disposed on the electronic device body 200 for obtaining graphics.

The present creation further provides a method for manufacturing a molded photosensitive component 20A, wherein the manufacturing method includes the following steps: (a) connecting at least two photosensitive elements 21A and at least one circuit board 22A through a set of leads 24A; (b) connecting each The photosensitive element 21A and each of the circuit boards 22A are placed on an upper mold 101A or a lower mold 102A of a molding mold 100A; (c) during the closing of the upper mold 101A and the lower mold 102A, The upper mold 101A is supported upward by at least one supporting element 25A to prevent the pressing surface 1011A of the upper mold 101A from applying pressure to each group of the leads 24A; A molding space 103A between the lower molds 102A is filled with a fluid-like molding material to form a molded base 23A after the molding material is cured, wherein the molded base 23A includes a molded body 232A and There are at least two light windows 231A, wherein the molded body 232A covers a part of the edge area 223A of each circuit board 22A and at least a part of the supporting element 25A, and the photosensitive area 212A of each photosensitive element 21A It corresponds to each of the light windows 231A, respectively.

Referring to FIGS. 34A to 36F of the drawings of the specification, a camera module according to a preferred embodiment of the present creation is illustrated, wherein the camera module includes at least one optical lens 10C, at least one photosensitive element 21C, and at least one circuit The board 22C, at least one protection frame 300C, and at least one integrated packaging bracket 400C.

It is worth mentioning that the camera module in this creation can be a fixed-focus camera module or a zoom camera module. In other words, whether the camera module of this creation allows focus adjustment does not limit the content and scope of this creation.

It is worth mentioning that the camera module of this creation can be a single-lens camera module or a multi-lens camera module. For example, in a specific example, the camera module can be implemented as an array Camera module. In other words, the number of the optical lenses 10C of the camera module of this creation does not limit the content and scope of this creation.

Specifically, in the camera module of the present creation shown in FIG. 34A, the protective frame 300C is convexly arranged on the outer peripheral side of the photosensitive area of the photosensitive element 21C. It is worth mentioning that the protective frame 300C is equivalent to the supporting element 25 in the above-mentioned embodiment of the present invention. The photosensitive element 21C and the circuit board 22C are conductively connected, and the integrated packaging bracket 400C is arranged to wrap at least a part of the circuit board 22C and at least a part of the protection frame 300C. Further, the integrated package support 400C can also cover at least a part of the non-photosensitive area of the photosensitive element 21C after molding, so that the integrated package support 400C, the photosensitive element 21C and the circuit board 22C are combined As one. It is worth mentioning that the integrated package bracket 400C is equivalent to the molded base 23 in the above-mentioned embodiment of the present invention. The optical lens 10C is arranged on the light-receiving path of the light-receiving element 21C. The light reflected by the object can be condensed into the camera module through the optical lens 10C, so as to be further received by the photosensitive element 21C and photoelectrically converted to generate an image related to the object.

In a specific example of the camera module of the present invention, the photosensitive element 21C is mounted on the circuit board 22C, and the photosensitive element 21C and the circuit board 22C are conductively connected. For example, the photosensitive element 21C can be electrically connected to the circuit board 22C through a wire bonding process. catch. For example, a gold wire is drawn between the non-photosensitive area of the photosensitive element 21C and the circuit board 22C to connect the photosensitive element 21C and the circuit board 22C through the gold wire, as shown in FIG. 34A.

In another specific example of the camera module created by the present invention, the photosensitive element 21C is electrically connected to the circuit board 22C while being mounted on the circuit board 22C, for example, the photosensitive element 21C The non-photosensitive area is provided with die pads, and the circuit board 22C is provided with circuit board pads. When the photosensitive element 21C is mounted on the circuit board 22C, the die pads of the photosensitive element 21C and the The wiring board pads of the wiring board 22C are conductively connected.

The protective frame 300C has a hollow structure so that the protective frame 300C can be arranged around the outer peripheral side of the photosensitive area of the photosensitive element 21C. Preferably, the size of the inner side of the protective frame 300C is greater than or equal to the size of the photosensitive area of the photosensitive element 21C, so that when the protective frame 300C is convexly disposed on the photosensitive element 21C, The protective frame 300C can be held on the outer peripheral side of the photosensitive area of the photosensitive element 21C, so that the protective frame 300C does not block the photosensitive area of the photosensitive element 21C.

Preferably, the size of the outer side of the protective frame 300C is smaller than the size of the photosensitive element 21C, so that when the protective frame 300C is convexly disposed on the photosensitive element 21C, the size of the photosensitive element 21C The outside of the non-photosensitive area can be connected to the photosensitive element 21C and the circuit board 22C through a wire bonding process. Nevertheless, those skilled in the art can understand that when the photosensitive element 21C and the circuit board 22C are conductively connected through the die pad and the circuit board pad, the size of the outer side of the protective frame 300C It may be consistent with the size of the photosensitive element 21C.

The integrated packaging bracket 400C wraps the non-photosensitive area of the circuit board 22C and the photosensitive element 21C after being formed, so that the integrated packaging bracket 400C, the circuit board 22C and the photosensitive element 21C are integrated into one body In this way, the structure of the camera module can be increased The structure is stable and the volume of the camera module is reduced, so that the camera module can be applied to electronic devices pursuing lightness and thinness.

Further, the integrated packaging bracket 400C is arranged to wrap the outer peripheral side of the protective frame 300C, so that the integrated packaging bracket 400C, the circuit board 22C, the protective frame 300C and the photosensitive element 21C are integrated into one body . It can be understood that the integrated packaging bracket 400C may also be configured to wrap at least a part of the top surface of the protective frame 300C.

Further, as shown in FIG. 34A, the camera module includes at least one lens support 500C, wherein the lens support 500C is disposed on the upper part of the integrated package bracket 400C, and the optical lens 10C is disposed at all. The lens support 500C allows the optical lens 10C to be held in the light-receiving path of the light-receiving element 21C by the lens support 500C.

In a specific example of the camera module created by the present invention, the lens support 500C is disposed on the upper part of the integrated packaging bracket 400C after being molded. In another specific example of the camera module created by this invention, the lens support 500C can be integrally formed with the integrated packaging bracket 400C. In this way, the packaging error of the camera module can be reduced. , In order to help improve the imaging quality of the camera module.

Preferably, the lens supporting body 500C may be implemented as a driver, such as a motor, that is, the optical lens 10C is operably disposed on the lens supporting body 500C so as to pass through the lens supporting body 500C. The optical lens 10C is driven to move back and forth along the photosensitive path of the photosensitive element 21C, thereby adjusting the focal length of the camera module by changing the position between the optical lens 10C and the photosensitive element 21C. It is worth mentioning that the lens support 500C may be various drivers for driving the optical lens 10C to move back and forth along the photosensitive path of the photosensitive element 21C. For example, in this preferred embodiment of this creation, the lens support 500C may be implemented as a voice coil motor.

Those skilled in the art can understand that when the lens supporting body 500C is implemented as a motor, the lens supporting body 500C and the circuit board 22C are conductively connected.

Further, as shown in FIG. 34A, the camera module includes a filter element 40C, wherein the filter element 40C is disposed between the optical lens 10C and the photosensitive element 21C, and when reflected by an object When light is collected from the optical lens 10C to the inside of the camera module, the light is filtered by the filter element 40C and then received by the photosensitive element 21C and photoelectrically converted to improve the performance of the camera module. Image quality. In other words, the filter element 40C can reduce noise to improve the imaging quality of the camera module.

It is worth mentioning that the type of the filter element 40C may not be limited. For example, in a specific example of the camera module of the present invention, the filter element 40C may be implemented as an infrared cut filter. The filter element 40C filters the infrared part of the light. In another specific example of the camera module of the present invention, the filter element 40C is implemented as a full-transmission spectral filter piece.

Referring to FIG. 34B showing a modified embodiment of the camera module of the present creation, the filter element 40C can also be overlapped and arranged on the photosensitive element 21C, and the protective frame 300C is arranged on the The outer peripheral side of the filter element 40C.

The integrated packaging bracket 400C forms at least one mounting platform 410C for mounting the filter element 40C. For example, the mounting platform 410C may be a mounting groove formed on the upper part of the integrated packaging bracket 400C or the The mounting platform 410C may be formed on the integrated package support 400C The upper plane. In other words, the filter element 40C can be directly mounted on the upper part of the integrated packaging bracket 400C.

Figures 36A to 36F are schematic diagrams of a manufacturing process of the camera module created according to the present invention. In Figures 36A to 36F, for convenience of description, all of the camera modules are shown in cross-sectional views. The optical lens 10C, the photosensitive element 21C, the protective frame 300C, the circuit board 22C, and the integral package bracket 400C are structured among other elements.

In this step shown in FIG. 36A, the photosensitive element 21C is turned on the circuit board 22C. Those skilled in the art can understand that in this step shown in FIG. 36A, after the photosensitive element 21C is mounted on the circuit board 22C, the photosensitive element 21C and the The conductive connection method of the circuit board 22C is merely an example description, and this conductive connection method of the photosensitive element 21C and the circuit board 22C does not constitute a limitation on the content and scope of this creation. In another example of the camera module created by the present invention, the photosensitive element 21C and the circuit board 22C may also be directly conductively connected through a chip pad and a circuit board pad .

In this step shown in FIG. 36B, the protective frame 300C is convexly provided on the outer peripheral side of the photosensitive area of the photosensitive element 21C. Specifically, in the manufacturing process of the camera module of the present creation, after the protective frame 300C is provided, the protective frame 300C is convexly arranged on the outer peripheral side of the photosensitive area of the photosensitive element 21C . Preferably, a glue layer 600C is formed between the protective frame 300C and the outer peripheral side of the photosensitive area of the photosensitive element 21C, and the glue layer 600C is used to connect the protective frame 300C and the photosensitive element 21C. The outer peripheral side of the photosensitive area.

For example, in an example of the camera module of the present creation, glue is set on the outer peripheral side of the photosensitive area of the protective frame 300C and/or the photosensitive element 21C so as to be in the protective frame 300C and/or the protective frame 300C and/or the photosensitive area The adhesive layer 600C is formed on the outer peripheral side of the photosensitive area of the photosensitive element 21C. That is That is, the surface of at least one of the protective frame 300C and the outer peripheral side of the photosensitive region of the photosensitive element 21C forms the glue layer 600C. Later, the glue layer 600C is used to connect the protective frame 300C and the outer peripheral side of the photosensitive area of the photosensitive element 21C together.

Preferably, after the glue is set on the outer peripheral side of the photosensitive area of the protective frame 300C and the photosensitive element 21C, the glue can be quickly formed to connect the protective frame 300C by thermal curing or UV curing. And the glue layer 600C on the outer peripheral side of the photosensitive area of the photosensitive element 21C. In another example of the camera module created by the present invention, the protective frame 300C can be provided with the glue layer 600C, so that in the process of packaging the camera module, the protective frame 300C can be directly attached. It is provided on the outer peripheral side of the photosensitive region of the photosensitive element 21C.

In addition, the protective frame 300C may be formed by an injection molding process or a stamping process. For example, the protective frame 300C may be a plastic part formed by an injection molding process.

As shown in FIG. 35, the protective frame 300C is a hollow structure, so that the protective frame 300C can be convexly disposed on the outer peripheral side of the photosensitive area of the photosensitive element 21C to isolate the photosensitive element 21C Therefore, in the subsequent process of packaging the camera module, the protective frame 300C can prevent contaminants from entering the photosensitive area of the photosensitive element 21C to cause defective stains.

In this step shown in FIG. 36C, the integrated packaging bracket 400C is formed during the process of packaging the camera module by a molding mold 100C, wherein the molding mold 100C includes an upper mold 101C, and the upper mold The pressing surface 1011C of 101C presses the protective frame 300C to isolate the photosensitive area of the photosensitive element 21C from the external environment.

Those skilled in the art can understand that the protective frame 300C is convexly provided on the outer peripheral side of the photosensitive area of the photosensitive element 21C, so that when the upper mold 101C is pressed When the joint surface 1011C is pressed against the protective frame 300C, the protective frame 300C can prevent the pressing surface 1011C of the upper mold 101C from contacting the photosensitive area of the photosensitive element 21C, so that the protective frame 300C can The pressing surface 1011C of the upper mold 101C is prevented from damaging or scratching the photosensitive area of the photosensitive element 21C.

Further, referring to a modified example of the manufacturing process of the camera module shown in FIG. 38, the inner surface of the upper mold 101C corresponding to the photosensitive area of the photosensitive element 21C is formed in a concave manner. The groove 105C, so that in the process of molding the integrated package holder 400C by the molding die 100C, the groove 105C can make the photosensitive area of the photosensitive element 21C and the inner surface of the upper mold 101C safe The gap, thereby further reducing the influence of the upper mold 101C on the photosensitive element 21C, to prevent the photosensitive element 21C from being damaged or scratched by the inner surface of the upper mold 101C.

Preferably, the protective frame 300C has elasticity, so that when the pressing surface 1011C of the upper mold 101C is pressed against the protective frame 300C, the protective frame 300C can play a buffering role to prevent damage. The impact force generated when the mold 101C contacts the protective frame 300C damages the photosensitive element 21C. In addition, due to the limitation of the manufacturing process of the photosensitive element 21C, the manufacturing process of the circuit board 22C, and the mounting process of the photosensitive element 21C and the circuit board 22C, the photosensitive element 21C is mounted After the circuit board 22C, there may be a mounting tilt. At this time, when the pressing surface 1011C of the upper mold 101C is pressed against the protective frame 300C, the protective frame 300C can be deformed to The photosensitive area of the photosensitive element 21C is isolated from the external environment to prevent the molding material used to form the integrated package holder 400C from entering the photosensitive area of the photosensitive element 21C.

In this step shown in FIG. 36D, the molding material is added to the upper mold 101C, and the integrated packaging bracket 400C is formed after the molding material is cured, wherein the integrated The packaging support 400C wraps the non-photosensitive area of the circuit board 22C and the photosensitive element 21C, so that the integrated packaging support 400C, the circuit board 22C and the photosensitive element 21C are integrated into one body. Preferably, the integrated packaging bracket 400C further wraps the outer peripheral side of the protective frame 300C, so that the integrated packaging bracket 400C, the circuit board 22C, the protective frame 300C and the photosensitive element 21C are combined into one body . It is worth mentioning that the molding material is fluid or granular. After the molding die 100C is removed, the integrated package bracket 400C, the circuit board 22C, the protection frame 300C, and the photosensitive element 21C can be obtained as shown in FIG. 36E.

Those skilled in the art can understand that the photosensitive area of the photosensitive element 21C is isolated from the external environment, so that when the molding material is added to the upper mold 101C, the molding material will not flow to the The photosensitive area of the photosensitive element 21C, so that the protective frame 300C can prevent the molding material from damaging the photosensitive area of the photosensitive element 21C. In addition, the protection frame 300C has elasticity so that there is no gap between the protection frame 300C and the upper mold 101C that is pressed against the protection frame 300C. There will be no "flash" phenomenon during the curing of the molding material, so as to ensure the imaging quality of the camera module.

Further, referring to a modified example of the manufacturing process of the camera module shown in FIGS. 37A and 37B, the pressing surface 1011C of the upper mold 101C is provided with a cover film 104C, when the upper mold When the pressing surface 1011C of 101C is pressed against the protective frame 300C, the cover film 104C provided on the upper mold 101C is in direct contact with the protective frame 300C, so that the cover film 104C The photosensitive element 21C provides further protection. In addition, it is understandable that the cover film 104C can reduce the difficulty of demolding and increase the sealing performance, thereby preventing the molding material from appearing "flash" on the inner side of the integrated package holder 400C during the curing process.

In addition, in the embodiment in which the pressing surface 1011C of the upper mold 101C is provided with the covering film 104, the protective frame 300C may also have no elasticity, so that the covering film 104C absorbs the upper The impact force generated when the mold 101C presses the protective frame 300C to avoid damaging the photosensitive element 21C.

In this step shown in FIG. 36F, the filter element 40C and the optical lens 10C are respectively disposed on the light-sensing path of the light-sensing element 21C, so as to manufacture the camera module. Preferably, the filter element 40C is mounted on the integrated package bracket 400C, and the optical lens 10C is held on the photosensitive element by the lens support 500C provided on the integrated package bracket 400C. 21C's photosensitive path.

39A to 39G are schematic diagrams of another manufacturing process of the camera module created according to the present invention. In this step shown in FIG. 39A, the photosensitive element 21C is turned on the circuit board 22C.

In this step shown in FIG. 39B, the protective frame 300C is convexly provided on the outer peripheral side of the photosensitive area of the photosensitive element 21C. Preferably, the upper part of the protective frame 300C is provided with a protective film 700C to facilitate the suction of the protective frame 300C and the mounting of the protective frame 300C on the photosensitive area of the photosensitive element 21C by means of vacuum suction. Peripheral side. Those skilled in the art can understand that, after the protective frame 300C is disposed on the outer peripheral side of the photosensitive area of the photosensitive element 21C, the protective film 700C correspondingly covers the photosensitive area of the photosensitive element 21C. In the upper part, the photosensitive area of the photosensitive element 21C is isolated from the external environment by the protective film 700C and the protective frame 300C, so as to prevent the molding material from flowing to the photosensitive area of the photosensitive element 21C in the future.

In this step shown in FIG. 39C, the pressing surface 1011C of the upper mold 101C of the forming mold 100C is pressed against the protective frame 300C to further isolate the photosensitive area of the photosensitive element 21C from The external environment.

In this step shown in FIG. 39D, the molding material is added to the molding die 100C, and the integrated packaging bracket 400C is formed after the molding material is cured, wherein the integrated packaging bracket 400C wraps the circuit board 22C and the non-photosensitive area of the photosensitive element 21C, so that the integrated packaging bracket 400C, the circuit board 22C and the photosensitive element 21C are integrated into one body. Preferably, the integrated packaging bracket 400C further wraps the outer peripheral side of the protective frame 300C, so that the integrated packaging bracket 400C, the circuit board 22C, the protective frame 300C and the photosensitive element 21C are combined into one body . After the molding die 100C is removed, an integrated package holder 400C, the circuit board 22C, the protection frame 300C, and the photosensitive element 21C can be obtained as shown in FIG. 39E, wherein the protection The film 700C is still set on the protective frame 300C.

In this step shown in FIG. 39F, the protective film 700C is removed from the protective frame 300C to obtain an integrated package support 400C, the circuit board 22C, the protective frame 300C and the The photosensitive element 21C.

In this step shown in FIG. 39G, the filter element 40C and the optical lens 10C are respectively disposed on the light-sensing path of the light-sensing element 21C, to produce the camera module.

According to FIGS. 40 to 42G of the accompanying drawings of the specification, the camera module according to another preferred embodiment of the present creation is illustrated, wherein the camera module includes at least one optical lens 10D, at least one photosensitive element 21D, and at least A protective frame 300D, at least one circuit board 22D, at least one integrated package support 400D, and at least one filter element 40D, wherein the photosensitive element 21D and the circuit board 22D are conductively connected, and the filter element 40D is overlapped Is set on the photosensitive element 21D, and the protective frame 300D is set Placed on the outer periphery of the filter element 40D so that the protective frame 300D does not block the photosensitive area of the photosensitive element 21D, and the integrated package bracket 400D is set to wrap the circuit board 22D and the filter element 40D, so that the integrated package holder 400D, the filter element 40D, the photosensitive element 21D and the circuit board 22D are integrated, wherein the optical lens 10D is arranged on the photosensitive element 21D Sensitivity path. The light reflected by the object is condensed into the camera module through the optical lens 10D to be further received by the photosensitive element 21D and photoelectrically converted to generate an image related to the object.

Preferably, the integrated package support 400D wraps the outer periphery of the circuit board 22D and the filter element 40D during molding, so that the integrated package support 400D, the filter element 40D, and the photosensitive element 21D is integrated with the circuit board 22D.

More preferably, the integrated packaging bracket 400D further wraps the outer side of the protection frame 300D, so that the integrated packaging bracket 400D, the filter element 40D, the photosensitive element 21D, and the circuit board 22D It is integrated with the protection frame 300D.

The protective frame 300D is convexly disposed on the outer periphery of the filter element 40D, so that when the inner surface of the upper mold 101D of a forming mold 100D is pressed against the protective frame 300D later, the upper mold The inner surface of 101D will not contact the surface of the filter element 40D, thereby preventing the inner surface of the upper mold 101D from being damaged or scratched on the filter element 40D. That is, the protective frame 300D protrudingly provided on the outer periphery of the filter element 40D makes the surface of the filter element 40D and the inner surface of the upper mold 101D form a safe distance to prevent The inner surface of the upper mold 101D is damaged or scratched on the filter element 40D.

Further, the camera module includes at least one lens supporting body 500D, wherein the lens supporting body 500D is disposed on the upper part of the integrated packaging bracket 400D, and the optical lens 10D It is provided on the lens supporting body 500D, so that the optical lens 10D is held in the photosensitive path of the photosensitive element 21D by the lens supporting body 500D.

In a specific example of the camera module created by the present invention, the lens support 500D is disposed on the upper part of the integrated packaging bracket 400D after being molded. In another specific example of the camera module created by the present invention, the lens support 500D can be integrally formed with the integrated packaging bracket 400D. In this way, the packaging error of the camera module can be reduced. , In order to help improve the imaging quality of the camera module.

Preferably, the lens support 500D can be implemented as a motor, that is, the optical lens 10D is operably disposed on the lens support 500D to drive the lens support 500D through the lens support 500D. The optical lens 10D moves back and forth along the photosensitive path of the photosensitive element 21D, thereby adjusting the focal length of the camera module by changing the position between the optical lens 10D and the photosensitive element 21D. It is worth mentioning that the lens supporting body 500D may be various drivers for driving the optical lens 10D to move back and forth along the photosensitive path of the photosensitive element 21D, for example, in this preferred embodiment of this creation The lens support 500D may be implemented as a voice coil motor.

Those skilled in the art can understand that when the lens supporting body 500D is implemented as a motor, the lens supporting body 500D and the circuit board 22D are conductively connected.

42A to 42G are schematic diagrams of a manufacturing process of the camera module of the present invention. In this step shown in FIG. 42A, the photosensitive element 21D is conductively connected to the circuit board 22D. Similar to the above-mentioned preferred embodiment of the invention, the photosensitive element 21D and the circuit board 22D are conductively connected. The way is not restricted.

In this step shown in FIG. 42B, the filter element 40D is overlapped and arranged on the photosensitive element 21D. Those skilled in the art can understand that combining the filter element 40D and the filter element 40D The overlapping arrangement of the photosensitive elements 21D can reduce the back focus focal length of the camera module, thereby facilitating the miniaturization of the camera module, so that the camera module can be applied to electronic devices pursuing lightness and thinness.

In this step shown in step 42C, the protective frame 300D is placed on the outer periphery of the filter element 40D, wherein the protective frame 300D does not block the photosensitive area of the photosensitive element 21D. Those skilled in the art can understand that after the protective frame 300D is provided, the protective frame 300D can be disposed on the outer periphery of the filter element 40D through a glue layer 600D. That is, the glue layer 600D disposed between the protective frame 300D and the filter element 40D is used to connect the protective frame 300D and the filter element 40D.

In this step shown in FIG. 42D, pressure is applied to the protective frame 300D through the pressing surface 1011D of the upper mold 101D to isolate the inner area and the outer periphery of the filter element 40D, wherein the filter element 40D The size of the inner area of the element 40D is greater than or equal to the photosensitive area of the photosensitive element 21D to prevent the protective frame 300D from blocking the photosensitive area of the photosensitive element 21D. Those skilled in the art can understand that the protective frame 300D is protrudingly arranged on the outer periphery of the filter element 40D, so that when the pressing surface 1011D of the upper mold 101D is pressed against the When protecting the frame 300D, the protection frame 300D can prevent the pressing surface 1011D of the upper mold 101D from contacting the photosensitive area of the filter element 40D, so that the protection frame 300D can prevent the upper mold 101D from The pressing surface 1011D damages or scratches the inner area of the filter element 40D.

Preferably, the protection frame 300D has elasticity, so that when the pressing surface 1011D of the upper mold 101D is pressed against the protection frame 300D, the protection frame 300D can play a buffer function to prevent The pressure generated by the mold 101D damages the filter element 40D.

In this step shown in FIG. 42E, the molding material is added to the upper mold 101D, and after the molding material is cured, the integrated package support 400D is formed, wherein the integrated package support 400D wraps the The circuit board 22D and the outer periphery of the filter element 40D are integrated so that the integrated package support 400D, the circuit board 22D, the photosensitive element 21D, and the filter element 40D are integrated into one body. Preferably, the integrated packaging bracket 400D further wraps the outer peripheral side of the protection frame 300D, so that the integrated packaging bracket 400D, the circuit board 22D, the protection frame 300D, the photosensitive element 21D and the The filter element 40D is integrated into one body. It is worth mentioning that the molding material is fluid or granular. After the molding die 100D is removed, the integrated package support 400D, the circuit board 22D, the protection frame 300D, the photosensitive element 21D and the filter can be obtained as shown in FIG. 42F. Optical element 40D.

Those skilled in the art can understand that the inner area and outer periphery of the filter element 40D are isolated, so that when the molding material is added to the upper mold 101D, the molding material will not flow to the The inner area of the filter element 40D, so that the protective frame 300D can prevent the molding material from damaging the inner area of the filter element 40D. In addition, the protection frame 300D has elasticity, so that there is no gap between the protection frame 300D and the upper mold 101D that is pressed against the protection frame 300D. There will be no "flash" phenomenon during the curing of the molding material, so as to ensure the imaging quality of the camera module.

In this step shown in FIG. 42G, the filter element 40D and the optical lens 10D are respectively disposed on the light-sensing path of the light-sensing element 21D to produce the camera module.

Furthermore, this creation also provides a method for manufacturing a camera module, wherein the manufacturing method includes the following steps: (a) Conductively connect at least one photosensitive element 21C and at least one circuit board 22C; (b) Provide at least one protective frame 300C, wherein the protective frame 300C is disposed on the outer peripheral side of the photosensitive area of the photosensitive element 21C; (c) The inner surface of the upper mold 101C of a molding mold 100C is pressed against the The protective frame 300C separates the photosensitive area and the non-photosensitive area of the photosensitive element 21C; (d) wrapping the circuit board 22C and the non-photosensitive area of the photosensitive element 21C with the molding material added to the molding die 100C Area to form an integrated package bracket 400C integrated with the photosensitive element 21C and the circuit board 22C after the molding material is cured; and (e) providing at least one optical lens 10C, wherein the optical lens 10C It is arranged on the photosensitive path of the photosensitive element 21C to form the camera module.

Furthermore, the present creation also provides a method for manufacturing a camera module, wherein the manufacturing method includes the following steps: (A) conductively connect at least one photosensitive element 21C and at least one circuit board 22C; (B) connect a filter The light element 40C is superimposed on the photosensitive element; (C) at least one protective frame 300C is provided, wherein the protective frame 300C is disposed on the outer peripheral side of the filter element 40C; (D) through a molding die 100C The inner surface of the mold 101C is pressed against the protective frame 300C to isolate the inner area and the outer peripheral side of the filter element 40C; (E) the circuit board 22C is wrapped with the molding material added to the molding mold 100C And the outer peripheral side of the filter element 20C to form an integrated package holder 400C integrated with the filter element 40C, the photosensitive element 21C and the circuit board 22C after the molding material is cured; and (F) At least one optical lens 10C is provided, wherein the optical lens 10C is disposed on the photosensitive path of the photosensitive element 21C to form the camera module.

With reference to Figures 43 and 44 of the drawings, this creation relates to a method for manufacturing a camera module and a camera module, wherein the camera module can be configured in an electronic device for collecting the information of the electronic device Information such as images or images of the surrounding environment.

It is worth mentioning that the type of the electronic device is not limited. For example, the electronic device can be a civilian electronic device such as a smart phone, a tablet computer, a media player, a notebook computer, a personal digital assistant, a remote control, etc. Medical electronic equipment such as speculum or any electronic equipment in other fields that can be equipped with the array camera module.

FIG. 43 shows an example in which the camera module of the present creation can be implemented as a fixed focus module, where the camera module includes at least one optical lens 10E, at least one photosensitive element 21E, a circuit board 22E, A blocking element 800E and an integrated package support 400E, the photosensitive element 21E is conductively connected to the circuit board 22E, and the blocking element 800E is arranged on the outer peripheral side of the photosensitive area of the photosensitive element 21E, which is understandable The blocking element 800E has a ring shape and is located in the non-photosensitive area of the photosensitive element 21E. It is worth mentioning that the blocking element 800E is equivalent to the supporting element 25 of the camera module shown in the above embodiment of the present invention. The integrated packaging bracket 400E wraps the circuit board 22E, the non-photosensitive area of each photosensitive element 21E, and the outer peripheral surface 801E of the blocking element 800E. In another embodiment, the integrated packaging bracket 400E may further wrap at least a part of the top surface 802E of the blocking element 800E. The optical lens 10E is arranged on the light-receiving path of the light-receiving element 21E. The light reflected by the object enters the inside of the camera module from the optical lens 10E, and is subsequently received by the photosensitive element 21E and photoelectrically converted to generate an image related to the object.

The blocking element 800E has a ring shape. For example, the blocking element 800E may be implemented in a circular ring or a box shape, that is, the middle portion of the blocking element 800E is hollowed out, so as to prevent the blocking element 800E from blocking the The photosensitive area of the photosensitive element 21E is described.

It is worth mentioning that although FIG. 43 shows an example in which the camera module of the present creation only includes one optical lens 10E and one photosensitive element 21E, those skilled in the art can understand that, The camera module of the present invention may include two or more optical lenses 10E and two or more photosensitive elements 21E, so that the camera module forms an array camera module. Therefore, the camera module of the present creation shown in FIG. 43 is only an exemplary description, and in fact, the number and types of the optical lens 10E and the photosensitive element 21E of the present creation do not constitute a contribution to the creation. The content and scope of the camera module are restricted.

In addition, the photosensitive element 21E of the camera module of the present creation shown in FIG. 43 is mounted on the circuit board 22E, and then each is made by gold wire, silver wire, copper wire and other processes. The photosensitive element 21E is connected to the circuit board 22E. Nevertheless, those skilled in the art can understand that the circuit board 22E may be provided with circuit board pads, and the photosensitive element 21E may be provided with die pads, so that the die pads of the photosensitive element 21E are connected to each other. The circuit board pads of the circuit board 22E mount the photosensitive element 21E on the circuit board 22E in a one-to-one correspondence, and at the same time, the photosensitive element 21E and the circuit board 22E are conductively connected. In addition, the photosensitive element 21E may not be mounted on the circuit board 22E, but only the photosensitive element 21E is electrically connected to the circuit board 22E. In this way, the flatness of the photosensitive element 21E is It is not limited to the flatness of the circuit board 22E. For example, in the present invention, the flatness of the photosensitive element 21E can be ensured by the integrated packaging bracket 400E.

Further, the camera module includes at least one lens supporting body 500E, wherein each of the lens supporting bodies 500E is respectively located on the upper part of the integrated packaging bracket 400E, and the optical lens 10E is arranged on the lens supporting body 500E , So that the optical lens 10E is held in the photosensitive path of the photosensitive element 21E by the lens support 500E. It is worth mentioning that, in a preferred embodiment of the camera module created in this invention, the lens support 500E can be made separately, and then the lens support 500E can be attached to the camera module. The integrated package bracket 400E is described. In another preferred embodiment of the camera module created by the present invention, the integrated packaging bracket 400E may be integrally extended to form the lens support 500E. In other words, the lens support 500E and the integrated packaging bracket 400E may be integrally formed. In this way, it is possible to eliminate the need for attaching the separately formed lens support 500E to the integrated packaging bracket 400E. Therefore, the imaging quality of the camera module can be improved by reducing the package tilt of the camera module.

Fig. 44 and Fig. 45 show an example in which the camera module of the present creation can be implemented as a zoom module, which can change the focal length of the camera module according to the specific needs of the user to improve the The environmental adaptability of the camera module. Specifically, the camera module of the present creation includes at least one motor, which can be various similar drivers 30E. For example, in this embodiment, it can be a voice coil motor 30E, wherein each of the voice coil motors 30E The optical lens 10E is drivably installed on the voice coil motor 30E so as to be driven by the voice coil motor 30E. The optical lens 10E is held on the photosensitive path of the photosensitive element 21E, and the voice coil motor 30E can drive the optical lens 10E to move back and forth along the photosensitive path of the photosensitive element 21E to adjust the The focal length of the camera module.

Those skilled in the art can understand that the voice coil motor 30E of the camera module created by this invention can be electrically connected to the circuit board 22E in a variety of ways. For example, in a real In an embodiment, the integrated package holder 400E can be embedded with leads while being molded, wherein one end of the lead is connected to the circuit board 22E, and the other end of the lead is connected to the integrated package holder 400E. A pad is formed on the surface of the or the other end of the lead is connected to a pad provided on the surface of the integrated package holder 400E, when the voice coil motor 30E is mounted on the integrated package holder 400E The pads of the voice coil motor 30E and the pads on the surface of the integrated package support 400E are welded together to conduct the voice coil motor 30E and the circuit board 22E. For example, in another example, the voice coil motor 30E and the circuit board 22E may be connected by electroplating a conductive layer on the surface of the integrated package bracket 400E.

Further, the camera module of the present creation includes at least one filter element 40E, the filter element 40E is arranged between the optical lens 10E and the photosensitive element 21E, and the light reflected by the object comes from the After the optical lens 10E enters the camera module and is filtered by the filter element 40E, it is received by the photosensitive element 21E and undergoes subsequent photoelectric conversion. The filter element 40E can reduce noise to improve the imaging quality of the camera module.

It is worth mentioning that the type of the filter element 40E is not limited. For example, in a preferred embodiment of the camera module of the present invention, the filter element 40E can be implemented as an infrared cut filter. The light sheet is used to filter the infrared part of the light by the filter element 40E. In another preferred embodiment of the camera module created by the present invention, the filter element 40E can be implemented as a whole Transmittance filter.

The integrated packaging bracket 400E forms at least one mounting platform for mounting the filter element 40E. For example, a mounting groove may be formed on the top, or there may be no mounting groove on the top, and the filter element 40E may be directly attached to the filter element 40E. combine. When the camera module of the present creation is implemented as the array camera module, the number of the filter element 40E can be implemented as one, so that each of the optical lens 10E and Each of the photosensitive elements 21E is respectively arranged corresponding to a different part of the filter element 40E. Nevertheless, the number of the filter element 40E of the present creation is preferably the same as the number of the photosensitive element 21E and the optical lens 10E, so that the filter element 40E, the optical lens 10E and the The photosensitive elements 21E have a one-to-one correspondence.

Fig. 46 and Fig. 47 show another preferred embodiment of the camera module created by the present invention, wherein the blocking element 800E is not arranged on the outer edge of the photosensitive element 21E. Specifically, in the embodiment shown in FIGS. 46 and 47, the photosensitive element 21E is conductively connected to the circuit board 22E, and the filter element 40E is overlapped and arranged on the photosensitive element 21E. , Wherein the blocking element 800E is disposed on the outer edge of the filter element 40E to distinguish the inner area and the outer area of the filter element 40E by the blocking element 800E, and the integrated package holder 400E is being molded The outer area of the circuit board 22E and the filter element 40E is then wrapped, so that the integrated packaging bracket 400E, the filter element 40E, the photosensitive element 21E and the circuit board 22E are integrated.

By overlapping the filter element 40E on the photosensitive element 21E and then forming the integrated package holder 400E, damage to the molding material used to form the integrated package holder 400E or contamination of the photosensitive element 21E can be avoided. The photosensitive area, thereby ensuring the reliability of the photosensitive element 21E.

It is worth mentioning that the part of the filter element 40E corresponding to the photosensitive area of the photosensitive element 21E is defined as the inner area of the filter element 40E, and the filter element 40E corresponds to the photosensitive element 21E. The non-photosensitive area is located in the outer area of the filter element 40E, and the blocking element 800E provided on the filter element 40E is used to distinguish the inner area and the outer area of the filter element 40E. After the integrated packaging bracket 400E is formed, the integrated packaging bracket 400E is wrapped around the outer area of the filter element 40E to prevent the integrated packaging bracket 400E from covering the corresponding area. The photosensitive area of the photosensitive element 21E corresponds to the inner area of the filter element 40E. It can be understood that, between the photosensitive element 21E and the filter element 40E, the outer peripheral side of the photosensitive area of the photosensitive element 21E can also be further applied with a medium to form a fixing, buffering and blocking structure.

In addition, in this embodiment of the camera module created by the present invention, the filter element 40E and the photosensitive element 21E are directly overlapped together, which can reduce the back focus of the camera module. In this way, It is beneficial to reduce the height dimension of the camera module so that the camera module is suitable for being applied to electronic devices pursuing lightness and thinness.

Refer to FIG. 48, FIG. 49, and FIG. 50 for a schematic diagram of a manufacturing step of the camera module of the present invention. FIG. 48 shows a specific example of a step in which the camera module of the present creation is manufactured, in which the photosensitive element 21E is mounted on the circuit board 22E, and the photosensitive element 21E is formed by a gold wire The process is connected to the circuit board 22E, and the blocking element 800E is arranged on the outer peripheral side of the photosensitive area of the photosensitive element 21E.

Optionally, in other specific examples of the camera module, the photosensitive element 21E and the circuit board 22E may be conductively connected to each other by means of pad welding. The method of conducting the photosensitive element 21E and the circuit board 22E through gold wire is only a specific example.

In addition, the photosensitive element 21E may be connected to the circuit board 22E first, and then the blocking element 800E may be disposed on the photosensitive element 21E, or the blocking element 800E may be disposed on the photosensitive element 21E first. Then, the photosensitive element 21E is electrically connected to the circuit board 22E.

For example, in a specific example of this creation, after the photosensitive element 21E is electrically connected to the circuit board 22E, the outer edge of the photosensitive element 21E is painted or sprayed. The glue is arranged in a manner, and the glue is cured to form the barrier element 800E. It is worth mentioning that since the glue is directly applied to the photosensitive element 21E by painting or spraying glue, the blocking element 800E formed after the glue is cured protrudes from the photosensitive element 21E. Those skilled in the art can understand that when the glue is set on the outer edge of the photosensitive element 21E by painting or spraying glue, it is necessary to ensure that the glue has a certain height and also to prevent the glue. It flows to the photosensitive area of the photosensitive element 21E to ensure that the photosensitive area of the photosensitive element 21E is not contaminated by the glue.

Further, when the glue is set on the outer edge of the photosensitive element 21E by painting or spraying, the glue can be cured on the photosensitive element by baking or UV light (ultraviolet light) irradiation. The blocking element 800E is formed on 21E. Nevertheless, those skilled in the art can understand that the glue can also be cured in other ways or cured under natural conditions. Therefore, baking or UV light can accelerate the curing process of the glue, and not It is not the only condition for curing the glue. It is worth mentioning that when the glue is cured, it may not be sticky, but in some embodiments, it can also be further sticky, so as to adhere to dust, thereby reducing the stains and black spots of the camera module. .

FIG. 49 shows a specific example of another step in the manufacturing process of the camera module of the present creation, in which the circuit board 22E, the photosensitive element 21E, and the blocking element 800E are placed in a molding mold 100E And pressure is applied by an upper mold 101E of the forming mold 100E. It is understandable that because the blocking element 800E protrudes from the photosensitive element 21E, the pressing surface 1011E of the upper mold 101E of the forming mold 100E can only contact the blocking element 800E to avoid the molding. The pressing surface 1011E of the upper mold 101E of the mold 100E and the photosensitive element 21E are straight Contact, so as to ensure that the photosensitive element 21E is not damaged by the pressure provided by the pressing surface 1011E of the upper mold 101E of the forming mold 100E.

It is worth mentioning that the barrier element 800E formed by the curing of the glue has elasticity, so that when the photosensitive element 21E and the circuit board 22E are mounted tilted, the barrier element 800E can resist Make compensation. In other words, the blocking element 800E can be deformed to isolate the photosensitive area of the photosensitive element 21E from the external environment, that is, to achieve relative sealing to prevent fluid material from flowing to the photosensitive area of the photosensitive element 21E during molding.

FIG. 50 shows the steps of forming the integrated package bracket 400E in the manufacturing process of the camera module, wherein the molding material is filled into the molding mold 100E, such as injection molding or dusting and heating A fluid material is formed, and then after the molding material is cured to form the integrated packaging bracket 400E, the integrated packaging bracket 400E wraps the non-photosensitive area of the circuit board 22E and the photosensitive element 21E to make the integrated The packaging bracket 400E, the circuit board 22E, and the photosensitive element 21E are integrated. Those skilled in the art can understand that the structure shown in FIG. 50 is a semi-finished product of the camera module formed after demolding.

It is understandable that the integrated packaging bracket 400E may also wrap the outer peripheral surface 801E of the blocking element 800E, so that the integrated packaging bracket 400E, the circuit board 22E, the blocking element 800E and the photosensitive element 21E Integrated.

It is understandable that since the blocking element 800E isolates the photosensitive area of the photosensitive element 21E from the external environment, the molding material added to the molding die 100E will not flow to the photosensitive area of the photosensitive element 21E. In addition, due to the blocking of the blocking element 800E, the molding material used to form the integrated package holder 400E will not flow from the non-photosensitive area of the photosensitive element 21E to the photosensitive area, so as to avoid being placed on the integrated package holder 400E. The feeling towards the photosensitive element 21E "Flashing" occurs on one side of the light area to ensure the imaging quality of the camera module and improve the product yield of the camera module.

It is worth mentioning that the integrated packaging bracket 400E, the circuit board 22E and the photosensitive element 21E are integrated, so that the integrated packaging bracket 400E can increase the strength of the circuit board 22E. In addition, the flatness of the photosensitive element 21E is no longer limited by the flatness of the circuit board 22E, but the flatness of the photosensitive element 21E is maintained by the integrated packaging bracket 400E, so that the circuit board 22E A flexible circuit board with a thinner thickness can be selected. In this way, the height of the camera module can be further reduced, so that the camera module is suitable for the thinner and lighter electronic equipment.

It is worth mentioning that the camera module of the present creation further includes a set of container blocking members 90E, wherein the container blocking members 90E are mounted on the circuit board 22E, and the molding material automatically flows into and fills the phase. Between adjacent to the container member 90E, the integrated packaging bracket 400E formed by curing the molding material wraps the container member 90E. In this way, the integrated packaging bracket 400E can not only isolate the The container member 90E and the photosensitive element 21E can overlap each other in space with the integrated packaging bracket 400E and the container member 90E, thereby helping to reduce the height and length dimensions of the camera module. It is understandable that the blocking container 90E is equivalent to the electronic component 26 of the camera module shown above in the present invention.

The molding material is an insulating material. For example, the molding material may be resin or plastic. The integrated package support 400E formed of these materials not only has good strength and insulation, but also has good heat dissipation. The ability to conduct heat generated by the photosensitive element 21E during operation. Those skilled in the art can understand that this feature of the integrated package bracket 400E is important for the camera that is implemented as an array camera module. The improvement of module performance is particularly effective.

It is worth mentioning that the barrier element 800E formed by the glue can also be viscous during curing, so as to be used to bond contaminants such as dust generated during the manufacturing process of the camera module to prevent Contaminants such as dust contaminate the photosensitive area of the photosensitive element 21E, so as to improve the imaging quality of the camera module by preventing the camera module from staining spots and the like.

Later, the optical lens 10E is arranged on the light-sensing path of the light-sensing element 21E to form the camera module. When the camera module is used, the light reflected by the object enters the camera module from the optical lens 10E, is filtered by the filter element 40E, and is received by the photosensitive element 21E and photoelectrically converted to Generate images related to the object.

In a specific example of the camera module created by the present invention, the optical lens 10E is held in the lens support body 500E by the lens support body 500E that is set in the integrated package bracket 400E or is integrally formed with the integrated package bracket 400E. The photosensitive path of the photosensitive element 21E. In another specific example of the camera module created by the present invention, the optical lens 10E is held in the light-sensing path of the light-sensing element 21E by the voice coil motor 30E provided in the integrated package bracket 400E.

Refer to FIG. 51, FIG. 52, and FIG. 53 for schematic diagrams of another manufacturing step of the camera module created by the present invention. FIG. 51 shows a specific example of a step in which the camera module is manufactured, in which the photosensitive element 21E is mounted on and electrically connected to the circuit board 22E, and the filter element 40E is overlapped. Is arranged on the photosensitive element 21E so that the inner area of the filter element 40E corresponds to the photosensitive area of the photosensitive element 21E and the outer area of the filter element 40E corresponds to the non-sensitive area of the photosensitive element 21E area. Glue is provided on the filter element 40E by painting or spraying glue to form the blocking element 800E after the glue is cured.

52 shows a specific example of another step of the manufacturing process of the camera module, wherein the circuit board 22E, the photosensitive element 21E, the filter element 40E and the barrier The element 800E is placed in the forming mold 100E, and is pressed by the pressing surface 1011E of the upper mold 101E of the forming mold 100E. It is understandable that because the blocking element 800E protrudes from the filter element 40E, the pressing surface 1011E of the upper mold 101E of the forming mold 100E can only be in contact with the blocking element 800E. The pressing surface 1011E of the upper mold 101E of the forming mold 100E is in contact with the filter element 40E, so as to ensure that the filter element 40E is not affected by the upper mold 101E of the forming mold 100E. The pressure provided by the pressing surface 1011E is damaged.

It is worth mentioning that the barrier element 800E formed by curing the glue has elasticity, so that when the photosensitive element 21E and the circuit board 22E are mounted tilted, the barrier element 800E can compensate for it . In other words, the blocking element 800E isolates the inner area of the filter element 40E from other components, thereby preventing the fluid molding material from flowing to the inner area of the filter element 40E.

FIG. 53 shows the steps of forming the integrated package holder 400E during the manufacturing process of the camera module, wherein the molding material is added to the molding die 100E to form the molding material after curing After the integrated packaging bracket 400E, the integrated packaging bracket 400E wraps the circuit board 22E and the outer area of the filter element 40E, so that the integrated packaging bracket 400E, the filter element 40E, and the photosensitive The element 21E and the circuit board 22E are integrally combined.

It is understandable that since the blocking element 800E isolates the inner area and the outer area of the filter element 40E, the molding material added to the molding die 100E will not flow into the filter element 40E. Area to avoid "flash" on the side of the integrated packaging bracket 400E facing the inner area of the filter element 40E, so as to ensure the imaging quality of the camera module and improve the performance of the camera module Product yield.

Figure 54 and Figure 55 are schematic diagrams of another manufacturing step of this creation. 54 shows that the photosensitive element 21E of the camera module is connected to the circuit board 22E, and the blocking element 800E is disposed on the photosensitive element 21E to distinguish the photosensitive area and the non-sensitive area of the photosensitive element 21E . After the circuit board 22E, the photosensitive element 21E, and the blocking element 800E are placed in the forming mold 100E, they are set on the pressing surface 1011E of the upper mold 101E of the forming mold 100E A cover film 104E interacts with the barrier element 800E. In other words, the cover film 104E is in contact with the blocking element 800E to prevent the pressing surface 1011E of the upper mold 101E of the forming mold 100E from directly pressing the photosensitive element 21E.

It is worth mentioning that although FIG. 54 shows an example in which the photosensitive element 21E of the present creation is provided with the blocking element 800E and the blocking element 800E interacts with the cover film 104E, that is, The pressing surface 1011E of the upper mold 101E of the forming mold 100E is provided with the cover film 104E, on the one hand, the difficulty of demolding is reduced, and on the other hand, the cover film 104E and the barrier element 800E can be used Bonding and cushioning effect, enhance the sealing performance.

FIG. 55 shows the steps after the formation of the integrated package bracket 400E in the manufacturing process of the camera module, in which the molding material is added to the molding mold 100E, so that the molding mold 100E is After curing, the integrated packaging bracket 400E is formed, wherein the integrated packaging bracket 400E wraps the non-photosensitive area of the circuit board 22E and the photosensitive element 21E and the blocking element 800E, so that the integrated package bracket 400E, the photosensitive element 21E and the circuit board 22E are integrated.

As shown in FIG. 56, the forming mold 100E forms an inner groove 105 in the photosensitive area corresponding to the photosensitive element 21E, so that the photosensitive element 21E and the upper mold 101E of the forming mold 100E The pressing surface 1011E has a safety gap, thereby further reducing the impact on the photosensitive element 21E and preventing damage and scratches. It is understandable that this solution can also further describe the solution in the embodiment of FIGS. 54 and 55, that is, the pressing surface 1011E of the upper mold 101E of the forming mold 100E in this embodiment can also be further described The cover film 104E is provided.

Those skilled in the art should understand that the above description and the embodiments of the present creation shown in the drawings are only examples and do not limit the present creation.

The purpose of this creation has been completely and effectively achieved. The function and structure principle of this creation have been shown and explained in the embodiments. Without departing from the principle, the implementation of this creation can have any deformation or modification.

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Document	Office	Kind	Date
2016101834476	China	–	2016-03-28
2016202466316	China	–	2016-03-28
201610183447	China	A	2016-03-28
201620246631	China	U	2016-03-28
2016102780350	China	–	2016-04-28
201620373323X	China	–	2016-04-28
201610278035	China	A	2016-04-28
201620373323	China	U	2016-04-28
2016106688071	China	–	2016-08-12
2016208753831	China	–	2016-08-12
2016208753812	China	–	2016-08-12
2016106692147	China	–	2016-08-12
2016208760568	China	–	2016-08-12
2016208757813	China	–	2016-08-12
201610668807	China	A	2016-08-12
201620875383	China	U	2016-08-12
201620875381	China	U	2016-08-12
201610669214	China	A	2016-08-12
201620876056	China	U	2016-08-12
201620875781	China	U	2016-08-12

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CN206294241U	China	U	2017-06-30
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TW201734622A	Taiwan Province of China	A	2017-10-01
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TW201738645A	Taiwan Province of China	A	2017-11-01
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US2018109709A1	United States of America	A1	2018-04-19
CN107957649A	China	A	2018-04-24

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Photographing module and its molded photosensitive component and electronic equipment

Abstract

Term

Priority claims20

Members307

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