Method and device for placing electronic components, especially semiconductor chips, on a substrate

p0001The invention relates to a method for depositing electronic components, in particular semiconductor chips, on a substrate. With a method of this type, the unhoused chip is picked from the already subdivided silicon wafer (wafer), for example, during the production of semiconductor components in chip mounting machines (die bonders) and then deposited or bonded to corresponding substrates. After the bonding process, further process steps, such as curing, wirebonding, melting of solder joints, encapsulation, separation, etc.

p0002There are a variety of different processes, such as gluing, soldering or laminating, for placing the chip on the substrate. The type of connection process also determines whether the chip must be used before placement (flip-chip applications) or not (non-flip applications). By turning the chip, the following is not expressly meant to be a relative movement with respect to a space axis or space plane but rather a turning with respect to the original application side. In the case of nonflip applications, the chip is not used and, after being picked up, transported directly from the wafer film in one step to the substrate, wherein the pickup tool is simultaneously also used as a bonding tool. The side of the wafer with which the chip was adhered to the wafer film is then also the side with which the chip is adhered to the substrate. A known device of this type is, for example, shown in FIG<patcit id="pcit0001" dnum="EP1049140A"><text>EP 1 049 140</text></patcit> Or by the company magazine "Newsline 1/2002" of the applicant (machine type "Easyline"). In the case of flip-chip applications, the chip is deposited with its structural side after turning on the substrate, ie, the mounting side with which the chip was adhered to the wafer film is, after placement, the side facing away from the substrate. Increasing demands are placed on modern diebonder systems in terms of production costs, throughput, accuracy and process flexibility. Nevertheless, the machines should not surpass existing devices with regard to the height, machine floor, weight etc. This leads to an ever greater complexity of the machines with regard to mechanics, movement sequences and control. Through the<patcit id="pcit0002" dnum="US20050132567A"><text>US 2005/0132567</text></patcit> A device has been disclosed in which semiconductor chips are picked up by a rotatable picking tool with three tool heads and from there transported to a higher plane and are taken over by a further tool which guides the chips in a linear motion over the substrate and settles there. Pick plane and substrate plane run parallel, but at different levels. This makes it possible for the wafer table to be driven underneath the substrate table, which is evidently particularly advantageous in the case of large wafers, since the overall base area of ​​the machine can thereby be kept small. However, in this case, the chip is always used by the transfer operation so that it is not placed on the substrate (flip-chip application) with its application side, but with its structural side. In addition, the rotatable pick tool requires a relatively large outer diameter to overcome the difference in height between the pick plane and the delivery plane, which is not advantageous in terms of kinematics as well as for reasons of space.

p0003Through the <patcit id="pcit0003" dnum="WO9732460A"><text>WO 97/32460</text></patcit> A device has become known in which a chip is transported in two working cycles from a receiving plane to an output plane. In this case, it is deposited at an intermediate station and optionally pivoted or rotated there.

p0004It is therefore an object of the invention to provide a method of the type mentioned at the outset in which the difference in height between the plane of the supply station and a higher supply plane can be overcome with a smaller space requirement and kinematically more advantageously and in the case of components also with the same support side Can be deposited again on the substrate (non-flip application), whereby the highest possible throughput with an improved settling accuracy can be achieved. It should also be possible to peck at room temperature, but under certain circumstances also to place it hot. In addition, it should be possible with the same storage or with the same device to drive both flip-chip and non-flip applications in order to significantly broaden the range of applications with little additional costs. The location of the chip is to be detected as optimally as possible with the corresponding optical image recognition devices at various points. Finally, the device should also be constructed to be as compact as possible and to have a machine plan as small as possible. This object is solved in a process-related manner by a method which has the features in claim 1. In a device-related aspect, the object is achieved by a device having the features of claim 11.

p0005If the path of the component between the plane of the storage station and the delivery plane is covered in at least two separate, ascending curve movements, it is obviously possible to save with respect to the floor plan. The primary tool, in this case, returns a first curve movement with the component, transfers the component in a transfer position to at least one pivot tool, which travels a second curve movement up to the delivery plane. The curve radii are thereby substantially smaller than if the stroke of the component has to be covered by a single turning tool. In addition, significantly smaller masses have to be accelerated or decelerated, which reduces energy expenditure and enables faster movement sequences. With appropriately large differences in height, several swiveling tools could, of course, be connected in series, so that the stroke would be traversed in more than two separate swivel movements. It is obvious that the at least one pivoting tool must be arranged in the working area of ​​the primary tool.

p0006For a flip-chip application, it is particularly advantageous if the primary tool transfers the component to an intermediate pivoting tool which engages the component on the side of the support and, after a pivoting movement, transfers it to an end pivoting tool which in turn engages the structural side at the structural side and pivots into the delivery plane where, Is transferred to the secondary tool, where it is finally deposited on the substrate with the structural side. The intermediate pivoting tool, as a matter of fact, assumes the function of transferring the component to the end pivoting tool in such a way that it can be detected on the structural side. Only under this condition, the component is finally released from the secondary tool again with the structural side, if a further turning is to be avoided.

p0007On the other hand, in the case of nonflip applications, it is expedient for the primary tool to transfer the component directly to an end pivoting tool which grips the component on the support side and pivots it into the delivery plane where it is delivered to the secondary tool, again with the same support side facing the substrate Is discontinued. It is thus evident that the transfer of the component from the primary tool to the end pivoting tool, which is detected by the secondary tool on the structural side, can thus also be set back again with the support side.

p0008However, particularly versatile applications are obtained if the components are delivered directly to the end pivoting tool in a first operating mode, the pivoting movement of the primary tool in the first or in the second operating mode proceeding from the receptacle at the storage station, preferably on a separate For example, sectors. This allows flip-chip applications and non-flip applications. The execution of the pivoting movement of the primary tool on separate movement sections as a function of the selected operating mode enables an optimal arrangement of the intermediate pivoting tool or of the end pivoting tool or a geometrically optimum curve profile. Instead of partial arc movements, however, other curve motions could also be driven, such as a cycloid or a spiral, depending on the selected transmission. The mutually extending curvature permits short paths and a possible overcoming of the stroke as far as possible between the plane of the supply station and the delivery plane. The movement of the secondary tool from the transfer of the component to the substrate is advantageously linear. Again, however, a curved movement would be conceivable.

p0009A particularly advantageous machine arrangement and movement guide results when the transport of the component runs from the supply station to the substrate essentially on an approximately vertical transport plane. All drive elements and auxiliary devices can thus be arranged along this plane. This also significantly simplifies the visual observation of the workflow and the maintenance of the machine. Further advantages can be achieved if the actual position (position and angle) of the component on the supply station is determined before recording with a first image recognition device and / or if the actual position of the component is determined in the delivery plane before transport to the substrate by means of a second image recognition device , And / or when the actual position of the substrate is determined with a third image-recognition device, deviations between the ascertained actual values ​​and a predetermined desired position of the component being preferably corrected during transport. The image recognition devices can, for example, be CCD cameras. With a total of only three such cameras, a very high precision or an optimal correction possibility can be achieved. Depending on the application, however, it would also be conceivable to merely measure the actual position of the component in the delivery plane, for example.

p0010With regard to the possibility of the different operating modes mentioned at the outset, it is expedient if the determination of the actual position of the component in the delivery plane by the second image recognition device in the first operating mode from bottom to top against the component held on the secondary tool and in the second operating mode from top to bottom The component held on the end pivoting tool takes place. This ensures that the component can always be measured on the structural side, regardless of the operating mode in the delivery level.

p0011The determination of the actual position is advantageously performed with one of the image recognition devices whenever the primary tool or the secondary tool or the end pivoting tool releases the image field of the actual position to be determined. Transport movement and image recognition are thus carried out in such a way that they do not interfere with each other.

p0012Further advantages can be achieved if the first image recognition device is arranged in such a way that the image field assigned to it is detected in both operating modes from within the pivot range of the primary tool. Likewise, the second image recognition device for the second operating mode can be arranged in such a way that the image field assigned to it is detected from within the pivoting range of the end pivoting tool. The first and the second image recognition device or their optical axes at the output opening can in this case be arranged on mutually offset vertical axes. However, another arrangement would also be possible, for example if the rotational axes of the primary tool and of the end pivoting tool lie on a common vertical.

p0013The third image recognition device for recognizing the actual position of the substrate can be arranged on a carriage which is preferably linearly displaceable. In this way, the camera can be moved into an observation position independently of the respective position of the secondary tool. This simplifies the construction of the substrate feed. In the case of substrates with a matrix-like arrangement of settling positions, the substrates have to be displaced only in one direction (x), while the other direction (y) can be reached by the image recognition device movable in this spatial direction and the secondary tool also movable in this spatial direction. In addition, this obviously increases the flexibility of the sequences and improves the throughput, since the measurement can be decoupled from the position of the secondary tool and processes can thus be parallelized. For high-precision applications, however, it may also be expedient to arrange the third image recognition device directly on the carriage of the secondary tool.

p0014Further advantages can be achieved if the depositing station is designed as a transport station for the preferably linear passage of a plurality of substrates. Conventional clamping devices, conveyor belts or the like can be used as transport means.

p0015In addition to the storage station, a wafer cassette can be arranged which is movable for loading wafer frames onto the storage station into different loading positions in which the storage station and the wafer cassette are arranged at least partially on the same plane, the wafer cassette being movable into a rest position in which The storage station for processing a charged wafer frame can be displaced at least partially in the horizontal working plane via the wafer cassette. Clearly, the wafer cassette can thus be arranged in a very space-saving manner, without affecting its function when loading the work station.

p0016Further advantages can finally also be achieved if one or more intermediate depositing stations are arranged in the pivoting range of the primary tool and / or the end pivoting tool, at which a component can be temporarily deposited before transfer to the secondary tool. As a result, individual components can temporarily be separated out of the work process and temporarily stored, in order to be processed again at a later point in time. In view of today's quality requirements in manufacturing, it is partly necessary, for example, to differentiate chips quantitatively. In order to obtain the highest possible yield, it may be necessary that only high quality chips are deposited on high quality substrate positions, wherein qualitatively inferior chips can be used on qualitatively inferior substrate positions. The intermediate storage station allows a qualitative control of the storage process in a particularly simple manner.

p0017Various configurations of the invention are conceivable without leaving the object of the protective area. For example, two separate end pivoting tools could take over components from a common primary tool and transfer them to two separate secondary tools.

p0018Further features and advantages of the invention will become apparent from the following description of an exemplary embodiment and from the drawings. Show it:<dl id="dl0001"><dt>FIG</dt><dd>A simplified representation of a subdivided wafer with an enlarged semiconductor chip,</dd><dt>FIG</dt><dd>An overall perspective view of a device,</dd><dt>FIG</dt><dd>1 shows a greatly simplified side view of the device according to FIG <figref idrefs="f0001">FIG</figref> With a wafer cassette in the rest position,</dd><dt>FIG</dt><dd>The device according to FIG <figref idrefs="f0002">FIG</figref> With the wafer cassette in the lowest supply position,</dd><dt>FIG</dt><dd>The device according to FIG <figref idrefs="f0002">FIG</figref> With the wafer cassette in the uppermost supply position,</dd><dt>FIG</dt><dd>A perspective view of a primary tool, an intermediate pivoting tool and an end pivoting tool, as well as a secondary tool,</dd><dt>FIG</dt><dd>5 shows a schematic representation of the curve profile of the tools on the device according to FIG <figref idrefs="f0005">FIG</figref>, </dd><dt>FIG</dt><dd>A lateral representation of the first image recognition device on the primary tool,</dd><dt>FIG</dt><dd>A lateral representation of the second image recognition device on the end pivoting tool,</dd><dt>FIG</dt><dd>2 is a front view of the two image recognition devices according to FIGS <figref idrefs="f0006">FIGS</figref></dd><dt>11a-11e</dt><dd>And various sequences of an operation without turning the component, and FIG</dd><dt>12a-12e</dt><dd>Various sequences of a working process with turning of the component.</dd></dl>

p0019In <figref idrefs="f0001">FIG</figref> A known arrangement is shown in which a semiconductor wafer 18, which has already been divided, is glued onto a wafer foil 19, which in turn is tensioned in a waferframe 20. The semiconductor chips 1 are already singled out by the sawing lines, which is indicated by the intersecting lines. Each chip 1 has a mounting side 4 with which it adheres on the wafer foil 19 prior to detachment. A semiconductor structure is applied on the side opposite to the contact side 4, which is referred to as the structural side 17 hereinafter. If the electronic component is not a semiconductor chip, the structural side simply corresponds to the top side of the component. The separation of the chips by sawing or the detachment process from the wafer film with the aid of needles and other auxiliary means are already sufficiently known to a person skilled in the art.

p0020First of all, <figref idrefs="f0001">FIG</figref> The essential functional units of a device. A storage station 5 is arranged on a machine frame and, in the present case, serves as a wafer table for the reception of prepared wafer frames according to FIG<figref idrefs="f0001">FIG</figref> is trained. The storage station can be displaced on a horizontal plane into two space axes so that each individual chip can be moved into a detachment position. From a wafer cassette 27, which here is lowered into the resting position, further wafer frames can be fed as required. The depositing station 3, to which the components have to be transported from the storage station, is designed here as a supply system 39, on which substrates 2 can be fed in a clockwise direction in the direction of the arrow.

p0021The individual chips are lifted off the storage station 5 by a primary tool 6 and swung upwards and then alternatively transferred to an intermediate swiveling tool 41 or directly to an end swiveling tool 42. The latter transfers the chip to the secondary tool 8 which is displaceable along a carriage guide 21 to above the deposit station 3.

p0022Further details of the device are shown in FIG <figref idrefs="f0002">FIG</figref> Can be seen. For transporting the individual chips 1, a height difference must first be overcome between the plane 47 of the supply station and the delivery plane 7, which practically coincides with the plane of the deposit station 3 with the substrates 2. This elevation difference is performed in a manner to be described in more detail below At least two pivoting movements of the primary tool 6 or of the end pivoting tool 42 and, if appropriate, by an intermediate pivoting movement of the intermediate pivoting tool 41. The secondary tool 8 is attached to a carriage 15, which is linearly displaceable on a guide rail 21. On the secondary tool, correction movements in the x- and y-axes as well as about an axis of rotation before the settling of the component are possible if this is necessary on the basis of the determination of the actual position.

p0023The various working tools are provided with recording tools for holding a component, for example by means of vacuum. These recording tools can preferably also carry out at least one further movement in their longitudinal axis and / or about their longitudinal axis.

p0024An intermediate deposit station 40a or 40b is arranged in each case in the swivel range of the primary tool 6 or of the end swivel tool 42. As mentioned at the outset, these intermediate stations serve to temporarily place a chip in a waiting position in order to transport it further at a later point in time. Similar to the working tools for the transport of the components, the intermediate deposit stations are also provided with receiving tools.

p0025Various cameras are arranged on the device for the monitoring and correction of different actual positions. A first camera 10 determines the actual position of a chip 1 at the supply station 5 before lifting. A second lower camera 11a recognizes the position of a chip when the secondary tool 8 has already been handed over. A second upper camera 11b, on the other hand, recognizes the position of a chip on the end pivoting tool 42 before it is transferred to the secondary tool 8. As an alternative, one of the two second cameras 11a Or 11b, depending on whether the secondary tool detects the chip on the load side or on the structural side. Finally, a third camera 12 can recognize the actual position of the substrate 2 on the deposition station 3. This third camera 12 is arranged on a carriage 16, which is displaceable along a guide rail 22. Further details on these components are given in the<figref idrefs="f0006 f0007">FIGS. 8 to 10</figref>.

p0026Since the depositing station 3 and the storage station 5 lie on different planes, the storage station 5, that is to say the wafer table with regard to its range of movement, can be pushed under the depositing station, that is to say under the feed system, whereby the plan of the machine frame 26 can be kept very small. The storage station 5 must be horizontally displaceable in two spatial axes, since each individual chip to be lifted has to be moved exactly under the lifting primary tool 6. Such controls are already known to a person skilled in the art.

p0027From the <figref idrefs="f0002 f0003 f0004">FIGS. 3 to 5</figref> Further details regarding the displaceability of the storage station 5 in combination with the wafer cassette 27 can be seen. The wafer cassette 27 has, in a manner known per se, a plurality of slide-in compartments, wherein a prepared wafer frame with a divided wafer (according to FIG<figref idrefs="f0001">FIG</figref>) Is included. The wafer cassette is vertically movable and a removal mechanism, not shown here, can remove a wafer frame from each floor and transfer it to the storage station 5. According to<figref idrefs="f0002">FIG</figref> The wafer cassette 27 is lowered below the level of the storage station. In this position, the storage station 5 displaceable in two spatial axes can be pushed both under the depositing station 3 and also over the wafer cassette 27, whereby the machine floor plan can be kept very small.

p0028According to <figref idrefs="f0003">FIG</figref> The wafer cassette 27 is in the lowest unloading position in which a wafer frame can be removed from the uppermost floor. Subsequently, each time a wafer frame is picked up, it is pushed back into the corresponding empty floor and a new wafer frame is removed from the next floor until the last floor is reached. In this case, the wafer cassette 27 is located in the uppermost removal position, as shown in FIG<figref idrefs="f0004">FIG</figref> Is shown. The wafer cassette 27 is, of course, returned to its rest position after each charging or discharging process<figref idrefs="f0002">FIG</figref> Is lowered.

p0029<figref idrefs="f0005">FIG</figref> 10 shows further details of the entire transport device. The primary tool 6 is arranged at the end and on the outside of an L-shaped rotary arm 23. The rotary arm rotates about a horizontal axis 13 and can be driven by means of a motor 25. The primary tool thereby describes a rotary circuit or subcircuit 14, the motor 25 enabling actuation in both directions of rotation. A camera housing 24 with a lens output, described later, is arranged within the rotary circuit 14. In the same or similar manner, the end pivot train 42 is pivotable on an L-shaped rotary arm 43 about an axis 44 on a rotary circuit 45. Here also, a camera housing 24 'projects into the interior of the rotary circuit 45, but with an upwardly directed objective output.

p0030Finally, an intermediate pivoting tool 41 is also arranged in the working area of ​​the primary tool 6 or of the end pivoting tool 42. This rotates about an axis 50 and describes a rotary circuit 51. Since no chamber housing has to be stored within the rotary circuit, the arrangement on an L-shaped rotary arm is not required. The supply plane 7 practically forms a horizontal tangent to the rotary circuit 45. The guide rail 21 for the carriage 15 of the secondary tool 8 extends above the supply plane 7<figref idrefs="f0005">FIG</figref> The secondary tool 8 has just taken over a semiconductor chip from the end pivoting tool 42 and transports it in the direction of the depositing station. All the tools are provided with recording tools in a manner known per se, the pneumatic lines and control devices required for their operation being not shown.

p0031<figref idrefs="f0006">FIG</figref> Shows the geometric relation of the <figref idrefs="f0005">FIG</figref> And in particular the curve profile of a component 1 between the plane 47 of the supply station and the delivery plane 7. The rotary axes 13, 44 and 50 of the working tools form a triangle with one another, the rotary circuits 14, 45 and 51 contacting the limbs of the triangle Or approximately, and thereby form a first transfer position 52, a second transfer position 53 and a third transfer position 54. The primary tool 6 extends from the receiving position 55 a pivoting movement, which leads, depending on the operating mode, over a first sector S1 to the first transfer position 52 or via a second sector S2 to the second transfer position 53. The intermediate pivoting tool 41 is either inactive or always returns a pivoting movement between the first transfer position 52 and the third transfer position 54. The end pivoting tool 42, depending on the operating mode, returns a pivotal path between the second transfer position 53 and the delivery position 56 or between the third transfer position 54 and the delivery position 56. Obviously, depending on the design conditions, it is possible to design the radii of the different rotary circuits differently. It would also be conceivable to integrate additional pivoting tools, so that the stroke between the two planes 7 and 47 is traversed in several curve movements. The intermediate depositing stations 40 a, 40 b arranged along the curved track could also be designed as pivoting tools which are able to transport a component away.

p0032In the following, <figref idrefs="f0006 f0007">FIGS. 8 to 10</figref> The operation and arrangement of the first camera 10 and the lower second camera 11a are described. The cameras are each arranged in an elongated camera housing 24 or 24 ', which projects into the rotary circuit of the primary tool 6 or of the end pivoting tool 42. In the case of the first camera 10, the outlet opening 29 is directed downwards against the plane 47 of the storage station. Opposite, in the lower second camera 11a, the outlet opening 29 'is directed upwards against the supply plane. The image deflection is effected in each case on a deflection mirror 36. Depending on the working position of the primary tool 6 arranged on the rotary arm 23 or of the end pivoting tool 42 arranged on the rotary arm 43, the image region 37 is completely released for the corresponding camera.

p0033Especially from <figref idrefs="f0007">FIG</figref> It can be seen that, corresponding to the rotational axes 13 and 44, the respective optical axes are also offset laterally relative to each other in the region of the exit openings of the cameras. In certain cases, however, it would also be conceivable for the rotary axes 13 and 44 and thus also the optical axis to be arranged on a common vertical axis in the region of the output opening.

p0034In the following, <figref idrefs="f0008 f0009 f0010">Figures 11a to 11e</figref> The deposition process of a semiconductor chip is described in which the chip is placed with the same deposition side on the substrate with which it previously adhered to the wafer film (nonflip application). According to<figref idrefs="f0008">11a</figref> The rotary arm 23 is in a vertical position in which the primary tool 6 detects a semiconductor chip from the supply station 5. At the same time, the end pivoting tool 42 delivers a previously charged chip in the delivery plane 7 to the secondary tool 8.

p0035According to <figref idrefs="f0008">11b</figref> The primary tool 6 and the end pivot 42 rotate toward each other in the clockwise direction, while the secondary tool 8 on the carriage 15 is moved against the depositing station 3. Before reaching the deposit station, the actual position of the substrate 2 is determined with the third camera 12 on the carriage 16.

p0036According to <figref idrefs="f0009">11c</figref> The secondary tool 8 has reached its dispensing position over the substrate 2. The primary tool 6 transfers its chip to the end pivoting tool 42 and, at the same time, the next chip 1 to be picked up is measured on the storage station 5 by means of the first camera 10.

p0037According to <figref idrefs="f0009">11d</figref> The secondary tool 8 has deposited its chip on the substrate 2. The primary tool 6 has returned counterclockwise to its receiving position. Likewise, the end pivoting tool 42 was pivoted counterclockwise back into its dispensing position.

p0038Finally shows <figref idrefs="f0010">11e</figref> The empty secondary tool 8 on its way back to receiving a new chip. As shown, the upper second camera 11b for determining the actual position of the chip on the end pivoting tool 42 as well as the third camera 12 for determining the actual position of the substrate 2 can be actuated in an intermediate position. As soon as the secondary tool 8 has reached its initial position, the cycle begins according to FIG<figref idrefs="f0008">11a</figref> Again anew. For reasons of clarity,<figref idrefs="f0008 f0009 f0010">Figures 11a to 11e</figref> The unnecessary lower second camera 11a and the intermediate pivoting tool 41 are omitted.

p0039If a deposit of the chip on the substrate with its structural side is desired (flip chip application), the device can be operated in a different operating mode. In this case, the intermediate pivoting device 41 is actuated as shown in FIGS<figref idrefs="f0010 f0011 f0012">12a to 12e</figref> . For reasons of clarity, the upper second camera 11b, which is not required in this operating mode, has been omitted in these figures.

p0040According to <figref idrefs="f0010">12a</figref> A chip is accommodated by the primary tool 6 at the supply station 5. At the same time, a chip is deposited on the substrate 2 at the deposition station 3 from the secondary tool 8. The end pivoting tool 42 receives a previously loaded chip from the intermediate pivoting tool 41. The various cameras are inactive.

p0041According to <figref idrefs="f0011">FIG. 12b</figref> The primary tool 6 was pivoted with its received chip counterclockwise to the first transfer position. Likewise, the intermediate pivoting tool 41 has been pivoted counterclockwise to accommodate a new chip. The end pivoting tool has pivoted the previously loaded chip back into the dispensing position, and also the secondary tool 8 has reached its initial position again, in which it can accommodate a new chip. With the aid of the third camera 12, the actual position of the substrate 2 to be newly fitted is measured at the delivery station 3.

p0042According to <figref idrefs="f0011">12c</figref> The chip is transferred to the secondary tool 8 at the end pivoting tool 42. The primary tool 6 remains in the first transfer position. As soon as<figref idrefs="f0012">FIG. 12d</figref> The end pivoting tool 42 pivots back again, the actual position of the chip, which is now fixed to the secondary tool 8, can be determined with the lower second camera 11a. At the same time, the actual position of the next chip to be lifted off at the storage station 5 is determined with the first camera 10. The primary tool can transfer its previously loaded chip to the intermediate pivot tool 41. Finally, according to<figref idrefs="f0012">12e</figref> The primary tool 6 can be pivoted back into its receiving position. Likewise, the intermediate pivoting tool 41 moves its previously loaded chip into the third transfer position and the secondary tool 8 has reached its discharge position over the substrate 2. The cycle then commences as described below<figref idrefs="f0010">12a</figref> Again anew.