Thermal module

Thermal module

THERMAL MODULE

The embodiments described herein are generally directed to compact computing systems. More specifically, the present creative embodiment relates to mechanical and thermal structures that help increase the thermal efficiency of a compact computing system.

For users of compact computing systems, the appearance of a compact computing system , including its design and its weight, is important because it helps the user's overall impression of the sophisticated computing system. At the same time, the assembly of a compact computing system is important to the user, as the durable assembly will help to extend the overall life of the compact computing system and will increase its value to the user.

One design challenge associated with the fabrication of compact computing systems is the emission of heat from delicate computing systems. This design challenge is generally caused by several conflicting design goals, including the need to make the outer casing or outer casing lighter and thinner, to make the casing stronger, to make the casing aesthetically pleasing, and other possibilities. aims. Unfortunately, enclosures or enclosures with small exterior dimensions tend to have less surface area that heat can be dissipated to dissipate via convection or radiation. Moreover, even if an outer casing having a smaller outer size is required, it is generally considered that the performance reduction is unacceptable.

This application describes various embodiments of systems and methods for dissipating heat from a lightweight computing system that is lightweight and durable in a cylindrical cross section.

A thermal management system for a desktop computer having a An outer casing enclosing an inner volume symmetrical about the longitudinal axis, the thermal management system comprising: a heat sink disposed within the inner volume and including defining and at least partially enclosing a central thermal region a plurality of flat faces having a cross section perpendicular to the longitudinal axis; and a blower that passes air through at least the central heat zone.

A thermal management system for removing heat from a desktop computer, the desktop computer including a housing having a longitudinal axis and at least partially defining and enclosing an interior volume symmetrical about the longitudinal axis, The thermal management system includes a heat sink positioned within the interior volume. The heat sink includes a plurality of flat faces defining a central airflow region having a cross section in a polygonal shape perpendicular to the longitudinal axis. At least one of the plurality of flat faces includes: an inner surface integrally formed with a cooling fin extending from the inner surface and spanning the central airflow region to the plurality of flat faces An inner surface of at least one of the other; and an outer surface configured to carry one of the operational components in thermal contact with the heat sink.

A heat removal system for an arithmetic device enclosed in a cylindrical housing, the heat removal system comprising: a plurality of vents configured to span one of the plurality of vents Receiving an incoming airflow with a pressure differential and directing the incoming airflow along a longitudinal axis of the cylindrical outer casing, wherein the plurality of venting holes are disposed at a first end of the cylindrical outer casing; a baffle configuration, the placement thereof Between the plurality of venting holes and the longitudinal axis of the cylindrical outer casing, the baffle configuration is configured to bifurcate the incoming airflow into a central airflow and a peripheral airflow, the central airflow being directed toward the computing device a central portion and the peripheral airflow is directed toward a peripheral portion of the computing device; and an exhaust system disposed at a second end of the cylindrical outer casing opposite the first end, the exhaust system The central airflow is configured to receive and combine the ambient airflow and the combined airflow is exhausted through the opening in the cylindrical outer casing at the second end.

A method for removing heat generated by an arithmetic component, the computing component Arranging in an air passage defined by an outer casing, the outer casing having a first opening at a first end and a second opening at a second end opposite the first end The method is performed by extracting an incoming airflow into the air passage at the first opening by a blower located near the second opening; splitting the incoming airflow into the air passage a central airflow of a central portion and a peripheral airflow passing through a peripheral portion of the air passage separated from the central portion of the air passage, wherein the computing component transfers at least some of the heat to the central airflow and the periphery a flow of air; the central airflow and the ambient airflow are combined into a discharge airflow by the blower; and the heat is removed from the outer casing by moving the exhaust airflow through the second opening.

A thermal management system for a cylindrical desktop computer includes at least one exhaust assembly adapted to cool the cylindrical desktop computer. The exhaust assembly includes an impeller including: a hub; a plurality of blades projecting radially from the hub, wherein adjacent ones of the plurality of blades are disposed at an irregular angular interval around the hub; A support ring integrally formed along a bottom surface of a rear edge portion of each of the plurality of blades, the support ring being operable to provide at least structural support for the plurality of blades. The thermal management system also includes a plurality of stator vanes configured to inhibit the formation of a radial component in the exhaust gas stream.

A thermal management system for use in a desktop computer includes: an impeller including a plurality of blades; and an exhaust grille surrounding the impeller and including a plurality of venting holes through which an exhaust airflow passes The plurality of vents are removed from the desktop. The plurality of exhaust vents includes: a plurality of ribs configured to cooperate with the plurality of blades to increase an axial component of the exhaust stream; and a plurality of stators configured to remove The all-directional component of the air passing through the exhaust grill.

A heat sink for removing heat from a desktop computer, the desktop computer including a longitudinal axis and at least partially defining an internal volume symmetrical about the longitudinal axis An outer casing and an arithmetic engine positioned within the inner volume, the operational engine having an arithmetic component, the heat sink including a plurality of flat faces defining a central thermal region, the central thermal region having a substantially perpendicular to the longitudinal axis One of the cross sections.

A compact computing system includes: a housing having a longitudinal axis and enclosing and defining an internal volume symmetrical about the longitudinal axis; a heat sink enclosing at least a central thermal region having a central thermal region a cross-section of one of the polygons and substantially perpendicular to the longitudinal axis; a blower configured to direct air through the interior volume and including a central airflow through the central thermal zone; and an operation An assembly disposed within the interior volume and supported by the heat sink and in thermal contact with the heat sink.

A combined thermal module (CTM) for fastening an integrated circuit (IC) to an electrical connector disposed on a first surface of a printed circuit board (PCB) and maintaining the IC in an a heat transfer assembly in thermal contact, the CTM comprising: a stiffener disposed on a second surface of the PCB; a retaining mechanism at least a portion of which is disposed on the stiffener, the retaining mechanism configured to provide a first holding force and a second holding force; a first fastening member for fastening the IC to the reinforcing plate and the holding mechanism, wherein the holding mechanism makes the first holding force uniform across the reinforcing plate Ground distribution, the first fastener maintains the IC in uniform electrical contact with the electrical contacts in the electrical connector; and a second fastener for securing the heat removal assembly to the retention mechanism, The second fastener maintains the IC in uniform thermal contact with the heat transfer assembly.

A thermal management system for a cylindrical desktop computer having a cylindrical outer casing enclosing a cylindrical volume having a longitudinal axis, the cylindrical outer casing having a first end a first opening having a first cross section and a second opening having a second cross section at a second end opposite the first end, the thermal management system comprising: a heat sink Disposed within the cylindrical volume and comprising a plurality of flat faces defining and enclosing a central thermal region having a triangular cross section; and a blower located adjacent the second opening, the blower having no diameter Component Air passes at least through the central hot zone.

A thermal module (TM) for fastening an integrated circuit (IC) to an electrical connector disposed on a first surface of a printed circuit board (PCB) and maintaining the IC with The heat transfer assembly is in thermal contact, the TM comprising: a holding mechanism configured to provide a first holding force and a second holding force; a first fastener for fastening the IC to the holding a mechanism, wherein the holding mechanism uniformly distributes the first holding force across the IC, the first fastener maintaining the IC in uniform electrical contact with the electrical contacts in the electrical connector; and a second fastener, It is used to secure the heat removal assembly to the retention mechanism and maintain the IC in uniform thermal contact with the heat transfer assembly.

A desktop computing system includes: a housing at least partially enclosing and defining an interior volume symmetrical about an axis; an air passageway within the interior volume extending along a full length of the housing; and an operation An engine disposed within the air passage and including at least one operational component.

Other devices, methods, features, and advantages of the present invention will be apparent or become apparent to those skilled in the <RTIgt; All such additional systems, methods, features, and advantages are intended to be included within the scope of the present invention and are protected by the scope of the accompanying claims.

<p>100Compact computing system</p><p>102Shell</p><p>104First opening</p><p>106second opening</p><p>108 discharge lip</p><p>110Parts</p><p>112 Section</p><p>114Exhaust airflow</p><p>116Base unit</p><p>118Lower conductive gasket</p><p>120Upper conductive gasket</p><p>122ventilation holes</p><p>124Into the airflow</p><p>200Compact computing system</p><p>202Shell</p><p>204 openings</p><p>206Interface panel</p><p>208Audio Socketport</p><p>210Informationport</p><p>212Informationport</p><p>214Informationport</p><p>216Informationport</p><p>218Informationport</p><p>220Power up/down button</p><p>222Power inputport</p><p>224 Shell interlocking opening</p><p>226Shell interlocking device</p><p>300 center core</p><p>302 memory module</p><p>304Substrate</p><p>306 memory device</p><p>310 main axis</p><p>312Peripheral airflow</p><p>314 center airflow</p><p>316 impeller</p><p>318Exhaust vents</p><p>320Blowers</p><p>322Exhaust assembly</p><p>324ventilation holes</p><p>326Decorative protective cover</p><p>328 touch points</p><p>402 Heat sink</p><p>403flat surface</p><p>404Steam chamber</p><p>405 center volume</p><p>406Central Processing Unit (CPU) riser</p><p>407Slow fins</p><p>408 Attachment</p><p>410Central Processing Unit (CPU) Spring</p><p>412Graphic Processing Unit (GPU) riser</p><p>414Graphic Processing Unit (GPU) riser</p><p>416Graphic Processing Unit (GPU)</p><p>418Video Random Access Memory (VRAM) Wafer</p><p>420Solid Disk Drive (SSD) Module</p><p>422Main Logic Board (MLB)</p><p>424 card edge connector</p><p>426 card edge slot</p><p>428Flexed crossover connector</p><p>430Input/Output (I/O) Assembly</p><p>432Power Supply Unit (PSU)</p><p>434Airflow perforation</p><p>436Input/Output (I/O) Board</p><p>438Structural wall</p><p>440Exhaust assembly</p><p>442Inflatable board</p><p>502 ribs</p><p>504Flexing jumper cable</p><p>602 Cooling fins</p><p>602-1Center cooling fins</p><p>602-2First cooling fin</p><p>602-3Second cooling fins</p><p>604First flat surface</p><p>605Second flat surface</p><p>606Low profile thermal module</p><p>607 Triangle center volume</p><p>608Central Processing Unit (CPU)</p><p>609 third flat surface</p><p>610Communication end</p><p>611 fasteners</p><p>614Graphical Processing Unit (GPU)</p><p>616Graphic Processing Unit (GPU)</p><p>618 fasteners</p><p>619fasteners</p><p>620Graphic Processing Unit (GPU) Spring</p><p>622 reinforcements</p><p>624Connector column</p><p>626Input/Output (I/O) inlay</p><p>630Graphic Processing Unit (GPU) airflow zone</p><p>632Graphic Processing Unit (GPU) Airflow Zone</p><p>634Airflow zone</p><p>636Airflow zone</p><p>638Airflow zone</p><p>640Airflow zone</p><p>702DC (DC) input device</p><p>704Power adjustment module</p><p>706 capacitor</p><p>710Central processing unit (CPU) spring ferrule</p><p>712Central processing unit (CPU) spring ferrule</p><p>714fasteners</p><p>716fasteners</p><p>718 reinforcements</p><p>802 thickness</p><p>902 Impeller blades/fan blades</p><p>904 Wheels</p><p>906stator</p><p>1002 stator blades</p><p>1102Fan motor</p><p>1104Wave introduction area</p><p>1106 ribs</p><p>1108Support ring</p><p>1200Rack configuration</p><p>1202 Data Connector</p><p>1300Methods for cooling compact computing systems</p><p>1400Program for removing heat from a desktop computer</p><p>1500 computing system</p><p>1501 Input device</p><p>1502 processor</p><p>1504File System</p><p>1506Cache memory</p><p>1508 Random Access Memory (RAM)</p><p>1510Reading Memory (ROM)</p><p>1512data link</p><p>1514" interface</p><p>1516Sensor</p><p>a₁distance</p><p>a₂distance</p><p>d₁diameter</p><p>d₂diameter</p><p>L length</p><p>r_i inner radius</p><p>r_oouter radius</p><p>Tthickness</p><p>WWidth</p><p>IFirst District</p><p>IISecond District</p><p><img file="TWM504351U_D0001.tif" he="59" img-content="character" img-format="tif" inline="no" orientation="portrait" wi="28" />1 first angle</p><p><img file="TWM504351U_D0002.tif" he="58" img-content="character" img-format="tif" inline="no" orientation="portrait" wi="32" />2second angle</p>

The drawings are included for purposes of illustration and are merely illustrative of the possible structures and configurations of the disclosed authoring apparatus and method for providing a compact computing system. These drawings are in no way intended to limit any changes in the form and details of the present invention by those skilled in the art without departing from the spirit and scope of the invention. Embodiments will be readily understood by the following detailed description of the drawings, wherein like referenced

1 shows a perspective view of an embodiment of a compact computing system in an independent and vertically configured configuration.

2 shows another perspective view of an embodiment of the compact computing system of FIG. 1 showing an input/output panel.

Figure 3 shows a perspective view of the general system layout of the compact computing system (removing the housing) of Figure 1.

4 shows an exploded view of a compact computing system in accordance with the described embodiments.

Figure 5 shows a partial cross-sectional view of the air inlet of the compact computing system.

Figure 6A shows a cross-sectional top view of a fin stack of a compact computing system.

Figure 6B shows a cross-sectional top view of a fin stack of a compact computing system.

6C-6D show a cross-sectional top view of a compact computing system and a region of airflow through which cooling air can pass.

Figure 7A shows a side view of one of the GPU risers and how airflow can be distributed across it.

Figure 7B shows a side view of the CPU riser and, in particular, the features of the CPU spring.

Figure 8 shows a partial cross-sectional side view of how the cooling air is exhausted from the compact computing system.

9A-9B show a blade configuration of an impeller in accordance with the described embodiments.

10A-10B show a blade of an impeller configured with curved stator blades.

11A-11B show cross-sectional side and bottom views of an exhaust assembly in accordance with the described embodiments.

Figure 12A shows a rack configuration suitable for supporting several compact computing systems.

Figures 12B-12C show various other rack configurations suitable for supporting several compact computing systems.

Figure 13 is a block diagram illustrating a method for cooling a compact computing system.

Figure 14 is a flow chart detailing the procedure in accordance with the described embodiments.

Figure 15 is a block diagram of a representative computing system.

Representative applications of the devices and methods in accordance with the presently described embodiments are provided in this section. These examples are provided to add only context and to aid in understanding the described embodiments. It will be apparent to those skilled in the art that the presently described embodiments may be practiced without some or all of the specific details. In other instances, well-known program steps have not been described in detail in order to avoid unnecessarily obscuring the presently described embodiments. Other applications are possible so that the following examples should not be considered limiting.

The following is a compact computing system that can be configured for stand-alone units (also known as desktop computers) that are placed on or under a desk or other work area. A compact computing system can also be configured as part of a group of computers that are network connected or otherwise interconnected. In any case, a compact computing system may include several electronic components (including at least one central processing unit (CPU) and graphics processing unit (GPU)), as well as other primary and secondary components, such as solid state memory devices, wireless components. Wait. One or more internal electronic component boards may be shaped to match the surface of the outer casing of the compact computing system, including, for example, a circular shape that matches the top or bottom of the cylinder, or that matches the curved outer surface of the outer casing The curved shape of the arc segment. In a representative embodiment as described herein, a compact computing system can be cylindrical in shape and can be configured to configure a plurality of rectangular electronic components to provide characterization to have a high component packing density (per available volume) The number of components is the central core of the apparent size. The resulting compact computing device provides high computing power density in a small, lightweight, transportable form factor. In some embodiments, the compact computing device can also be coupled to other compact computing devices to form a server computer system (such as in a data farm (data) Farm) or a multi-computer system used as a network computing system for each delicate computing device as a node (or nodes). For example, in the embodiments described herein, the compact computing system can be cylindrical and configured in a manner such that the rectangular electronic components can be assembled to have a high component packing density (per available volume) The number of components is the central core of the apparent size. The center core can also have the same shape as the outer casing In the shape of a cylinder, the outer casing has an annular cylindrical shape along the pipeline. The thermal management system can utilize a blower that can effectively and quietly pass a large amount of air available to cool the center core axially through the interior volume defined by the cylindrical outer casing. In general, a blower can provide approximately 15 to 20 cubic feet (CFM) of air per minute when the major components such as a central processing unit (CPU) and/or graphics processing unit (GPU) are not utilized in large quantities. However, as processing demands increase, the blower can compensate for any increase in heat generated by ramping up the airflow. For example, in response to an increase in demand for processing resources from either or both of the CPU and/or GPU, the blower increases the airflow from about 15 CFM to 20 CFM to about 25 CFM to 30 CFM (at about 25 ° C) The temperature is acoustically output is about 35 dbA (it should be noted that these acoustic levels are experienced only when the blower is performing during the high demand period rather than during the higher end of its operating range during normal operation). It should be noted that at higher ambient temperatures (35 ° C), the blower may even ramp up the airflow to compensate for the reduced heat transfer at higher ambient temperatures. In this case, the blower can ramp the airflow to above about 35 CFM to 40 CFM or above 40 CFM, which has a higher acoustic output of 40 dBA or more.

The blower can occupy a large number of available cross-sections defined by the outer casing to provide axial flow through the outer portion of the outer casing including the central portion of the central core that is substantially free of radial airflow components, the central core including fins. In addition, the axial alignment of the amount of surface area that is in thermal contact with the axial airflow can be maximized to align the components that make up the central core. In addition, the design and layout of the components can be axial in nature, further enhancing the available heat transfer capability and component packing density, resulting in higher computing power densities (operating operands per available volume). For example, an integrated circuit can be designed to have a power input node at a first end of the integrated circuit and a data I/O at an opposite end of the integrated circuit.

A compact computing system can also be coupled to other sophisticated computing systems to form a network that can be used as a server computer system (such as in a data farm) or as a node (or nodes) for each delicate computing system. Multi-computer system for road computing systems. Compact computing system One of the advantages of the compact size and shape is the use of a simple racking system (lined along the wine rack configuration) to locate multiple connected compact computing systems. For example, individual fine-grained computing systems can be placed in an rack configuration at an angle to provide a connection to other devices without restricting airflow into or out of the compact computing system. The input device and the output device are easily connected. In some cases, individual compact computing systems may be stacked without or without limiting the alternate configuration of intake or exhaust. These and other general topics are set forth in greater detail below.

In a particular embodiment, the compact computing system can include a housing that can surround and protect the center core. The outer casing can be easily removed for maintenance or other proximity. The outer casing may be formed of aluminum having an alumina (alumina) layer that protects the outer casing and promotes radiant cooling. The alumina/anodized layer also improves heat dissipation from the outer surface of the outer casing by increasing its infrared radiation emissivity. Aluminum has several properties that make it a good choice for the outer casing. For example, aluminum is a good electrical conductor that provides good electrical grounding, and it can be easily machined and has well-known metallurgical properties. The superior electrical conductivity of aluminum provides good chassis grounding for internal electrical components that are configured to fit and operate within the housing. The aluminum housing also provides good electromagnetic interference (EMI) shielding to protect sensitive electronic components from external electromagnetic energy and to reduce electromagnetic (EM) energy leakage from delicate operating systems. In a process called anodization, an aluminum oxide layer can be formed on the surface of aluminum. In some cases, the aluminum oxide layer can be dyed or otherwise dip colored to exhibit one or more specific colors. It should be noted that since alumina is a good electrical insulator, the interior surface of the outer casing is shielded during the anodizing process to maintain a close proximity to the bulk material, or a selected portion of the aluminum oxide layer is removed to provide good electrical contact.

In one embodiment, the cylindrical outer casing may be in the form of a one-piece outer casing (single). In this way, the cylindrical outer casing appears to be seamless and homogeneous. In the case of two dimensions (2D), the cylindrical shape of the outer casing maximizes the ratio of volume to the surface area of the casing. However, in the three dimensional case, the spherical shape maximizes the ratio of the internal volume to the surface area of the casing. In the context of this discussion In this case, the cylinder can be considered to be more useful, however, a sphere or any other shape for the substance can still be considered as an alternative. In one embodiment, the cylindrical outer casing is formed from a single blank that is surface treated (anodized) to provide an aesthetically pleasing appearance of a strong and resilient material, such as aluminum. The top portion of the cylindrical outer casing is formed as a lip for engaging a circumferential portion of the air flow traveling from the first opening to the second opening in the axial direction, and the air flow is transmitted to the external environment at the second opening. It is also possible to use, for example, a hand to transport a delicate computing system using a lip.

In a particular embodiment, a compact computing system can be assembled using a bottom-up assembly method. The initial assembly operation can include installing a vapor chamber on each side of the triangular center core structure. In some embodiments, the triangular center core structure can be a right triangle center core structure or an isosceles right triangle center core structure. In the depicted embodiment, the vapor chamber can be in the form of a two phase (gas phase/solid phase) heat spreader. In a particular implementation, the core can be in the form of an aluminum frame that is fastened to the clamp and supported within the clamp. High power components, such as a graphics processing unit (GPU) and/or a central processing unit (CPU), can be directly mounted to the vapor chamber.

Good thermal contact between the vapor chamber and the high power components can be achieved using a thermally conductive adhesive, slurry or other suitable mechanism. The main logic board (MLB) can be pressed against the CPU edge connector, followed by the GPU flexure. Once the MLB has been placed and connected to the CPU and GPU, a memory module can be installed, after which the inlet assembly can be mounted using a fastener and coupled to the core structure. An independently assembled and pre-tested input/output (I/O) assembly can be installed, after which the power supply unit (PSU) control cable can be connected to the MLB, and then the DC PSU power supply can be connected using a bus bar system. A discharge assembly can be installed and the RF antenna flexure is then attached to the I/O board.

As mentioned above, the outer casing can take many forms, however, for the remainder of this discussion and without loss of generality, the outer casing is cylindrical in shape that encloses and defines a cylindrical volume. In the described embodiment, the outer casing and the corresponding cylindrical volume may be defined in terms of a straight cylinder, The straight cylinder has a longitudinal axis that can be used to define the height of the straight cylinder. The outer casing can also be characterized as having a circular cross-section with a center point on the longitudinal axis. The circular cross section may have a radius extending from a center point and perpendicular to the longitudinal axis. In one embodiment, the thickness of the outer casing may be defined by the relationship between the inner radius (extending from the center point to the inner surface of the outer casing) and the outer radius (extending from the center point to the outer surface of the outer casing). The outer casing may have a thickness that is adjusted to facilitate secondary and axial conduction that assists in dissipating heat in the outer casing thereby inhibiting the formation of hot spots. The separation between the center core and the outer casing allows the inner peripheral airflow to cool the outer casing, thereby helping to minimize the touch temperature of the outer casing. In one embodiment, the housing can be mated with a (releasable) base unit that partially provides a pedestal for supporting a compact computing system on a surface. The outer casing may include a first opening having a size and shape according to the base unit. The first opening can be a full perimeter air inlet, and the circular design of the opening can still be functional even where the compact computing system is located at a corner or against a wall. In an assembled configuration, the base unit corresponds to the base of the cylinder. The first opening can be used to receive airflow from the external environment through the venting holes in the base unit. The amount of air flowing into the outer casing is related to a pressure difference between an external environment generated by the blower assembly adjacent the second opening and the interior of the compact computing system, the second opening being axially disposed away from the first opening . The thermal management system can utilize a blower that can effectively and quietly pass a large amount of air available to cool the center core axially through the interior volume defined by the cylindrical outer casing.

In an embodiment, the exhaust assembly may be in the form of a fan assembly. The fan assembly can be an axial fan assembly configured to axially pass air through the outer casing by creating a pressure differential as mentioned above. The fan assembly can also be configured as a hybrid air fan assembly that provides both axial and centrifugal components as the air exits the fan assembly. In one embodiment, the fan assembly can occupy a substantial portion of the available cross-sectional area of the cylindrical outer casing. For example, the fan assembly can occupy at least 85% or about 85% of the available cross-sectional area of the interior of the enclosure. In any case, air can enter the venting holes through the base unit. In one embodiment, the baffle configuration may bifurcate (split) the airflow in a manner such that some of the airflow remains in Within the heart string, it is separated from the surrounding airflow that is positioned away from the center string. The central column of air can thermally engage the heat sink structure, which can be mounted with internal components. To optimize heat transfer, the components are configurable and axially (in the direction of the airflow) to maximize the amount of air that snaps into the assembly. In this way, both the center stream and the peripheral stream can be used to cool the center core while still maintaining the outer casing at an acceptable temperature.

The outer casing can include a discharge lip at the second opening. The discharge lip can be configured to bite a portion of the air as it exits the second opening, thereby having the effect of directing airflow (and sound) away from the user. The discharge lip can also provide an integrated handle structure suitable for grasping a compact computing system. The outer casing may have an adjusted thickness, which means that the outer casing has a varying thickness, wherein one portion of the outer casing that is closest to the discharge lip is thicker than the portion that is remote from the discharge lip. The thickness of the outer casing can be varied in a manner that promotes axial and circumferential conduction of heat in the outer casing, which promotes a more uniform heat distribution, thereby inhibiting the formation of hot spots in the outer casing.

Good electrical grounding (also known as chassis grounding) can be used to isolate components that emit significant electromagnetic energy, such as a main logic board or MLB, from their circuits that are sensitive to electromagnetic energy, such as wireless circuits. This isolation can be particularly important in compact computing systems because the components that emit electromagnetic energy are in close proximity to their components that are sensitive to electromagnetic energy. In addition, the outer casing can include a conductive material (such as a gasket filled with conductive particles) that can mate with corresponding attachment features on the base unit to complete the formation of a Faraday cage. The Faraday cage blocks electromagnetic energy (both internal and external), effectively shielding the external environment from EMI generated by delicate computing systems (and shielding the internal environment from external EMI). To complete the Faraday cage, the venting holes in the base unit can be sized to effectively block electromagnetic energy having a selected wavelength. More specifically, the wavelength of electromagnetic energy blocked by the vents can be consistent with the wavelength emitted by the active components within the compact computing system.

In one embodiment, a compact computing system can include a sensor configured to detect whether the housing is properly seated and aligned relative to the internal components. Due to the shape of the outer shell And the configuration of both the key functions of the thermal management of the compact computing system and the completion of the Faraday cage discussed above, the proper placement of the outer casing is important. A compact computing system can include a chain system that detects the presence of the housing and its proper alignment with respect to the internal components. Only when proper alignment is detected, the interlock system will allow power to turn on internal components and operate in a manner consistent with system specifications. In one embodiment, the interlocking system can include magnetic elements that can be detected by the Hall effect sensor only when the housing is in place and aligned with respect to the internal components.

At least due to the robust and resilient nature of the material used to form the outer casing; the outer casing may include large openings with spans that do not require additional support structures. This opening can be used to provide a proximity to the input/output panel and power supply. The input/output panel can include, for example, a data cartridge adapted to receive a data cable configured for connection to an external circuit. The opening can also provide a proximity to an audio circuit, a video display circuit, a power input device, and the like. In one embodiment, the selected data illumination can be illuminated to provide an easier proximity for reduced illumination.

These and other embodiments are discussed below with reference to Figures 1-15. However, those skilled in the art will readily appreciate that the detailed description given in the drawings herein is for the purpose of explanation.

FIG. 1 shows a perspective view of a compact computing system 100. The compact computing system 100 can have a shape defined by the outer casing 102. In the depicted embodiment, the outer casing 102 can be cylindrical in shape and characterized as having a diameter d₁The first opening 104. More specifically, the outer casing 102 can be in the form of a straight cylinder having a longitudinal axis extending along a centerline of the central volume enclosed by the outer casing 102. The outer casing 102 can be characterized as having a circular cross-section with a center point that coincides with a corresponding point on the longitudinal axis. The circular cross section has a radius that is perpendicular to the longitudinal axis and extends outward therefrom. Therefore, the thickness of the outer casing 102 (more specifically, the outer casing wall) can be<i>t</i>Defined as the outer radius r associated with the exterior of the outer casing 102_oThe inner radius r associated with the inner surface of the outer casing 102_iThe difference between. In addition, the housing 102 can be packaged a second opening 106 axially disposed away from the first opening 104, the second opening having a diameter d defined in part by the discharge lip 108₂, where d₁At least equal to or greater than d₂. The outer casing 102 may be formed from a single aluminum blank in the form of a disk that may be extruded in some manner to form a discharge lip 108. Thickness of the outer casing 102<i>t</i>Can be adjusted to reduce hot spots. In this regard, the outer casing 102 can have a non-uniform thickness<i>t</i>. In particular, the portion 110 near the discharge lip 108 can have a first thickness of about 4 mm to 6 mm, which thickness then changes to the portion 112 that is associated with the reduction from the first thickness and away from the discharge lip 108. Two thicknesses. In this manner, portion 110 can serve as both an integrated handle structure for grasping delicate computing system 100 and a feature that absorbs and conducts thermal energy transferred from a portion of exhaust airflow 114 that is occluded from discharge lip 108. The formation of localized hot spots in the outer casing 102 can be reduced by radiative and conductive heat transfer and by limiting the amount of heat transferred to the portion 112. Adjustment of the thickness of the outer casing 102 can be accomplished using a metal disk that is then machined to the desired thickness profile using, for example, a squeezing process. The metal disc can be made of aluminum, titanium, and any other metallic material that provides the desired strength, thermal conductivity, and RF isolation. The extrusion process is formed into a cylinder machined in the outer and inner portions to obtain a desired cross-sectional profile and a desired visual appearance from the exterior.

The compact computing system 100 can further include a base unit 116. The base unit 116 can be used to provide support for the compact computing system 100. Thus, the base unit 116 can be formed of a strong and resilient material along the wire that also prevents leakage of EM energy from components within the compact computing system 100 that radiate electromagnetic (EM) energy during operation. The susceptor unit 116 can also be formed of a non-metallic compound that can be rendered electrically conductive using, for example, conductive particles embedded therein. To ensure that any electromagnetic energy emitted by components within the compact computing system 100 is not leaked outward, the lower conductive gasket 118 can be used to complete the Faraday cage formed by the base unit 116 and the outer casing 102. An upper conductive gasket 120 (shown in greater detail in FIG. 3) can be disposed on the interior surface of the outer casing 102 near the lower edge of the portion 110. Use conductive gaskets 118 and 120 to complete the Faraday cage The amount of EMI isolation increases by approximately 20 dB.

The base unit 116 may also include a venting opening 122. The vents 122 can serve a dual purpose because the vents 122 can be configured in the base unit 116 in a manner such that a suitable amount of air from the external environment can flow into the vents 122 in the form of airflow 124. In one embodiment, the incoming airflow 124 may be related to a pressure differential across the vents 122 created by a blower disposed with the compact computing system 100. In one embodiment, a blower can be placed adjacent the second opening 106 to create a suction effect that reduces the pressure within the outer casing 102. In addition to facilitating the entry of the airflow 124, the vents 122 can also be sized to prevent leakage of electromagnetic energy therethrough. The size of the vents 122 can be related to the wavelength corresponding to the electromagnetic energy emitted by the internal components.

2 shows another embodiment of a compact computing system 100 in the form of a compact computing system 200. It should be noted that with respect to the size and shape of the outer casing 102, the compact computing system 200 can be substantially identical or similar to the compact computing system 100. The compact computing system 200 can include a housing 202 that can be different than the housing 102. In this embodiment, the outer casing 202 can include an opening 204 having a size and shape according to the interface panel 206. The interface panel 206 can include various means for communicating data between the compact computing system 200 and various external circuits. For example, interface panel 206 can include an audio jack 208 that can be used to provide audio streaming to external audio circuitry, such as a headset circuit, an audio processor, and the like. The collection of data sets 210 can be used to transfer various forms of data and/or power between the external circuitry and the compact computing system 200. The data cartridge 210 can be used to accommodate data connectors such as USB, Thunderbolt®, and the like. For example, the collection of data port 210 can include data port 212 in the form of a USB port, and the data 214 can be in the form of a Thunderbolt® file. In this manner, the compact computing system 200 can be interconnected to other computing systems, such as data storage devices, portable media players, and video equipment, as well as networks that form computing systems. In addition, the data 216 may be in the form of an Ethernet network suitable for forming communication channels to other computing systems and external circuits, and the data 218 may be used for audio/video (AV). The form of HDMI transmission of data transmission. In this manner, data port 218 can be used to stream high speed video between compact computing system 200 and an external video monitor or other video processing circuit. Thus, the interface panel 206 can be used to form connections to a large number of external computing systems and circuits, which is particularly useful in situations where a large amount of computing resources are required without the high capital cost associated with large computers. In addition, the compact size and shape of the compact computing system 200 is also applicable to space efficient computing networks, data farms, and the like.

The interface panel 206 can be made of a non-conductive material that is used to electrically isolate each of the crucibles from each other and from the housing 202. Thus, the interface panel 206 can include a plastic inlay that is dyed to provide a decorative appearance to the computing system 200. For example, in some embodiments, the interface panel 206 is tinted with black or dark colors. Below the surface of the interface panel 206, a conductive mesh supported by a conductive gasket maintains the outer casing 202 and the upper and lower conductive gaskets (118, 120) at the inner surface of the outer casing 202 for RF and EMI. Insulated Faraday cage. The power up/down button 220 can be readily adapted to accept user touches for initiating a power up sequence (including, for example, a power up procedure) and a power down sequence. The power input port 222 can be sized and shaped to accept a power plug adapted to transfer external power to the operating components within the housing 202. In some cases, the compact computing system 200 can include an internal power resource (such as a battery) that can be charged and recharged according to the power delivered by the power input port 222.

The housing interlocking opening 224 can house an outer casing interlock 226 for securing the outer casing 202 to the internal structure of the compact computing system 200. The housing interlock 226 can be in the form of a slide latch or other such mechanism that can be manually snapped and bitten. In this manner, the outer casing 202 can be easily removed to expose internal components and structures for, for example, maintenance. It should be noted that although not shown, the detection circuitry can be used to detect if the housing 202 is properly seated relative to the internal components and structures. This detection is particularly important since the thermal management of the compact computing system 200 relies to a large extent on the presence and proper placement of the housing 202. Therefore, it is desirable to determine that the outer casing 202 is not properly placed or aligned relative to the internal structure or component, then The detection circuitry will prevent the compact computing system 200 from operating, or at least prevent the compact computing system from operating at full capacity. In one embodiment, the detection circuitry can include a magnetic sensor (such as a Hall effect device) that is positioned to detect a magnet disposed on the housing 202 only when the housing 202 is properly placed and aligned.

Removing the housing 202 exposes the central core of the compact computing system 200. More specifically, FIG. 3 shows the central core 300 of the compact computing system 200 in which the outer casing 202 is absent. The central core 300 can include an arithmetic engine having computing components, and a heat sink that can be used as a framework for supporting at least some of the computing components. In this way, the arithmetic engine adopts an appearance size according to the outer dimensions of the heat sink. Thus, the cylindrical shape of the compact computing system 200 dictates the configuration of various internal components and the requirements for thermal management. For example, the internal components can be configured in an axial manner that optimizes both the component packing density (the number of operating components per available volume) and the computing capacity density (the computing power per available volume). In addition, the axial configuration of the internal components also optimizes the amount of heat that can be transferred from the internal components to the incoming airflow 124 and removed by means of the exhaust airflow 114. (It should be noted that, in general, the nature of the compact computing system 200 assumes that the incoming airflow 124 is about the same as the exhaust airflow 114.)

For example, the memory module 302 can be formed by the substrate 304 on which the memory device 306 is mounted. Substrate 304 can have a major axis 310 that is parallel to ambient gas flow 312. To optimize heat transfer from the memory device 306 to the ambient gas stream 312, the memory device 306 can be mounted to the substrate 304 in a manner that maximizes the heat transfer interface with the ambient gas stream 312. For example, each memory device can have a corresponding size (eg, representing a width)<i>W</i>And the main size (for example, by length)<i>L</i>The shape of the representation). In the illustrated embodiment, the width of the memory device 306<i>W</i>Aligned generally parallel to the peripheral gas stream 312. In this manner, the heat transfer interface formed between the ambient airflow 312 and the memory device 306 disposed on the memory module 304 can be optimized. It should also be noted that the ambient airflow 312 is constrained by the presence of the outer casing 202 to flow in the peripheral zone defined by the interior surface of the outer casing 202 and the central core 300. In addition, the ambient airflow 312 can be characterized as having substantially no crossing The radial component of the central portion of the majority of the heat generating component is retained, thereby further enhancing the heat transfer capability of the ambient airflow 312 with respect to the memory module 302 and the memory device 306. In this manner, the axial component of ambient airflow 312 and the width of memory device 306<i>W</i>alignment. It should be noted that the incoming airflow 124 splits into a peripheral airflow 312 and a central airflow 314 (not shown) that flows within a central portion of the central core 300. Thus, prior to passing the delicate computing system 200 through the second opening 106, the ambient airflow 312 and the central airflow 314 are combined to form the exhaust airflow 114.

In the depicted embodiment, the blower 320 can be placed proximate to the second opening 106 (see Figure 1). It should be noted that the blower 320 can combine the central airflow 314 and the ambient airflow 312 back into the exhaust airflow 114. The blower 320 can include an exhaust assembly 322 that can be used to direct the exhaust stream 114 through the second opening 106, at least some of which are occluded in a manner that facilitates transfer of thermal energy generated by internal components of the compact computing system 200. Lip 108. Exhaust assembly 322 includes venting holes 324 to allow exhaust gas flow 114 to pass therethrough. A decorative shield 326 can be used to cover operational components such as RF circuitry and antennas. In this regard, the decorative shield 326 can be formed from an RF transparent material such as plastic, ceramic or other non-conductive material.

Due to the conductive nature of the outer casing 202, the outer casing 202 can be used as a chassis ground to provide good grounding for internal components. Thus, touch point 328 can be formed from a conductive material and used to form a conductive path between the inner component and the interior of outer casing 202. It should be noted that in order to form a good electrical connection, the portion of the outer casing 202 that contacts the touch point 328 is free of any non-conductive or insulating material such as alumina. Thus, in the condition that the outer casing 202 has an aluminum oxide layer formed thereon, a selected portion of the aluminum oxide (or a portion of the outer casing 102 that is obscured during the anodizing operation) is removed for exposure and touch. The bulk material in the locations where point 328 contacts. As discussed above, to prevent leakage of electromagnetic energy, the outer casing 202 and the base unit 116 form a Faraday cage.

In order to provide a user interaction with the user of the compact computing system 200, the central core 300 can include a sensor (such as an accelerometer) disposed at a plurality of points. Thus, in order to position the compact computing system 200 in a convenient location and orientation when the user disposes of the housing 202, the illumination pattern can be used to highlight a plurality of aspects of the interface panel 206 to cause portions of the interface panel 206. More visible to the user. Accordingly, some of the sensors may include light sensing devices for determining whether there is sufficient ambient illumination for the user to view selected items on the interface panel 206.

4 shows a perspective exploded view of the compact computing system 100. The fins 402 can include a plurality of flat faces 403 defining a central volume 405 having a triangular cross-section along the line of the triangular prisms. The heat sink 402 can also serve as a support structure or frame upon which an arithmetic engine including at least the operational components of the compact computing system 100 can be supported. In this manner, the computing engine can assume the general shape of the heat sink 402. In one embodiment, the heat sink 402 can cooperate with the interior surface of the outer casing 102 to define a peripheral region that can be used as an air path for the ambient airflow to cool the operational and operational components of the compact computing system 100. At least some. The center volume 405 can also serve as an air path for the central airflow 314 to further cool at least some of the operational and operational components. To facilitate cooling provided by the central airflow 314, the heat sink 402 has a plurality of cooling fins 407 extending from the first flat surface to at least the second flat surface and spanning the central volume of the triangle. In an embodiment, the central cooling fins may extend from the first flat surface to the junction of the second flat surface and the third flat surface. In this manner, the central cooling fins can separate the central volume 405 into two adjacent volumes each having a similar triangular cross-section, and can include a vapor chamber 404 disposed on each face 403 of the heat sink 402.

The vapor chamber 404 can be used to distribute the heat generated by the various integrated circuits across each flat surface of the heat sink 402. A CPU riser 406, which may include a multi-core central processing unit (CPU) and memory module 302, may be coupled to the heat sink 402 by means of an attachment point 408. The attachment point 408 can cooperate with the CPU spring 410 to place the CPU in direct thermal contact with the vapor chamber 404. CPU spring 410 can be utilized to stack and steam chambers in the CPU and its associated cooling A predefined amount of pressure is provided between chambers 404. Similarly, graphics processing unit (GPU) riser board 412 and GPU riser board 414 can be similarly coupled to their respective faces of heat sink 402. GPU risers 412 and 414 each include a GPU 416 surrounded by a video random access memory (VRAM) die 418. In this description, four VRAM wafers 418 can be configured in a diamond pattern around GPU 416. GPU when GPU risers 412 and 414 are coupled to their respective vapor chambers 404 Each of 416 and VRAM wafer 418 can be in direct thermal contact with a respective vapor chamber 404. It should be noted that in some configurations (not shown), a single vapor chamber can wrap around the edges of the heat sink 402 such that the integrated circuitry mounted on the GPU risers 412 and 414 can span substantially a larger area. The steam chamber consumes heat. This configuration can be advantageous in the case of single GPU operation. In addition, the VRAM wafer 418 can include a thermal gap spacer that is placed in direct thermal contact with the vapor chamber 404 because the VRAM wafer tends to have a profile that is lower than the approaching GPU 416. In this manner, the vapor chamber 404 thereby facilitates evenly spreading heat across each side of the heat sink 402 during operation of the compact computing system 100. A solid state disk drive (SSD) module 420 that can be coupled to the back of the GPU riser board 414 is also depicted.

Once each of the risers 406, 412, and 414 are securely coupled to the heat sink 402, each of the lift plates can be electrically coupled together across the main logic board (MLB) 422. In some embodiments, the MLB 422 can include a system management controller (SMC) die. The CPU riser board 406 includes a card edge connector 424 that is attached to the MLB 422 at the card edge slot 426. In one embodiment, the card edge connector 424 can be a PCI-E 3.0 type connector that allows for at least 32 unidirectional channels of PCI-E between the CPU riser board 406 and the MLB 422. GPU risers 412 and 414 can be coupled to MLB 422 at flexing jumper connector 428. In this manner, each of the risers 406, 412, and 414 can be in an electrical contact state.

The compact computing system 100 also includes an input/output (I/O) assembly 430. The input/output (I/O) assembly 430 covers several components including a power supply unit (PSU) 432. The PSU 432 can supply external power to various components of the compact computing system 100. In an embodiment The PSU 432 can be configured to supply approximately 450 W of total power to the compact computing system 100. The PSU 432 may also include airflow perforations 434 that are configured to allow cooling air to flow through the PSU 432 during operation of the compact computing system 100. The airflow perforations 434 can be sized to regulate the flow of air through the PSU 432. The I/O assembly 430 also includes an I/O board 436. When the compact computing system 100 is fully assembled, the I/O board 436 can be electrically coupled to the MLB 422 by a flexing jumper cable (not shown). The I/O board 436 allows high speed communication to enter and leave the compact computing system 100. The I/O assembly 430 also includes a structural wall 438 that provides a decorative interface to the user when the high speed data cable or power cable is installed and the self-exact computing system 100 removes the cables. Once the I/O assembly 430 is fully assembled, the structural wall 438 can be coupled to the top lip portion of the base unit 116.

A description of the exhaust assembly 440 is also provided in FIG. The exhaust assembly 440 includes an inflatable plate 442, an impeller 316, an exhaust vent 318, and a decorative shield 326. The inflatable panel 442 is operable to shape the airflow into the impeller 316. The inflatable panel 442 can also operate as a shroud for the blades of the impeller 316, as discussed in more detail below. The impeller 316 and the inflatable plate 442 can be coupled to the exhaust vent 318. A decorative shield 326 can be secured to the top surface of the exhaust vent 318. Once fully assembled, the exhaust assembly 440 can be coupled to the top portion of the heat sink 402. In this way, the center core 300 can be assembled.

FIG. 5 shows a partial cross-sectional view of the base unit 116 showing the vents 122. As depicted, the incoming airflow 124 can be extracted into the compact computing system 100 via the vents 122. As the incoming airflow 124 passes through the base unit 116, the ribs 502 help direct airflow into the compact computing system 100. In some embodiments, the ribs 502 can facilitate the transition of the incoming airflow 124 into the peripheral flow 312 and the central airflow 314. In the depicted embodiment, the first portion of the incoming airflow 124 may be directed by the ribs 502 in the form of a central airflow 314 toward a central volume of the heat sink 402. In one embodiment, a baffle configuration (which includes a flexing jumper cable 504, also referred to as a flow splitter) can be used to split the incoming airflow 124 into a central airflow 314 as described above, and will be second Partially split into ambient airflow 312. In one embodiment, the flexing jumper Cable 504 can be used as an airflow splitter. In this manner, in addition to electrically coupling the GPU riser board 414 to the MLB 422, the flex jumper cable 504 can redirect the proportional intake airflow 124 into the center airflow 314 and the ambient airflow 312. For example, the flexing jumper cable 504 may bias the more airflow 124 toward the central portion of the panel than on the peripheral edge of the GPU riser 414. Widening or narrowing the flexing jumper cable 504 can adjust the amount of air that is redirected up the GPU riser plate 414. It should be noted that the distance between the bottom surface of the GPU riser 414 and the MLB 422 can be adjusted to deflect more or less air to enter the center airflow 314.

FIG. 6A shows a top cross-sectional view of the heat sink 402. The heat sink 402 can be formed by machining a plurality of features from the extruded aluminum block. In one embodiment, a plurality of cooling fins 602 can be attached to the inner surface of the flat face of the heat sink 402, while in another embodiment, the plurality of cooling fins 602 can serve as a flat during the formation of the heat sink 402 Produced by the part of the extrusion process. In either case, a plurality of cooling fins 602 can be distributed in a number of ways. In one embodiment, all of the plurality of cooling fins 602 can extend from the first flat surface 604 to at least the second flat surface 605 to span the triangular center volume 607. In one embodiment, one of the plurality of cooling fins 602 (referred to as central cooling fins 602-1) may extend from the first flat surface 604 to the second flat surface 605 and the third flat surface 609 Face to face. In this manner, the triangular center volume defined by the fins 402 is divided equally into a first zone I and a second zone II each having a similar right-angled triangular cross section. In one embodiment, the first cooling fin 602-2 across the region I can be at a first angle relative to the first flat surface 604<img file="TWM504351U_D0003.tif" he="64" img-content="character" img-format="tif" inline="no" orientation="portrait" wi="31" />1. First angle<img file="TWM504351U_D0004.tif" he="64" img-content="character" img-format="tif" inline="no" orientation="portrait" wi="31" />1 may have a distance a between the first cooling fin 602-2 and the central cooling fin 602-1₁The angle of change. Similarly, the second cooling fin 602-3 across the region II can be at a second angle relative to the first flat surface 604.<img file="TWM504351U_D0005.tif" he="65" img-content="character" img-format="tif" inline="no" orientation="portrait" wi="27" />2. Second angle<img file="TWM504351U_D0006.tif" he="65" img-content="character" img-format="tif" inline="no" orientation="portrait" wi="30" />2 may have a distance a between the second cooling fin 602-3 and the central cooling fin 602-1.₂The angle of change. In general, the distance a₁And distance a₂They are approximately equal, however, as required by a particular design, the number of cooling fins actually implemented in Zone I or II can vary and various geometric relationships can also vary. In one embodiment, the first angle<img file="TWM504351U_D0007.tif" he="68" img-content="character" img-format="tif" inline="no" orientation="portrait" wi="26" />1 and second angle<img file="TWM504351U_D0008.tif" he="63" img-content="character" img-format="tif" inline="no" orientation="portrait" wi="26" />The sum of 2 can be about 180°.

Any of the flat faces can be modified to accommodate various components. For example, a portion of the first flat surface 604 can be removed by any number of processes to leave a low profile mounting location for the vapor chamber 404. The vapor chamber 404 can be adhesively or mechanically secured to the first flat surface 604. The vapor chamber 404 can have extremely efficient heat transfer properties, about 10 times the heat transfer efficiency of copper. In some embodiments, a conductive gel can be placed between the vapor chamber 404 and the heat sink 402 to promote efficient heat transfer between the vapor chamber 404 and the heat sink 402. The vapor chamber 404 can also include an attachment point 408. The attachment point 408 can be formed integrally with the vapor chamber 404 and configured to provide means for attaching various risers associated with the compact computing system 100 to the vapor chamber.

Figure 6B illustrates another cross-sectional view of a heat sink 402 with a plurality of lift plates attached thereto. The CPU riser 406 is shown attached to the steam chamber 404. CPU riser plate 406 is attached to steam chamber 404 via low profile thermal module 606. The low profile thermal module 606 can be configured to properly position the CPU 608 on the communication end 610 of the CPU riser board 406. In some embodiments, the low profile thermal module 606 can apply a force of approximately 100 pounds on the CPU 608. This 100 lb. force can be balanced by a CPU spring 410 disposed on the opposite side of the CPU riser 406. The CPU spring 410 can be a U-shaped spring that counteracts the force of the low profile thermal module 606 when flattened. The CPU spring 410 can be made of any number of stabilizing materials. In one embodiment, the CPU spring 410 can be made of 17-7 precipitation hardened stainless steel.

In addition to housing the CPU 608, the low profile thermal module 606 can have apertures through which the fasteners 619 (also referred to as fasteners 714 in FIG. 7B) can engage the attachment points 408 of the vapor chamber 404. . A fastener 611 (also referred to as fastener 716 in FIG. 7B) that couples the CPU riser plate 406 to the vapor chamber 404 can be used to establish a stable thermal interface between the CPU 608 and the vapor chamber 404. The fastener 611 is disposed behind the fastener 619 and is shown as a broken line in the cross-sectional view of FIG. 6B. In some embodiments, a force of about 30 pounds can be applied between the CPU 608 and the vapor chamber 404. In addition to housing the CPU 608, the CPU spring 410 can also be used to assist in setting a force of 30 pounds between the CPU 608 and the vapor chamber 404. This applied force is allowed in the CPU 608 with steaming A stable thermal contact is established between the vapor chambers 404 and the CPU riser 406 is securely attached to the heat sink 402. GPU risers 412 and 414 having GPU 614 and GPU 616, respectively, can be mechanically coupled to other faces of heat sink 402. Similar to the CPU riser 406, the GPU risers 412 and 414 can be coupled to their respective vapor chambers. For example, GPU riser 412 can be coupled to its respective vapor chamber by fasteners 618.

The fastener 618 can be coupled to an attachment point disposed on the vapor chamber, and a certain amount of pressure between the vapor chamber 404 and the GPU 614 can be balanced by the GPU spring 620. The fastener 618 can cooperate with the GPU spring 620 to provide a predetermined amount of force to place the GPU riser 412 to the heat sink 402. In one embodiment, GPU 614 can be soldered to GPU riser 412, eliminating the need to apply additional pressure to place GPU 614 within the communication end. It should also be noted that in some embodiments, GPU riser 412 can include a stiffener 622 that is operable to receive force from GPU spring 620 and provide additional structural support for GPU riser 412. It should also be noted that one of the GPU risers 412, 414 (as depicted) or both may include the SSD module 420. The SSD module 420 can be coupled to the back surface of one or both of the GPU risers 412, 414.

FIG. 6C shows yet another cross-sectional view of the heat sink 402 disposed within the outer casing 102. In addition to showing the outer casing 102 surrounding the heat sink 402, an I/O assembly 430 is also depicted. The I/O assembly 430 includes a PSU 432, an I/O board 436, and a structural wall 438. I/O assembly 430 includes a number of dashed holes that represent perforations in the top surface of PSU 432. In some embodiments, the perforations of the PSU 432 can be sized to adjust the airflow through the PSU 432. The connector string 624 is disposed on the outwardly facing surface of the I/O board 436, which represents the connector string that the user can access via the I/O inlay 626. In one embodiment, the I/O inlay 626 can be a highly scratch resistant RF transparent hard plastic.

Figure 6D shows the same cross section from Figure 6C divided into multiple gas flow zones. The central airflow 314 is depicted in FIG. 6D as an airflow path parallel to the longitudinal axis of the outer casing 102 and within the triangular central region of the heat sink 402. As shown in more detail in Figure 7A, ambient airflow 312 A plurality of airflow branches may be diverged, one of which may be directed along the back portion of the GPU riser and displayed as GPU airflow zones 630 and 632. It should be noted that various computing components can have a duty cycle that generates a large amount of waste heat. For example, the SSD module 420 can be disposed only on the GPU riser board 414. Given additional operational parameters of both GPU risers 412, 414, SSD 420 may cause substantially more heat to be emitted into GPU airflow zone 630 than GPU airflow zone 632. In this case, a balancing operation can be implemented to offload GPU operations from the GPU riser board 414 to the GPU riser board 412, thereby balancing the heat dissipation across the airflow zones 630 and 632.

A portion of the peripheral airflow 312 can be directed along both sides of the CPU riser, as depicted by the airflow zone 634. In this manner, the CPU riser 406 can receive convective cooling on both the front and back surfaces. Airflow zone 636 represents the flow of convective cooling to the memory (DIMM) module 302. Airflow zone 638 represents a portion of ambient airflow 312 that is routed through PSU 432. As mentioned above, the perforations in the top surface of the PSU 432 can be sized to adjust the amount of gas flow through the PSU 432. Finally, the airflow zone 640 can represent the volume of air directed along the I/O pad 436. Various airflow guides can be used to facilitate the generation of an optimum amount of airflow for each airflow zone. For example, in one embodiment, depending on the angular position of the rib 502 on the base unit 116 (which in some embodiments may be releasable), the ribs may There is a varying angle to help distribute the airflow to the desired airflow zone. In one embodiment, nearly 50% of the air passing through the compact computing system 100 can be directed into the central airflow 314. In this configuration, about 10% can be drawn through the gas flow zone 638 and the remaining approximately 40% of the gas flow can be divided across other gas flow zones.

FIG. 7A illustrates a side view of GPU riser board 414. The airflow over GPU riser 414 is indicated as ambient airflow 312, which may be shunted up on GPU riser 414 by flexing jumper cable 504 as described with respect to FIG. This situation causes a disproportionate amount of ambient airflow to travel over the central portion of the GPU riser 414. This situation may be advantageous in embodiments such as the embodiments depicted in the following situations: heat emitting bodies (such as SSDs) Module 420 and GPU (not shown) are disposed in a central portion of GPU riser board 414. As the peripheral airflow 312 travels up the GPU riser 414, it can be naturally spread out along the GPU riser 414. In addition to the natural normalization of the airflow 312, the spread of the airflow 312 can be further facilitated by the interaction between the top portion of the GPU riser 414 and the inflatable panel 442. Because the peripheral portion of the GPU riser 414 is disposed at a greater radial distance from the center point of the circular inflatable panel 442, a large gap is left for air to rush toward the GPU lift plate 414 and rush to the impeller 316 (not shown) )in. Therefore, in the upper portion of the GPU lifting plate 414, the peripheral portion of the peripheral airflow 312 may be larger. The upper portion of the GPU riser 414 can be configured such that the heat emitting assembly can benefit from a more even distribution of the airflow 312. For example, DC input device 702 can emit a significant amount of heat. Additionally, the power conditioning module 704 can be spread across the GPU riser board 414 at even intervals. Capacitor 706 can also greatly benefit from the convective cooling provided by ambient gas stream 312. It should be noted that as depicted, many of the heating bodies (including, for example, SSD module 420 and power conditioning module 704) can be placed vertically such that the airflow thereon and the resulting convective heat transfer are maximized. It should be noted that the ambient airflow 312 on the GPU riser 412 can be substantially similar to the airflow depicted with respect to the GPU riser 414.

FIG. 7B illustrates a side view of the CPU riser 406. This view is provided to show additional details of the CPU spring 410. The CPU spring 410 as previously discussed may be constructed from a U-shaped 17-7 precipitation hardened stainless steel alloy. A force may be applied by the fastener along the CPU spring 410 to squash the spring against the rear side of the CPU riser 406 as depicted. The CPU spring 410 can include a number of secondary rings of various sizes. The CPU spring ferrule 710 as depicted is thicker than the CPU spring ferrule 712 and provides about 200 pounds of force required to place a CPU (not shown) to the CPU riser 406. The fastener 714 extends only into the low profile thermal module 606, allowing the CPU spring 410 to securely mount the CPU to the CPU riser 406 prior to mounting the CPU riser 406 on the heat sink 402. The fastener 716 is configured to apply a force of about 30 pounds via the narrower CPU spring bell 712 and additionally operates to couple the CPU riser plate 406 to the vapor chamber configured to receive the CPU riser 406 Point 408. It should be noted that the stiffener 718 can be placed in the CPU spring Between the 410 and the CPU riser 406, the CPU riser 406 provides additional structural rigidity.

FIG. 8 illustrates a partial cross-sectional side view of the exhaust assembly 440 disposed within the top portion of the outer casing 102. The central airflow 314 is combined with the ambient airflow 312 at the exhaust assembly 440. Exhaust assembly 440 includes an impeller 316 that is responsible for drawing air through the compact computing system 100 during operation of the apparatus. The impeller 316 receives the central airflow 314 and the ambient airflow 312 and combines the two airflows back into the exhaust airflow 114. As depicted, the exhaust stream 114 is discharged with axial and centrifugal components, so the impeller 316 can be said to be a mixed flow fan. When the exhaust stream 114 contacts the portion 110 of the outer casing 102, the axial component of the exhaust stream 114 reduces the amount of pressure drop because the stream does not experience as it would otherwise exit the exhaust assembly 440 in a substantially centrifugal direction. Reboot as many reboots. The axial component of the exhaust stream 114 also helps to reduce heat transfer between the exhaust stream 114 and the portion 110 of the outer casing 102. In this manner, the normal operating temperature of portion 110 of housing 102 can be maintained at a sufficiently low temperature to allow the user to comfortably manipulate housing 102. It should be noted that the exhaust gas stream 114 can be further adjusted to exit the exhaust gas assembly 440 in a substantially radial direction such that air can be quickly removed from the outer casing 102. When the exhaust stream 114 contains a non-radial component, a vortex pattern may occur, resulting in an additional pressure drop and increased convective heat transfer to the outer casing 102.

The heat distribution around the outer casing 102 can be further controlled depending on the thickness 802 of the portion 110 of the outer casing 102. In one embodiment, the thickness 802 can be about 4 mm to 6 mm, thereby allowing heat to be effectively conducted circumferentially around the outer casing 102. In this way, the formation of a hot spot along the outer casing 102 can be prevented. As depicted, the thickness 802 of the outer casing 102 can taper downwardly because most of the heat received by the outer casing 102 is near the top portion. Therefore, heat can be evenly distributed in the circumferential direction at the top, allowing the narrower lower portion to conduct heat simply away from the upper opening in the outer casing 102. In some embodiments, the impeller 316 can be configured to draw air through the compact computing system 100 at a rate of about 28 cubic feet to 29 cubic feet per minute while maintaining the total acoustic output of the compact computing system at Less than 37 dB.

FIG. 9A shows a cross-sectional top view of the exhaust assembly 440. In this description, the impeller 316 can have 57 impeller blades 902. In some embodiments, the impeller blades 902 can be disposed at non-uniform intervals around the hub 904. For example, the angular distance between the blades can vary between about 5.5 and 7 degrees. This irregular spacing can help reduce the acoustic profile of the impeller 316. Table 1 below shows a particular blade spacing configuration that can be utilized by the 57 impeller blades 902 of the impeller 316. Additionally, the impeller blades 902 can have rearwardly curved blades to bias the exhaust gas stream 114 in a radial direction.

<tables><img alt="" file="twm504351u_d0009.tif" he="1935" id="" img-content="drawing" img-format="tif" inline="no" orientation="portrait" wi="2004" /></tables>

Figure 9B shows a portion of the cross section shown in Figure 9A. Specifically, the fan blade 902 It can be configured such that the trailing edge of the blade 902 is inclined about 10 degrees more than the leading edge of the blade 902. In one embodiment, as depicted, the leading edge of the blade 902 may have an angle of 130 degrees, while the trailing edge of the blade 902 may have an angle of about 140 degrees. Even though the blade 902 is swept-back, due to the direction of rotation of the impeller 316, the airflow exiting the impeller 316 may still have a circumferential component as it exits the impeller 316. The radially oriented stator 906 can be configured to substantially straighten the airflow by removing the tangential component from the airflow 114 as it exits the stator 906. As a result, the average direction of the airflow away from the stator 906 is more closely aligned with the radial direction.

10A-10B show cross-sectional top views of an alternate embodiment of an exhaust assembly 440. In this embodiment, the stator vanes 1002 can have a curved geometry and are oriented in opposite directions to provide a more gradual re-directing of the exhaust gas stream 114. Due to the separation from the stator blade surface, this configuration reduces the flow energy loss of the turbulence. In a set of tests, a similarly configured curved stator configuration produced approximately 30% more pressure capacity than a similarly configured system with straight stator blades. In other embodiments, the straight stator blades can be oriented similar to the direction of the curved stator blades 1002 depicted.

FIG. 11A shows a partial cross-sectional side view of an exhaust assembly 440 including an impeller 316, an exhaust vent 318, and an inflatable plate 442. The impeller 316 can be driven by a fan motor 1102. Fan motor 1102 can be a small form factor motor that allows for reduced airflow entry losses and allows more volume for blade 902, which should be desirable. In one particular embodiment, the fan motor 1102 can push the bearings up. Due to the delicate nature of the thrust bearing, the impeller 316 can have a corrugated lead-in area 1104 that helps the airflow to have an axial component as it exits the impeller 316. In addition to including the stator vanes such that the exhaust gas stream 114 is substantially radial, the exhaust vents 318 also include ribs 1106 for adding additional axial components to the exhaust stream 114 as it exits the exhaust assembly 440. It should be noted that the exhaust stream 114 is shown to be only on the left side of the impeller 316 for illustrative purposes only, and that the stream will also travel through the right side of the impeller 316. In this embodiment, the inflatable panel 442 acts as a shield for the impeller 316.

FIG. 11B shows a bottom view of the exhaust assembly 440 without the inflatable panel 442. In this description, the impeller 316 is specifically shown without a bottom shroud or shroud plate. This configuration may allow the impeller 316 to be made as a single piece more easily than if a unique shroud must be manufactured. Moreover, this implementation allows the use of a support ring 1108 disposed at the peripheral edge of the bottom of the impeller 316. Support ring 1108 can add structural stability to fan blade 902. Support ring 1108 can also be used to help balance impeller 316. For example, a notch or aperture can be designed within the support ring 1108 to help remedy the small balancing problem that can be associated with the impeller 316. The support ring 1108 may also advantageously provide a small axial component for the air passing over the support ring 1108 as the air exits the exhaust assembly 440.

FIG. 12A shows a rack configuration 1200 suitable for supporting a number of compact computing systems 100 in accordance with any of the described embodiments. In this description, cooling air may be drawn in one side of the rack configuration 1200 and cooling air may be exhausted on the other side. In this way, the exhaust air from a compact computing system cannot be recirculated into the intake of nearby computing devices. The compact computing system configured in this manner can also communicate directly via the data connector 1202. The data connector 1202 can be embodied by an Ethernet cable, a Thunderbolt® cable, or any number of other high speed data transfer protocols. In some embodiments, the depicted compact computing system can be in a wireless communication state. Figure 12B shows the configuration of several fine-grained computing systems controlled by a master fine-tuning computing system to allow the master fine-tuning computing system to allocate resources for various other delicate computing systems. FIG. 12C shows various other configurations that are compatible with the compact computing system 100. A perspective view and a cross-sectional view depicting an embodiment of a hexagonal configuration showing a compact computing system. In another configuration, the compact computing system can be configured in a linear cube configuration.

FIG. 13 depicts a method 1300 for cooling a compact computing system. At step 1302, the cooling airflow entering the compact computing system is split across a plurality of airflow zones. At step 1304, one portion of the cooling gas stream is partially removed from the fin stack that is in direct thermal contact with a number of printed circuit boards (PCBs). Another part of the cooling air can be utilized to simultaneously cool the convection Applied to the back part of each of several PCBs. At step 1306, the airflow is recombined before the cooling airflow is exhausted from the compact computing system.

14 is a flow chart detailing a procedure 1400 for removing heat from a desktop computer having a cylindrical housing having a first opening at a first end and a second in accordance with the described embodiments. a second opening at the end that is axially disposed away from the first opening. Procedure 1400 is performed by the operation 1400: at 1402, a negative pressure differential is generated within the cylindrical housing relative to the external environment adjacent the first opening by a blower located adjacent the second opening. At 1404, air is drawn from the external environment into the first opening of the cylindrical outer casing as an incoming airflow in response to the negative pressure differential. At 1406, the incoming airflow is split into a central airflow and a peripheral airflow by an airflow splitter located adjacent the first opening. At 1408, the central airflow follows the central airflow path through the central volume by the blower and the peripheral airflow follows a peripheral airflow path through the peripheral volume separated from the central volume. At 1410, the central airflow and the ambient airflow are combined at the blower into an exhaust airflow. At 1412, a positive pressure differential relative to the external environment near the second opening is produced by the blower. At 1414, the exhaust stream is removed from the cylindrical outer casing into the external environment in response to a positive pressure differential.

15 is a block diagram of an arithmetic system 1500 suitable for use with the described embodiments. The computing system 1500 illustrates the circuitry of a representative computing system. Computing system 1500 includes an input device 1501 coupled to processor 1502 that is associated with a microprocessor or controller for controlling the overall operation of computing system 1500. It should also be noted that processor 1502 can also be referred to as a multi-processor system. For example, computing system 1500 can include a single or multiple central processing units (CPUs) in addition to single or multiple dedicated function processors, such as a graphics processing unit (GPU). The computing system 1500 stores data, such as media material, in the file system 1504 and the cache memory 1506. File system 1504 typically provides high capacity storage capabilities for computing system 1500. The cache memory 1506 is, for example, a random access memory (RAM) provided by a semiconductor memory. The computing system 1500 can also include a RAM 1508 and a read only memory (ROM) 1510. ROM 1510 can store programs to be executed in a non-volatile manner, common Program or program.

The computing system 1500 also includes an interface 1514 (which includes a network interface or a bus interface) coupled to the data link 1512. The data link 1512 allows the computing system 1500 to be coupled to a host computer or accessory device. The data link 1512 can be provided via a wired connection or a wireless connection. In the case of a wireless connection, interface 1514 (which includes a network interface or a bus interface) can include a wireless transceiver. A media project (media material) can be associated with one or more different types of media content. In one embodiment, the media item is an audio track (eg, a song, an audio book, and a podcast). In another embodiment, the media item is an image (eg, a photo). However, in other embodiments, the media item can be any combination of audio, graphics, or visual content. The sensor 1516 can be in the form of a circuit for detecting any number of stimuli. For example, sensor 1516 can include a Hall effect sensor that responds to an external magnetic field, an audio sensor, a light sensor such as a luminometer, and the like.

Various embodiments are described herein. These embodiments include at least the following.

A thermal management system for a desktop computer having a housing having a longitudinal axis enclosing an interior volume symmetrical about the longitudinal axis, the thermal management system including at least: A heat sink disposed within the interior volume, the heat sink including a plurality of flat faces defining and at least partially enclosing a central thermal region having a cross section perpendicular to the longitudinal axis. The thermal management system also includes a blower that passes air through at least one of the central hot zones.

A thermal management system for removing heat from a desktop computer, the desktop computer including a housing having a longitudinal axis and at least partially defining and enclosing an interior volume symmetrical about the longitudinal axis, The thermal management system includes a heat sink positioned within an interior volume. The heat sink includes a plurality of flat faces defining a central airflow region having a cross section in a polygonal shape perpendicular to the longitudinal axis. At least one of the plurality of flat faces includes: an interior surface integrally formed with a cooling fin extending from the interior surface and spanning the central airflow region to the complex An inner surface of at least one of the plurality of flat faces; and an outer surface configured to carry one of the operational components in thermal contact with the heat sink.

A heat removal system for an arithmetic device is described that is enclosed within a cylindrical housing. The heat removal system includes a plurality of vents configured to receive an incoming airflow based on a pressure differential across one of the plurality of vents and direct the incoming airflow along a longitudinal axis of the cylindrical outer casing, Wherein the plurality of venting holes are disposed at a first end of the cylindrical outer casing. The heat removal system also includes a baffle configuration disposed between the plurality of vents and the longitudinal axis of the cylindrical outer casing, the baffle configuration being configured to bifurcate the incoming airflow into a central airflow And a peripheral airflow that is directed toward a central portion of the computing device and the peripheral airflow is directed toward a peripheral portion of the computing device; and an exhaust system disposed in the cylindrical housing At one of the opposite ends of the second end, the exhaust system is configured to receive and combine the central airflow with the ambient airflow, and at the second end, exhaust the combined airflow through an opening in the cylindrical outer casing .

A method for removing heat generated by an arithmetic component disposed in an air passage defined by an outer casing, the outer casing having a first opening at a first end and At a second opening at a second end opposite the first end, the method is performed by: placing an incoming airflow at the first opening by a blower located adjacent the second opening Extracting into the air passage; splitting the incoming airflow into a central airflow passing through a central portion of the air passage and passing through a peripheral portion of the air passage separated from the central portion of the air passage a peripheral airflow, wherein the computing component transfers at least some of the heat to the central airflow and the peripheral airflow; the central airflow and the ambient airflow are combined into an exhaust airflow by the blower; and the exhaust airflow is passed through the second Opening the outer casing removes the heat from the outer casing.

A thermal management system for a cylindrical desktop computer includes a device adapted to cool the circle At least one exhaust assembly of a cylindrical desktop computer. The exhaust assembly includes an impeller including: a hub; a plurality of blades projecting radially from the hub, wherein adjacent ones of the plurality of blades are disposed at an irregular angular interval around the hub; A support ring integrally formed along a bottom surface of a rear edge portion of each of the plurality of blades, the support ring being operable to provide at least structural support for the plurality of blades. The thermal management system also includes a plurality of stator vanes configured to inhibit the formation of a radial component in the exhaust gas stream.

A thermal management system for use in a desktop computer includes: an impeller including a plurality of blades; and an exhaust grille surrounding the impeller and including a plurality of venting holes through which an exhaust airflow passes The plurality of vents are removed from the desktop. The plurality of exhaust vents includes: a plurality of ribs configured to cooperate with the plurality of blades to increase an axial component of the exhaust stream; and a plurality of stators configured to remove The all-directional component of the air passing through the exhaust grill.

A heat sink for removing heat from a desktop computer, the desktop computer including a housing having a longitudinal axis and at least partially defining an interior volume symmetrical about the longitudinal axis and positioned within the interior volume An arithmetic engine having an arithmetic component, the heat sink including a plurality of flat faces defining a central thermal region, the central thermal region having a cross section substantially perpendicular to the longitudinal axis.

A compact computing system includes: a housing having a longitudinal axis and enclosing and defining an internal volume symmetrical about the longitudinal axis; a heat sink enclosing at least a central thermal region having a central thermal region a cross-section of one of the polygons and substantially perpendicular to the longitudinal axis; a blower configured to direct air through the interior volume and including a central airflow through the central thermal zone; and an operation An assembly disposed within the interior volume and supported by the heat sink and in thermal contact with the heat sink. In one embodiment, the computing component has a shape having a primary centerline corresponding to one of the primary dimensions and a primary centerline corresponding to the primary dimension. In an embodiment The primary dimension corresponds to a primary length, and the secondary dimension corresponds to a primary length. In one embodiment, the primary dimension is a length (L) and the secondary dimension is a width. In an embodiment, the primary dimension is substantially parallel to the longitudinal axis. In one embodiment, the secondary dimension is substantially parallel to the longitudinal axis. In one embodiment, the primary centerline is perpendicular to the secondary centerline. In one embodiment, the internal structure of one of the operational components is organized substantially parallel to the primary centerline and according to the primary length. In an embodiment, the primary centerline is substantially parallel to the longitudinal axis. In an embodiment, the secondary centerline is substantially parallel to the longitudinal axis.

A combined thermal module (CTM) for fastening an integrated circuit (IC) to an electrical connector disposed on a first surface of a printed circuit board (PCB) and maintaining the IC in an a heat transfer assembly in thermal contact, the CTM comprising: a stiffener disposed on a second surface of the PCB; a retaining mechanism at least a portion of which is disposed on the stiffener, the retaining mechanism configured to provide a first holding force and a second holding force; a first fastening member for fastening the IC to the reinforcing plate and the holding mechanism, wherein the holding mechanism makes the first holding force uniform across the reinforcing plate Ground distribution, the first fastener maintains the IC in uniform electrical contact with the electrical contacts in the electrical connector; and a second fastener for securing the heat removal assembly to the retention mechanism, The second fastener maintains the IC in uniform thermal contact with the heat transfer assembly.

A thermal management system for a cylindrical desktop computer having a cylindrical outer casing enclosing a cylindrical volume having a longitudinal axis, the cylindrical outer casing having a first end a first opening having a first cross section and a second opening having a second cross section at a second end opposite the first end, the thermal management system comprising: a heat sink Disposed within the cylindrical volume and comprising a plurality of flat faces defining and enclosing a central thermal region having a triangular cross section; and a blower located adjacent the second opening, the blower having no diameter The air to the component passes at least through the central hot zone.

A thermal module (TM) for fastening an integrated circuit (IC) to an electrical connector disposed on a first surface of a printed circuit board (PCB) and maintaining the IC with The heat transfer assembly is in thermal contact, the TM comprising: a holding mechanism configured to provide a first holding force and a second holding force; a first fastener for fastening the IC to the holding a mechanism, wherein the holding mechanism uniformly distributes the first holding force across the IC, the first fastener maintaining the IC in uniform electrical contact with the electrical contacts in the electrical connector; and a second fastener, It is used to secure the heat removal assembly to the retention mechanism and maintain the IC in uniform thermal contact with the heat transfer assembly.

A desktop computing system includes: a housing at least partially enclosing and defining an interior volume symmetrical about an axis; an air passageway within the interior volume extending along a full length of the housing; and an operation An engine disposed within the air passage and including at least one operational component.

Furthermore, a thermal management system for a cylindrical desktop computer having a cylindrical outer casing enclosing a cylindrical volume having a longitudinal axis, the cylindrical outer casing having a first end a first opening and a second opening at a second end opposite the first end. The thermal management system includes a heat sink disposed within the cylindrical volume and having a plurality of flat faces defining and enclosing a central thermal region having a triangular cross section.

The thermal management system includes a cooling fin that extends from at least one of the inner surfaces of the first planar surface to an inner surface of one of the second planar surfaces and spans the central thermal region. In one embodiment, the plurality of flat faces and an inner surface of the cylindrical outer casing enclose and define a peripheral thermal zone. In one embodiment, a central cooling fin extends from the inner surface of the first flat surface to a junction of the inner surface of the second flat surface and an inner surface of a third flat surface. In one embodiment, the central cooling fins divide the central thermal region into a first region and a second region each having a similar triangular cross section. In an embodiment, the system also includes a first cooling fin from the inner surface of the first flat surface Extending only to the inner surface of the second flat surface and across the first region. In one embodiment, the system also includes a second cooling fin extending from the inner surface of the first flat surface to the inner surface of the third flat surface and across the second region.

In an embodiment, a first angle between the first cooling fin and the inner surface of the first flat surface varies according to a distance between the first cooling fin and the central cooling fin. In one embodiment, a second angle between the second cooling fin and the inner surface of the first flat surface varies according to a distance between the second cooling fin and the central cooling fin. In an embodiment, the sum of the first angle and the second angle is equal to about 180°. In an embodiment, the heat sink is formed from a single piece of extruded metal. In one embodiment, the system also includes a blower located adjacent the second opening, the blower generating a negative pressure differential in a first portion of the cylindrical outer casing, the negative pressure differential being such that at the first opening Air is drawn into the cylindrical casing. In one embodiment, the air is split into a central airflow through one of the central thermal zones and a peripheral airflow through one of the peripheral thermal zones. In an embodiment, the blower is configured to recombine the central airflow and the ambient airflow into an exhaust airflow.

In an embodiment, the blower is configured to create a positive pressure differential in a second portion of the cylindrical outer casing that forces the exhaust gas flow through the second opening away from the cylindrical outer casing. In one embodiment, one of the flat faces carries the computing component maintained by the thermal management system within a range of predetermined operating temperatures.

A thermal management system for removing heat from an arithmetic engine having an operational component positioned within a cylindrical housing having a longitudinal axis. The thermal management system includes a heat sink having a plurality of flat faces defining a substantially triangular central airflow region. Each of the plurality of faces has: an interior surface integrally formed with a plurality of cooling fins extending from the interior surface and spanning the central airflow region of the triangle to the plurality of An inner surface of the other of the faces; and an outer surface configured to carry the operational component in thermal contact with the heat sink.

In one embodiment, the plurality of flat faces and an inner surface of the cylindrical outer casing enclose and define a peripheral airflow zone. In an embodiment, the cylindrical outer casing further includes a first opening at a first end and a second opening at a second end opposite the first end. In one embodiment, the thermal management system further includes a blower adjacent the second opening, the blower configured to generate a negative pressure differential within the cylindrical outer casing relative to an external environment at the first opening . In an embodiment, the negative pressure differential at the first opening causes air to enter from one of the external environment to the first opening. In one embodiment, the system also includes an air splitter adjacent the first opening, the air splitter configured to split the incoming air into a central airflow and a peripheral airflow. In an embodiment, the central airflow passes through the central airflow region along a central airflow path that is substantially parallel to the longitudinal axis.

In an embodiment, the peripheral airflow passes through the peripheral airflow zone along a peripheral airflow path that is substantially parallel to the longitudinal axis. In an embodiment, wherein the peripheral airflow and the central airflow have substantially no radial component. More specifically, when the central airflow passes through the central airflow zone, the central airflow has no radial component and the peripheral airflow moves along the peripheral airflow path in a portion of the majority of the heat generating components that reside therein. The peripheral airflow does not have a radial component. In an embodiment, the blower is configured to recombine the central airflow and the ambient airflow into an exhaust airflow. In an embodiment, the blower is configured to create a positive pressure differential within the cylindrical outer casing relative to the external environment adjacent the second opening. In one embodiment, the positive pressure differential forces the exhaust gas stream through the second opening and away from the cylindrical outer casing, wherein the exhaust gas stream has a maximum acoustic signature of about 40 dBA and is at room temperature (25 ° C) A maximum vent gas flow is from about 25 cubic feet to 30 cubic feet per minute (CFM) and is about 40 CFM at a high temperature (35 ° C).

In one embodiment, the first amount of heat from the computing component is transferred to a vapor chamber in thermal contact with one of the plurality of cooling fins, the heat being subsequently transferred to the central gas stream. In one embodiment, the second amount of heat from the computing component is directly Passed to the surrounding airflow. In one embodiment, the opening in the second end of the cylindrical outer casing has an area that is greater than 50% of a total cross-sectional area of the second end of the cylindrical outer casing. In one embodiment, the blower is a mixed flow fan that does not substantially produce a radial airflow component.

A heat removal system for an arithmetic device is described that is enclosed within a cylindrical housing. The heat removal system includes a plurality of venting holes configured to receive an incoming airflow based on a pressure differential across one of the plurality of venting apertures and directing the incoming airflow toward a longitudinal axis of the cylindrical outer casing, wherein The plurality of venting holes are disposed at a first end of the cylindrical outer casing; a baffle arrangement disposed between the plurality of venting holes and the longitudinal axis of the cylindrical outer casing, the baffle arrangement being grouped And diverting the incoming airflow into a central airflow and a peripheral airflow, the central airflow being directed toward a central portion of the computing device and the peripheral airflow being directed toward a peripheral portion of the computing device; and an exhaust system, Positioned at a second end of the cylindrical outer casing opposite the first end, the exhaust system configured to receive and combine the central airflow with the ambient airflow and via one of the cylindrical outer casings The opening discharges the combined gas stream. In one embodiment, the first end of the cylindrical outer casing includes a horizontal base that is converted into a curved portion, and wherein the plurality of venting holes are disposed along the curved portion of the cylindrical outer casing relative to the horizontal The base is angled such that the incoming airflow is directed toward the longitudinal axis of the cylindrical outer casing.

In one embodiment, a blower disposed adjacent the opening in the cylindrical outer casing is configured to evenly dissipate heat across the cylindrical outer casing, the opening being defined by a circular lip portion having an adjusted thickness. In one embodiment, the exhaust system includes a mixed flow fan configured to exhaust air out of the cylindrical outer casing. In one embodiment, the baffle configuration includes electrically coupling a first printed circuit board (PCB) to a data cable of a second PCB. In one embodiment, a portion of the incoming airflow that contacts the data cable is split toward the peripheral airflow. In one embodiment, a heat sink is configured to At least two printed circuit boards are supported, wherein an inner surface of the cylindrical outer casing cooperates with an outer surface of the heat sink to define a portion of the peripheral airflow. In one embodiment, the heat sink includes a cooling fin stack defining one of the central air flows. In one embodiment, the opening in the second end of the cylindrical outer casing has an area that is greater than 50% of a total cross-sectional area of the second end of the cylindrical outer casing.

Described a method for removing heat from a desktop computer having a cylindrical outer casing having a first opening at a first end and a second end a second opening disposed axially away from the first opening. The method is performed by extracting an incoming airflow from an external environment into the first opening of the cylindrical casing by a blower located near the second opening, wherein one of the airflows near the first opening is split Splitting the airflow into a central airflow and a peripheral airflow that follows a central airflow path through a central volume that follows a peripheral airflow path through a perimeter volume that is separated from the central volume; The central airflow and the peripheral airflow are combined into a discharge airflow by the blower, the blower then passing the exhaust airflow through the second opening out of the cylindrical outer casing and into the external environment.

A thermal management system for a cylindrical desktop computer is described. The thermal management system includes an exhaust assembly adapted to cool the cylindrical desktop computer, the exhaust assembly having an impeller comprising: a hub; a plurality of blades extending radially from the hub And a neighboring one of the plurality of blades is disposed at an irregular angular interval around the hub; and a support ring integrated along a bottom surface of a rear edge portion of each of the plurality of blades Formed, the support ring is operable to provide at least structural support for the plurality of blades.

A plurality of stator blades are also included, and the impeller further includes a mechanical shaft that is axially stabilized by a thrust bearing. In one embodiment, the plurality of blades comprise swept-back blades. In one embodiment, a trailing edge of each of the plurality of blades is greater than the complex A corresponding leading edge of each of the plurality of blades is inclined by about 10 degrees. In one embodiment, the plurality of stator blades are curved stator blades oriented in one of the opposite directions of the plurality of blades. In one embodiment, the air exiting the impeller has both an axial component and a centrifugal component. In one embodiment, one of the hub geometries has a wavy geometry configured to facilitate an axial discharge component of one of the gas streams. In one embodiment, an inflatable panel is configured to direct air into the impeller. In one embodiment, the plurality of blades comprises 57 blades. In one embodiment, each of the blades is separated from a neighboring fan blade by a particular angular interval, wherein when each of the equal angular intervals is added together, the equiangular spacing amounts to a total of 360 degrees, and wherein A first angular interval is 6.92°, a second angular interval is 6.2399°, a third angular interval is 6.1458°, a fourth angular interval is 5.7145°, a fifth angular interval is 5.9564°, and a sixth hexagonal interval is 5.7037°, a seventh angular interval is 5.7124°, an eighth angular interval is 5.8201°, a ninth angular interval is 6.3916°, a tenth angular interval is 6.1342°, and an eleventh angular interval is 6.2996°, one The twelfth angular interval is 6.8305°, a tenth triangular interval is 6.3928°, a fourteenth angular interval is 6.9324°, a fifteenth angular interval is 6.79°, and a tenth hexagonal spacing is 6.3158°, one The seventeenth angle interval is 6.6752°, the eighteenth angle interval is 6.332°, the nineteenth angle interval is 6.8873°, the second twentieth angle interval is 6.9171°, and the second twenty-first angle interval is 6.529°. The twenty-second angular interval is 6.8115°, a twentieth triangular interval is 6.1026°, and a twenty-fourth angular interval is 6.7456°. The twenty-fifth angular interval is 5.7116°, a twenty-sixth angular interval is 5.6961°, a twenty-seventh angular interval is 6.1673°, and a twenty-eighth angular interval is 5.8777°, and a twenty-nine angular interval It is 5.8416°, a 30th angular interval is 5.9396°, a 31st angular interval is 6.1763°, a 30th angular interval is 6.692°, and a 30th triangular interval is 5.801°, a 30th The four-corner spacing is 6.4961°, the thirty-fifth angular interval is 6.4858°, the thirty-sixth angular interval is 6.305°, the thirty-seventh angular interval is 5.86°, and the thirty-eighth angular interval is 5. The two-corner spacing is 6.3266°, a forty-th triangle interval is 6.395°, a forty-fourth angle interval is 6.2282°, a forty-five angular interval is 6.4552°, and a forty-sixth angle interval is 6.9279°. A forty-seventh angular interval is 6.7538°, a forty-eighth angular interval is 6.9354°, a forty-nine angular interval is 6.926°, a fifty-corner spacing is 6.4034°, and a fifty-first angular interval The interval of 6.1482°, a fifty-two angle is 6.4643°, the interval of a fifty-th triangle is 5.7442°, the interval of a fifty-fourth angle is 5.7055°, and the interval of a fifty-fifth angle is 6.4974°, a fifth. The ten hex spacing is 6.2366°, and the fifty-seventh angular interval is 6.2388°.

A thermal management system for use in a cylindrical desktop computer is described. The thermal management system includes a flow fan including: an impeller including a plurality of blades configured to discharge air having both an axial component and a centrifugal component; and an exhaust A grille surrounds the impeller and defines a plurality of venting apertures through the plurality of venting apertures to exit the mixed flow fan. In the depicted embodiment, the plurality of exhaust vents includes: a plurality of ribs configured to cooperate with the plurality of blades to impart an increase to the air exhausted from the impeller An axial component; and a plurality of stators configured to straighten the air exiting the impeller by substantially removing an omnidirectional component of the air passing through the exhaust grill.

In one embodiment, each of the plurality of stators has a curved geometry that is configured to gradually remove the tangential component from the exhaust air such that substantially no turbulence is avoided. In one embodiment, one of the plurality of blades has a curvature that is opposite to one of the plurality of stators. In one embodiment, an inflatable plate is disposed across an inlet portion of the impeller, the inflatable plate configured to direct air into a central portion of the impeller and act as a shroud to guide through the impeller The air of one of the lower portions faces the exhaust grill. In one embodiment, the impeller further includes a lower ring coupled to a peripheral portion of the impeller, the lower ring configured to provide structural support for the plurality of blades and to add an additional axial component To a portion of the air that it contacts.

In one embodiment, a thrust bearing is configured to stabilize the impeller. In one embodiment, the impeller further includes a undulating portion configured to impart an axial component to the air prior to engagement of the air by the blades.

A heat sink for removing heat from an arithmetic engine, the arithmetic engine including an operational component disposed within a cylindrical volume having a longitudinal axis. The heat sink includes at least a plurality of flat faces enclosing and defining a central thermal region, the central thermal region having a triangular cross-section substantially parallel to the longitudinal axis. In one embodiment, one of the flat faces carries the computing component. In one embodiment, the computing engine has an apparent size corresponding to one of the heat sinks. In one embodiment, the heat sink includes a cooling fin extending along an inner surface of a first flat surface. In one embodiment, the cooling fin extends from the inner surface of the first flat surface to at least one inner surface of a second flat surface and spans the central thermal region.

In one embodiment, a central cooling fin extends from the inner surface of the first flat surface to a junction of the inner surface of the second flat surface and an inner surface of a third flat surface. In one embodiment, the central cooling fins divide the central thermal zone into a first zone and a second zone each having a similar triangular cross section. In one embodiment, a first cooling fin extends from the inner surface of the first planar surface to the inner surface of the second planar surface and spans the first region. In one embodiment, a second cooling fin extends from the inner surface of the first flat surface to the inner surface of the third flat surface and spans the second region. In one embodiment, a first angle between the first cooling fin and the inner surface of the first flat surface varies according to a distance between the first cooling fin and the central cooling fin. In one embodiment, a second angle between the second cooling fin and the inner surface of the first flat surface varies according to a distance between the second cooling fin and the central cooling fin. . In one embodiment, the sum of the first angle and the second angle is equal to about 180°.

A compact computing system includes: a cylindrical outer casing that is enclosed and defined a cylindrical volume of one of the longitudinal axes; a heat sink enclosing at least one central thermal region substantially parallel to the longitudinal axis; and an arithmetic component disposed within the cylindrical volume and supported by the heat sink Thermal contact with the heat sink. In one embodiment, the cylindrical outer casing includes: a first opening at a first end of the cylindrical outer casing, the first opening having a first diameter corresponding to a diameter of one of the cylindrical outer casings; And a top opening at a second end opposite the first end, the top opening having a second diameter. The system also includes a base unit at the first end of the cylindrical outer casing, the base unit engaging the first opening of the cylindrical outer casing and including a support member for supporting the compact computing system and In cooperation with the blower, the incoming airflow can pass through a venting opening, wherein the blower is adjacent the top opening. In one embodiment, the blower incorporates a central airflow and a peripheral airflow, and the blower passes the combined airflow through the top opening and out of the cylindrical outer casing. In an embodiment, the second diameter is smaller than the first diameter.

A desktop computing system includes an outer casing having an axisymmetric shape and a length, and an air passage extending the length of the outer casing. In one embodiment, an arithmetic engine is disposed within the air passage. In one embodiment, a structural core is positioned within the housing, the structural core providing structural support to the computing engine such that the computing engine is in the general shape of the core of the structure. In one embodiment, the structural core includes a heat sink that facilitates removal of heat from the computing engine. In one embodiment, the heat sink transfers at least some of the heat removed from the computing engine to the air passage. In one embodiment, the outer casing is a cylindrical outer casing. In one embodiment, the air passage is a cylindrical air passage. In one embodiment, the structural core has a triangular shape. In one embodiment, the desktop computing system includes a blower configured to pass air through the length of the air passage.

The various aspects, embodiments, implementations or features of the described embodiments can be used individually or in any combination. Various aspects of the described embodiments can be implemented by software, hardware, or a combination of hardware and software. The described embodiments can also be embodied in computer readable media. A computer readable code that controls manufacturing operations or embodied as a computer readable code on a computer readable medium for controlling manufacturing lines. A computer readable medium is any data storage device that can store data, which can thereafter be read by a computer system. Examples of computer readable media include read only memory, random access memory, CD-ROM, DVD, magnetic tape, optical data storage devices, and carrier waves. The computer readable medium can also be distributed on a computer system coupled to the network, so that the computer readable code is stored and executed in a distributed manner.

For purposes of explanation, the foregoing description uses specific nomenclature to provide a thorough understanding of the present invention. However, it will be apparent to those skilled in the art that no specific details are required in order to practice the present invention. Accordingly, the foregoing description of the specific embodiments of the present invention is presented for purposes of illustration and description. The above description is not intended to be exhaustive or to limit the invention to the precise form disclosed. It will be apparent to those skilled in the art that many modifications and variations are possible in light of the above teachings.

The embodiments were chosen and described in order to best explain the principles of the present invention and the application thereof Example. The scope of the present invention is intended to be defined by the scope of the following claims and their equivalents.

Although the embodiments have been described in terms of a particular embodiment, modifications, substitutions, and equivalents are included within the scope of the general concepts. It should also be noted that there are many alternative ways of implementing the methods and apparatus of the presently-created embodiments. Accordingly, the scope of the following claims is to be construed as including all such modifications, permutations and equivalents in the true spirit and scope of the described embodiments.