Computer internal architecture
Abstract
An internal component and external interface arrangement for a cylindrical compact computing system is described that includes at least a structural heat sink having triangular shape disposed within a cylindrical volume defined by a cylindrical housing. A computing engine having a generally triangular shape is described having internal components that include a graphics processing unit (GPU) board, a central processing unit (CPU) board, an input/output (I/O) interface board, an interconnect board, and a power supply unit (PSU).

Term
No projected expiry on record.
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81 claims: 11 independent, 70 dependent
- 1一種桌上型運算系統,其包含:一外殼,其具有一縱向軸線且界定圍繞該縱向軸線對稱之一內部體積;一運算引擎,其包含一運算組件;及一結構核心,其定位於該內部體積內,該結構核心提供針對該運算引擎之結構支撐。
- 2如請求項1之桌上型運算系統,其中該結構核心包含促進自該運算引擎移除熱之一散熱片。
- 3如請求項2之桌上型運算系統,該散熱片包含複數個平坦面,該複數個平坦面圍封具有一多邊形橫截面之一中心熱區。
- 4如請求項3之桌上型運算系統,其中該運算引擎之一形狀符合該結構核心之一形狀。
- 5如請求項4之桌上型運算系統,其中該中心熱區大體上平行於該縱向軸線。
- 6如請求項5之桌上型運算系統,其中該複數個平坦面中至少一者之一外表面及該外殼之一內表面界定與該中心熱區分開之一周邊熱區。
- 7如請求項6之桌上型運算系統,其中一熱管理系統及該運算引擎合作以使該運算組件之一溫度維持於操作溫度之一預定範圍內。
- 8如請求項7之桌上型運算系統,其中該熱管理系統與該運算引擎之間的該合作包含:與將一周邊氣流引導通過該周邊熱區同時地將一中心氣流引導通過該中心熱區。
- 9如請求項1之桌上型運算系統,其中該外殼包含 n 個側面,其中 n 為具有為至少3之一值的一整數,其中該內部體積包含對應於一 n 邊多邊形之一橫截面。
- 10如請求項1之桌上型運算系統,其中該外殼為圓柱形,且其中該內部體積包含一圓形橫截面。
- 11一種桌上型運算系統,其包含:一圓柱形外殼,其具有一縱向軸線且圍封及界定一內部體積,該內部體積具有一圓形橫截面,該圓形橫截面係以該縱向軸線為中心且由以該縱向軸線為中心且垂直於該縱向軸線之一半徑界定;及一印刷電路板(PCB),其安置於該內部體積內,該PCB包含部分地由平行於該縱向軸線及垂直於該半徑且經定位成沿著該半徑而與該縱向軸線相隔一距離之一主要中心線界定的一形狀。
- 12如請求項11之桌上型運算系統,其中該半徑在該外殼之一內表面處具有一最大徑向距離。
- 13如請求項12之桌上型運算系統,其中該PCB為一互連PCB堆疊中之一個PCB,該堆疊包含:一中央處理單元(CPU)板,其沿著該半徑而定位於一第一徑向距離處,且具有大體上平行於該縱向軸線之一CPU板中心線,且包含裝配於該CPU板之一第一側上的具有一CPU中心線之一CPU,該CPU中心線大體上平行於該CPU板中心線,該CPU板包含位於一第一末端處之一電力輸入節點,及位於與該第一末端相對之一第二末端處的包含一或多個寬頻寬邊緣連接器之一資料節點,其中該第一末端及該第二末端定位於該CPU主要中心線之相對末端處;及一電力供應單元,其耦接至該CPU板且經配置以將一或多個直流電(DC)電壓提供至該電力輸入節點。
- 14如請求項13之桌上型運算系統,其中該互連PCB堆疊進一步包含:一輸入/輸出(I/O)介面板,其定位於大於該第一徑向距離之一第二徑向距離處,該第一徑向距離及該第二徑向距離中每一者小於該最大徑向距離,該I/O介面板包含:至一或多個外部系統之複數個高速資料埠;及一I/O介面面板,其包含複數個可照明I/O埠,該複數個可照明I/O埠中至少一者對應於該複數個高速資料埠中之一者,其中當一感測器偵測到該桌上型運算系統之移動時,照明用於該複數個可照明I/O埠中至少一些之一照明圖案顯示指示器。
- 15如請求項14之桌上型運算系統,其進一步包含:一可撓性I/O壁子總成,其裝配於該I/O介面面板之一內表面上,該可撓性I/O壁子總成經組態以根據由一感測器偵測之一移動來接收一照明控制信號。
- 16如請求項15之桌上型運算系統,該可撓性I/O壁子總成進一步包含:一發光二極體(LED),其藉由產生一光而對該照明控制信號作出回應;及一分組光導,其經定位成鄰近於該複數個I/O埠中至少一者,且經組態以通過該I/O介面面板之一外表面上之一不透明層的一開口而接收及導引由該LED產生之該光。
- 17如請求項16之桌上型運算系統,其中鄰近於該分組光導的該介面面板之一第一部分對於該光至少部分地透明。
- 18如請求項17之桌上型運算系統,其中鄰近於該介面面板之該第一部分且鄰近於該複數個I/O埠中之該至少一者的該介面面板之一第二部分對於該光不透明。
- 19如請求項18之桌上型運算系統,其中該介面面板之該第一部分包括該照明圖案顯示指示器。
- 20如請求項19之桌上型運算系統,其中該介面面板之該第二部分阻擋該光免於自該複數個I/O埠中之該至少一者發出。
- 21如請求項20之桌上型運算系統,該移動包含一旋轉移動及一平移移動中至少一者。
- 22如請求項18之桌上型運算系統,其中鄰近於該介面面板之該第一部分且鄰近於該至少一個I/O埠的該介面面板之該第二部分對於該光不透明。
- 23一種桌上型運算系統,其包含:一外殼,其具有圍繞一縱向軸線對稱之一形狀;一空氣通路,其跨越該外殼之一整個長度;及一運算組件,其安置於該空氣通路內。
- 24如請求項23之桌上型運算系統,其進一步包含一散熱片,該散熱片安置於該空氣通路內且與該運算組件進行熱接觸。
- 25如請求項24之桌上型運算系統,其中該散熱片包含界定對應於一多邊形之一橫截面的複數個平坦面,且其中該運算組件裝配至該複數個平坦面中之一者。
- 26如請求項25之桌上型運算系統,其中該外殼之該形狀為圓柱形,且該多邊形為一三角形。
- 27一種桌上型運算系統,其包含:一運算引擎,其定位於一圓柱形外殼內,該圓柱形外殼界定具有一縱向軸線之一圓柱形體積;及一熱管理系統,其與該運算引擎密切地耦接,其中該熱管理系統即時直接地對該運算引擎之一活動等級之一改變作出回應。
- 28如請求項27之桌上型運算系統,其中該熱管理系統包含經組態以使某一量之空氣移動通過該圓柱形體積的一鼓風機。
- 29如請求項28之桌上型運算系統,其中該熱管理系統進一步包含定位於該圓柱形體積內之一結構核心,該結構核心包含一冷卻翼片,該冷卻翼片將熱傳送至移動通過該圓柱形體積的該量之空氣之一部分。
- 30如請求項29之桌上型運算系統,其中該結構核心進一步包含提供針對該運算引擎之結構支撐的一結構支撐件。
- 31如請求項30之桌上型運算系統,其中該結構核心進一步包含一散熱片,該散熱片包含複數個平坦面,該複數個平坦面界定具有一三角形橫截面之一中心熱區。
- 32如請求項31之桌上型運算系統,其中該中心熱區大體上平行於該縱向軸線。
- 33如請求項32之桌上型運算系統,其中該運算引擎之一總體形狀符合該散熱片之一總體形狀。
- 34如請求項33之桌上型運算系統,其中該冷卻翼片跨越該中心熱區。
- 35如請求項34之桌上型運算系統,其中該運算引擎之該活動等級對應於一運算處理速率。
- 36如請求項35之桌上型運算系統,其中熱管理系統指導該鼓風機以與該運算引擎之該活動等級相稱的一速度來提供通過該中心熱區的該量之空氣。
- 37如請求項36之桌上型運算系統,其中該圓柱形體積包含跨越該圓柱形外殼之一整個長度的一空氣通路。
- 38如請求項37之桌上型運算系統,其中該鼓風機經組態以:自該圓柱形外殼外部吸取該量之空氣,且使該量之空氣移動至該空 氣通路中;使該量之空氣移動通過該空氣通路;及將該量之空氣自該空氣通路排出至一外部環境。
- 39如請求項38之桌上型運算系統,其中移動通過該空氣通路之空氣之該量係根據該運算引擎之該活動等級。
- 40如請求項37之桌上型運算系統,其中該空氣通路包含一中心空氣通路及一周邊空氣通路。
- 41如請求項40之桌上型運算系統,其中該量之空氣係在該中心空氣通路與該周邊空氣通路之間分裂。
- 42一種包含於一桌上型運算系統中之記憶體模組機構,該記憶體模組機構包含:一對末端導引件,其包含一第一末端導引件及一第二末端導引件,該對末端導引件係由一支撐構件連接,每一末端導引件包括一狹槽以固持一記憶體模組之一末端且將該記憶體模組引導至裝配於一電路板上之一插口;一鎖定機構,其經組態以提供該記憶體模組機構在一解除鎖定位置與一鎖定位置之間的旋轉;及一致動器,其附接至該對末端導引件中之一第一末端導引件,其中一使用者藉由將一力施加至該致動器或該支撐構件來致動該記憶體模組機構之一旋轉及鎖定功能,藉此使該記憶體模組機構在該解除鎖定位置與該鎖定位置之間旋轉。
- 43如請求項42之記憶體模組機構,其中該記憶體模組機構在處於該解除鎖定位置中時允許該記憶體模組之插入及移除,且在處於該鎖定位置中時限定該記憶體模組之插入及移除。
- 44如請求項43之記憶體模組機構,其中該記憶體模組機構回應於在該記憶體模組機構處於該鎖定位置中時施加至該致動器或該支撐構件之該力而提供該記憶體模組機構在一第一旋轉方向上 之一超程旋轉。
- 45如請求項44之記憶體模組機構,其中該記憶體模組機構進一步包含:一彈簧負載機構,其用以使該記憶體模組機構回應於該超程旋轉而在與該第一旋轉方向相對之一第二旋轉方向上自該鎖定位置旋轉至該解除鎖定位置。
- 46如請求項42之記憶體模組機構,其中該鎖定機構包含形成一可移動鏈接總成之複數個互連桿。
- 47如請求項42之記憶體模組機構,其中該支撐構件經組態以提供結構支撐,及促進被施加至與該第一末端導引件相對之該第二末端導引件之一力之一部分的傳送且抵抗該記憶體模組機構之扭轉。
- 48如請求項42之記憶體模組機構,其中記憶體模組機構容納一雙同軸記憶體模組。
- 49如請求項48之記憶體模組機構,其中記憶體模組機構容納具有為133mm之一近似長度的該雙同軸記憶體模組。
- 50如請求項42之記憶體模組機構,其中該記憶體模組機構在該解除鎖定位置中允許該記憶體模組之插入及移除,且在該鎖定位置中限定該記憶體模組之插入及移除。
- 51一種桌上型運算系統,其包含:一外殼,其具有一內表面,該內表面界定具有縱向軸線之一圓柱形體積;及一運算引擎,其包含裝配至一印刷電路板(PCB)之一運算組件,該運算引擎定位於該圓柱形體積內且具有垂直於該縱向軸線之一大體上三角形橫截面。
- 52如請求項51之桌上型運算系統,其中該運算引擎具有一大體上 三角形橫截面且經組態成以一活動等級進行操作。
- 53如請求項52之桌上型運算系統,其中該三角形橫截面垂直於該縱向軸線。
- 54如請求項53之桌上型運算系統,其進一步包含一熱管理系統,該熱管理系統對該運算引擎之該活動等級之一改變作出回應。
- 55如請求項54之桌上型運算系統,該熱管理系統包含定位於該圓柱形體積內之一結構核心,其中該運算引擎具有根據該結構核心之一總體形狀的一總體形狀。
- 56如請求項55之桌上型運算系統,其中該結構核心提供針對該運算引擎之結構支撐。
- 57如請求項56之桌上型運算系統,其中該結構核心包含:一散熱片,其包含界定一中心熱區之複數個平坦面;及一冷卻翼片堆疊,其包含跨越該中心熱區之一冷卻翼片。
- 58如請求項57之桌上型運算系統,其中該結構核心包含位於兩個平坦面之一接面處且延伸該結構核心之一長度的一垂直支柱。
- 59如請求項58之桌上型運算系統,其中該中心熱區延伸該圓柱形體積之一中心部分且平行於該縱向軸線。
- 60如請求項59之桌上型運算系統,其中該冷卻翼片自一第一平坦面之一內表面延伸至一第二平坦面之至少一內表面。
- 61如請求項60之桌上型運算系統,其中該熱管理系統進一步包含經組態以使空氣移動通過該中心熱區之一鼓風機。
- 62如請求項61之桌上型運算系統,其中該鼓風機藉由逐步增大或逐步減小傳遞通過該散熱片之一氣流而對該運算引擎之該活動等級之該改變作出回應。
- 63如請求項62之桌上型運算系統,其中該逐步增大或逐步減小該氣流包含指導該鼓風機提供通過該散熱片的每單位時間的某一 體積之空氣,該體積係與該運算引擎之該活動等級相稱。
- 64一種桌上型運算系統,其包含:一外殼,其具有一縱向軸線,該外殼圍封及界定圍繞該縱向軸線對稱之一內部體積;一運算引擎,其安置於該內部體積內;及一結構散熱片,其定位於該內部體積內,該結構散熱片提供針對該運算引擎之結構支撐,使得該運算引擎之一形狀對應於該結構散熱片之一形狀,且其中該結構散熱片促進自該內部體積移除熱。
- 65如請求項64之桌上型運算系統,該結構散熱片包含複數個平坦面。
- 66如請求項65之桌上型運算系統,其中該複數個平坦面圍封具有一橫截面之一中心熱區,該橫截面具有一多邊形之一形狀。
- 67如請求項66之桌上型運算系統,其中該多邊形之該形狀為三角形。
- 68如請求項67之桌上型運算系統,其中該中心熱區具有大體上平行於該縱向軸線之一主要長度。
- 69如請求項68之桌上型運算系統,其中該複數個平坦面之一外表面及該外殼之一內表面界定與該中心熱區分離之一周邊熱區。
- 70如請求項69之桌上型運算系統,其中該結構散熱片使該運算引擎之一溫度維持於操作溫度之一預定範圍內。
- 71如請求項64至70中任一項之桌上型運算系統,其中該外殼具有一圓柱形形狀,且其中該內部體積具有一圓柱形形狀。
- 72如請求項71之桌上型運算系統,其進一步包含一鼓風機,該鼓風機經組態以與使一周邊氣流移動通過該周邊熱區同時地使一中心氣流移動通過該中心熱區。
- 73如請求項72之桌上型運算系統,其中由該鼓風機移動之空氣的一量取決於該運算引擎之一活動等級。
- 74一種桌上型運算系統,其包含:一外殼,其界定一內部空間;一空氣通路,其定位於該內部空間內,該空氣通路具有跨越該外殼之一整個長度的一長度;及一運算組件,其安置於該空氣通路內,其中移動通過該空氣通路之空氣的一量係根據該運算組件之一當前操作。
- 75如請求項74之桌上型運算系統,其進一步包含一鼓風機,該鼓風機經組態以使該量之空氣沿著該空氣通路之該長度移動。
- 76如請求項75之桌上型運算系統,其中該空氣通路包含一中心空氣通路及一周邊空氣通路。
- 77如請求項76之桌上型運算系統,其中該中心空氣通路及該周邊空氣通路合作以使該運算組件維持於溫度之一操作範圍內。
- 78如請求項74之桌上型運算系統,其中該外殼具有一縱向軸線。
- 79如請求項78之桌上型運算系統,其中該內部空間圍繞該縱向軸線對稱。
- 80如請求項79之桌上型運算系統,其中該空氣通路平行於該縱向軸線。
- 81如請求項80之桌上型運算系統,其中該外殼及該內部空間為圓柱形。
Independent claims81
182 paragraphs in 1 section, as filed
Computer internal structure
COMPUTER INTERNAL ARCHITECTURE
The embodiments described herein are generally about compact computing systems. More specifically, this embodiment relates to the structure and organization of internal components and external interfaces used in a compact computing system.
The appearance size of the compact computing system (including the external shape and configuration of its internal components) can determine the achievable computing power density. The dense packaging of high-speed computing components can provide significant challenges in maintaining thermal stability under changing environmental conditions. In addition, users of sophisticated computing systems can expect moderate to low operating sound levels and ready access to replaceable components. As storage density and other computing support components continue to improve, users may also need to expand capabilities to provide customization and upgrades.
One design challenge associated with the manufacture of compact computing systems is the configuration of structural components and functional components with proper heat transfer and acceptable sound levels when used in a fully functional operating state. An additional design challenge is to provide user maintenance and ready expansion capabilities of selected components to supplement the processing and/or storage capabilities of the sophisticated computing system. Generally available expandable designs (for example, based on rectangular box-shaped computing towers) can be restricted in terms of proper airflow and/or require complex heat transfer mechanisms for multiple internal computing units. A "tower"-based computer may include expansion space at the expense of an enlarged outer casing, which always has a substantial "dead space". Instead, the current portable computing system provides a high degree of sophistication with limited expansion capabilities, complex component replacement, and minimal user customization Type design.
This application describes various embodiments of systems and methods for providing a lightweight, durable, and compact computing system with a cylindrical cross-section. This situation can be realized at least in part through a general computing system configuration of internal components that cooperates with the overall housing to provide a compact computing system with high computing power density in a compact and durable enclosure.
A desktop computing system includes: a housing having a longitudinal axis and defining an internal volume symmetrical around the longitudinal axis; a computing engine including a computing component; and a structural core positioned in the internal volume , The structural core provides structural support for the computing engine.
A desktop computing system includes: a housing having a longitudinal axis and an inner surface, the housing defining an internal volume symmetrical about the longitudinal axis; and an arithmetic engine, which includes an arithmetic component, and the arithmetic engine is positioned at Within the internal volume, the internal volume includes a cross section having a polygonal shape and perpendicular to the longitudinal axis.
A desktop computing system includes: a cylindrical housing having a longitudinal axis and enclosing and defining an internal volume, the internal volume having a circular cross-section, the circular cross-section is centered on the longitudinal axis and Defined by a radius centered on the longitudinal axis and perpendicular to the longitudinal axis; and a printed circuit board (printed circuit board, PCB), which is disposed in the internal volume, the PCB including partly formed by parallel to the longitudinal axis And a shape defined by a major centerline perpendicular to the radius and positioned along the radius at a distance from the longitudinal axis.
A method for instructing a movement of a desktop computing system includes at least the following operations: detecting the movement of the desktop computing system by a sensor; according to the movement, the sensor sends a motion detection signal Provided to a processor; in response to the motion detection signal, the processor provides an illumination control signal to a light emitting diode (light emitting diode). diode, LED) an I/O interface panel; in response to the lighting control signal, the LED generates a light; and at least some of the light is used to illuminate an I/O port, thereby instructing the desktop computing system The move.
A desktop computing system includes: a housing having a shape symmetrical about a longitudinal axis; an air passage spanning an entire length of the housing; and a computing component arranged in the air passage.
This creation describes a computer architecture that includes internal components and external interface configurations for a compact computing system. The internal component and external interface configuration includes: a structural heat sink having a longitudinal axis and providing structural support for a computing engine with a computing component, the structural heat sink including flat surfaces, the flat surfaces defining a vertical In a central zone of a polygonal cross section of the longitudinal axis, and at least one of the flat surfaces carries the computing component; and a cooling element that connects an inner surface of a first flat surface to at least An inner surface of a second flat surface crosses the central zone.
This creation describes a method for illuminating a lighting pattern display indicator of a group of I/O ports on an input/output (I/O) interface panel of a compact computing system. The method is performed by the following steps: detecting at least one of a rotational movement and a translational movement of the compact computing system; providing a lighting control signal to an I/O flexible wall assembly, the I /O The flexible wall assembly is assembled on an inner surface of the I/O interface panel of the compact computing system; and in response to the provided lighting control signal, one or more light-emitting diodes (LED ) So that a light beam guided by a grouped light guide positioned adjacent to the set of I/O ports transmits through a laser etched opening of a paint layer on an outer surface of the interface panel, wherein the laser etched The opening surrounds the set of ports, and wherein a first portion of the interface panel adjacent to the grouping light guide is at least partially transparent to the light beam, and wherein the first portion adjacent to the interface panel and adjacent to at least one of the set of ports A second part of the interface panel of the port is opaque to the light beam.
A mechanism for rotating and locking a memory module includes: a pair of end guides, which are Connected by a supporting member, each end guide includes a slot to hold an end of a memory module and guide the memory module to a socket assembled on a circuit board; a locking mechanism, which Is configured to provide rotation of the memory module mechanism between an unlocked position and a locked position; an actuator, which is attached to a first end guide of the pair of end guides, wherein A user activates a rotation and locking function of the memory module mechanism by applying a pressing force to the actuator or the supporting member, thereby causing the memory module mechanism to be in the unlocked position and Rotate between the locked positions; and the support member, which is configured to provide structural support to transmit a portion of the pressing force applied to the actuator to an end guide opposite to the actuator and Resist the torsion of the memory module mechanism. The memory module mechanism allows the insertion and removal of the memory module when in the unlocking position, and restricts the insertion and removal of the memory module when in the locked position.
A desktop computing system includes: a computing engine positioned in a cylindrical housing defining a cylindrical volume with a longitudinal axis; and a thermal management system closely coupled to the computing engine Then, the thermal management system directly responds to a change in one of the activity levels of the computing engine in real time.
A memory module mechanism includes: a pair of end guides, including a first end guide and a second end guide, the pair of end guides are connected by a supporting member, and each end guide The lead includes a slot to hold an end of a memory module and guide the memory module to a socket assembled on a circuit board; a locking mechanism configured to provide the memory module The rotation of the mechanism between an unlocked position and a locked position; and an actuator, which is attached to one of the pair of end guides, the first end guide, in which a user applies a force The actuator or the supporting member activates a rotation and locking function of the memory module mechanism, thereby causing the memory module mechanism to rotate between the unlocked position and the locked position.
A desktop computing system includes: a housing with an inner surface, and the housing Defining a cylindrical volume with a longitudinal axis; and an arithmetic engine, which includes an arithmetic component assembled to a printed circuit board (PCB), the arithmetic engine is positioned in the cylindrical volume and has a vertical axis Roughly triangular in cross section.
A desktop computing system includes: a housing having a longitudinal axis, the housing enclosing and defining an internal volume symmetrical around the longitudinal axis; a computing engine arranged in the internal volume; and a structural heat sink , Which is positioned in the internal volume, the structural heat sink provides structural support for the computing engine, so that a shape of the computing engine corresponds to a shape of the structural heat sink, and wherein the structural heat sink promotes from the internal volume Remove heat.
A compact desktop computing system includes: a housing having a longitudinal axis, the longitudinal axis having a length L, wherein the housing encloses and defines an internal space, the internal space is symmetric about the longitudinal axis and has a volume V; an arithmetic engine, which is positioned in the internal space; and a thermal management system, which is closely coupled with the arithmetic engine, wherein the thermal management system enables the arithmetic engine to operate at an arithmetic processing rate.
A desktop computing system includes: a housing defining an internal space; an air passage positioned in the internal space, the air passage having a length spanning an entire length of the housing; and a computing component, which It is arranged in the air passage, and an amount of air moving through the air passage is based on the current operation of one of the arithmetic components.
For those who are familiar with this technology, after checking the following figures and detailed description, other devices, methods, features and advantages of this creation will be obvious or will become obvious. It is hoped that all these additional systems, methods, features, and advantages are included in this description, are within the scope of this creation, and are protected by the scope of the accompanying patent application.
<p>100Compact computing system</p><p>102External shell</p><p>104Entrance/Base Unit</p><p>106Exit/Handle</p><p>108Mechanical latch</p><p>110Interface Panel</p><p>112Alternating current (AC) power input port</p><p>114Video port</p><p>116Audio port</p><p>118Bus port</p><p>120Expansion port</p><p>122Network port</p><p>124Power switch</p><p>200Central Core</p><p>202Decorative shield</p><p>204Exhaust air flow</p><p>206Contact surface</p><p>208Bottom gasket</p><p>210Vertical long axis</p><p>212Vertical touch point</p><p>214 Surrounding airflow</p><p>216Memory Module</p><p>218Exhaust Assembly</p><p>300Exploded diagram</p><p>302Wireless Subsystem</p><p>304Impeller</p><p>306Graphics Processing Unit (GPU) Board</p><p>308Solid State Drive</p><p>310Structural core/heat sink</p><p>311Cooling fins</p><p>311-1Center cooling fin</p><p>311-2First cooling fin</p><p>311-3Second cooling fin</p><p>312Steam chamber assembly</p><p>314Vertical pillar</p><p>316Interconnect board</p><p>318Central Processing Unit (CPU) Board</p><p>320Dual coaxial memory module (DIMM) mechanism</p><p>322Power Supply Unit (PSU)</p><p>324Input/Output (I/O) Board</p><p>326Input/output (I/O) sub-assembly cover</p><p>328Air chamber plate</p><p>400First side</p><p>402Central Assembly Central Processing Unit (CPU)</p><p>404Low profile thermal module</p><p>406Open</p><p>408Open</p><p>410 Central Processing Unit (CPU) Board Edge Connector</p><p>412Direct Current (DC) Input</p><p>414DC/DC adjustment section</p><p>500Second side</p><p>502Central Processing Unit (CPU) Spring</p><p>504Fastener</p><p>506Fastener</p><p>508Flexible metal belt</p><p>509Support board</p><p>510Flexible Metal Belt</p><p>602Attachment point</p><p>604Socket</p><p>610First flat surface</p><p>612Second flat surface</p><p>614Third flat surface</p><p>700Cross-sectional view</p><p>800First side</p><p>802Graphics Processing Unit (GPU)</p><p>804Video Random Access Memory (VRAM)</p><p>806Graphics processing unit (GPU) direct current (DC) input</p><p>900Second side</p><p>902Graphics Processing Unit (GPU) Thermal Module Spring</p><p>904Graphics Processing Unit (GPU) Rigid Flex Connector Socket</p><p>1000Cross-sectional view</p><p>1100Perspective</p><p>1102Dual coaxial memory module (DIMM) connector base</p><p>1104Dual coaxial memory module (DIMM) mechanism actuator</p><p>1200Perspective</p><p>1202torsion bar</p><p>1204Dual coaxial memory module (DIMM) guide</p><p>1300Front perspective view</p><p>1302Push/push dual coaxial memory module (DIMM) locking mechanism</p><p>1310Back perspective view</p><p>1320Dual coaxial memory module (DIMM) mechanism</p><p>1322First Actuator</p><p>1324Second Actuator</p><p>1326Pivot</p><p>1328Locking mechanism</p><p>1400Front perspective view</p><p>1410Rear perspective view</p><p>1500First end view</p><p>1502Latch orientation</p><p>1504Change orientation</p><p>1506Unlock orientation</p><p>1508surface</p><p>1510surface</p><p>1512Offset mechanism</p><p>1514surface</p><p>1516Locking feature</p><p>1518First member</p><p>1520Second member</p><p>1522Pin</p><p>1524Slot</p><p>1600Top view</p><p>1602Exhaust Assembly Shell</p><p>1604antenna</p><p>1606Top cover of wireless processing circuit system</p><p>1608Antenna cable</p><p>1610Magnet</p><p>1612Conductive gasket</p><p>1614Impeller assembly point</p><p>1700Top view</p><p>1702Wireless Processing Circuit System Board</p><p>1704Wireless Intermediary Laminate</p><p>1706Wireless processing circuit system interconnection</p><p>1708Wireless antenna connection point</p><p>1800Top perspective view</p><p>1804Secondary antenna cable</p><p>1806Secondary antenna housing</p><p>1900Looking up perspective view</p><p>1902Wireless processing circuit system</p><p>2000Perspective</p><p>2002Light-Emitting Diode (LED) Flex Cable</p><p>2004Alternating Current (AC) Power Cable</p><p>2100Perspective</p><p>2102Input/Output (I/O) Board</p><p>2104Input/Output (I/O) Rigid Flex Connector</p><p>2200Front view</p><p>2202Can be illuminated icon</p><p>2204Lighting pattern</p><p>2206Alternating current (AC) power inlet opening</p><p>2300Front view</p><p>2302Illustrated light guide</p><p>2304Picture light emitting diode (LED)</p><p>2306Grouping light guide</p><p>2308Group Light-Emitting Diode (LED)</p><p>2310Input/output flexible wall assembly</p><p>2400Back view</p><p>2500Back view</p><p>2502Port opening</p><p>2504Light transparent zone</p><p>2506Light blocking zone</p><p>2508White paint layer</p><p>2510Cross-sectional view</p><p>2512Black paint layer</p><p>2514Laser etching opening</p><p>2516Light Emitting Diode (LED) Light</p><p>2600Method</p><p>2602The first step</p><p>2604Second step</p><p>2606The third step</p><p>2700Compact computing system</p><p>2702Shell</p><p>2704First opening</p><p>2706Second opening</p><p>2708Exhaust lip</p><p>Part 2710</p><p>2712Part</p><p>2714Exhaust air flow</p><p>2716Base unit</p><p>2718Lower conductive gasket</p><p>2720Top conductive gasket</p><p>2722Vent</p><p>2724Inlet airflow</p><p>d<sub>1</sub>diameter</p><p>d<sub>2</sub>diameter</p><p>F<sub>1</sub>First force</p><p>F<sub>2</sub>Latching force</p><p>F<sub>BIAS</sub>Biasing force</p><p>IThe first zone</p><p>IISecond Zone</p><p>r<sub>i</sub>Inner radius</p><p>r<sub>o</sub>Outer radius</p><p>tThickness</p><p>X<sub>1</sub>distance</p><p>X<sub>2</sub>distance</p><p>Φ<sub>1</sub>The first angle</p><p>Φ<sub>2</sub>Second Angle</p>
The drawings included are for illustrative purposes, and are only used to provide examples of possible structures and configurations for the disclosed creative devices and methods for providing a sophisticated computing system. These schemes by no means limit that those who are familiar with this technique can not deviate from the spirit and scope of this creation. Any changes in the form and details of this creation under the circumstances. The embodiments will be easily understood by the following detailed description in conjunction with the accompanying drawings, in which similar reference numerals denote similar structural elements.
Figure 1 illustrates a perspective external view of a compact computing system according to some embodiments.
Figure 2 illustrates the central core of the internal components of a compact computing system according to some embodiments.
Figure 3 illustrates an exploded view of the central core of the internal components of the compact computing system according to some embodiments.
Figure 4 illustrates a view of the first side of a central processing unit (CPU) board according to some embodiments.
Figure 5 illustrates a view of the second side of the CPU board attached to the structural core/heat sink according to some embodiments.
6 illustrates a top view of a CPU board assembled to the structural core/heat sink of a compact computing system according to some embodiments.
FIG. 7 illustrates a cross-sectional view of a CPU board assembled to the structural core/heat sink of a compact computing system according to some embodiments.
Figure 8 illustrates a view of the first side of a graphics processing unit (GPU) board according to some embodiments.
Figure 9 illustrates a view of the second side of the GPU board according to some embodiments.
10 illustrates a cross-sectional view of a GPU board assembled to a structural core/heat sink of a compact computing system according to some embodiments.
Figure 11 illustrates a perspective view of a CPU board according to some embodiments, the CPU board including a DIMM mechanism attached to the CPU board.
Figure 12 illustrates another perspective view of a CPU board according to some embodiments, the CPU board including a DIMM mechanism attached to the CPU board.
Figures 13A-13C illustrate perspective views of various embodiments of the DIMM mechanism.
Figure 14 illustrates a front perspective view and a rear perspective view of an end of a DIMM mechanism according to some embodiments.
15A to 15D illustrate views of an embodiment of the DIMM mechanism in the unlocked position and the locked position.
Figure 16 illustrates a top view of a wireless subsystem of a compact computing system according to some embodiments.
Figure 17 illustrates another top view of a wireless subsystem of a compact computing system according to some embodiments.
Figure 18 illustrates a top perspective view of components of a wireless subsystem of a compact computing system according to some embodiments.
Figure 19 illustrates a bottom perspective view of a wireless subsystem of a compact computing system according to some embodiments.
Figure 20 illustrates a perspective view of an input/output assembly coupled to a top-mounted blower assembly according to some embodiments.
Figure 21 illustrates another perspective view of the input/output assembly coupled to the top-mounted blower assembly according to some embodiments.
FIG. 22 illustrates a front view of an interface panel of a compact computing system according to some embodiments.
FIG. 23 illustrates a front view of an input/output flexible wall assembly for an interface panel of a compact computing system according to some embodiments.
24 illustrates a rear view of the input/output flexible wall assembly attached to the rear of the interface panel of the compact computing system according to some embodiments.
FIG. 25 illustrates a rear view and a cross-sectional view of a part of an interface panel of a compact computing system according to some embodiments.
FIG. 26 illustrates a method for illuminating an illumination pattern in response to detecting movement of a smart computing system according to some embodiments.
Figure 27 shows a perspective view of an embodiment of a compact computing system in a stand-alone and upright configuration.
This section provides representative applications of the devices and methods according to the currently described embodiments. These examples are provided to merely add context and to aid understanding of the described embodiments. Therefore, it will be obvious to those familiar with the art that the currently described embodiments can be practiced without some or all of these specific details. In other examples, well-known program steps have not been described in detail in order to avoid unnecessarily obscuring the currently described embodiments. Other applications are possible, so that the following examples should not be considered restrictive.
The following content is about a compact computing system that can be configured as a stand-alone device for placement on a work surface (for example, a workbench or table), under a work surface, or placed adjacent to Work surface. The compact computing system can be called a desktop computer. The compact computing system may include multiple internal electronic components, including at least one central processing unit (CPU) board, one or more graphics processing unit (GPU) boards, and other primary internal components and secondary internal components. Although the internal electronic components are generally rectangular in shape, the compact computing system may be in a non-rectangular form. One or more internal electronic component boards can be shaped to match the surface of the outer casing of a compact computing system, including, for example, a circular shape to match the top or bottom of a cylinder, or to match The curved shape of the segment of the arc of the curved outer surface of the outer casing. In the representative embodiment as described herein, the compact computing system can be cylindrical in shape and can be configured to configure a number of rectangular electronic components as a central core that is characterized as having high components Package density (number of components per usable volume) appearance size. The resulting compact computing system can provide high computing power density in a small, lightweight, and transportable appearance size. In some embodiments, the compact computing system can also be coupled to other compact computing systems to form a multi-computer system, which can be used as a server computer system (such as in a data server array (data farm)) or used as a network operation with each sophisticated computing system as a node (or nodes) Computing system.
In a specific embodiment, the compact computing system may include an integral housing that surrounds and protects the central core. The integral casing can be easily removed for user maintenance. The integral shell may be formed of aluminum, which has an anodized aluminum oxide layer that both protects the shell and enhances heat transfer for cooling the central core. Aluminum has several attributes that make it a good choice for overall housings. For example, aluminum is a good electrical conductor that can provide a good electrical ground; it can be easily processed and has well-known metallurgical properties. The excellent electrical conductivity of aluminum provides base grounding for internal electrical components that are configured to fit and operate in the housing. The aluminum housing also provides good electromagnetic interference (EMI) shielding, thereby protecting sensitive electronic components from external electromagnetic energy, and reducing the amount of electromagnetic energy emitted from internal components in the compact computing system from penetrating the housing , Thereby contributing to help achieve good electromagnetic compatibility (EMC).
The aluminum oxide layer can be formed on the aluminum surface in a process called anodization. In some cases, the aluminum oxide layer may be dyed or impregnated with one or more colors to present one or more specific colors. It should be noted that since aluminum oxide is a good electrical insulator, the inner surface of the housing is shielded during the anodization process to maintain the bare metal state of the bulk material in the shielded zone, or selected parts of the aluminum oxide layer are removed to provide a suitable On the surface of the electrical contact. As a solid metal structure, the aluminum monolithic shell can partially provide thermal cooling when the compact computing system is operating. The anodization process applied to the surface of the housing can improve the heat dissipation caused by the heat radiation from the outer surface of the compact computing system by increasing the infrared emissivity of the anodized surface.
As mentioned above, the housing can take many forms, however, for the remainder of this discussion, without loss of generality, the external housing presents the structural components, internal processing components, internal storage components, internal power conditioning components, and The cylindrical shape of the inner cylindrical center core of the interconnecting component is separated. In order to maximize the thermal cooling of the central core, the outer shell can be electrically coupled to an internal structural component that can act as a rigid structural element and act as a heat sink Selected part of. The outer casing may have a thickness tuned to increase circumferential and axial heat conduction that helps reduce hot spots on the outer surface of the compact computing system.
The thermal management system can utilize a blower that can move a large amount of air axially through the internal volume defined by the housing in an efficient and quiet manner, which can be used to cool the central core of the compact computing system. Generally speaking, when the main components such as the central processing unit (CPU) and/or graphics processing unit (GPU) are not used in large quantities, the blower can provide an airflow of about 15 to 20 cubic feet per minute (CFM). The volume of air per unit time. However, when the processing demand increases, the blower can compensate for any increase in heat generated by gradually increasing the air flow. For example, in response to increased demand for processing resources from either or both of the CPU and/or GPU, the blower can increase the airflow from about 15 to 20 CFM to about 25 to 30 CFM (at a temperature of about 25°C). (At room temperature), where the sound output is about 35 dbA (note that the blower only experiences this sound level when it is performed at the higher end of its operating range during periods of high demand and not during more normal operation). It should be noted that at higher ambient temperatures (35°C), the blower can gradually increase the airflow even further to compensate for the reduced heat transfer at higher ambient temperatures. In this case, the blower can gradually increase the airflow to about 35 to 40 CFM or more, thereby having a higher sound output of 40 dbA or more.
The separation between the central core and the shell allows the internal bypass of the peripheral airflow to cool a part of the outer shell, thereby helping to minimize the temperature of the shell. In one embodiment, the outer housing may be paired with a base unit that partially provides a pedestal for supporting a sophisticated computing system including an inner cylindrical center core when placed upright on a work surface. The outer casing may include a first opening having a size and shape according to the base unit. The first opening can provide a full-perimeter air inlet (for example, through a circumferential opening in the base unit), and even in those cases where the compact computing system is positioned in the corner or is positioned against the wall, the circular shape The design can still allow full functionality and proper air inlets. In an assembled configuration, the base unit corresponds to the base of the cylinder. The first opening can be used from the external environment Accepts the airflow passing through the vents in the base unit. The amount of air flowing into the housing can be related to the pressure difference between the external environment and the interior of the compact computing system generated by the blower assembly. The blower assembly can be placed next to the second opening, and the second opening is axially disposed at the end opposite to the first opening.
In one embodiment, the blower assembly may take the form of a fan assembly. The fan assembly may be an axial fan assembly configured to move air axially through the housing by generating the aforementioned pressure difference. The fan assembly can also be configured as a combination of an axial fan assembly and a centrifugal fan assembly. In one embodiment, air can enter the compact computing unit through the vent in the base unit. In one embodiment, the baffle arrangement can bifurcate the airflow so that some of the airflow remains in the central pipe string, which is separated from the bypass peripheral airflow disposed radially outward from the central pipe string. The central pipe column of the air (central airflow) can be thermally engaged with the heat sink structure that can be assembled with one or more internal component boards. Such internal components may include a processing unit plate and / or write memory thereof, these processing units and / or at least some of the memory of the fin structure is thermally coupled to. The bypass peripheral airflow can pass over one side or two side parts of the internal component board, and high-efficiency processing units, memory, solid state disk drives and/or power conditioning components can be installed on these parts. In order to optimize heat transfer, at least some of the components can be configured and assembled axially (in the direction of the airflow) and appropriately spaced apart to maximize the amount of air that engages the components distributed across the internal component plates.
In one embodiment, the vapor chamber in thermal contact with the heat sink structure, placed adjacent to the heat sink structure and/or attached to the heat sink structure can be used to further increase the flow of air from the internal component board to the center. The amount of heat. The high-performance processing unit and/or part of the memory can be thermally coupled via a vapor chamber directly contacting the heat sink structure and/or connected to the heat sink structure. Both the central airflow through the heat sink structure and the bypass airflow across the internal component boards and other internal components can be used to cool the central core of the compact computing system and maintain the external casing at an acceptable touch temperature.
Good electrical grounding (also known as base grounding) can be used to emit significant electromagnetic energy Internal components (for example, main logic board (MLB), internal boards with higher performance computing units, high-throughput interconnects and boards, and/or internal components with high-bandwidth interfaces) and electromagnetic energy Sensitive circuits (such as wireless circuits) are isolated. This electromagnetic isolation can be attributed to the close proximity of the internal components that emit electromagnetic energy and their nearby components that are sensitive to electromagnetic energy, and is particularly important in sophisticated computing systems. In addition, the outer housing may include conductive materials (such as gaskets impregnated with conductive particles), or may be paired with corresponding attachment features on the base unit or top-mounted blower assembly to complete the Faraday cage Other conductive zones formed. The Faraday cage can block electromagnetic energy (both internal and external), thereby effectively shielding the external environment from EMI generated by the sophisticated computing system. In order to complete the Faraday cage, the air vents in the base unit can be sized to effectively block and/or attenuate electromagnetic energy with a certain range of selected wavelengths. More specifically, the wavelength of the electromagnetic energy blocked and/or attenuated by the vent may be the same as the wavelength emitted by the active internal components operating in the compact computing system.
In one embodiment, the smart computing system may include a sensor configured to detect whether the housing is properly positioned and aligned with respect to the internal components. The proper placement of the overall housing is important due to the key roles of the shape and configuration of the overall housing regarding the thermal management of the compact computing system and the completion of the Faraday cage discussed above. The compact computing system may include an interlocking system that detects the presence of the integral casing and the proper alignment of the integral casing with respect to internal components. Only when proper alignment is detected, the interlocking system will allow the internal components to be powered and operate in a manner consistent with the system specifications. In one embodiment, the interlocking system may include magnetic elements that can be detected by a Hall effect sensor only when the housing is in proper position and alignment with respect to the internal components.
At least due to the strong and elastic nature of the material used to form the housing; the housing can include large openings with wide spans that require no additional support structure. This opening can be used to provide access to the input/output panel and the power supply port. The input/output panel may include, for example, data ports suitable for accommodating data cables configured to connect to external systems, such external The system can provide expansion capabilities during input/output data transmission. The opening can also provide access to audio circuits, video display circuits, power input, etc. In one embodiment, one or more data ports (and/or icons representing the data ports and/or data port groupings) can be illuminated to provide information for positioning and connecting to the one or more data ports in the reduced lighting The port is easier to access.
FIG. 1 illustrates a perspective external view of a compact computing system 100 according to some embodiments. The compact computing system 100 can be configured in a shape defined by the outer casing 102. The configuration of the internal components of the compact computing system 100 and the thermal management strategy can be selected to provide a computing intensive computing system with sufficient airflow to allow the compact computing system 100 to be placed in a variety of physical locations Support high-performance computing. In the described embodiment, the outer casing 102 may include a cylindrical shape having a first circular opening at the base of the outer casing 102, and the first circular opening may provide a combination of components for the compact computing system 100 The supported air inlet inlet/base unit 104 is paired. The outer housing 102 can also include a second opening positioned opposite to the first circular opening, and the second opening can be used as a combination of an air exhaust outlet and a carrying handle 106.
When in operation, the blower assembly in the compact computing system 100 allows air to enter through a plurality of circumferential openings positioned in the inlet/base unit 104, pass through the internal structure core/heat sink, and traverse a plurality of component boards , And exit through the exit/handle 106. The size of the core/heat sink of the internal structure, the configuration of multiple internal component boards, the configuration of arithmetic units and memory units on multiple internal component boards, the design of attached power supplies, and the high speed between various internal component boards The configuration of the interconnects can function in unison with the blower assembly to provide a thermal management system that enables a high-performance computing system in a compact and dense geometric configuration that is subject to acceptable touch temperatures The lower package is in the outer casing 102.
The entrance/base unit 104 of the compact computing system 100 can provide support for the compact computing system 100. Therefore, the inlet/base unit 104 can be made of a strong and flexible material (for example, it can also prevent electromagnetic (EM) from being able to radiate during operation in the compact computing system 100). The leakage of metal from the internal components of the EM energy) is formed. Therefore, the inlet/base unit 104 can contribute to shielding internal components from electromagnetic interference (EMI) and contribute to blocking and/or attenuating radiated EM energy to support electromagnetic compatibility (EMC) compliance. The inlet/base unit 104 can be formed of non-metallic compounds, which can be made conductive using, for example, conductive particles embedded therein. In order to ensure that the least electromagnetic energy emitted by the internal components in the compact computing system 100 escapes, a conductive seal can be used to complete the Faraday cage formed at least in part by the inlet/base unit 104 and the outer housing 102.
The inlet/base unit 104 may also include a series of circumferential vents extending around the entire inlet/base unit 104. These vents can provide a suitable amount of air flowing from the external environment to the internal volume of the compact computing system 100. In one embodiment, the amount of air flowing through the vent may be related to the pressure difference across the vent generated by the blower assembly installed in the compact computing system 100. In one embodiment, the blower assembly may be placed near the second opening of the outer casing 102, which forms an outlet/handle 106 for the compact computing system 100, thereby creating a reduced external of the compact computing system 100 The suction effect of the ambient pressure in the housing 102. In addition to promoting airflow, the vents in the inlet/base 104 can also be sized to prevent electromagnetic energy from being transmitted into or out of the assembled compact computing system 100. In some embodiments, the size of the vent in the inlet/base 104 may be related to one or more wavelengths of electromagnetic energy emitted by internal components contained in the smart computing system 100.
The compact computing system 100 may further include an opening in the outer casing 102, and the opening may have a size and shape according to the interface panel 110. The interface panel 110 may include various ports that can be used to communicate data between the compact computing system 100 and various external systems. For example, the interface panel 110 may include a set of audio ports 116 that can be used to provide audio streams to an external audio system (such as earphones, speakers, or audio processors). The set of audio ports 116 can also be used to receive audio streams from external audio systems (for example, microphones or audio recording devices). The interface panel 110 may also include a set of data ports, including a set of bus ports 118. A set of high-speed expansion ports 120, a set of network ports 122, and a set of video ports 114. The set of data ports can be used to transmit data and/or power between one or more external circuits and the compact computing system 100. This set of data ports can be used to accommodate a wide range of data connections according to different wired data communication protocols, for example, one or more Universal Serial Bus (USB) ports 118, one or more Thunderbolt high-speed Expansion port 120, one or more Ethernet ports 122, and one or more high definition media interface (HDMI) ports 114.
The compact computing system 100 can be interconnected to other computing systems through one or more of the data ports provided by the interface panel 110, for example, to data storage devices, portable media players and/or video equipment, To form a network of computing systems. Therefore, the interface panel 110 and the associated data port of the compact computing system 100 can be used to form connections from the compact computing system 100 to a large number and variety of external computing systems and circuits. This situation can be proved when a large number of computing resources are required. Especially useful. In addition, in some representative embodiments and uses, the compact size and shape of the compact computing system 100 can facilitate separation of effective computing networks or data servo arrays.
The interface panel 110 may include a video port 114 that can be used to communicate high-speed video between the compact computing system 100 and an external video monitor or other external video processing circuitry. The interface panel 110 can include a power switch 124 that can be easily used to accept a user's touch for initiating a power-on sequence (for example, including a power-on sequence) and a power-off sequence. In some embodiments, the power switch 124 may be illuminated and provide an activity indication to the user, for example, under software control of the processing unit in the compact computing system 100. The interface panel 110 may include an alternating current (AC) power input port 112. The AC power input port 112 can be sized and shaped to receive a power plug suitable for transmitting external power to the operating electronic components in the outer casing 102. In some embodiments, the compact computing system 100 may include an internal power resource (such as a battery) that can be charged and recharged according to the power delivered through the power input port 112.
The outer casing 102 may include a mechanical latch 108 that can be used to safely couple the outer casing 102 of the compact computing system 100 to the internal structure of the compact computing system 100. The mechanical latch 108 may take the form of a sliding latch that can be manually engaged and disengaged or other such operable mechanisms. In this way, the outer casing 102 can be easily removed to expose the internal components and structures of the compact computing system 100 for user maintenance, upgrade, or repair by a service center. The detection circuit (not shown) of the compact computing system 100 can be used to detect whether the outer casing 102 is properly positioned relative to the internal components and structures. The detection circuit can serve as a useful function, because the thermal management strategy of the compact computing system 100 can depend on the proper placement and placement of the external housing 102 that combines the internal components of the compact computing system 100 and the configuration of the blower assembly. use.
In some embodiments, the detection circuit can determine that the outer casing 102 is not properly placed or aligned with respect to the internal structure or components of the compact computing system 100, and the detection circuit can prevent the compact computing system 100 from operating or at least Prevent the compact computing system 100 from operating at full capacity. In one embodiment, the detection circuit may include a magnet positioned to detect one or more magnets placed on the external housing 102 when the external housing 102 is properly placed and aligned on the compact computing system 100. Sensors (such as Hall-effect devices).
Figure 2 illustrates the central core 200 of the internal components assembled together and positioned on the entrance/base 104 of the compact computing system 100, with the external housing 102 removed. The cylindrical shape of the compact computing system 100 can specify the configuration of various internal components and set the requirements for thermal management. For example, the internal components of the compact computing system 100 can be configured in an axial manner that optimizes both component packaging density (number of operating components per available volume) and computing power density (operating power per available volume). In addition, the axial configuration of the internal components can be optimized. It can be transmitted from the internal components to the central structure heat sink and then to the central airflow (not shown) passing through the central structure heat sink and from the internal components to the cross-internal components. The amount of heat of the surrounding airflow 214. For example, one or more memory modules 216 (for example, dual inline memory module (DIMM)) can be A substrate structure with multiple memory chips assembled. The memory module 216 can be arranged along the long axis 210 of the compact computing system 100 parallel to the peripheral airflow 214, and the peripheral airflow 214 can traverse a plurality of memory chips contained on the memory module 216. In order to optimize the heat transfer from the memory chip to the peripheral air flow 214, in some embodiments, the memory chip may be assembled on the underlying substrate in a manner aligned with the peripheral air flow 214. In this way, an effective heat transfer interface can be formed between the peripheral airflow 214 (which flows inside the outer housing 102) and the memory module 216.
In one embodiment, the central core 200 of the internal components may include an exhaust assembly 218, which may include a blower assembly (not shown) placed closely adjacent to the outlet/handle 106 of the outer housing 102 ), and can provide an exit path for the exhaust airflow 204. The blower assembly of the exhaust assembly 218 can combine two of the following to form the exhaust airflow 204: a central airflow (not shown), which passes through the central structure fins of the central core 200 of the internal components; and a peripheral airflow 214, which Go over the internal component board and other internal components. The exhaust assembly 218 can direct the exhaust airflow 204 toward the outlet/handle 106, and at least a portion of the outlet/handle 106 can facilitate the transfer of heat generated by the internal components of the compact computing system 100 to the outer housing 102 to intercept the exhaust. A part of the air stream 204. The decorative shield 202 can be used to cover the operating components contained in the exhaust assembly 218, such as a radio frequency (RF) processing circuit system, and one or more antennas located on the top of the exhaust assembly 218. The decorative shield 202 may be formed of an RF transparent material such as plastic, ceramic, or glass.
Due to the conductive nature of the outer casing 102, it may be preferable to use the outer casing 102 as a base ground to provide a good electrical ground for the internal components of the compact computing system 100. Therefore, a set of vertical touch points 212 on the cover of the input/output sub-assembly adjacent to the interface panel 110 can be formed of conductive materials, and can be used on the inner surface of the internal components of the compact computing system 100 and the outer casing 102 A conductive path is formed between the set of matching vertical conductive patches. In order to form a good electrical connection, it can be shielded and/or lasered during the manufacturing process The portion of the outer housing 102 that contacts the vertical touch point 212 is etched to ensure that the portion that contacts the vertical touch point 212 lacks any non-conductive or insulating material (such as aluminum oxide). When the outer casing 102 includes an aluminum oxide layer formed thereon, a selected portion of the aluminum oxide can be removed to expose the underlying conductive bulk material in the location where the vertical touch point 212 is contacted.
In addition to providing base grounding, the outer casing 102 can also be combined with the inlet/base 104 and the exhaust assembly 218 to prevent leakage of electromagnetic energy to the internal components of the self-compact computing system 100 by forming a Faraday cage. The contact surface 206 of the exhaust assembly 218 can be masked or laser-etched during the manufacturing process to form a conductive contact surface 206 that can contact a conductive pad positioned inside the outer housing 102. When the outer casing 102 is properly placed over the internal components of the compact computing system 100 and positioned to enclose the internal components in a safety lock position, the conductive gasket of the outer casing 102 can contact the exhaust manifold. The conductive contact surface 206 of 218 is formed. The outer shell 102 may also include a conductive zone on the bottom surface of the outer shell 102, which can contact a conductive bottom gasket assembled on the inlet/base 104 (or formed as an integral part of the inlet/base 104) 208. In addition, the input/output (I/O) sub-assembly cover part (which may include the interface panel 110, embedded in the interface panel 110) may include or directly contact the inlet/base 104 and/or exhaust manifold The component 218 corresponds to the bare metal zone of the bare metal zone. In some embodiments, when the internal components of the compact computing system 100 are properly assembled, the selected part of the internal structure core/heat sink can also contact the inlet/base 104 and the exhaust assembly 218.
A combination of the following can be used to form an effective Faraday cage for a sophisticated computing system: (1) The contact surface 206 formed on the exhaust assembly 218 and the gasket (not shown) assembled in the interior of the outer casing 102 (2) The conductive ring formed between the bottom gasket 208 of the inlet/base 104 and the bottom of the outer housing 102; (3) Along the input/output (I/O) sub-assembly One or more arc-shaped conductive zones on the inner surface of the bottom of the cover, which contact the matching conductive arc-shaped zones along the surface of the inlet/base 104; (4) One or more arc-shaped zones along the surface of the exhaust assembly 218 Or multiple conductive arc zones, which contact along the inner surface of the top of the I/O sub-assembly cover And (5) the vertical touch point 212, which contacts the matching vertical zone along the inner surface of the outer casing 102. In addition, the assembly points on the core/heat sink of the central structure can be in electrical contact with the inlet/base 104 and the exhaust assembly 218.
3 illustrates an exploded view 300 of the central core 200 of the internal components of the compact computing system 100 according to some embodiments. The central core 200 of the internal components can be formed around the structural core/heat sink 310, and the structural core/heat sink 310 can serve as a structural core that can be assembled with internal component boards. In one embodiment, the structural core/heat sink 310 can be shaped into a triangle, for example, an isosceles triangle with two equal length sides and a third longer side, which in some embodiments extends at each corner to Form the structural support element. The cooling fins 311 can fan out from the inner surface of the longer side to the inner surfaces of two equal sides. In one embodiment, the central cooling fin can bisect the triangular central volume defined by the side of the structural core/heat sink 310, thereby forming two similar triangular zones. In one embodiment, the other cooling fins may extend from the longer side to the other side at an angle related to the distance from the central cooling fin. In this way, the cooling fins can form a symmetrical cooling assembly within the triangular center volume. The structural core/heat sink 310 may include three vertical pillars 314 that vertically span a part of the inner portion of the outer casing 102 of the compact computing system 100. Between each pair of vertical pillars 314, one surface of the structural core/heat sink 310 can span a portion of a string that extends horizontally across the inside of the outer casing 102 of the compact computing system 100. On each of the three faces of the triangular structure core/heat sink 310, the vapor chamber assembly 312 can be positioned to contact the surface of that face of the structure core/heat sink 310. In a representative embodiment, a portion of each side of the structural core/heat sink 310 can be removed to form a cavity that can be embedded with the vapor chamber assembly 312. In some embodiments, the structural core/heat sink 310 and/or the vapor chamber assembly 312 may include assembly points for attaching internal component boards. The internal component board may include one or more arithmetic processing units, graphics processing units and/or memory units, which can transfer the heat generated therein to the structural core/heat sink 310 through the steam chamber assembly 312 .
In a representative embodiment, the two surfaces of the structural core/heat sink 310 can be used according to The size is set based on the external dimensions of the graphics processing unit (GPU) board 306 that can be assembled to these surfaces. In a representative embodiment, the third surface of the structural core/heat sink 310 can be sized according to the external dimensions of the central processing unit (CPU) board 318 that can be assembled to the surface. In one embodiment, the structural core/heat sink 310 can be approximately formed in the shape of an isosceles triangle, which has two faces of equal width on which two GPU boards 306 will be assembled, and will be Assemble a third side of the CPU board 318 with a longer width. In some embodiments, the longer width of the surface of the structural core/heat sink 310 where the CPU board 318 is mounted can determine the diameter of the cylindrical center core 200 of the internal components, and thereby substantially determine the external housing 102 and the compactness of the assembly. The diameter of the type computing system 100.
In one embodiment, each GPU board 306 can be assembled to the structure, for example, via a corresponding vapor chamber assembly 312 assembled on the structural core/heat sink 310 and/or embedded in the structural core/heat sink 310 The core/heat sink 310, where the GPU and surrounding video memory face (and thermally contact) the structural core/heat sink 310. In an embodiment, the solid state disk drive 308 may be mounted on the outward-facing side of one or two GPU boards 306 in the space between the external housing 102 and the GPU board 306. In one embodiment, the solid state disk drive 308 can be configured as a set of vertical components along the vertical long axis 210 of the compact computing system, and can be centrally located in the outer housing 102 along the width of the GPU board 306 In the zone with the widest space between the GPU board 306 and the GPU board 306. The configuration and placement of the solid-state disk drive 308 can be determined to maximize the amount of airflow across the solid-state disk drive 308. In one embodiment, the vapor chamber assembly 312 can be assembled on the surface of the structural core/heat sink 310 and/or embedded in the surface of the structural core/heat sink 310, for example, by directly contacting the vapor chamber assembly 312 The CPU board 318 is assembled to the structural core/heat sink 310, where the CPU faces (and thermally contacts) the structural core/heat sink 310.
In one embodiment, a full-size dual coaxial memory module (DIMM) that supports the CPU can be positioned on the outward-facing side of the CPU board 318 (on the opposite side of the CPU board 318 where the CPU and the CPU socket are placed) Side) in the DIMM mechanism 320. The DIMM mechanism 320 can be tilted to a locked position that causes the DIMM to face the component in the direction of the CPU. The inside of the center core 200 (for example, toward the vertical center line of the CPU board 318) is angled. The DIMM mechanism 320 can also be tilted into an unlocked position that angles the DIMM away from the inside of the central core 200 of the internal components (for example, away from the CPU and in the direction of the outer housing 102). In one embodiment, the DIMM mechanism 320 may restrict the user to insert and/or remove the DIMM when in the locked position, and permit the user to insert and/or remove the DIMM when in the unlocked position. The DIMM mechanism 320 can angle the DIMM within a circle bounded by the outer housing 102 when in the locked position, and position the DIMM at least partially outside the circle when in the unlocked position, to provide a precise calculation Access for DIMM insertion and removal performed by the user of the system 100.
The CPU board 318 and the GPU board 306 may be connected to each other and/or to the I/O board 324 via the interconnect board 316, which may also be referred to as a main logic board (MLB) in some embodiments. In one embodiment, the CPU board 318 may be connected to the interconnection board 316 via a dual-row edge connector to a mating socket mounted on the interconnection board 316 in the center. The connection of the CPU board 318 via the double-edge row connectors can provide a compact configuration in the central core 200 of the components of the compact computing system 100. In an embodiment, the GPU board 306 may be connected to the interconnection board 316 via a wide bandwidth flex connector (for example, a flex cable).
In some embodiments, the wide bandwidth flex connector can also be used as a partition to guide at least a part of the air flow introduced from the inlet/base 104 to diverge and expand across the surface of the GPU board 306. Adjacent to the CPU board 318, a power supply unit (PSU) 322 can be positioned between the DIMM mechanisms 320. In one embodiment, the cross-section of the PSU is shaped as a trapezoid to fit between the DIMM mechanism 320, the CPU board 318, and the I/O board 324 in a delicate manner. In one embodiment, an external AC power source can be connected to the PSU 322 via the interface panel 110 and via the I/O board 324, and the PSU 322 can convert AC power to one or more DC voltages. The DC power from the PSU 322 can be connected to the GPU board 306 and/or the CPU board 318 via thin flexible flat copper bus bars. The I/O board 324 can be mechanically connected to the PSU 322 and/or the I/O sub-assembly cover 326, and the interface panel 110 can connect the compact computing system through the I/O sub-assembly cover 326. The internal core 200 of the system 100 is connected to the outside world. The I/O board 326 can provide numerous high-speed interfaces for the compact computing system 100 through a common high-bandwidth flex connector connected to the interconnection board 316, and the interconnection board 316 can be connected to the CPU through an additional high-bandwidth connector Board 318 and GPU board 306. The configuration of the component board and other units illustrated in FIG. 3 provides the most intensive computing core thermally coupled to the components of the large structure core/heat sink 310 used in the compact computing system 100.
In some embodiments, the structural core/heat sink 310 may be mechanically connected to the top-mounted exhaust assembly 218, and the top-mounted exhaust assembly 218 may include an impeller 304 and an air chamber plate connected to the exhaust assembly 218 328, the exhaust airflow 204 can be sucked through the impeller 304 and the air chamber plate 328. In an embodiment, the exhaust assembly 218 may include a wireless subsystem 302, which is assembled in a cavity embedded in the top surface of the exhaust assembly 218 and covered by a decorative shield 202. In some embodiments, the assembly points on the vertical pillars 314 of the structural core/heat sink 310 can electrically couple the top-mounted exhaust assembly 218 to the structural core/heat sink 310. The structural core/heat sink 310 can also be mechanically connected to the bottom-mounted inlet/base 104. In some embodiments, the assembly points on the vertical pillars 314 of the structural core/heat sink 310 can electrically couple the inlet/base 104 to the central core/heat sink 310.
4 illustrates a front view of the first side 400 of the CPU board 318. The first side 400 includes a center-mounted CPU 402 side-mounted on either side by a vertical DIMM mechanism 320 mounted on the opposite side of the CPU board 318. In some embodiments, the CPU 402 is mechanically and electrically coupled to the CPU board 318 by a low-profile thermal module 404. The low-profile thermal module 404 and a flexible high-strength spring mechanism (in FIGS. 5 to 7 are Illustrated as spring 502) cooperate to compress the CPU 402 into the socket placed under the CPU 402. A fastener disposed in the CPU board 318 through the opening 406 and engaged in the threaded aperture of the low-profile thermal module 404 allows the CPU 402 to be compressed into the socket. The low profile thermal module 404 is described in more detail in FIG. 7. The spring mechanism can be arranged on the other side of the CPU board 318 opposite to the CPU 402. The CPU board 318 may have one or more openings 408, and the fastener (illustrated as the fastener 504 in FIG. 5) may be engaged through the one or more openings 408 The attachment points arranged on the structural core/heat sink 310, thereby coupling the CPU board 318 to the structural core/heat sink 310. As described in more detail in FIG. 5, the spring mechanism may have openings corresponding to the openings 408 that allow the fastener to be driven via both the spring mechanism and the CPU board 318.
In some embodiments, the layout of the CPU board 318 provides a high-bandwidth data path through the dual-row edge connector at the base of the CPU board 318 (e.g., illustrated as the CPU board edge connector 410 in FIG. 4). As illustrated in FIG. 4, the DC power for the CPU board 318 can be provided via one or more DC inputs 412 disposed on the top edge of the CPU board 318. In one embodiment, one or more flat copper interconnection bus bars connect the DC input 412 of the CPU board 318 to the PSU 322. In one embodiment, the DC/DC adjustment section 414 on the CPU board 318 can adjust and/or convert the DC power provided through the DC input 412 to provide computing components such as those installed on the CPU board 318 (including at least the assembly A set of stable DC voltages required by the memory in the DIMM mechanism 320 and the CPU 402). By configuring the layout of the CPU board 318 when the DC power flows from the top edge and the high-speed digital data input/output flows from the bottom edge, a compact and effective CPU board 318 can be achieved. In one embodiment, the bottom edge of the CPU board 318 includes a dual-row CPU board edge connector 410, and high-speed digital data input/output flows through the dual-row CPU board edge connector 410 to a mating socket mounted on the interconnect board 316 .
In some embodiments, the DIMM mechanism 320 includes memory module sockets that are press-fitted to connect to the CPU board 318, for example, so as not to be used simultaneously on both sides of the CPU board 318 Surface mount technology (surface mount technology, SMT). In one embodiment, some or all of the components of the CPU board 318 (for example, the DC/DC adjustment section 414) are configured to increase airflow in a vertical direction across the CPU 402 from the CPU board edge connector 410 on the bottom. And the memory in the DIMM mechanism 320 reaches the top-mounted blower assembly (not shown) through the DC/DC adjusting section 414. As illustrated, the CPU 402 can be assembled on one side of the CPU board 318 that is oriented to contact the vapor chamber assembly 312 attached to the structural core/heat sink 310. In order to make the memory The module can be repaired without removing the CPU board 318 when it is attached to the structural core/heat sink 310, and the DIMM mechanism 320 can be assembled on the side of the CPU board 318 opposite to the CPU 402. As described above, in some embodiments, the DIMM mechanism 320 may include angling the memory module contained therein toward the inside of the compact computing system 100 when in the locked position and enabling the memory when in the unlocked position. The body module is angled outwards to allow the user to access the tilt and lock feature.
5 illustrates a front view of the second side 500 of the CPU board 318. The second side 500 includes a portion of the CPU spring 502 connected to the left and right sides of the CPU board 318 by the DIMM mechanism 320. In some embodiments, the CPU spring 502 may be provided via one or more attachment points (for example, assembled on the structural core/heat sink 310 and attached to the vapor chamber assembly 312 of the structural core/heat sink 310, and /Or integrated with the structural core/heat sink 310 and the vapor chamber assembly 312 attached to the structural core/heat sink 310) to attach the CPU 402 to the socket and/or the structural core/heat sink 310. As depicted, a force can be applied along the CPU spring 502 by the fasteners 504 and 506 to flatten the CPU spring 502 against the second side of the CPU board 318.
In some embodiments, the CPU spring 502 may include a flexible metal band 508 that provides force for installing the CPU 402 into the socket. The CPU spring 502 may also include a flexible metal band 510, which allows the CPU board 318 to be coupled to the vapor chamber assembly 312, thereby adjusting the assembly of the CPU board 318 to the structural core/heat sink 310 The amount of force applied at the time. In some embodiments, the flexible metal strap 510 can apply about 30 pounds of force when assembling the CPU board 318 to the steam chamber assembly 312. The flexible metal band 510 can also be used to help keep the CPU 402 installed in the socket. When the CPU board 318 is fastened to the steam chamber assembly 312, the raised portion of the CPU 402 can also be compressed when the flexible metal belt applies force to the CPU board 318 via the support plate 509, thereby The CPU 402 is directly pressed against the surface of the steam chamber assembly 312. It should be noted that the fastener 506 can only extend into the low-profile thermal module 404, thereby allowing the CPU spring 502 to safely install the CPU 402 in the socket before the CPU board 318 is installed to the structural core/heat sink 310 using the fastener 504 middle.
In some embodiments, the CPU spring 502 may be formed as two separate structural units, (1) to press the CPU 402 into the socket 604, and (2) to compress the CPU 402 against the vapor chamber assembly 312. In some embodiments, the CPU spring 502 may be formed as a single structure that performs two functions, for example, as illustrated in FIG. 5.
In one embodiment, the CPU board 318 includes one or more DIMM connector sockets mounted on the second side 500 of the CPU board 318, and the second side 500 is opposite to the first side 400 on which the CPU 402 can be mounted. In one embodiment, press-fit connectors (instead of connectors requiring surface mount technology) are used to assemble the DIMM connector sockets. In one embodiment, the DIMM connector socket accepts a full-size DIMM. As illustrated in FIG. 5, the DIMM connector socket can be assembled along the long axis 210 of the central core 200 of the internal components of the compact computing system 100. This situation can provide for the DIMM to be oriented substantially along its entire length and with the peripheral airflow. 214 aligned. In one embodiment, the DIMM mechanism 320 is tilted toward the center of the CPU board 318 to the locked position for use in the operation of the compact computing system 100, and tilted away from the center of the CPU board 318 to the unlocked position for use in the compact computing system 100. It is used when the user (or maintenance technician) of the type computing system inserts, replaces and/or removes the DIMM from the DIMM connector socket.
6 illustrates a top view of the CPU board 318 of the structural core/heat sink 310 of the central core 200 assembled to the internal components of the compact computing system 100. Between each pair of vertical pillars 314 of the structural core/heat sink 310, the vapor chamber assembly 312 can be assembled to one surface of the structural core/heat sink 310. In a representative embodiment, the CPU board 318 can be attached to the structural core/heat sink 310 via a set of attachment points 602 that protrude along the surface of the structural core/heat sink 310 Through the steam chamber assembly 312 (and/or integrated with the steam chamber assembly 312). The fastener 504 can be driven through the CPU spring 502 and the opening 408 of the CPU board 318 to engage the attachment point 602. In combination with the CPU spring 502, the fastener 504 can exert a force that not only establishes a firm thermal contact between the raised portion of the CPU 402 and the vapor chamber assembly 312, but also securely attaches the CPU board 318 to the structural core/heat sink 310.
As described above, DC power can be supplied to the CPU board 318 via one or more connectors (DC input 412) positioned at the top edge of the CPU board 318. In an embodiment, the DC input 412 may be positioned on the top edge of the CPU board 318 opposite to the bottom edge of the CPU board 318. The bottom edge may include a high-speed edge connector through which high-speed data can be transferred. Communicated to the interconnection board 316. On the left and right edges of the CPU board 318, two DIMM mechanisms 320 can be assembled on the side of the CPU board 318 facing away from the structural core/heat sink 310 (and therefore on the side of the board opposite the CPU 402 ). The DIMM mechanism 320 may provide for guiding one or more memory modules 216 (eg, full-size DIMMs) and holding them in place. In one embodiment, the DIMM mechanism 320 can be tilted inwardly toward the center of the CPU board 318 when in the locked position (for example, when the compact computing system 100 is assembled and operated), and can be tilted inwardly toward the center of the CPU board 318 when in the unlocked position (For example, when inserting and removing the memory module 216 from the DIMM socket and DIMM mechanism 320 is provided), it is inclined outward away from the center of the CPU board 318.
In one embodiment, the cooling fin (referred to as the central cooling fin 311-1) may extend from the first flat surface 610 to the junction of the second flat surface 612 and the third flat surface 614. In this way, the triangular center volume defined by the heat sink 310 is equally divided into a first zone I and a second zone II each having a similar right-angled triangle cross section. In one embodiment, the first cooling fin 311-2 spanning zone I may be at a first angle with respect to the first flat surface 610<img file="TWM500282U_D0001.tif" he="59" img-content="character" img-format="tif" inline="no" orientation="portrait" wi="31" />1. First angle<img file="TWM500282U_D0002.tif" he="57" img-content="character" img-format="tif" inline="no" orientation="portrait" wi="35" />1 may have a distance X according to the distance between the first cooling fin 311-2 and the center cooling fin 311-1<sub>1</sub>And the angle value of the change. Similarly, the second cooling fins 311-3 across zone II may be at a second angle with respect to the first flat surface 610<img file="TWM500282U_D0003.tif" he="57" img-content="character" img-format="tif" inline="no" orientation="portrait" wi="35" />2. Second angle<img file="TWM500282U_D0004.tif" he="57" img-content="character" img-format="tif" inline="no" orientation="portrait" wi="31" />2 may have a distance X between the second cooling fin 311-3 and the center cooling fin 311-1<sub>2</sub>And the angle value of the change. Generally speaking, the distance X<sub>1</sub>And distance X<sub>2</sub>Approximately equal, however, the actual number of cooling fins implemented in zone I or zone II can vary as required by a specific design, and various geometric relationships can also vary. In one embodiment, the first angle<img file="TWM500282U_D0005.tif" he="59" img-content="character" img-format="tif" inline="no" orientation="portrait" wi="33" />1 and the second angle<img file="TWM500282U_D0006.tif" he="57" img-content="character" img-format="tif" inline="no" orientation="portrait" wi="35" />The sum of 2 may be about 180°.
7 illustrates a cross-sectional view 700 of the CPU board 318 assembled to the structural core/heat sink 310 of the compact computing system 100 according to some embodiments. The cross-sectional view 700 of the CPU board 318 may correspond to the section line AA depicted in FIG. 5, which passes through at least a part of the central core 200 of the components of the compact computing system 100. FIG. 7 depicts how the low-profile thermal module 404 can be used to fix the CPU 402 to the socket 604. In some embodiments, the low-profile thermal module 404 may have an opening having a size according to the protrusion of the CPU 402. In this regard, the raised portion can pass through the opening of the low-profile thermal module 404 so that the raised portion can make direct thermal contact with the vapor chamber assembly 312.
In this regard, in addition to installing the CPU 402, the low-profile thermal module 404 may also have a threaded hole through which the fastener 506 can be engaged. The fastener 506 can be passed through the opening 406 of the CPU board 318 and the opening in the spring 502 to engage the threaded hole in the low profile thermal module 404.
Figure 8 illustrates a view of the first side 800 of a graphics processing unit (GPU) board according to some embodiments. The GPU 802 can be centrally mounted on the GPU board 306, and one or more video random access memory (VRAM) 804 units can be positioned symmetrically around the GPU 802. In a representative embodiment, the GPU 802 and the VRAM 804 can be mounted on the same side of the GPU board 306, which can be placed in contact with the vapor chamber assembly 312 embedded in one surface of the structural core/heat sink 310. In one embodiment, the GPU thermal module spring can compress the GPU 802 against the vapor chamber assembly 312, thereby providing the GPU 802 when the GPU board 306 is assembled to the structural core/heat sink 310 via a set of attachment points 602 Thermal coupling to structural core/heat sink 310. In some embodiments, the VRAM 804 may also contact the vapor chamber assembly 312 to provide a heat conduction path to the structural core/heat sink 310 when the GPU board 306 is attached to the structural core/heat sink 310. In one embodiment, the layout of the VRAM 804 around the GPU 802 may configure the VRAM 804 to permit approximately equal airflow across and/or adjacent to the VRAM 804 when the GPU board 306 is attached to the structural core/heat sink 310.
In an embodiment, the GPU board 306 may include one or more power connection points (indicated as GPU DC input 806 in FIG. 8) located at the top edge of the GPU board 306, through which Or multiple power connection points to supply DC power from the PSU 322. As described above for the CPU board 318, the GPU board 306 may include a DC/DC power regulation located at the top edge of the GPU board 306, and a high-speed digital data connection from the bottom edge of the GPU board 306. In an embodiment, the GPU board 306 may be connected to the interconnect board 316 via a high-speed flex connector. In some embodiments, the high-speed flex connector also provides an air baffle to split the air flow from the inlet/base 104 into the central air flow through the structural core/heat sink 310 and the peripheral air flow across the surface of the internal component board 214. In one embodiment, the high-speed flex connector also deploys the peripheral airflow 214 to provide airflow along the outer section of the GPU board 306 (eg, across and/or adjacent to the VRAM 804).
FIG. 9 illustrates the second side 900 of the GPU board 306 according to some embodiments. As described above, the GPU board 306 can be equipped with the GPU 802 and VRAM 804 facing and thermally contacting the structural core/heat sink 310, for example, using attachment points 602 that are connected to the structural core/heat sink 310 And/or the steam chamber assembly 312, and/or is an integral part of the structural core/heat sink 310 and/or the steam chamber assembly 312. In an embodiment, the GPU thermal module spring 902 can be used at least in part to attach the GPU board 306 to the structural core/heat sink 310 by the attachment point 602. In one embodiment, the GPU thermal module spring 902 can compress the GPU 802 against the vapor chamber assembly 312 to provide positive thermal contact between the GPU 802 and the structural core/heat sink 310, for example, by assembling in the structural The surface of the core/heat sink 310 or the vapor chamber assembly 312 embedded in the surface of the core/heat sink 310 of the structure.
In some embodiments, the GPU thermal module spring 902 can also make all or a portion of the VRAM 804 adjacent to the GPU 802 contact the vapor chamber assembly 312, thereby providing thermal contact for cooling the VRAM 804. In some embodiments, one or more DC voltages may be provided to the GPU board 306 via one or more GPU DC inputs 806 located at the top edge of the GPU board 306. In some embodiments, the DC/DC adjustment section 414 can adjust and convert one or more DC voltages to provide DC power to the components of the GPU board 306. In one embodiment, the GPU board 306 may include a board positioned along the bottom edge (opposite to the top edge that can be supplied with DC power). The GPU rigid flex connector socket 904, the high-speed flex connector can communicate data to the interconnect board 316 through the GPU rigid flex connector socket 904. In some embodiments, the solid state disk drive (SSD) 308 can be mounted on the center (side-to-side) of the GPU board 306 along the long axis 210 of the GPU board 306 across the rear side of the GPU 802 and across the GPU thermal module spring 902. ), as illustrated in Figure 9. In one embodiment, the layout of the components on the GPU board 306 can place taller components toward the center of the GPU board 306 (top to bottom), and place shorter components toward the outside of the GPU board 306 .
In some embodiments, multiple components of the GPU board 306 (for example, GPU 802, GPU thermal module spring 902, and SSD 308) can be stacked inside the compact computing system along the central long axis 210 of the GPU board 306 In one zone, the zone can accommodate components whose height is greater than that of the adjacent zone. In some embodiments, when the GPU board 306 is assembled to the structural core/heat sink 310 and placed on the entrance/base 104 in the outer casing 102, it can form a segment of a string across the inside of the outer casing 102, wherein A larger volume can be used for placement of components along the middle of the segment of the string, and a smaller volume can be used for placement of components along the outside of the segment of the string. In some embodiments, the placement of components on the GPU board 306 may be configured to accommodate the volume constraints imposed by the position of the GPU board 306 relative to the outer housing 102.
10 illustrates a cross-sectional view 1000 of the GPU board 306 assembled to the structural core/heat sink 310 of the compact computing system 100 according to some embodiments. In some embodiments, the cross-sectional view 1000 may correspond to a view cut through at least a portion of the central core 200 of the components of the compact computing system 100 along the line B indicated in FIG. 9. The GPU board 306 can be assembled to a surface of the structural core/heat sink 310, where the GPU 802 contacts a surface of the vapor chamber assembly 312, and the surface can be attached to the surface of the structural core/heat sink 310 and/or embedded in the structure In this side of the core/heat sink 310. In one embodiment, the GPU thermal module spring 902 can compress the GPU 802 and abut the vapor chamber assembly 312. In an embodiment, the GPU board 306 may be attached to the structural core/heat sink 310 via a set of attachment points 602 protruding from the structural core/heat sink. In one embodiment, the separate GPU board 306 can be assembled to the structural core/heat sink 310 Each of the two sides, and the CPU board 318 can be assembled to the third side of the structural core/heat sink 310. In one embodiment, the solid-state drive 308 can be mounted across the GPU thermal module spring 902 on the side of the GPU board 306 opposite to the side on which the GPU 802 can be mounted.
11 illustrates a perspective view 1100 of a CPU board 318 including a DIMM mechanism 320 attached to the CPU board 318 according to some embodiments. In one embodiment, the CPU board 318 includes a CPU 402 mounted on the side opposite to the CPU spring 502 illustrated in FIG. 11. In one embodiment, the DIMM mechanism 320 and the CPU 402 are mounted on opposite sides of the CPU board 318. In one embodiment, the DC power is supplied via one or more DC inputs 412 at the top edge of the board above the CPU 402, and via the bottom edge of the board below the CPU 402 (e.g., via the CPU board edge The connector 410) transmits high-speed digital signals. In one embodiment, the DIMM mechanism 320 provides guiding, twisting support, tilting functions, and locking/unlocking functions for the memory module 216 installed therein. In one embodiment, the DIMM mechanism 320 includes a DIMM mechanism actuator 1104, which can be engaged by a user to tilt, lock, and unlock the DIMM mechanism 320. It should be noted that although the actuator 1104 is referred to as the button 1104 hereinafter, it is expected that any type of mechanism suitable for actuating the DIMM mechanism 320 is possible.
In one embodiment, the DIMM mechanism 320 includes guides to install the memory module 216 into the DIMM connector base 1102 that is assembled to the CPU board 318. In one embodiment, the DIMM connector base 1102 is assembled to the CPU board 318 as a press-fit connector. In one embodiment, the user can engage the DIMM mechanism 320 by pushing the DIMM mechanism button 1104 to switch the DIMM mechanism 320 from the unlocked (tilted outward) position to the locked (tilted inward) position, for example, to switch The memory is securely locked in the socket in the DIMM connector base 1102. The user can also push the DIMM mechanism button 1104 to engage the DIMM mechanism 320 to switch the DIMM mechanism 320 from the locked position to the unlocked position, for example, to remove the memory module 216 in the DIMM mechanism 320 and replace the DIMM mechanism The memory module 216 in 320 or the memory module 216 is installed in the DIMM mechanism 320. One real In an embodiment, when the user presses the DIMM mechanism button 1104 and the DIMM mechanism 320 is in the locked position, the DIMM mechanism 320 provides a short overtravel distance. In one embodiment, after the user presses the DIMM mechanism button 1104, the DIMM mechanism 320 provides a spring-loaded action to tilt the DIMM mechanism 320 from the inwardly locked position to the outwardly unlocked position.
FIG. 12 illustrates another perspective view 1200 of a CPU board 318 including a DIMM mechanism 320 attached to the CPU board 318 according to some embodiments. The DIMM mechanism 320 illustrated in FIG. 11 is filled with the installed memory module 216, while the DIMM mechanism 320 illustrated in FIG. 12 is blank, in which the memory module 216 is not installed. The DIMM mechanism 320 may include a torsion bar 1202 that links the two ends of the DIMM mechanism 320 together and provides a force applied to one end of the DIMM mechanism 320 (for example, applied to the DIMM mechanism button 1104) to transmit And applied to the other end of the DIMM mechanism 320. The DIMM mechanism 320 may also include a DIMM guide 1204. The DIMM guide 1204 helps the user to properly align and install the memory when the memory module 216 is inserted into the DIMM mechanism 320 to connect with the DIMM connector base 1102 Body module 216. In some embodiments, the DIMM mechanism 320 can accommodate a memory module 216 that is a "full size" DIMM having a length of approximately 133 mm (for example, as used in a desktop personal computer).
In one embodiment, the DIMM mechanism 320 can accept the insertion of the memory module 216 into the DIMM connector base 1102 at an acute angle (non-vertical). In some embodiments, the user can insert the memory module 216 into the DIMM mechanism 320 at an acute angle in the unlocked position, and by pressing on one side of the DIMM mechanism 320 (for example, pressing on the DIMM mechanism button 1104 (Top) to rotate the DIMM mechanism 320 to the locked position. In some embodiments, the torsion bar 1202 of the DIMM mechanism 320 transmits at least a portion of the force applied by the user on one end of the DIMM mechanism 320 (for example, by pressing the DIMM mechanism button 1104) to the opposite end of the DIMM mechanism 320. For example, to help rotate, lock, position, and/or actuate the full-length DIMM in the socket of the DIMM connector base 1102.
FIG. 13A illustrates a front perspective view 1300 and a rear view of a DIMM mechanism 320 according to some embodiments Perspective view 1310. Each end of the DIMM mechanism 320 may include a push/push DIMM locking mechanism 1302. The push/push DIMM locking mechanism 1302 provides an angle for the DIMM mechanism 320 (including the memory module 216 installed therein) when in the locked operating position Into the interior of the compact computing system 100, and when in the unlocked position, at least a portion of the DIMM mechanism 320 is angled outside the circular zone bounded by the outer housing 102 for installation and removal of memory modules Group 216. Each end of the DIMM mechanism 320 is connected to the opposite end of the DIMM mechanism 320 by a torsion bar 1202.
One end of the DIMM mechanism 320 may include a DIMM mechanism button 1104. The user can press the DIMM mechanism button 1104 to tilt the DIMM mechanism 320 to the locked position or release the DIMM mechanism 320 from the locked position to the unlocked position. In one embodiment, as the DIMM mechanism 320 tilts, the memory module 216 contained therein also tilts. In some embodiments, the user can press on one or more surfaces of the DIMM mechanism 320 to tilt the memory module 216 to the locked position or the unlocked position. In some embodiments, the user can press on the surface of the memory module 216 to tilt the DIMM mechanism 326 (and the memory module 216 contained therein) to the locked position or release the latch and enable the DIMM mechanism 326 (And the memory module 216 contained therein) tilt to the unlocked position. In some embodiments, "lock" and "unlock" (and other forms of these words) may also be referred to as "lock" and "unlock" (and other synonyms).
13B and 13C illustrate another embodiment of a dual coaxial memory module (DIMM) mechanism. More specifically, FIG. 13B shows a front perspective view of the DIMM mechanism 1320 in a closed or latched configuration, and FIG. 13C shows the DIMM mechanism 1320 in an open or unlocked configuration. In one embodiment, in the unlocked position, the memory module 216 positioned within the DIMM mechanism 1320 is substantially perpendicular to the printed circuit board that can be attached to the DIMM mechanism 1320 via the DIMM connector base 1102. In this embodiment, the DIMM mechanism 1320 may include a first actuator 1322 and a second actuator 1324. In one embodiment, the first actuator 1322 and the second actuator 1324 are configured to present a single unit consistent with a clean and aesthetically pleasing appearance. The appearance of piece by piece. In any situation, the first actuator 1322 and the second actuator 1324 are designed to resist opening (unlocking) of the DIMM mechanism 1320 regardless of the high impact load applied to the housing 102. More specifically, unless functioning in a specific manner, the DIMM mechanism 1320 remains in a latched configuration, thereby securing the DIMM 310 therein. Therefore, the DIMM mechanism 1320 can be configured to lock the DIMM 310, and the DIMM mechanism 1320 can cause the DIMM 310 to be accessible and available for removal (or replacement) in the unlocked configuration.
As shown in FIG. 13B, the first actuator 1322 and the second actuator 1324 are coplanar with respect to each other, thus presenting a compact, well-defined, and aesthetically pleasing structure. In order to access and release the DIMM fixed by the DIMM mechanism 1320 310 (or make the DIMM mechanism 1320 available for accommodating new or replacement DIMMs), the first force F1 can be directly applied to the actuator 1322. In one embodiment, the first force F1 must overcome the biasing force applied by a biasing member (shown in more detail in FIG. 15B) that moves the first actuator 1322 about the pivot 1326, As a result, the DIMM locking mechanism 1328 is tilted from the locked position shown in FIG. 13B to the unlocked position shown in FIG. 13C. In one embodiment, as the DIMM mechanism 1320 is tilted, the memory module 216 contained therein is also tilted, thereby providing easy user access that facilitates the removal or insertion of the memory module 216. It should also be noted that as the locking mechanism 1328 tilts from the locked position to the unlocked position (and vice versa), the second actuator 1324 moves so that the second actuator 1324 is in the locked configuration and unlocked The orientation in the configuration relative to the DIMM base 1102 remains substantially unchanged. In this way, the second actuator 1324 is well positioned for the user to apply the latching force F2 to the second actuator 1324, thereby tilting the latch mechanism 1328 back to the latching position and causing the first actuation The device 1322 undergoes a second movement around the pivot 1326.
14 illustrates a front perspective view 1400 and a rear perspective view 1410 of an end of the DIMM mechanism 320, the end including the DIMM mechanism button 1104, according to some embodiments. The DIMM mechanism 320 may include a push/push DIMM locking mechanism 1302 at each end. The push/push DIMM locking mechanism 1302 includes a plurality of interconnecting rods forming a movable link assembly. One end of the DIMM mechanism 320 may include a DIMM mechanism button 1104, and each end of the DIMM mechanism 320 may include a DIMM guide 1204 to align the memory module 326 after insertion. In some embodiments, the DIMM mechanism 320 can block an improperly inserted memory module 216 from engaging the socket in the DIMM connector base 1102.
In some embodiments, the DIMM mechanism 320 may reject the memory module 216 that has been improperly inserted. In some embodiments, the DIMM mechanism 320 can prevent the user from latching the improperly inserted memory module 216 into the locked position. In some embodiments, the DIMM mechanism 320 may not be able to be latched into the locked position when the memory module 216 is improperly inserted therein. In some embodiments, the DIMM guide 1204 can at least partially assist the user in inserting the memory module 216 in the correct orientation for properly engaging the DIMM mechanism 320. In some embodiments, the DIMM mechanism 320 includes retention features that hold the memory module 216 in the correct position when in the locked position. In some embodiments, one or more "hold down" features can be translated into a position that keeps the memory module 216 in place in the DIMM mechanism 320 when the DIMM mechanism 320 is in the locked position.
15A illustrates a first end view 1500 of the DIMM mechanism 320 with the push/push DIMM mechanism 1302 oriented in the unlocked position, and a second end view 1510 of the DIMM mechanism 320 with the push/push DIMM locking mechanism 1302 oriented in the locked position. In one embodiment, in the unlocked position, the memory module 216 positioned within the DIMM mechanism 320 is substantially perpendicular to the printed circuit board that can be attached to the DIMM mechanism 320 via the DIMM connector base 1102. In one embodiment, in the locked position, the memory module 216 positioned within the DIMM mechanism 320 is inclined away from the vertical and angled toward the central area of the printed circuit board to which the DIMM mechanism 320 can be attached. In one embodiment, the user can push the DIMM mechanism button 1104 to tilt the DIMM mechanism 320 from the unlocked position 1500 to the locked position 1510.
In one embodiment, the push/push DIMM locking mechanism 1302 includes three parallel Rods, each parallel rod is connected to the fourth rod crossing the three parallel rods. In one embodiment, the fourth cross bar can be connected to one end of the first outer parallel bar and to the opposite end of the second outer parallel bar of the pushing/pushing DIMM locking mechanism 1302. In one embodiment, the fourth cross bar is also connected to an inner parallel bar, which is positioned between the two outer parallel bars. In one embodiment, the fourth cross bar includes an open zone that allows the fourth cross bar to be engaged and disengaged as the DIMM locking mechanism 1302 is pushed/pushed (for example, when the locked position is changed to unlocked Position) travel relative to the three parallel rods below. In one embodiment, the size of the open zone of the fourth cross bar can at least partially determine the amount of movement between the unlocked position and the locked position of the DIMM mechanism 320. In one embodiment, a spring latch (not indicated) can be engaged to push/push the DIMM locking mechanism 1302 when the DIMM locking mechanism 1302 is in the locked position, and the user can push the DIMM mechanism button 1104 to push/push the DIMM locking mechanism 1302. Push the DIMM locking mechanism to release the lock. In this case, it can further "overtravel" a short distance inward, thereby as the fourth cross bar rotates and slides until it reaches the end of the open zone, the spring latch is disengaged and forced Push/push the DIMM locking mechanism 1302 to rotate outward. In one embodiment, the amount of inward "overtravel" and the amount of outward travel achieved by pushing/pushing the DIMM locking mechanism 1302 can be determined at least in part by the length of the open zone of the fourth cross bar.
15B to 15D are views of the DIMM mechanism 1320, which illustrate (push/push) the manner in which the DIMM locking mechanism 1328 transforms from the latched (locked) orientation to the unlocked (unlocked) orientation. More specifically, FIG. 15B shows the DIMM mechanism 1320 in the latch orientation 1502, and FIG. 15C shows the DIMM mechanism 1320 in the transition orientation 1504 to better illustrate the kinematics of the DIMM mechanism 1320, and finally, FIG. 15D illustrates the DIMM mechanism 1320 in the release The DIMM mechanism 1320 of the orientation 1506 is locked (or unlocked). In the embodiment shown in FIG. 15B, the DIMM locking mechanism 1328 is oriented in the latched position 1502, whereby the surface 1508 of the arm 1510 formed integrally with the first actuator 1322 is held in place to resist the biasing mechanism Bias force F provided by 1512<sub>bias</sub>. In one embodiment, the biasing mechanism 1512 can be a spring form. More specifically, the biasing mechanism 1512 may take the form of a torsion spring configured to provide a torsional biasing force to the DIMM locking mechanism 1328. More specifically, the biasing force F<sub>bias</sub>A frictional coupling can be created between the surface 1508 of the arm 1510 and the surface 1514 of the locking feature 1516 that is part of the DIMM latch mechanism 1328. It should be noted that the spatial relationship between the surface 1508 and the surface 1514 can be adjusted to customize the "feel" of the DIMM mechanism 1320. It should be noted that the foot 1516 can limit the pivotal movement of the first actuator about the pivot 1326. In this way, the first actuator 1322 and the second actuator 1324 can be aligned to provide the appearance of a single component achieved by the first actuator 1322 and the second actuator 1324 in the latched orientation.
As shown in FIG. 15C, as the force F1 is applied to the first actuator 1322, both the first actuator 1322 and the first member 1518 move about the pivot 1326. The movement of the first member 1518 about the pivot 1326 causes the second member 1520 to translate both horizontally and vertically (by the pin 1522 moving through the slot 1524), thereby causing the second actuator 1324 to translate horizontally and pass through to unlock The program basically maintains the original orientation. In other words, as shown in FIG. 15D, the final position of the second actuator 1324 is parallel to the initial position of the second actuator 1324 relative to the DIMM base 1102. In this way, the user's interaction with the second actuator 1324 also remains substantially unchanged, regardless of the current orientation of the DIMM mechanism 1320 (latched or unlocked). It should also be noted that when the DIMM mechanism 1320 moves from the transition orientation 1506 to the unlock orientation 1508 shown in FIG. 15D, the "snap" feeling can be customized to adjust the surface 1508 and the edge of the surface 1514. The spatial relationship.
It should be noted that the relative contours or surfaces 1504 and 1510 can be used to adjust the "feel" of the DIMM mechanism 1302 during the unlocking process. In the unlocked orientation, the memory module 216 positioned within the DIMM mechanism 1320 is substantially perpendicular to the printed circuit board that can be attached to the DIMM mechanism 1320 via the DIMM connector base 1102. In one embodiment, in the locked position, the memory module 216 positioned within the DIMM mechanism 1320 is inclined away from the vertical and angled toward the central area of the printed circuit board to which the DIMM mechanism 1320 can be attached.
Figure 16 illustrates the wireless subsystem of the compact computing system 100 according to some embodiments Top view 1600 of 302. In one embodiment, one or more antennas 1604 are assembled inside the air exhaust vent of the exhaust assembly housing 1602. In one embodiment, one or more antennas 1604 are symmetrically arranged around the center point of the exhaust assembly housing 1602. Each antenna 1604 can connect a corresponding antenna cable 1608 to the wireless processing circuit system (not shown) assembled under the top cover 1606 of the wireless processing circuit system. In some embodiments, the top cover 1606 of the wireless processing circuit system is formed of conductive metal, and may partially form a Faraday cage to shield the wireless processing circuit system from external radio frequency interference or noise.
In some embodiments, the radio frequency transparent decorative shield 202 can cover the antenna assembly and the wireless processing circuit system. In one embodiment, the ring of the magnet embedded in the exhaust assembly housing 1602 can surround the antenna assembly and provide magnetic attraction for the metal ring assembled inside the radio frequency transparent decorative shield 202. In an embodiment, a plurality of conductive pads 1612 may be placed between the magnets 1610 to provide a conductive path for radio frequency interference signals. In some embodiments, the magnet 1610 and the conductive gasket 1612 can be omitted, and the radio frequency transparent decorative shield 202 can be mechanically attached to the exhaust assembly housing 1602, for example, it can be shaped to be assembled in a compact computing system It is formed by clamping a part of the flexible material of the exhaust assembly shell 1602 when it is mounted. In an embodiment, the antenna 1604 may be positioned outside a set of impeller assembly points 1614 through which the impeller 304 is attached to the exhaust assembly housing 1602. In one embodiment, at least a portion of the impeller assembly points and/or attachment mechanisms may be conductive to ensure that the impeller assembly point 1614 is not a free-floating metal piece close to the radio frequency antenna 1604 of the wireless subsystem 302.
FIG. 17 illustrates another top view 1700 of the wireless subsystem 302 of the compact computing system 100 according to some embodiments. The top view 1700 in FIG. 17 illustrates the wireless processing circuit system located between the impeller assembly points 1614 that attach the impeller 304 in the exhaust assembly housing 1602. The top view 1700 in FIG. 17 is similar to the top view 1600 in FIG. 16 with the top cover 1606 of the wireless processing circuit system removed. In an embodiment, one or more antennas 1604 may be connected to the wireless processing circuit board via an associated antenna cable 1608 The individual wireless antenna connection points 1708 on the 1702, the wireless processing circuit system board 1702 can be sandwiched to the wireless interposer board 1704 between the impeller assembly points 1604.
The wireless processing circuit system interconnect 1706 may include a flat flexible cable that can transmit digital (and/or analog) signals from the wireless processing circuit system board 1702 to another circuit board of the compact computing system 100 (Not shown) for further processing. The wireless processing circuit system interconnection 1706 can also transmit signals from other processing circuits in the compact computing system 100 to the wireless processing circuit board 1702, for example, for modulation and modulation via one or more of the antennas 1604. transmission. In some embodiments, the analog radio frequency processing circuit system and/or the digital radio frequency processing circuit system can be assembled on the wireless processing circuit system board 1702, and the analog and digital radio frequency processing circuit system on the wireless processing circuit system board 1702 can be at least partially provided According to the protocol data unit transmission and reception of one or more wireless communication protocols. In some embodiments, multiple antennas 1604 may be used to transmit and/or receive radio frequency signals between the smart computing system 100 and additional wireless communication devices.
FIG. 18 illustrates a top perspective view 1800 of the antenna assembly and wireless processing circuit system used in the compact computing system 100 according to some embodiments. In an embodiment, each of the three symmetrically positioned antennas 1604 can be connected to the wireless processing circuit board 1702 via a separate antenna cable 1608. The additional secondary antenna housing 1806 may include a fourth antenna connected to the wireless processing circuit system board 1702 via a secondary antenna cable 1804. In one embodiment, the three top antennas 1604 can be used to communicate according to the first wireless communication protocol, and the fourth front-mounted (secondary) antenna can be used to communicate according to the second wireless communication protocol. In one embodiment, four antennas 1604 (including front-mounted secondary antennas) can be used together to communicate according to wireless communication protocols, for example, in multiple-input multiple-output (MIMO) mode .
In one embodiment, the wireless signal processing circuit system on the wireless processing circuit system board 1702 can be selected among different antennas 1604 (including front-mounted secondary antennas in some embodiments) for use individually or collectively One or more of the antennas 1604 are based on Measure RF signal quality conditions to transmit and/or receive RF signals. In one embodiment, the wireless processing circuit board 1702 includes a wireless local area network (WLAN) communication protocol (for example, Wi-Fi protocol) and/or a wireless personal area network (wireless personal area network). network, WPAN) communication protocol (for example, Bluetooth protocol) and radio frequency processing circuit system for communication. In one embodiment, the digital signal can be transmitted from the wireless processing circuit system board 1702 to another circuit board (not shown) of the compact computing system for further processing via the wireless processing circuit system interconnect 1706 cable. In some embodiments, the digital signals of the wireless processing circuit system board 1702 can be passed through the wireless interposer board 1704 that can be attached to the wireless processing circuit system interconnect 1706.
FIG. 19 illustrates a bottom perspective view 1900 of the wireless subsystem 302 of the compact computing system 100 according to some embodiments. In an embodiment, the wireless processing circuit system 1902 can be assembled on the wireless processing circuit system board 1702, and can be connected to one or more antennas 1604 via the antenna cable 1608 and/or via the secondary antenna housing 1806 The front-mounted antenna receives and/or transmits radio frequency signals. The wireless processing circuit system board 1702 can communicate digital data (for example, a protocol data unit) via a wireless processing circuit system interconnect 1706 cable that can be assembled to another circuit system board (not shown) of the compact computing system, for example , To communicate with "higher-level" application processors (for example, CPU 402, or other digital chips provided for digital communication formatting and processing). In some embodiments, the wireless processing circuit system interconnect 1706 can be connected to the wireless interposer board 1704, and the wireless interposer board 1704 can then be connected to the wireless processing circuit system board 1702.
Figure 20 illustrates a perspective view 2000 of an input/output (I/O) assembly coupled to a top-mounted blower assembly according to some embodiments. In some embodiments, the top-mounted blower assembly may include an impeller 304 coupled to the exhaust assembly 218 and covered by the air chamber plate 328, which can draw air flow through the central core 200 of the components of the compact computing system 100 . The outer casing 102 of the compact computing system 100 may include an opening through which the interface panel 110 can be positioned, for example, as illustrated in FIG. 1. Interface panel 110 can be attached to the I/O sub-assembly cover 326. The I/O sub-assembly cover 326 can at least partially block and/or attenuate electromagnetic energy from entering or exiting a part of the Faraday cage of the outer housing 102. In one embodiment, the interface panel 110 can be formed of a radio frequency transparent material (for example, hardened plastic), and the separated perforated wire mesh panels (not shown) can be aligned with the inner part of the interface panel 110 to limit electromagnetic energy. It passes through the interface panel 110.
As illustrated in Figure 20, several openings for I/O ports can be accommodated. In addition, in some embodiments, the secondary antenna housing 1806 can be assembled inside the I/O sub-assembly cover 326 containing the secondary antenna (not shown) to pass through the interface panel 110 (and/or the I/O sub-assembly). The radio frequency transparent window in the cover 326) is formed to transmit radio frequency signals. In some embodiments, the wireless processing circuitry 1902 (not shown) can communicate digital signals via a wireless processing circuitry interconnect 1706 cable, which can be attached to the back of the I/O assembly. Placed circuit board (not shown). In one embodiment, for example, one or more individual icons and/or grouped icons for I/O ports of the interface panel 110 can be illuminated under computer control of a light emitting diode (LED), as further described herein Described. In some embodiments, the LED flex cable 2002 that is mounted on the back of the interface panel 110 (and/or mounted to the I/O sub-assembly cover 326) can be communicated to control the use of I/O ports. Illuminated signal of one or more of the individual icons and/or grouped icons. In one embodiment, the interface panel 110 includes an opening for the AC power connection 112, and the AC power cable 2004 can transmit the received AC power from the AC power connector 112 to the power supply unit 322 (not shown).
Figure 21 illustrates another perspective view 2100 of the input/output assembly coupled to the top-mounted blower assembly according to some embodiments. Figure 21 illustrates the I/O board 2102 mounted on the inner surface of the input/output (I/O) sub-assembly cover. In some embodiments, the I/O board 2102 illustrated in FIG. 21 substantially corresponds to the I/O board 324 illustrated in FIG. 3. The I/O board 2102 may include a plurality of I/O connectors that can protrude through the interface panel 110. The I/O board can provide high-speed data connection via the I/O rigid flex connector 2104 for the set of I/O ports of the compact computing system 100. In one embodiment, the I/O rigid flex connector 2104 can terminate the flex cable connected to the interconnect board 316 (Not shown), thereby providing a high-bandwidth connection between the set of I/O ports on the I/O board 2102 and the CPU board 318 and GPU board 306, and the CPU board 318 and GPU board 306 are also connected to the interconnect board 316 .
The wireless processing circuit system interconnection 1706 can also be connected to the I/O board 2102, so that the wireless processing circuit system 1902 and the interconnection board 316, the CPU board 318 and/or the GPU board 306 assembled in the top part of the blower assembly At least a part of the data path is provided between the one or more processing chips. In one embodiment, the high-speed connection to the GPU board 306 via the flex connector and/or to the CPU board 318 via the edge connector may include multiple peripheral component interconnect express (PCIe) interfaces. Channels, for example, 32 channels of PCIe 2.X/3.X/4.X interface. In some embodiments, the high-bandwidth connection between the I/O board 2102 and the interconnection board 316 can utilize one or more peripheral component interconnection express (PCIe) interfaces of multiple channels, for example, 32 channels of the PCIe interface, 2 x 16 lanes of two parallel PCIe interfaces, n x 32 lanes of multiple PCIe interfaces, or other combinations of one or more PCIe interfaces.
FIG. 22 illustrates a front view 2200 of the interface panel 110 of the compact computing system 100 according to some embodiments. In one embodiment, a transparent material covered with one or more lacquer layers on the surface may be used at least partially to form the interface panel 110. In one embodiment, a part of one or more lacquer layers may be laser etched to reveal a part of the underlying surface layer. In one embodiment, a process including painting and laser etching the surface of the interface panel 110 may be used to form one or more icons and/or groups. As illustrated in FIG. 22, the icons on the interface panel 110 may indicate individual ports and/or port groups. In one embodiment, the illuminable icon 2202 can be formed adjacent to individual ports and/or centered in a group of ports on the interface panel 110. The illuminable icon 2202 can provide a graphical indication of the function of the port that can be associated with the illuminable icon 2202. In one embodiment, one or more illuminable icons 2202 (for example, the first illuminable icon 2202 to indicate the speaker (audio output) port, and the second illuminable icon 2202 to indicate the microphone (audio input) port) can be used. Two can illuminate the icon 2202) to mark a group of audio ports 116. In one embodiment, the illuminable icon 2202 can be used (for example, placed in a set of bus ports 118 in the center). Among them) is to mark the group of bus ports 118, and the group of bus ports 118 can also be marked with the lighting pattern 2204. The lighting pattern 2204 can delimit the group of bus ports 118 from adjacent ports on the interface panel 110 along the circumference.
In one embodiment, as illustrated in FIG. 22, the illumination pattern 2204 may include a rectangle with rounded edges surrounding the set of busbar ports 118. Similarly, in one embodiment, the combination of the illuminable icon 2202 placed in the center and the illumination pattern 2204 of the perimeter boundary can be used to mark the group of high-speed expansion ports 120. In one embodiment, an illuminable icon 2202 can be used and the set of network ports 122 can be marked by a lighting pattern 2204 surrounding a set of network ports 122. In one embodiment, the adjacent illuminable icon 2202 can mark the video port 114. In some embodiments, the power switch 124 may be illuminated and provide one or more activity indications via flashing (or other changes) to the illumination. The interface panel 110 may also include an AC power inlet opening 2206 through which the AC power input port 112 can be accessed.
FIG. 23 illustrates a front view 2300 of an input/output (I/O) flexible wall assembly 2310 that can be assembled on the inside of the interface panel 110 for the compact computing system 100 according to some embodiments. The I/O flexible wall assembly 2310 may include one or more illustrated light emitting diodes (LEDs) 2304 that may be positioned adjacent to one or more illustrated light guides 2302. The illustrated LED 2304 can transmit light through the illustrated light guide 2302, and the illustrated light guide 2302 can be placed behind the corresponding illuminable icon 2202. In one embodiment, each illuminable icon 2202 can be paired with a corresponding icon light guide 2302 and icon LED 2304, and the icon light guide 2302 and icon LED 2304 can be controlled to illuminate the corresponding illuminable icon 2202. For example, the control signal received from the control processing circuit system in the compact computing system 100 via the LED flex cable 2002. In some embodiments, one or more grouped LEDs 2308 can be positioned adjacent to one or more grouped light guides 2306, and one or more grouped light guides 2306 can be placed around a port group, for example, placed in a corresponding Illumination pattern 2204 behind. One or more grouped LEDs 2308 can transmit light through the grouped light guide 2306. In an embodiment, each lighting pattern 2204 can be paired with a corresponding grouped light guide 2306, and the grouped light guide 2306 can transmit light to a group of ports of the interface panel 110 around. In a representative embodiment, a pair of grouped LEDs 2308 can be placed at the corners of each grouped light guide 2306.
24 illustrates a rear view 2400 of the input/output flexible wall assembly 2310 attached to the rear of the interface panel 110 of the compact computing system 100 according to some embodiments. The I/O flexible wall assembly 2310 can be attached to position one or more illustrated light guides 2302 and/or grouped light guides 2306 to provide light from one or more LEDs 2304/2308 to the illuminable icon 2202 And/or the zone behind the lighting pattern 2204. The illuminated icon 2202 and/or the illumination pattern 2204 can be illuminated under the control of one or more processors in the compact computing system 100. In one embodiment, one or more sensors (for example, accelerometers) can sense the movement of the compact computing system, and illuminate one or more illuminable icons 2202 and/or illumination patterns 2204 to help compactness The user of the type computing system locates a specific port or a group of ports on the interface panel 110.
25 illustrates a rear view 2500 and a cross-sectional view 2510 of a portion of the interface panel 110 of the compact computing system 100 according to some embodiments. As described above with respect to FIGS. 22-24, one or more illuminable icons 2202 and/or lighting patterns 2204 may be formed on the interface panel 110 (and/or formed by the interface panel 110), and corresponding light guides may be used And LEDs are illuminated from the rear. In some embodiments, the interface panel 110 may be formed of a translucent and/or optically transparent material that can be dyed and/or painted in various zones and/or regions. In one embodiment, the light blocking zone 2504 may be formed around the periphery of the I/O port of the interface panel 110 that may protrude through one or more port openings 2502. In one embodiment, the light blocking zone 2506 may be formed by immersing a penetrating dye into a zone adjacent to one or more port openings 2502 in the interface panel 110. In one embodiment, the light transparent zone 1504 may adjoin the light blocking zone 2506 surrounding each of the port openings 2502.
In one embodiment, the interface panel 110 may be initially formed substantially entirely of a light transparent material (such as plastic), and the selection zone surrounding each port opening 2502 in the interface panel 110 may be changed to a light blocking zone 2506 . In one embodiment, each light-transparent zone 2504 adjacent to one or more light-blocking zones may enclose at least one illumination pattern for a group of ports Case 2204 area. The illumination pattern can be formed by laser etching off one or more lacquer layers applied to the surface of the interface panel 110. As illustrated by the cross-sectional view 2510, the interface panel 110 may include a port opening 2502 surrounded by a light blocking zone 2506, which is in turn adjacent to the light transparent zone 2504. In a manufacturing process, one or more lacquer layers may be applied to the outer-facing surface of the interface panel 110. In one embodiment, the white paint layer 2508 may be applied to the outwardly facing surface of the interface panel 110, and then the black paint layer 2512 may be applied to the outwardly facing surface of the interface panel 110. Subsequently, a part of the black paint layer 2512 may be laser-etched to remove the black paint, thereby forming a laser-etched opening 2514 (for example, in the shape of the illuminating icon 2202 and/or the lighting pattern 2204) in the black paint layer 2512. The white paint layer 2508 exposed below.
In some embodiments, the white paint layer is partially transparent to a portion of the light provided by the grouped LED 2308 and transmitted by the grouped light guide 2306 placed adjacent to the rear-facing side of the interface panel 110. As illustrated in FIG. 25, the LED light 2516 from the grouped LED 2308 can be guided by the grouped light guide 2306 through a part of the light transparent zone 2504 behind the laser-etched opening 2514, thereby targeting the lighting pattern 2204 (or equivalently targeting the Lighting diagram 2202) provides backlighting. The light blocking zone 2506 located between the light transparent zone 2504 through which the LED light 2516 passes and the port opening 2502 can block the LED light 2516 from being emitted from the port opening.
FIG. 26 illustrates a method 2600 for illuminating the illumination pattern 2204 of a group of ports on the interface panel 110 in response to detecting the movement of the compact computing system 100 according to some embodiments. The method includes at least the following steps. In the first step 2602, the processing element in the compact computing system 100 detects at least one of the rotational movement and the translational movement of the compact computing system 100. In the second step 2604, the processing element transmits the lighting control signal to the input/output flexible wall 2310 mounted on the inner surface of the interface panel 110 of the compact computing system 100. In the third step 2606, in response to obtaining the lighting control signal, activate one or more light-emitting diodes (LEDs) (for example, one or more grouped LEDs 2308) associated with the group of ports so that the The LED beam 2516 guided by the grouping light guide 2306 of the port is transmitted through the medium The laser etched opening 2514 in the paint layer 2512 on the outer surface of the face plate 110. The laser etched opening 2514 surrounds the group of ports, wherein the first portion of the interface panel 110 adjacent to the grouped light guide 2306 is at least partially transparent to the LED beam 2516 (for example, the light transparent zone 2504), and wherein the first portion adjacent to the interface panel 110 A portion of the second portion of the interface panel 110 adjacent to at least one port in the set of ports is opaque to the light beam (for example, the light blocking zone 2506).
Figure 27 shows a perspective view of a compact computing system 2700. The compact computing system 2700 may have a shape defined by the housing 2702. In the described embodiment, the housing 2702 may be cylindrical in shape with a first opening 2704 characterized as having a diameter d1. More specifically, the housing 2702 may take the form of a circular right cylinder having a longitudinal axis extending along the center line of the central volume enclosed by the housing 2702. The housing 2702 can be characterized as having a circular cross-section with a center point that coincides with a corresponding point on the longitudinal axis. The circular cross section has a radius perpendicular to the longitudinal axis and extending outward from the longitudinal axis. Therefore, the thickness t of the shell 2702 (more specifically, the shell wall) can be defined as the difference between: the outer radius ro, which is related to the outside of the shell 2702; and the inner radius r<sub>i</sub>, Which is associated with the inner surface of the housing 2702. In addition, the housing 2702 may include a second opening 2706 axially disposed from the first opening 2704, the second opening 2706 having a diameter d2 partially defined by the exhaust lip 2708, where d1 is at least equal to or greater than d2. The housing 2702 can be formed from a single aluminum blank in the form of a disc that can be extruded in such a way that the exhaust lip 2708 can be formed. The thickness t of the housing 2702 can be tuned to reduce hot spots. In this regard, the housing 2702 may have a non-uniform thickness t. In detail, the portion 2710 near the exhaust lip 2708 may have a first thickness of about 4 mm to 6 mm, and the first thickness is then changed to a portion that is reduced from the first thickness and positioned away from the exhaust lip 2708 2712 is associated with the second thickness. In this way, the portion 2710 can serve both as an integrated handle for holding the compact computing system 2700, and as a feature for absorbing and conducting heat transferred from a portion of the exhaust gas flow 2714 that engages the exhaust lip 2708. Heat transfer by radiation and conduction and be transferred by restriction The amount of heat sent to the portion 2712 can reduce the formation of local hot spots in the housing 2702. The tuning of the thickness of the housing 2702 can be achieved using, for example, a punching procedure using a metal disc, which is then processed to a desired thickness profile. The metal disc can be made of aluminum, titanium, and any other metal material that provides the required strength, thermal conductivity, and RF isolation. The extrusion process forms a cylinder that is machined in the outer part and the inner part to obtain the desired cross-sectional profile and also obtain the desired visual appeal from the outside.
The compact computing system 2700 may further include a base unit 2716. The base unit 2716 can be used to provide support for the compact computing system 2700. Therefore, the base unit 2716 can be formed of a strong and elastic material along the metal wire, which can also prevent electromagnetic (EM) energy from leaking from components in the compact computing system 2700 that radiate EM energy during operation. The base unit 2716 can also be formed of non-metallic compounds, which can be made conductive using, for example, conductive particles embedded therein. In order to ensure that any electromagnetic energy emitted by the components in the compact computing system 2700 will not leak out, the lower conductive pad 2718 can be used to complete the Faraday cage formed by the base unit 2716 and the housing 2702. The upper conductive pad 2720 (shown in more detail in FIG. 3) may be disposed on the inner surface of the housing 2702 near the lower edge of the portion 2710. Using conductive pads 2718 and 2720 to complete the Faraday cage can increase EMI isolation by approximately 20 dB.
The base unit 2716 may also include a vent 2722. The vent 2722 can have a dual purpose, in that the vent 2722 can be configured in the base unit 2716 so that a suitable amount of air from the external environment can flow through the vent 2722 in the form of an intake air flow 2724. In one embodiment, the intake air flow 2724 may be related to the pressure difference across the vent 2722 generated by the blower installed with the compact computing system 2700. In one embodiment, the blower may be placed near the second opening 2706 to produce a suction effect that reduces the environmental pressure in the housing 2702. In addition to promoting the intake air flow 2724, the vent 2722 can also be sized to prevent electromagnetic energy from leaking through the vent 2722. The size of the vent 2722 may be related to the wavelength corresponding to the electromagnetic energy emitted by the internal components.
It should be noted that although a cylindrical casing is shown, any suitable shape of casing can still be used. For example, the housing 2702 may have a rectangular cross-section, a conical cross-section (circle is the only one of them), or the cross-section may be<i>n</i>The form of a side polygon (a rectangle is one of them, where n=4; and a triangle is one of them, where n=3), where<i>n</i>Is an integer having a value of at least 3.
This creation describes a desktop computing system, which has: a housing with an inner surface defining an internal volume and a longitudinal axis; a computing engine including a computing component; and a structural core positioned at In the internal volume, the structural core provides structural support for the computing engine, so that the computing engine assumes the general shape of the structural core. In one embodiment, the structural core includes a heat sink that facilitates the removal of at least some of the heat generated by the computing engine from the desktop computing system.
In one embodiment, the structural core includes a heat sink that facilitates the removal of heat from the cylindrical volume, and the heat sink includes a plurality of flat surfaces, and the plurality of flat faces provides an enclosure with a triangular cross-section for the structural core The triangular shape of a central hot zone makes the computing engine the triangular shape of the core of the structure. In one embodiment, the central hot zone is substantially parallel to the longitudinal axis, and an outer surface of the plurality of flat surfaces and an inner surface of the cylindrical shell define a peripheral hot zone separate from the central hot zone . In one embodiment, a thermal management system and the computing engine cooperate to maintain a temperature of one of the computing components within a predetermined range of operating temperature, so that a central airflow and a peripheral airflow through the central hot zone are guided Pass through the surrounding hot zone. In one embodiment, the desktop computing system is characterized as having a computing density, which is defined as the peak operating rate of the computing engine over an amount of time divided by the cylindrical volume. In one embodiment, the cylindrical housing is formed of aluminum. In one embodiment, a shape of the arithmetic component is defined by a primary centerline corresponding to a primary length and a primary centerline corresponding to a primary length.
In one embodiment, the main centerline is perpendicular to the secondary centerline. In one In an embodiment, an internal structure of the computing component is substantially parallel to the main center line and organized according to the main length. In one embodiment, the computing component includes a first node located at a first end, and a second node located at a second end opposite to the first end. The desktop computing system also includes: a printed circuit board (PCB) having a PCB shape defined by a main center line of a PCB; and an electrical trace, and the computing component is assembled to the PCB and electrically connected to the PCB Electrical traces. In one embodiment, the PCB is assembled to one of the plurality of flat surfaces, and the PCB center line is substantially parallel to the longitudinal axis, and the PCB is one of a plurality of PCBs, the plurality of PCBs Each has its respective main centerline substantially parallel to the longitudinal axis, and at least one PCB is a graphics processing unit (GPU) board. In one embodiment, the GPU board includes: a graphics processing unit (GPU); and a video random access memory (VRAM), which is coupled to the GPU through a corresponding electrical trace. In one embodiment, the system includes a central processing unit (CPU) board. The CPU board includes: a central processing unit (CPU) mounted to a first side of the CPU board; and a memory module , Which is assembled on a second side of the CPU board and electrically connected to the CPU, wherein the first side is opposite to the second side of the CPU board.
In one embodiment, an input/output (I/O) board includes an input/output (I/O) interface panel, the I/O interface panel includes a high-speed data port, and the high-speed data port may be a Accessed by external systems. In one embodiment, the system includes an interconnect board, the interconnect board (1) is connected to the GPU board via a first broadband interconnection cable, (2) via a second broadband interconnection cable The cable is connected to the I/O interface panel, and (3) is connected to the CPU board via a wideband edge connector on the CPU board and a socket connector on the interconnection board. In one embodiment, the system also includes a power supply unit configured to provide one or more direct current (DC) voltages to: A top edge, the first broadband interconnection cable is attached to the bottom edge; and a top edge of the CPU board opposite to a bottom edge of the CPU board, the bottom edge including the broadband edge connector. In one embodiment, the first broadband broadband interconnect and the second broadband interconnect The wide interconnect includes a flexible cable, and a third wide bandwidth interconnect includes one or more edge connectors on the CPU board, and the one or more edge connectors are connected to the interconnect board. One or more corresponding socket connectors are paired.
This creation describes a desktop computing system. The desktop computing system includes: a housing with an inner surface defining an inner volume with a longitudinal axis; and an arithmetic engine positioned in the inner volume, wherein the arithmetic engine has an inner volume perpendicular to One of the longitudinal axes is generally triangular in cross section.
In one embodiment, the desktop computing system includes a heat sink in thermal contact with at least the computing component, wherein the heat sink includes a plurality of flat surfaces, and at least one of the plurality of flat surfaces is parallel to the longitudinal direction Axis, and at least one of the plurality of flat surfaces provides a structural support for the computing engine. In one embodiment, the computing component is assembled to one of the plurality of flat surfaces. In one embodiment, the computing component has a shape including a main center line corresponding to a main size and a primary center line corresponding to the primary size, and in one embodiment, the main size Is a length (L) and the secondary dimension is a width (W). In one embodiment, an internal structure of the computing component is organized substantially parallel to the main centerline. The arithmetic engine further includes a printed circuit board (PCB) including a plurality of electrical traces, and the printed circuit board has a main centerline of the PCB substantially parallel to the longitudinal axis. In one embodiment, the printed circuit board is a central processing unit (CPU) board, and a CPU is mounted on a first side of the CPU board, and the CPU is connected to one of the plurality of electrical traces . In one embodiment, the CPU board further includes a memory module mounted on a second side of the CPU board opposite to the first side of the CPU board.
The desktop computing system also includes a memory module mechanism arranged on the second surface of the CPU board and configured to provide support for the memory module. In one embodiment, the memory module mechanism includes a pair of end guides connected to each other by a supporting member, and each end guide includes a slot through which It is configured to hold an end of the memory module and guide the memory module to a socket assembled on the CPU board. In one embodiment, the memory module mechanism also includes: a locking mechanism configured to provide movement of the memory module mechanism between an unlocked position and a locked position; and an actuator , Which is attached to a first end guide, the actuator activates a locking function of the memory module mechanism by receiving an applied force at the actuator or the supporting member, so that the The memory module mechanism moves between the unlocked position and the locked position. In one embodiment, the support member is configured to provide structural support and to facilitate the transfer of a portion of the applied force to a second end guide opposite the first end guide and resist the memory The twist of the modular structure. In one embodiment, the memory module mechanism allows the insertion and removal of the memory module in the unlocked position, and restricts the insertion and removal of the memory module in the locked position. In one embodiment, when the memory module mechanism is in the locked position, the memory module mechanism responds to the applied force received at the actuator or the support member to a first party An overtravel movement of one of the memory module mechanisms is provided upward. In one embodiment, the memory module further includes a spring load mechanism that causes the memory module mechanism to move in a second direction opposite to the first direction in response to the overtravel movement Move from the locked position to the unlocked position. In one embodiment, the memory module is a dual coaxial memory module with an approximate length of 133 mm. In one embodiment, the memory module mechanism engages the memory module to the socket in the locked position, and disengages the memory module from the socket in the unlocked position. In one embodiment, the locking mechanism includes a movable link assembly, and the movable link assembly includes a plurality of interconnecting rods. In one embodiment, the housing is a cylindrical housing defining a shape of the internal volume as a cylindrical volume.
This creation describes a desktop computing system. The desktop computing system includes a housing that encloses an internal volume having a longitudinal axis and a circular cross section defined by a radius perpendicular to the longitudinal axis. The system also includes the A printed circuit board (PCB) within the volume, the PCB has a shape that is partly substantially parallel to the longitudinal axis and perpendicular to the radius and positioned radially along the radius to align with the The longitudinal axis is defined by a main centerline separated by a radial distance. In one embodiment, the housing has a cylindrical shape defining a shape of the internal volume as a cylindrical volume.
In an embodiment, the radius has a maximum radial distance at an inner surface of the cylindrical housing. In one embodiment, the PCB is part of an interconnected PCB stack, the stack comprising: a central processing unit (CPU) board positioned along the radius at a first radial distance and having substantially A CPU board centerline parallel to the longitudinal axis, and including a CPU having a CPU centerline mounted on a first side of the CPU board, the CPU centerline being substantially parallel to the CPU board centerline, the The CPU board includes a power input node located at a first end, and a data node including one or more broadband edge connectors located at a second end opposite to the first end, wherein the first end And the second end is positioned at the opposite end of the main centerline of the CPU; and a power supply unit coupled to the CPU board and configured to provide one or more direct current (DC) voltages to the power input node . In one embodiment, the interconnect PCB stack further includes an input/output (I/O) interface panel, the I/O interface panel is positioned at a second radial distance greater than the radial distance, the radial distance Each of the second radial distance and the second radial distance is less than the maximum radial distance, and the I/O interface panel includes: a plurality of high-speed data ports to one or more external systems; and an I/O interface panel, which includes A plurality of illuminable I/O ports, at least one of the plurality of illuminable I/O ports corresponds to one of the plurality of high-speed data ports, wherein when a sensor detects the cylindrical desktop When the computing system is moving, the illumination is used for the illumination pattern display indicator of at least some of the plurality of illuminable I/O ports.
A flexible I/O wall assembly is assembled on an inner surface of the I/O interface panel and is configured to receive a lighting control signal according to the movement detected by the sensor. In one embodiment, the flexible I/O wall assembly further includes: a light emitting diode (LED), which Responding to the lighting control signal by generating light; and a grouped light guide which is positioned adjacent to at least one of the plurality of I/O ports and configured to pass through one of the I/O interface panels An opening of an opaque layer on the outer surface receives and guides the light generated by the LED, and the opening surrounds at least one of the plurality of I/O ports. In one embodiment, a first portion of the interface panel adjacent to the grouping light guide is at least partially transparent to the light, and adjacent to the first portion of the interface panel and adjacent to the interface of the at least one I/O port The second part of one of the panels is opaque to this light. And, the first part of the interface panel includes the lighting pattern display indicator, and the second part of the interface panel blocks the light from being emitted from the at least one I/O port. In an embodiment, the movement includes at least one of a rotation movement and a translation movement.
This creation describes a method of instructing the movement of a desktop computing system. The method can be performed by the following steps: a sensor detects the movement of the desktop computing system; according to the movement, the sensor provides a motion detection signal to a processor; responds to The motion detection signal is provided by the processor with a lighting control signal to an I/O interface panel including a light emitting diode (LED); the LED generates light in response to the lighting control signal; and using the At least some of the light illuminates an I/O port, thereby indicating the movement of the desktop computing system.
A desktop computing system includes: a housing with an axisymmetric shape and a longitudinal axis; an air passage spanning an entire length of the housing; and a computing component arranged in the air passage. In one embodiment, the system includes a heat sink having a triangular cross section, the heat sink is disposed in the air passage and is in thermal contact with the computing component, wherein the triangular heat sink includes a plurality of flat surfaces, And the arithmetic component is assembled to one of the plurality of flat surfaces.
This creation describes a computer architecture with an internal component configuration including an internal component used in a cylindrical compact computing system and an external interface configuration, the internal component and external interface configuration having a structural heat sink, The structure of the heat sink package A plurality of surfaces including a computing element attached to a computing core of the compact computing system, the plurality of surfaces including a first surface, the first surface being connected to a second surface by a plurality of cooling fins .
This creation describes a method for illuminating a lighting pattern display indicator of a group of I/O ports on an input/output (I/O) interface panel of a compact computing system. The method is performed by the following steps: detecting at least one of a rotational movement and a translational movement of the compact computing system; providing a lighting control signal to an I/O flexible wall assembly, the I /O The flexible wall assembly is assembled on an inner surface of the I/O interface panel of the compact computing system; and in response to the provided lighting control signal, one or more light-emitting diodes (LED ) So that a light beam guided by a grouped light guide positioned adjacent to the set of I/O ports transmits through a laser etched opening of a paint layer on an outer surface of the interface panel, wherein the laser etched The opening surrounds the set of ports. In one embodiment, a first portion of the interface panel adjacent to the grouped light guide is at least partially transparent to the light beam, and is adjacent to the first portion of the interface panel and adjacent to at least one port in the group of ports A second part of the interface panel is opaque to the light beam.
This creation describes a mechanism for rotating and locking memory modules, which includes: a pair of end guides connected by a supporting member, and each end guide includes a slot to hold one of a memory module The end and guide the memory module to a socket assembled on a circuit board; a locking mechanism configured to provide rotation of the memory module mechanism between an unlocked position and an unlocked position ; Actuator, which is attached to the first end guide of one of the pair of end guides, wherein a user activates the memory by applying a pressing force to the actuator or the support member A rotation and locking function of the body module mechanism, whereby the memory module mechanism is rotated between the unlocked position and the locked position; and the support member, which is configured to provide structural support to apply A part of the pressing force to the actuator is transmitted to an end guide opposite to the actuator and resists the torsion of the memory module mechanism. In one embodiment, the memory module mechanism is in The insertion and removal of the memory module is allowed when in the unlocked position, and the insertion and removal of the memory module is restricted when in the locked position.
In one embodiment, there is provided: a locking mechanism for movement of the memory module mechanism between an unlocked position and a locked position; and an actuator attached to a first end guide The actuator activates a locking function of the memory module mechanism by receiving an applied force at the actuator or the supporting member, so that the memory module mechanism is in the unlocked position and Move between the locked positions. In one embodiment, the support member is configured to provide structural support and to facilitate the transfer of a portion of the applied force to a second end guide opposite the first end guide and resist the memory The twist of the modular structure. In one embodiment, the memory module mechanism allows the insertion and removal of the memory module in the unlocked position, and restricts the insertion and removal of the memory module in the locked position.
In one embodiment, when the memory module mechanism is in the locked position, the memory module mechanism responds to the applied force received at the actuator or the support member to a first party An overtravel movement of one of the memory module mechanisms is provided upward. In one embodiment, the memory module also includes a spring load mechanism that causes the memory module mechanism to move in a second direction opposite to the first direction in response to the overtravel movement Move from the locked position to the unlocked position. In one embodiment, the memory module is a dual coaxial memory module with an approximate length of 133 mm. In one embodiment, the memory module mechanism engages the memory module to the socket in the locked position, and disengages the memory module from the socket in the unlocked position. In one embodiment, the locking mechanism includes a movable link assembly including a plurality of interconnecting rods.
A cylindrical desktop arithmetic system includes an arithmetic engine positioned in a cylindrical housing, and the arithmetic engine cooperates with a thermal management system to increase a high arithmetic processing rate per unit volume.
A memory module mechanism includes: a pair of end guides, which has a first end guide and a second end guide, the pair of end guides are connected by a supporting member, and each end guide The lead includes a slot to hold an end of a memory module and guide the memory module to a socket assembled on a circuit board; a locking mechanism configured to provide the memory module The rotation of the mechanism between an unlocked position and a locked position; and an actuator, which is attached to one of the pair of end guides, the first end guide, in which a user applies a force The actuator or the supporting member activates a rotation and locking function of the memory module mechanism, thereby causing the memory module mechanism to rotate between the unlocked position and the locked position.
This creation describes a method of instructing the movement of a desktop computing system. The method includes at least the following steps: detecting the movement of the desktop computing system by a sensor; providing a movement detection signal to a processor by the sensor according to the movement; responding to the movement detection The processor provides a lighting control signal to an I/O interface panel including a light emitting diode (LED); in response to the lighting control signal, the LED generates light; using at least some of the light To illuminate an I/O port to indicate the movement of the desktop computing system. In one embodiment, at least some of the light generated by the LED is received by a grouped light guide adjacent to the plurality of I/O ports, and the grouped light guide guides some of the received light through the I/O An opening of an opaque layer on an outer surface of the O interface panel. In one embodiment, a first portion of the I/O interface panel is adjacent to the grouping light guide and is at least partially transparent to the light. In one embodiment, a second portion of the I/O interface panel adjacent to the first portion of the interface panel and adjacent to the at least one I/O port is opaque to the light.
This creation describes a method for illuminating a lighting pattern display indicator of a group of I/O ports on an input/output (I/O) interface panel of a compact computing system. The method is performed by the following steps: detecting at least one of a rotational movement and a translational movement of the compact computing system; providing a lighting control signal to an I/O flexible wall assembly The I/O flexible wall assembly is assembled on an inner surface of the I/O interface panel of the compact computing system; and in response to the provided lighting control signal, one or more light emitting diodes are activated A pole body (LED) so that a light beam guided by a grouped light guide positioned adjacent to the set of I/O ports transmits through a laser etched opening of a paint layer on an outer surface of the interface panel, wherein The laser etching opening surrounds the group of ports. In one embodiment, a first portion of the interface panel adjacent to the grouped light guide is at least partially transparent to the light beam, and is adjacent to the first portion of the interface panel and adjacent to at least one port in the group of ports A second part of the interface panel is opaque to the light beam.
A compact desktop computing system includes: a computing engine having a substantially triangular layout in cooperation with a corresponding cylindrical housing; and a thermal management system for enhancing a high computing processing rate per unit volume.
A desktop computing system includes: a housing with a longitudinal axis, the housing enclosing and defining an internal volume symmetrical around the longitudinal axis; a computing engine arranged in the internal volume; and a structural core, It is positioned in the internal volume, and the structural core provides structural support for the computing engine, so that the computing engine assumes the general shape of the structural core.
In one embodiment, the structural core includes a heat sink that facilitates the removal of heat from the axisymmetric volume. In one embodiment, the heat sink includes a plurality of flat surfaces, and the plurality of flat surfaces provide a shape of a polygon to the structural core, the shape enclosing a central hot area having a cross section of the shape of the polygon . In one embodiment, the computing engine has the shape of the structural core. In one embodiment, the central hot zone is substantially parallel to the longitudinal axis. In one embodiment, an outer surface of the plurality of flat surfaces and an inner surface of the housing define a peripheral thermal zone separate from the central thermal zone. In one embodiment, a thermal management system and the computing engine cooperate to maintain a temperature of the computing component within a predetermined range of operating temperature. In one embodiment, the housing with the axisymmetric shape is a cylindrical housing. In one embodiment, the axisymmetric volume is a cylindrical volume. In one implementation In the example, the polygon is a triangle.
A compact desktop computing system includes: a housing having a longitudinal axis, the longitudinal axis having a length L, wherein the housing encloses and defines an internal space, the internal space is symmetrical around the longitudinal axis and has a volume V; an arithmetic engine, which is positioned in the internal space; and a thermal management system, which is closely coupled with the arithmetic engine, wherein the thermal management system is used to operate according to the arithmetic engine at an increased processing rate The arithmetic engine is maintained in a hot state. In one embodiment, the thermal management system includes a structural core that provides structural support for the computing engine. In one embodiment, the structure core includes a plurality of flat surfaces, and the plurality of flat surfaces form a heat sink having a cross section according to a polygon and define a central hot zone.
In one embodiment, at least a part of the computing engine is assembled to and supported by at least one of the side surfaces, and is in close thermal contact with the heat sink. In one embodiment, the close coupling between the thermal management system and the arithmetic engine includes that the arithmetic engine is in the general shape of the heat sink. In one embodiment, the thermal management system further includes a blower configured to move air through the central hot zone. In one embodiment, the close coupling between the thermal management system and the arithmetic engine also includes the blower moving a certain amount of air through the center at a speed in response to an arithmetic processing rate of the arithmetic engine Hot zone. In one embodiment, the polygon is a triangle.
In one embodiment, an operation processing density is defined as the operation processing rate divided by the volume V. In one embodiment, the housing is cylindrical, and the inner space includes a circular cross-section perpendicular to the longitudinal axis and having an area A, and the volume V is approximately equal to the length L times the area A(L ×A). In another embodiment, the housing includes<i>n</i>Sides, of which<i>n</i>Is an integer having a value of at least 3, and wherein the inner space includes one that is perpendicular to the longitudinal axis and has an area A<i>n</i>A side cross-section, and the volume V is approximately equal to the length L times the area A (L×A). In yet another embodiment, the housing has a shape such that the corresponding inner space includes a conical shape perpendicular to the longitudinal axis and having an area A Cross section, and where the volume V is approximately equal to the length L times the area A (L×A).
A desktop computing system includes: a housing having a longitudinal axis and defining an internal volume symmetrical around the longitudinal axis; and a computing engine including a computing component; and a structural core positioned in the internal volume Inside, the structural core provides structural support for the computing engine.
A desktop computing system includes: a housing having a longitudinal axis and an inner surface, the inner surface defining an internal volume symmetrical about the longitudinal axis; and an arithmetic engine, which includes an arithmetic component, and the arithmetic engine is positioned Within the internal volume, the internal volume includes a cross section having a polygonal shape and perpendicular to the longitudinal axis.
A desktop computing system includes: a cylindrical housing having a longitudinal axis and enclosing and defining an internal volume, the internal volume having a circular cross-section, the circular cross-section is centered on the longitudinal axis and Defined by a radius centered on the longitudinal axis and perpendicular to the longitudinal axis; and a printed circuit board (PCB) disposed in the internal volume, the PCB including partly formed by parallel to the longitudinal axis and perpendicular to the longitudinal axis The radius is positioned as a shape defined by a major centerline along the radius and a distance from the longitudinal axis.
A method for instructing a movement of a desktop computing system includes at least the following operations: a sensor detects the movement of the desktop computing system; according to the movement, the sensor sends a motion detection signal Provided to a processor; in response to the motion detection signal, the processor provides a lighting control signal to an I/O interface panel including a light emitting diode (LED); in response to the lighting control signal, The LED generates a light; and at least some of the light is used to illuminate an I/O port, thereby indicating the movement of the desktop computing system.
A desktop computing system includes: a housing having a shape symmetrical about a longitudinal axis; an air passage spanning an entire length of the housing; and a computing component arranged in the air passage.
This creation describes a computer architecture that includes one of a sophisticated computing system Internal components and external interface configuration. The internal component and external interface configuration includes: a structural heat sink having a longitudinal axis and providing structural support for a computing engine with a computing component, the structural heat sink including flat surfaces, the flat surfaces defining a vertical In a central zone of a polygonal cross section of the longitudinal axis, and at least one of the flat surfaces carries the computing component; and a cooling element that connects an inner surface of a first flat surface to at least An inner surface of a second flat surface crosses the central zone.
This creation describes a method for illuminating a lighting pattern display indicator of a group of I/O ports on an input/output (I/O) interface panel of a compact computing system. The method is performed by the following steps: detecting at least one of a rotational movement and a translational movement of the compact computing system; providing a lighting control signal to an I/O flexible wall assembly, the I /O The flexible wall assembly is assembled on an inner surface of the I/O interface panel of the compact computing system; and in response to the provided lighting control signal, one or more light-emitting diodes (LED ) So that a light beam guided by a grouped light guide positioned adjacent to the set of I/O ports transmits through a laser etched opening of a paint layer on an outer surface of the interface panel, wherein the laser etched The opening surrounds the set of ports, and wherein a first portion of the interface panel adjacent to the grouping light guide is at least partially transparent to the light beam, and wherein the first portion adjacent to the interface panel and adjacent to at least one of the set of ports A second part of the interface panel of the port is opaque to the light beam.
A mechanism for rotating and locking a memory module includes: a pair of end guides connected by a supporting member, and each end guide includes a slot to hold an end of a memory module and the memory The body module is guided to a socket assembled on a circuit board; a locking mechanism is configured to provide rotation of the memory module mechanism between an unlocked position and a locked position; an actuator, which Attached to a first end guide of the pair of end guides, in which a user activates one of the memory module mechanisms by applying a pressing force to the actuator or the supporting member Rotation and locking function, whereby the memory module mechanism is rotated between the unlocked position and the locked position; and the support member, It is configured to provide structural support to transmit a part of the pressing force applied to the actuator to an end guide opposite to the actuator and resist the torsion of the memory module mechanism. The memory module mechanism allows the insertion and removal of the memory module when in the unlocking position, and restricts the insertion and removal of the memory module when in the locked position.
A desktop computing system includes: a computing engine positioned in a cylindrical housing defining a cylindrical volume with a longitudinal axis; and a thermal management system closely coupled to the computing engine Then, the thermal management system directly responds to a change in one of the activity levels of the computing engine in real time.
A memory module mechanism includes: a pair of end guides, including a first end guide and a second end guide, the pair of end guides are connected by a supporting member, and each end guide The lead includes a slot to hold an end of a memory module and guide the memory module to a socket assembled on a circuit board; a locking mechanism configured to provide the memory module The rotation of the mechanism between an unlocked position and a locked position; and an actuator, which is attached to one of the pair of end guides, the first end guide, in which a user applies a force The actuator or the supporting member activates a rotation and locking function of the memory module mechanism, thereby causing the memory module mechanism to rotate between the unlocked position and the locked position.
A desktop computing system includes: a housing having an inner surface defining a cylindrical volume with a longitudinal axis; and a computing engine including a computing component mounted on a printed circuit board (PCB) The arithmetic engine is positioned in the cylindrical volume and has a substantially triangular cross section perpendicular to the longitudinal axis.
A desktop computing system includes: a housing having a longitudinal axis, the housing enclosing and defining an internal volume symmetrical around the longitudinal axis; a computing engine arranged in the internal volume; and a structural heat sink , Which is positioned in the internal volume, and the structural heat sink provides structural support for the computing engine, so that the computing engine has a shape Corresponds to a shape of the structural heat sink, and wherein the structural heat sink facilitates the removal of heat from the internal volume.
A compact desktop computing system includes: a housing having a longitudinal axis, the longitudinal axis having a length L, wherein the housing encloses and defines an internal space, the internal space is symmetric about the longitudinal axis and has a volume V; an arithmetic engine, which is positioned in the internal space; and a thermal management system, which is closely coupled with the arithmetic engine, wherein the thermal management system enables the arithmetic engine to operate at an arithmetic processing rate.
A desktop computing system includes: a housing defining an internal space; an air passage positioned in the internal space, the air passage having a length spanning an entire length of the housing; and a computing component, which It is arranged in the air passage, and an amount of air moving through the air passage is based on the current operation of one of the arithmetic components.
For the purpose of explanation, the above description uses specific nomenclature to provide a thorough understanding of this creation. However, it will be obvious to those familiar with this technology that no specific details are needed in order to practice this creation. Therefore, the foregoing description of the specific embodiment of the present creation is presented for the purpose of illustration and description. The above description is not intended to be exhaustive or to limit the creation to the precise form disclosed. It will be obvious to those who are familiar with the technology. In view of the above teachings, many modifications and changes are possible.
The embodiments are selected and described in order to best explain the principle and practical application of the creation, so as to enable those familiar with the technology to make the best use of the creation and have various modifications suitable for the specific intended use. Various embodiments. It is hoped that the scope of this creation will be defined by the scope of the following patent applications and their equivalents.
Although the embodiments have been described in terms of certain specific embodiments, there are variations, permutations, and equivalents that fall within the category of these general concepts. It should also be noted that there are many alternative ways to implement the method and device of this creation. Therefore, it is hoped that the scope of the following appended application patents will be interpreted as including all such changes, permutations and equivalents that belong to the true spirit and scope of the described embodiments.
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143 members in 8 offices
Priority claims2
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| 201361832709 | United States of America | P |
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Numbers
- Publication
- M500282
- Application
- 103209978
Titles2
- English
- COMPUTER INTERNAL ARCHITECTURE
- Chinese
- 電腦內部架構
Classification
- CPC, 5
- G06F1/182
- G06F1/20
- G06F1/181
- G06F1/183
- G06F1/16
- IPC, 2
- G06F1 16
- H10W40 43