Apparatus for the placement of a semiconductor chips on a substrate

Equipment for placing semiconductor wafers on substrates

APPARATUS FOR THE PLACEMENT OF A SEMICONDUCTOR CHIP ON A SUBSTRATE

The present invention relates to a method for placing electronic components, especially semiconductor chips, according to the preamble of the first item of the scope of the patent application. Using this type of method, for example, during the production of semiconductor components in an automatic die bonder (die bonder), unpackaged chips are picked from the finely diced silicon wafer, and then placed and bonded On the corresponding substrate. The bonding process is followed by further procedural steps, such as hardening, wire bonding, welding fusion, packaging, singulation, and so on.

In order to position the wafer on the substrate, there are many different procedures, such as adhesive bonding, soldering or lamination. The type of bonding procedure also determines whether the chip must be flipped (flip-chip applications) or not (non-flip applications) before positioning. After that, it is understood that the flip of the wafer clearly does not mean the relative movement of the space axis or the space plane, but is about the flip of the original carrier side. In the case of non-flip chip applications, the chip is not turned over, and after extraction, it is directly transported from the wafer film to the substrate in one step, and the extraction tool is also used as a bonding tool. After the chip is bonded on the carrier side of the wafer film, it is also the side on which the chip is bonded on the substrate. For example, it has been mentioned in EP 1 049 140 or the applicants company magazine "Newsline 1/2002" (mechanical type "Easyline") has published this type of known equipment. In the case of flip-chip applications, after flipping, the chip is placed on the substrate by its structure, that is, after positioning, the chip By bonding the load-bearing side on the wafer film, it is the load-bearing side away from the substrate. As for the production cost, output, accuracy and program flexibility, the modern die bonder system has become an unprecedentedly larger element. As for the height of the structure and the mechanical configuration Planning, weight, etc., the machine should still not exceed the existing equipment. As for the mechanical structure, movement sequence and control, this has caused the unprecedented complexity of the machine. US 2005/0132567 has published a device with three tool heads. The rotatable picking tool picks up the semiconductor chip and transports it from there to a higher plane, and is further accommodated by the tool that carries the chip by linear movement above the substrate, and is placed there. The plane and the substrate plane move in parallel, but the level is different. Therefore, it becomes possible to drive the wafer table under the substrate table. In the case of large wafers, this is particularly advantageous because it means that the machine can be kept small. Basic area. However, in this case, the chip is obviously always flipped by the transfer operation, so it is placed on the substrate (flip chip application) on its structural side instead of its carrying side. Moreover, in order to overcome capture The height difference between the plane and the delivery plane requires a relatively large outer diameter for the rotatable extraction tool, which is unfavorable for kinematics or spatial factors.

Therefore, one of the items of the present invention is to provide a method of the type mentioned in the preamble, in which the gap between the plane of the supply table and the supply plane at a higher level can be overcome with less space requirements and a more advantageous kinematics method. The height difference, and the components can also be placed on the substrate on the same carrying side again (non-flip chip applications), and the highest possible yield with improved placement accuracy may be obtained. Moreover, it is intended to be possible at room temperature, but it can also complete thermal positioning in some cases. Moreover, in order to broaden the scope of use with low additional cost, it is intended to make it possible to use the same method and the same equipment to implement flip-chip and non-flip-chip applications. It is intended that the chip position can be captured as best as possible by the corresponding optical image recognition devices in different positions. Finally, the intention is to make the equipment structure as small as possible and have the smallest possible mechanical configuration planning. The cost objective is achieved from the viewpoint of using the method with the first characteristic method in the scope of patent application. From the equipment point of view, use equipment with the 11th feature of the scope of patent application to achieve this purpose.

If the component path between the plane of the supply table and the supply plane is covered by at least two separate ascending curve movements, it can significantly save space compared to the layout plan. In this case, the main tool is moved by the component covering the first curve, and the component is transferred to the at least one pivoting tool at the transfer position, which covers the second curve movement as far as the supply plane. In this case, the tortuous path is significantly smaller than that which must be covered by a single turning tool if the component travels. Moreover, the significantly smaller mass must be accelerated and decelerated, which reduces energy consumption and makes the movement sequence faster. Assuming that the height difference is large, most pivoting tools can of course be connected in series, and as a result, the travel will be covered by more than two separate pivoting movements. At least one pivoting tool system must be clearly arranged in the operating area of the main tool.

For flip chip applications, it is particularly advantageous if the main tool transfers the component to an intermediate pivoting tool, which takes the component on the load-bearing side and transfers it to the final pivoting tool after pivoting. Finally, the pivoting tool takes the component again on the structural side and pivots it into the supply plane, where it is transferred to the secondary tool, where it is finally placed on the substrate on the structural side. In this case, the intermediate pivoting tool obviously performs the function of transferring the components to the final pivoting tool in such ways that it can be obtained on the structural side. Only in this case, if you want to avoid repeated flips, a secondary tool is used, and the component is finally placed on the structural side again.

In contrast, in the case of non-flip chip applications, it is appropriate that if the main tool directly transfers the component to the final pivot tool that obtains the component on the load side and pivots it into the supply plane, at the supply plane It is transferred to the secondary tool, where it is finally placed on the substrate again with the same carrying side. It is obvious that the transfer of components from the primary tool to the final pivot tool thus has the effect that it can be taken by the secondary tool on the structural side, and therefore can also be placed on the load-bearing side again.

In particular, there are many possibilities for use. However, if the component is in the first operating mode and is directly transferred to the final pivoting tool through the intermediate pivoting tool in the second operating mode, in the first and second operating modes, The pivoting movement of the main tool is carried out separately from the supply station, and preferably carried out on each moving part, such as a sector. Therefore, you can choose to implement flip-chip applications and non-flip-chip applications. According to the selected operation mode, the pivotal movement of the main tool has the best performance for the respective moving parts to optimize the configuration of the intermediate pivoting tool or the final pivoting tool or the best curve-oriented geometry. However, instead of part of the circular arc movement, other curvilinear movements such as wheel rotation or spiral can also be implemented depending on the selection of the gear mechanism used. It is felt that the opposite curvature makes the path shorter and allows the travel between the plane of the supply table and the supply plane to pass as directly as possible. The movement of the secondary tool from accommodating the component to exceeding the substrate is linearly advantageous. However, in this case, it is also conceivable that it will move in a curve.

If the transportation of the components from the supply station to the top of the substrate is basically carried out on a substantially vertical transportation plane, a particularly advantageous mechanical configuration and movement execution will result. All driving elements and auxiliary devices can therefore be clearly arranged along this plane. This also significantly simplifies the visual observation and mechanical maintenance of the work sequence. If the actual position (position and angle) of the component on the supply table before capturing is determined by the first image recognition device, and/or if it is transported to the substrate, the actual position of the component in the supply plane is recognized by the second image It is determined by the device, and/or if the actual position of the substrate is determined by the third image recognition device, further advantages can be achieved. During the transportation, it is better to correct the determined actual value and the predetermined expected position of the component The deviation between. The image recognition device can be, for example, a CCD camera. Since there are only three types of cameras in total, it is possible to achieve very high accuracy or the best possible correction here. However, depending on the application, it is also conceivable, for example, to measure only the actual position of the component in the supply plane.

Regarding the possibility of the different modes of operation mentioned in the preamble, it is advantageous if the actual position of the component in the supply plane is in the first mode of operation, from bottom to top, towards the component held in the secondary tool and in the second In the second operation mode, from top to bottom, toward the component held in the final pivoting tool, the second image recognition device is used to determine. This ensures that the component can always be measured on the structure side regardless of the operating mode of the supply plane.

Whenever the primary tool or the secondary tool or the final pivot tool clears the image field of the actual position to be determined, the actual position is advantageously determined by each image recognition device. The conveying movement and image recognition are thus performed in such ways that they do not interfere with each other.

If the first image recognition device is configured in such a way as to capture a designated image field within the pivot range of the main tool in the two operation modes, further advantages can be achieved. For the second operation mode, the second image recognition device may also be configured in such a way as to capture the designated image field from the pivot range of the final pivot tool. In this case, the first and second image recognition devices or the optical axis of the exit can be arranged on the vertical axis offset from each other. However, different configurations are also possible, for example, if the rotation axis of the main tool and the final pivot tool are placed on a common vertical plane.

The third image recognition device for recognizing the actual position of the substrate can be arranged at a sliding plate that is preferably linearly movable. Regardless of the individual positions of the secondary tools, this allows the camera to be driven into the observation position. This simplifies the feeding structure of the substrate. This is because in the case of the substrate arranged in the placement position of the image matrix, the substrate only needs to be displaced in one direction (x), and the image recognition device that can move in this space direction can also move in this space direction. The secondary tool, complete the other direction (y). In addition, this significantly increases the flexibility of the sequence and therefore the yield, because the measurement can be effectively performed by removing the secondary tool position and therefore the process can be parallelized. However, for highly accurate applications, the third image recognition device can also be arranged directly on the sliding plate of the secondary tool.

If the placement table is embodied as a conveying table, as a linear channel for a better majority of substrates, further advantages can be achieved. In this case, a clamping device, a conveyor belt or a known per se, etc. can be used as the conveying means.

In order to load the wafer frame onto the supply table, the wafer cassette can be arranged along the supply table and moved to different loading positions, wherein the supply table and the wafer cassette are arranged at least partially on the same plane, where the wafer cassette can be placed Move to a stationary position, where in order to process the loaded wafer frame, the supply table can be at least partially displaced in the horizontal working plane on the wafer cassette. Therefore, the wafer cassette can be clearly configured in a highly space-saving manner, and its function will not be damaged during the loading period of the workbench.

Finally, if one or more intermediate stations are arranged in the pivot range of the main tool and/or the final pivot tool, a further advantage can be added, in which the intermediate station can be placed before the transfer of the secondary tool Place a component temporarily on top. In order to further process the individual components later, it is obvious that they are temporarily removed from the work program and stored in the center. Specifically, with regard to the quality requirements of current manufacturing, it is necessary, for example, in some instances, to distinguish wafers in terms of quality. In order to obtain the highest possible yield, it is necessary to place only high-quality wafers on high-quality substrate locations, while poor-quality wafers are used on poor-quality substrate locations. The intermediate placement table makes it possible to control the quality of the placement process in a particularly simple way.

As long as it does not deviate from the subject of the protection scope, various configurations of the present invention can be clearly imagined. Thus, for example, two separate final pivot tools can be transferred from the general primary tool housing assembly to the two separate secondary tools.

Figure 1 illustrates in a highly simplified manner an essentially known configuration. In this configuration, a finely diced semiconductor wafer 18 is bonded to a wafer film 19, and the wafer film, as its part, is clamped In the wafer frame 20. The semiconductor wafer 1 has been deframed using a sawtooth line, which is represented by a cut line. Each wafer 1 has a carrier side 4 adhered to the wafer film 19 before dissociation. The semiconductor structure is applied on the other side of the carrying side 4, and for this reason, it is referred to as the structure side 17 hereinafter. If the electronic component is not a semiconductor chip, in each case, the structural side is equal to the top of the component. With the help of needles and other auxiliary means, the singulation of the wafer from the wafer film in the sawing and dissociation steps is well known to those skilled in the art.

First, referring to Figure 2, the basic functional units of the device will be explained. The supply table 5 is configured on the mechanical rack. In this case, the supply table is specifically implemented as a wafer table for accommodating the prepared wafer frame according to Figure 1. The supply table can be moved on a horizontal plane according to two spatial axes, so that each individual chip can be driven into the dissociation position. Here, the wafer cassette 27 that has been lowered into the rest position can be provided with further wafer frames as needed. In this case, the components must be transported from the supply table to the placement table 3, which is specifically realized as a feeding system 39 that can be cyclically fed into the substrate 2 in the direction of the arrow x.

The individual wafers are moved away from the supply table 5 with the main tool 6 and pivoted upwards and then additionally transferred to the intermediate pivoting tool 41 or directly to the final pivoting tool 42. The latter transfers the wafer to the secondary tool 8, which can be moved to the top of the placement table 3 along the slide guide 21.

Figure 3 clearly shows further details of the equipment. In order to transport individual wafers 1, it is first necessary to overcome the height difference between the plane 47 of the supply table and the supply plane 7, and the supply plane 7 is actually the same as the plane position of the placement table 3 with the substrate 2. According to the following and even more detailed descriptions, the height difference is covered by at least two pivoting movements of the main tool 6 and the final pivoting tool 42, and, if appropriate, by the interventional pivoting movement of the intermediate pivoting tool 41 Covered. The secondary tool 8 is fixed to a sliding plate 15 which can be linearly displaced on the guide rail 21. At the secondary tool, on the x and y axis and around the axis of rotation before placing the components, if necessary, corrective movement can be made if the actual position of the determination is taken into consideration.

Various working tools are provided with containment tools for, for example, holding the components fixedly by means of a vacuum. The containment tool can preferably additionally perform at least one further movement in its longitudinal axis and/or about its longitudinal axis.

In each case, the intermediate placement tables 40a and 40b are placed on the main The pivot range of the required tool 6 and the final pivot tool 42. As mentioned in the introduction, in order to transfer the wafers later, the intermediate stages serve as temporarily positioning the wafers in the waiting position. Similar to the working tools of the conveying assembly, the middle placing table is also equipped with accommodating tools.

Various cameras are configured on the device to monitor and correct various actual positions. The first camera 10 determines the actual position of the wafer 1 at the supply station 5 before being moved away. The second lower camera 11a recognizes the position of the chip when the transfer to the secondary tool 8 has occurred. In contrast, the second upper camera 11b recognizes the position of the chip at the final pivot tool 42 before being transferred to the secondary tool 8. Depending on whether the tool takes the wafer on the carrier side or the structure side, obviously, one of the two second cameras 11a or 11b is selectively activated. Finally, the third camera 12 can recognize the actual position of the substrate 2 on the placing table 3. The third camera 12 is arranged on a sliding plate 16 that can be displaced along the guide rail 22. Figures 8 to 10 show further details about these components.

Regarding its moving range, because the placement table 3 and the supply table 5 are placed on different planes, the supply table 5, which is the wafer table, can obviously move under the placement table, which is also under the feeding system. Therefore, The configuration plan of the mechanical frame 26 can be kept very small. Because each individual wafer to be removed is moved just under the removal of the main tool 6 in each case, the supply table 5 must be horizontally shiftable in two spatial axes. Those skilled in the technology are already familiar with this type of control.

FIGS. 3 to 5 show further details about the displacement of the supply station 5 in combination with the wafer cassette 27. The wafer cassette 27 has various insertion compartments in a manner known per se, and each compartment contains a prepared wafer frame with finely diced wafers (according to Fig. 1). The cassette can be moved vertically and a removal mechanism (not explicitly illustrated here) can remove wafers from each layer and transfer them to the supply station 5. According to Figure 3, the wafer cassette 27 has been lowered to be lower than the level of the supply table. In this position, the supply table 5, which can be displaced in two spatial axes, can be moved below the placing table 3 and above the wafer cassette 27. Therefore, the layout plan of the machine can be significantly kept very small.

According to Figure 4, the wafer cassette 27 is located at the bottom unloading position, where the wafer frame can be removed from the top layer. Then, each time by picking, the wafer frame has been emptied, the wafer frame is pressed back into the corresponding empty layer, and the new wafer frame is removed from the next layer until the last layer is touched. In this case, the wafer cassette 27 is located at the top removal position shown in FIG. 5. Needless to say, after each loading or unloading step, the wafer cassette 27 is lowered to the rest position again according to FIG. 3.

Figure 6 shows further details of the entire conveying equipment. In this case, the main tool 6 is arranged at the end and on the outer side of the L-shaped rotating arm 23. The rotating arm rotates around the horizontal axis 13 and is driven to rotate by the motor 25. In this case, the main tool illustrates the rotation circle or part of the circle 14, and the motor 25 can activate both directions of rotation. The camera housing 24 with an objective output, which will be described below, is arranged in the rotating circle 14. In the same or similar manner, the final pivot tool 42 on the L-shaped rotating arm 43 can be pivoted around the shaft 44 on the rotation circle 45. Here too, the camera housing 24 protrudes inside the rotating circle 45, but the direction of the target output is upward.

Finally, the intermediate pivot tool 41 is additionally arranged in the operating area of the main tool 6 and the final pivot tool 42. The intermediate pivoting tool rotates around the shaft 50 and illustrates the rotation circle 51 in this case. Since it is not necessary to mount the camera housing in the rotating circle here, the configuration of the L-shaped rotating arm is unnecessary. The supply plane 7 actually forms a horizontal tangent with respect to the rotating circle 45. The guide rail 21 of the sliding plate 15 used for the secondary tool 8 extends above the supply plane 7. In the position illustrated in FIG. 6, the secondary tool 8 has received the semiconductor wafer from the final pivot tool 42 and transported the wafer in the direction of the placing table. All tools are provided with a containing tool in a known manner, and the pneumatic lines and control equipment required to operate the tool are not described.

FIG. 7 shows the geometric relationship between the tools described in FIG. 6, and especially the curve of the component 1 between the plane 47 of the supply table and the supply plane 7. The shafts 13, 44, and 50 of the work tool rotation form a triangle relative to each other. The rotation circles 14, 45, and 51 are in contact or substantially contact with each other on the side of the triangle, and form the first transmission position 52, the second transmission position 53, and The third transmission position 54. From the capture position 55, the main tool 6 covers pivoting movement, which depends on the operating mode, going through the first section S1 to the first transmission position 52 or through the second section S2 to the second transmission position 53 Leading. The intermediate pivoting tool 41 is inactive or always covers the pivotal movement between the first transmission position 52 and the third transmission position 54. Depending on the operation mode, the final pivot tool 42 covers the pivot path between the second transmission position 53 and the placement position 56 or the third transmission position 54 and the placement position 56. Depending on the structural conditions, the radii of various circles of rotation may obviously be formed differently. Moreover, it can be imagined that the additional pivoting tools are also integrated into one body, so that the travel between the two planes 7 and 47 is covered by most of the curved movements. The intermediate placement tables 40a, 40b arranged along the curved path can also be embodied as pivoting tools that can transport the components away.

Hereinafter, referring to FIGS. 8 to 10, the functionalization and configuration of the first camera 10 and the lower second camera 11a will be described. The cameras are respectively arranged in elongated camera housings 24 and 24' protruding into the main tool 6 and the final pivoting tool 42, respectively. In the case of the first camera 10, the direction of the output opening 29 is downward, toward the plane 47 of the supply table. In contrast, in the case of the lower second camera 11a, the direction of the output opening 29' is upward, toward the supply plane. In each case, the deflection mirror 36 causes image deflection. According to the working positions of the main tool 6 arranged on the rotating arm 23 and the final pivoting tool 42 arranged on the rotating arm 43, in each case, the image area 37 is completely cleared for the corresponding camera.

In particular, it is obvious from Fig. 10 that, in a manner corresponding to the rotation of the shafts 13 and 44, the respective optical axes in the output aperture area of the camera are also configured to be relatively complementary. However, in certain situations, it is also conceivable that the rotation shafts 13 and 44 are imaginable, and therefore, the optical axis in the output opening area is arranged on a general vertical axis.

In the case of placing the chip on the substrate with the same carrier side, refer to Figures 11a to 11e below to illustrate the placement steps of the semiconductor chip. With this carrier side, it was previously attached to the wafer film (non-flip chip application) . According to FIG. 11a, the position of the rotating arm 23 is vertical, and the main tool 6 obtains the semiconductor wafer from the supply station 5. At the same time, the final pivot tool 42 transfers the previously loaded wafer to the secondary tool 8 of the supply plane 7.

According to FIG. 11b, the primary tool 6 and the final pivot tool 42 rotate toward each other in a clockwise direction in each case, and the secondary tool 8 on the sliding plate 15 moves toward the placing table 3. Before touching the placing table, the third camera 12 on the sliding plate 16 is used to determine the position of the substrate 2.

According to Figure 11c, the secondary tool 8 has touched its delivery position above the substrate 2. The main tool 6 transfers its wafer to the final pivot tool 42 and uses the first camera 10 to measure the next wafer 1 to be picked up on the supply table 5 at the same time.

According to Figure 11d, the secondary tool 8 has placed its wafer on the substrate 2. The main tool 6 returns to its capture position in a counterclockwise direction. Finally, the pivoting tool 42 has similarly pivoted back to its delivery position in a counterclockwise direction.

Finally, Figure 11e shows that the empty secondary tool 8 is returning to pick up a new chip. As shown in the figure, in this case, in the middle position, the upper second camera 11b can be touched to determine the actual position of the wafer at the final pivot tool 42 and the third camera 12 can be touched to determine the actual position of the substrate 2 . As long as the secondary tool 8 has reached its starting position, the cycle starts again according to Figure 11a. In Figures 11a to 11e, for better clarity, the unnecessary lower second camera 11a and the intermediate pivoting tool 41 have been omitted.

If you want to place the chip on the substrate with its structural side (flip chip application), you can drive the device in another mode of operation. In this case, obviously from Figures 12a to 12e, the intermediate pivoting device 41 is touched. In these figures, for better clarity, the unnecessary upper second camera 11b in this operating mode has been omitted.

According to Fig. 12a, the main tool 6 is used to pick up the chip at the supply station 5. At the same time, the secondary tool 8 places the wafer on the substrate 2 of the placing table 3. The final pivot tool 42 receives the previously loaded wafer from the intermediate pivot tool 41. Various cameras are not working.

According to Fig. 12b, the main tool 6 with its pick-up chip has been pivoted counterclockwise to the first transfer position. In order to be able to pick up a new chip, the middle pivot tool 41 has been pivoted back in the same counterclockwise direction. The final pivot tool has pivoted the previously loaded wafer back to the delivery position, and the secondary tool 8 has also touched its starting position, where it can pick up new wafers. With the help of The third camera 12 measures the actual position of the substrate 2 to be newly planted on the placing table 3.

According to Figure 12c, the wafer at the final pivot tool 42 is transferred to the secondary tool 8. The main tool 6 remains in the first transfer position. According to Figure 12d, as long as the pivoting tool 42 finally pivots back again, the lower second camera 11a can be used to determine the actual position of the chip that is now fixed on the secondary tool 8. At the same time, the first camera 10 is used to determine the actual position of the next wafer to be moved away from the supply station 5. The main tool can transfer its previously loaded wafer to the intermediate pivot tool 41. Finally, according to Figure 12e, the main tool 6 can be pivoted back to its capturing position. The intermediate pivot tool 41 similarly moves its previously loaded wafer into the third transfer position, and the secondary tool 8 has touched its delivery position above the substrate 2. According to Figure 12a, then restart the cycle.

<p>1. . . Chip</p><p>2. . . Substrate</p><p>3. . . Placement table</p><p>4. . . Load side</p><p>5. . . Supply Desk</p><p>6. . . Main tools</p><p>7. . . Supply plane</p><p>8. . . Secondary tool</p><p>10. . . camera</p><p>11a. . . camera</p><p>11b. . . camera</p><p>12. . . camera</p><p>13. . . axis</p><p>14. . . Circle</p><p>15. . . skateboard</p><p>16. . . skateboard</p><p>17. . . Structure side</p><p>18. . . Semiconductor wafer</p><p>19. . . Wafer film</p><p>20. . . Wafer frame</p><p>twenty one. . . Skateboard guide</p><p>twenty one. . . guide</p><p>twenty two. . . guide</p><p>twenty three. . . Swivel arm</p><p>twenty four. . . Camera housing</p><p>twenty four'. . . Camera housing</p><p>25. . . motor</p><p>26. . . Mechanical frame</p><p>27. . . Wafer cassette</p><p>29. . . Output opening</p><p>29'. . . Output opening</p><p>36. . . Deflection mirror</p><p>37. . . Image area</p><p>39. . . Feed into the system</p><p>40a. . . Intermediate stage</p><p>40b. . . Middle placement table</p><p>41. . . Intermediate pivot tool</p><p>42. . . Ultimate pivot tool</p><p>43. . . Swivel arm</p><p>44. . . axis</p><p>45. . . Rotating circle</p><p>47. . . flat</p><p>50. . . axis</p><p>51. . . Rotating circle</p><p>52. . . First transmission position</p><p>53. . . Second transmission location</p><p>54. . . Third transmission position</p><p>55. . . Pick up position</p><p>56. . . Placement position</p><p>S1. . . First section</p><p>S2. . . Second section</p>

Further individual characteristics and advantages of the present invention are derived from the descriptions and drawings of the following exemplary embodiments, in which: Figure 1 shows a brief description diagram of a finely diced wafer, which has a semiconductor chip in an enlarged diagrammatic manner, and Figure 2 shows a device Fig. 3 shows a large simplified side view of the device with a wafer cassette in the rest position according to Fig. 2, and Fig. 4 shows a diagram with a wafer cassette in the bottommost feeding position according to Fig. 3 The equipment, Figure 5 shows the equipment with the wafer cassette at the top feeding position according to Figure 3, Figure 6 shows the perspective view of the main tool, the intermediate pivot tool and the final pivot tool and the secondary tools, and the seventh The figure shows a schematic diagram of the curve direction of the tool of the equipment according to figure 6, figure 8 shows the side view of the first image recognition device of the main tool, and figure 9 shows the side view of the second image recognition device of the final pivot tool. Figure 10 shows the front view of the two image recognition devices according to Figures 8 and 9, Figures 11a-11e show the different working step sequences when the component is not turned over, and Figures 12a-12e show the different working step sequence when the component is turned over.