Immersion exposure method and apparatus, and method for producing a device

Exposure method, exposure device, and element manufacturing method

The present invention relates to an exposure method, an exposure device, and a device manufacturing method for projecting a pattern image onto a substrate through a projection optical system and liquid to perform substrate exposure.

When manufacturing a semiconductor element or a liquid crystal display element, the method used is to transfer the pattern formed on the photomask to the photosensitive substrate, that is, the so-called lithography method. The exposure device used in the lithography process is equipped with a photomask stage to support the photomask and a substrate stage to support the substrate. The photomask stage and the substrate stage are moved successively, and the projection optical system The mask pattern is transferred to the substrate. In recent years, in order to correspond to the development of higher integration of element patterns, the projection optical system also requires higher resolution. The resolution of the projection optical system is higher depending on the shorter exposure wavelength used, and higher depending on the numerical aperture of the projection optical system. As a result, the exposure wavelength used by the exposure device has been progressing to shorter wavelengths year by year, and the numerical aperture of the projection optical system has gradually increased. In addition, the current mainstream exposure wavelength is 248nm for KrF excimer lasers. However, 193nm for ArF excimer lasers with shorter wavelengths has also entered the practical stage. In addition, when performing exposure, the depth of focus (DOF) is as important as the resolution. The resolution R and the depth of focus δ are expressed by the following equations, respectively.

R=K₁Λ/NA..............(1)

δ=±K₂Λ/NA² .......(2)

Here, λ represents the wavelength of exposure, NA represents the numerical aperture of the projection optical system, K₁, K₂Represents the condition factor. It can be seen from equations (1) and (2) that, in order to improve the resolution R, if the exposure wavelength is shortened and the numerical aperture NA is enlarged, the depth of focus δ becomes smaller.

If the focal depth δ is too small, the surface of the substrate is not easy to be consistent with the image plane of the projection optical system, which may cause insufficient margin during the exposure operation. Therefore, as a method that can substantially shorten the exposure wavelength and increase the depth of focus, for example, there is a liquid immersion method disclosed in International Publication No. 99/49504. This liquid immersion method is based on filling liquids such as water or organic solvents between the underside of the projection optical system and the surface of the substrate. The wavelength of the exposure light source in the liquid is 1/n of the air (n is the refractive index of the liquid, usually 1.2~1.6) to improve the resolution, while expanding the focal depth by about n times.

In addition, as the photoresist layer provided on the substrate as the exposure object, or the top coat layer provided on the film member, generally various types of members can be used. However, in the liquid immersion exposure, if the liquid immersion When the contact surface of the area liquid, that is, the type of the above-mentioned film member is changed, the affinity for the liquid for liquid immersion exposure will be different. In the liquid immersion exposure, if the liquid is supplied to the substrate and the liquid is recovered from the substrate, if the affinity of the liquid to the membrane member is changed, the liquid recovery or liquid supply may not proceed smoothly. At this time, the versatility of the liquid immersion exposure device will be significantly reduced.

The present invention is disclosed in view of the above-mentioned problem, and its purpose is to provide an exposure method and an exposure device that can smoothly apply liquid immersion exposure to substrates with different types of film members, and provide related device manufacturing methods. In particular, it is possible to perform liquid immersion exposure under optimal liquid immersion conditions for various film members formed on the substrate.

In order to solve the above-mentioned problem, the present invention adopts the following structure corresponding to FIG. 1 to FIG. 8 of the embodiment. However, the symbols attached to each element merely represent an example of the element, and are not used to limit each element.

According to the first aspect of the present invention, an exposure method in which the pattern image is projected on the substrate (P) through the liquid (1) to expose the substrate (P), which is formed by the liquid contact surface on the substrate (P) The membrane member (SP) determines the liquid immersion conditions of the substrate (P), and exposes the substrate under the determined liquid immersion conditions.

According to the present invention, the film member (specifically, the light The barrier layer or the upper coating layer) to determine the liquid immersion conditions used when the substrate is exposed through the liquid. When liquid immersion exposure is performed on a plurality of substrates provided with different types of film members, the optimal liquid immersion conditions determined respectively can be used to perform the exposure. The "liquid immersion conditions" in this specification refers to the conditions under which a liquid immersion area is formed on the substrate when the substrate is exposed through liquid. The concept includes conditions for supplying liquid to the substrate and recovering liquid from the substrate. Conditions, and the type of liquid supplied to the substrate, etc.

According to a second aspect of the present invention, an exposure device (EX) for projecting a pattern image onto a substrate through a liquid to perform the above-mentioned substrate exposure includes: a projection optical system (PL) for projecting the pattern image onto And a liquid supply mechanism (10) for supplying the liquid; and the liquid supply mechanism (10) is based on the film member (SP) formed on the liquid contact surface on the substrate (P) to change the The supplied liquid.

According to the exposure apparatus of the present invention, the liquid used in the liquid immersion exposure is changed according to the film member formed on the liquid contact surface on the substrate. Therefore, it is possible to use a good liquid for a plurality of substrates provided with different types of film members. Immersion conditions are used for liquid immersion exposure.

According to the third aspect of the present invention, an exposure device (EX) for projecting a pattern image onto a substrate (P) through a liquid (1) to perform the above-mentioned substrate exposure, which is provided with: a projection optical system (PL), which is used To project the pattern image onto the substrate; and a measuring device (70) for measuring the affinity of the film member (SP) formed on the liquid contact surface on the substrate with the liquid.

According to the present invention, a measuring device is provided to measure the affinity between the film member formed on the liquid contact surface on the substrate and the liquid for liquid immersion exposure, and the optimal liquid can be determined based on the measurement result. Immersion conditions. Therefore, even when liquid immersion exposure is performed on a plurality of substrates provided with different types of film members, each substrate can be smoothly exposed under good liquid immersion conditions.

According to the fourth aspect of the present invention, an exposure device (EX) for projecting a pattern image onto a substrate (P) through a liquid (1) to perform the above-mentioned substrate exposure, which includes: a projection optical system (PL) for The pattern image is projected on the substrate; and the memory device (MRY), which memorizes the affinity between the above-mentioned liquids, And the relationship between the liquid immersion conditions corresponding to the affinity; and the liquid immersion conditions are selected from the memory device according to the film member (SP) formed on the liquid contact surface on the substrate.

According to the present invention, the interrelationship between the affinity of the liquid and the membrane member and the corresponding liquid immersion conditions is pre-stored in the memory device, so that it can be selected and determined according to the relevant information of the membrane member of the exposure object Optimal liquid immersion conditions. Therefore, even if liquid immersion exposure is performed on a plurality of substrates provided with different types of film members, it is possible to apply smooth exposure treatment to each substrate under good liquid immersion conditions.

According to the fifth aspect of the present invention, the exposure device (EX) for projecting the pattern image onto the substrate (P) through the liquid (1) to perform the above-mentioned substrate exposure, which is provided with: a projection optical system (PL) for The pattern image is projected on the substrate; the memory device (MRY), which memorizes the relationship between the various film members (SP) that can be formed on the liquid contact surface on the substrate, and the liquid immersion conditions applicable to the various film members. According to the exposure device, the memory device stores the film member and the optimal liquid immersion conditions of various film members in advance. Therefore, once the film member is determined, the optimal liquid immersion conditions can be selected from the memory device immediately, including, for example, The conditions for supplying liquid to the substrate, the conditions for recovering the liquid from the substrate, and the type of liquid supplied to the substrate, etc. Therefore, during liquid immersion exposure, even if the object to be exposed or the film member is changed, the optimal liquid immersion conditions can be quickly found to respond. In addition, the exposure device has a control device (CONT), which selects the two liquid immersion conditions from the above-mentioned memory device to set the liquid immersion conditions according to the film member used in the liquid immersion exposure. Dip exposure.

According to a sixth aspect of the present invention, an exposure device (EX) for projecting a pattern image onto a substrate (P) through a liquid (1) to perform the above-mentioned substrate exposure, which is provided with: a liquid supply mechanism (10), which has a supply The ports (13A, 14A) are used to supply the liquid (1), and at least one of the size or the shape of the supply ports (13A, 14A) is variable. According to this exposure apparatus, since at least one of the size or shape of the supply port is variable, for example, even if the exposure target or the film member is changed during the immersion exposure, the optimum immersion conditions can be quickly achieved To respond.

According to a seventh aspect of the present invention, an exposure device (EX) for projecting a pattern image on a substrate (P) through a liquid (1) to perform the above-mentioned substrate exposure, which is provided with: a liquid recovery mechanism (30) with a recovery port (31A, 32A) to recover the liquid (1), and at least one of the size or shape of the recovery port (31A, 32A) is variable. According to this exposure apparatus, since at least one of the size or shape of the recovery port is variable, for example, even if the object or film member to be exposed is changed during immersion exposure, the optimal immersion conditions can be quickly achieved Respond.

According to an eighth aspect of the present invention, a device manufacturing method is characterized in that the exposure method of the above aspect is used. In addition, a ninth aspect of the present invention is a device manufacturing method characterized in that the exposure apparatus (EX) of the above aspect is used. According to the present invention, it is possible to achieve high transfer accuracy during pattern transfer under good liquid immersion conditions for various substrates, and the provided element will be able to exert the expected performance.

<p>EXExposure Device</p><p>MSTMask Stage</p><p>PSTSubstrate Stage</p><p>ILIllumination optical system</p><p>ELExposure light source</p><p>PLProjection optical system</p><p>CONTControl device</p><p>AR1Projection area</p><p>AR2Liquid immersion area</p><p>SPMembrane member</p><p>MSTDMask stage driving device</p><p>PKlens tube</p><p>SPMembrane member</p><p>MRYMemory device</p><p>MMask</p><p>PSubstrate</p><p>1Liquid</p><p>1ALighting area</p><p>2Optical components</p><p>2aLiquid contact surface</p><p>3Optical characteristics control device</p><p>4Focus detection system</p><p>4aLight-emitting part</p><p>4bLight receiving part</p><p>10Liquid supply mechanism</p><p>11The first liquid supply part</p><p>12Second liquid supply part</p><p>13,14Supply components</p><p>13A, 14ASupply port</p><p>13BSub-manifold</p><p>15The first piping system</p><p>16Second piping system</p><p>17, 18Connecting pipe</p><p>17A,18AValve</p><p>19Supply pipe</p><p>21The third liquid supply part</p><p>22The fourth liquid supply part</p><p>30Liquid recovery mechanism</p><p>31,32Recycling components</p><p>31A, 32ARecycling port</p><p>33,34Liquid Recovery Department</p><p>33A, 34ARecycling tube</p><p>40Body components</p><p>41Sliding member</p><p>42Baffle member</p><p>50Moving mirror</p><p>51Laser interferometer</p><p>52Z Stage</p><p>53XY stage</p><p>54Pedestal</p><p>55Moving mirror</p><p>56Laser interferometer</p><p>57Auxiliary Board</p><p>60Input device</p><p>70Measuring device</p><p>71Loading arm</p><p>72Drip part</p><p>73Testing Department</p><p>74Rotation drive unit</p><p>80Conduit</p>

Fig. 1 is a schematic configuration diagram of an embodiment of the exposure apparatus of the present invention.

Fig. 2 is a plan view showing an example of arrangement of a liquid supply mechanism and a liquid recovery mechanism in the embodiment of the present invention.

Figures 3 (a) to (d) are cross-sectional views showing one embodiment of the supply member and the recovery member.

Figure 4 (a) and (b) are schematic diagrams to illustrate the change of the liquid supply position and the liquid recovery position.

Fig. 5 is an example of a block diagram of the control system in the embodiment of the present invention.

Figures 6 (a) and (b) are schematic structural diagrams showing an embodiment of the measuring device.

Figures 7 (a) and (b) are cross-sectional views for showing one embodiment of the supply member and the recovery member.

FIG. 8 is a flowchart showing an example of a manufacturing process of a semiconductor device in the embodiment of the present invention.

The exposure apparatus of the present invention will be described below with reference to the drawings. However, the present invention is not limited to the text contained herein.

Fig. 1 is a schematic configuration diagram of an embodiment of the exposure apparatus of the present invention. The exposure apparatus EX in Fig. 1 is equipped with: a mask stage MST to support the photomask (reticle) M; a substrate stage PST to support the substrate P; an illumination optical system IL to illuminate the light source EL The photomask M supported by the photomask stage MST; the projection optical system PL, which enables the pattern image of the photomask M irradiated by the exposure light source EL to be projected and exposed on the substrate P supported by the substrate stage PST; control device CONT , Which integrates and controls the actions of the entire exposure device EX; and the memory device MRY, which is connected to the control device CONT, to memorize various related information about the exposure action.

The exposure apparatus EX of this embodiment is a liquid immersion exposure apparatus that adopts the night immersion method (in order to substantially shorten the exposure wavelength to increase the resolution while taking into account the expansion of the focal depth), and includes: a liquid supply mechanism 10 for discharging liquid 1 It is supplied to the substrate P; and the liquid recovery mechanism 30 is used to recover the liquid 1 from the substrate P. In the exposure device EX, at least in the process of transferring the pattern image of the mask M to the substrate P, the liquid 1 supplied by the liquid supply mechanism 10 is at least part of the substrate P (including the projection optical system PL The projection area AR1) forms the liquid immersion area AR2. Specifically, the exposure device EX is filled with the liquid 1 between the optical element 2 at the tip of the projection optical system PL and the surface (exposure surface) of the substrate P, and transmits the liquid 1 between the projection optical system PL and the substrate P and the projection The optical system PL projects the pattern image of the mask M on the substrate P, thereby performing exposure of the substrate P.

Here, in the illustrative example of this embodiment, the exposure device EX is a scanning type exposure device (ie, a scanning stepper), which makes the mask M and the substrate P run differently (reverse) in the scanning direction (predetermined direction) The ground is moved synchronously, and the pattern formed by the mask M is exposed to the substrate P. In the following description, the direction in which the mask M and the substrate P move synchronously in the horizontal plane (scanning direction, predetermined direction) is the X-axis direction; the direction orthogonal to the X-axis in the horizontal plane is the Y-axis direction (not Scanning direction); perpendicular to the X-axis direction and Y-axis direction and with the projection optical system PL The direction in which the optical axis AX coincides is the Z-axis direction. In addition, the directions around the X axis, around the Y axis, and around the Z axis are respectively denoted as the θ X direction, the θ Y direction, and the θ Z direction.

The substrate P is on the element substrate (semiconductor wafer or glass substrate), and is provided with a photoresist layer or a film member SP composed of an overcoat (protective layer) provided on the upper layer of the photoresist layer. Therefore, the film member SP of the uppermost layer provided on the substrate P forms a liquid contact surface that comes into contact with the liquid 1 during liquid immersion exposure. The photoresist layer used can be exemplified by the "P6111" product manufactured by Tokyo Ohka Kogyo Co., Ltd.; the overcoat used can be exemplified by the "TSP-3A" product manufactured by Tokyo Ohka Kogyo Co., Ltd. In the present invention, the liquid immersion conditions can be determined according to the characteristics of the film members, especially the wettability or contact angle with the used liquid.

The illumination optical system IL provides illumination of the exposure light source EL for the mask M supported by the mask stage MST, which includes: an exposure light source; an optical integrator, which makes the illuminance of the light beam emitted from the exposure light source uniform ; Focusing lens, which makes the exposure light source EL from the optical integrator have a condensing effect; relay lens system; and variable field aperture, which sets the exposure light source EL to the illumination area 1A on the mask M as a slit shape. The predetermined illumination area IA on the mask M is illuminated by the illumination optical system IL with an exposure light source EL having a uniform illuminance distribution. The exposure light source EL emitted from the illumination optical system IL can be exemplified by the bright lines (g-line, h-line, i-line) in the ultraviolet region emitted by the mercury lamp, and far ultraviolet light (wavelength 248nm) such as KrF excimer laser light ( DUV light), ArF excimer laser light (wavelength 193nm) and F₂Vacuum ultraviolet light (VUV light) such as laser light (wavelength 157nm). In this embodiment, ArF excimer laser light is used.

The mask stage MST is used to support the mask M. It can move in two dimensions in the vertical plane of the optical axis AX of the projection optical system PL, that is, in the XY plane, and can be rotated slightly in the θ Z direction. The mask stage MST is driven by a mask stage drive device MSTD such as a linear motor. The drive device MSTD of the mask stage is controlled by the control device CONT. A moving mirror 50 is provided on the mask stage MST. In addition, a laser interferometer 51 is provided at a position opposed to the movable mirror 50. The two-dimensional position and rotation angle of the mask M on the mask stage MST are measured in real time by the laser interferometer 51. The measurement result is output to the control device CONT. The control device CONT drives the mask stage driving device MSTD according to the measurement result of the laser interferometer 51, so as to perform the positioning of the mask M supported by the mask stage MST.

The projection optical system PL projects and exposes the pattern of the mask M to the substrate P at a predetermined projection magnification β. It has a plurality of optical elements, including an optical element (lens) 2 provided at the front end of the substrate P side. These optical elements are supported by the lens barrel PK. In addition, an imaging characteristic (optical characteristic) control device 3 is provided in the projection optical system PL to adjust the imaging characteristic (optical characteristic) of the projection optical system PL. The structure of the imaging characteristic control device 3 includes: an optical element drive mechanism, which can move a part of a plurality of optical elements constituting the projection optical system PL; a pressure adjustment mechanism, which can adjust a specific space between the plurality of optical elements in the lens barrel PK pressure. A predetermined optical element among the plurality of optical elements constituting the projection optical system PL is moved in the direction of the optical axis AX by an optical element drive mechanism, or is inclined to the optical axis AX. The imaging characteristic control device 3 is controlled by the control device CONT. The control device CONT can adjust the projection magnification or the image plane position of the projection optical system PL through the imaging characteristic control device 3.

The projection optical system PL in this embodiment is, for example, a reduction system with a projection magnification of 1/4 or 1/5. Furthermore, the projection optical system PL may be either a equal magnification system or an enlarged system. In addition, the tip optical element 2 of the projection optical system PL of the present embodiment can be installed in a manner that can be detached from the lens barrel PK (replaceable). In addition, the optical element 2 at the tip is exposed to the lens barrel PK, and the liquid 1 in the liquid immersion area AR2 is in contact with the optical element 2. As a result, the lens barrel PK made of metal can be prevented from being corroded.

In addition, the exposure apparatus EX has a focus detection system 4. The focus detection system 4 has a light-emitting part 4a and a light-receiving part 4b. The detection light from the light-emitting part 4a is projected obliquely to the surface (exposure surface) of the substrate P through the liquid 1, and the reflected light is received by the light-receiving part 4b. While controlling the operation of the focus detection system 4, the control device CONT detects the position (focus position) of the surface of the substrate P in the Z-axis direction with respect to the predetermined reference plane based on the result of the light received by the light receiving unit 4b. Also, the focus detection system 4 is required to The individual focus positions of a plurality of points on the surface of the substrate P can be obtained, and the posture of the tilt direction of the substrate P can also be obtained.

The substrate stage PST is used to support the substrate P, which includes: a Z stage 52 for holding the substrate P through a substrate holder; an XYZ stage 53 for supporting the Z stage 52; and a base 54, It is used to support the XY stage 53. The substrate stage PST is driven by a substrate stage driving device PSTD such as a linear motor. The substrate stage driving device PSTD is controlled by the control device CONT. Furthermore, the Z stage and the XY stage can be integrated, which should not be redundant. By driving the XY stage 53 of the substrate stage PST, the position of the substrate P in the XY direction (ie, the position in the direction substantially parallel to the image plane of the projection optical system PL) can be controlled accordingly.

The substrate stage PST (Z stage 52) is provided with a moving mirror 55 that moves with the substrate stage PST relative to the projection optical system PL. In addition, a laser interferometer 56 is installed at a position opposed to the movable mirror 55. The position and rotation angle of the substrate P on the substrate stage PST in the two-dimensional direction are measured by the laser interferometer 56 in real time, and the measurement result is output to the control device CONT. The control device CONT drives the XY stage 53 through the substrate stage driving device PSTD based on the measurement result of the laser interferometer 56 to perform the X-axis direction and Y-axis direction of the substrate P supported by the substrate stage PST. Orientation of the direction.

In addition, the control device CONT drives the Z stage 52 of the substrate stage PST through the substrate stage drive device PSTD, according to the position (focus position) in the Z-axis direction of the substrate P held by the Z stage 52, and The position in the θ X and θ Y directions is controlled. That is, the Z stage 52 is operated in accordance with the detection result of the focus detection system 4 in accordance with the command of the control device CONT to control the focus position (Z position) and the inclination angle of the substrate P so that the surface (exposure surface) of the substrate P and The image plane formed by the projection optical system PL and the liquid 1 coincides.

The substrate stage PST (Z stage 52) is provided with an auxiliary plate 57 having a flat surface so as to surround the substrate P. The auxiliary plate 57 is arranged such that its surface is approximately the same height as the surface of the substrate P held by the substrate holder. Here, although there is about 1~2mm between the edge of the substrate P and the auxiliary plate 57 However, due to the surface tension of the liquid 1, the liquid 1 hardly flows into the gap. When the exposure is performed near the periphery of the exposure substrate P, the liquid 1 can also be held under the projection optical system PL by the auxiliary plate 57 .

The liquid supply mechanism 10 is used for supplying the liquid 1 for liquid immersion exposure onto the substrate P, and can supply a plurality of types of liquids 1. The liquid supply mechanism 10 in this embodiment can supply two types of liquid 1, namely, pure water as the first liquid and fluorine-based oil (fluorine-based fluid) as the second liquid. The liquid supply mechanism 10 is provided with: a first liquid supply part 11 and a second liquid supply part 12 that can send out the first liquid (pure water); 4 Liquid supply part 22; The first piping system 15, which is connected to the first liquid supply part 11 and the third liquid supply part 21, selects either the first liquid (pure water) or the second liquid (fluorine-based oil) One type, the selected liquid 1 is supplied to the substrate P; and the second piping system 16, which is connected to the second liquid supply part 12 and the fourth liquid supply part 22, selects the first liquid (pure water) or the second liquid Any one of (fluorine-based oil) supplies the selected liquid 1 onto the substrate P.

FIG. 2 is a plan view of the schematic structure of the liquid supply mechanism 10 and the liquid recovery mechanism 30. As shown in FIG. As shown in FIGS. 1 and 2, the first piping system 15 has a supply pipe 19 for circulating the liquid 1 sent from any one of the first liquid supply unit 11 and the third liquid supply unit 21. One end of the supply pipe 19 is connected to the first liquid supply portion 11 and the third liquid supply portion 21 through the transmission pipes 17 and 18, respectively. On the other hand, the other end of the supply pipe 19 is connected to the plurality of first supply members 13 through the plurality of branch pipes 13B, respectively. The plurality of first supply members 13 are arranged side by side in the Y-axis direction, and the supply ports 13A thereof are arranged close to the surface of the substrate P. In this embodiment, five first supply members 13 are arranged side by side. In addition, these first supply members 13 are provided on one end side of the scanning direction with respect to the slit-shaped (rectangular) projection area AR1 of the projection optical system PL with the Y-axis direction (non-scanning direction) as the longitudinal direction. (-X) side.

The pipes 17, 18 are provided with valves 17A, 18A, respectively. The actions of the valves 17A and 18A are controlled by the control device CONT. The control device CONT uses valves 17A and 18A to close when the tube 17 is opened. The tube 18 drives the first liquid supply unit 11 so that the first liquid (pure water) from the first liquid supply unit 11 passes through the tube 17, the supply tube 19, and the first supply member 13, and is supplied to the substrate through the supply port 13A P on. On the other hand, the control device CONT uses the valves 17A and 18A to close the tube 17 while the tube 18 is opened, and drive the third liquid supply part 21, so that the second liquid (fluorine-based oil) from the third liquid supply part 21 The penetration tube 18, the supply tube 19, and the first supply member 13 are supplied onto the substrate P from the supply port 13A.

The second piping system 16 has a supply pipe 25 for circulating the liquid 1 sent from either the second liquid supply part 12 and the fourth liquid supply part 22, and one end of the supply pipe 25 is a through pipe 23, 24 They are connected to the second liquid supply part 12 and the fourth liquid supply part 22, respectively. On the other hand, the other end of the supply pipe 25 is connected to a plurality of second supply members 14 through a plurality of branch pipes 14B, respectively. The plurality of second supply members 14 are arranged side by side in the Y-axis direction, and the supply ports 14A thereof are arranged close to the surface of the substrate P. As with the first supply member 13, five second supply members 14 are arranged side by side. In addition, the second supply members 14 are arranged on the other side (+X) side in the scanning direction with respect to the projection area AR1.

The pipes 23 and 24 are respectively provided with valves 23A and 24A. The actions of the valves 23A and 24A are controlled by the control device CONT. The control device CONT uses the valves 23A and 24A to close the tube 24 while the tube 23 is opened, and drives the second liquid supply unit 12 so that the first liquid (pure water) from the second liquid supply unit 12 passes through the tube 23 and supplies The tube 25 and the second supply member 14 are supplied onto the substrate P from the supply port 14A. On the other hand, the control device CONT uses the valves 23A and 24A to close the pipe 23 while the pipe 24 is opened, and drive the fourth liquid supply unit 22, so that the second liquid (fluorine-based oil) from the fourth liquid supply unit 22 The penetration tube 24, the supply tube 25, and the second supply member 14 are supplied onto the substrate P from the supply port 14A.

Each of the above-mentioned first to fourth liquid supply parts 11, 12, 21, 22 has a storage tank and a pressure pump for storing the liquid 1, respectively. The respective liquid supply operations of the liquid supply units 11, 12, 21, and 22 are controlled by the control device CONT. Controlled by the control device CONT, it can be controlled by The respective liquid supply units 11, 12, 21, 22 respectively provide different liquid supply amounts per unit time to the substrate P. In addition, each of the liquid supply parts 11, 12, 21, 22 has a liquid temperature adjustment mechanism, and the temperature of the liquid 1 supplied to the substrate P can be maintained at 23°C approximately the same as the temperature in the device storage tank.

In this way, when the liquid supply mechanism 10 performs a liquid supply operation, the piping systems 15 and 16 are used to select a suitable liquid from a plurality of (here, two) liquids 1 for liquid immersion exposure. As shown in FIG. 2, the liquid immersion area AR2 filled with the liquid 1 is a portion formed on the substrate P including the projection area AR1. The liquid supply mechanism 10 simultaneously supplies the liquid 1 from both sides of the projection area AR1 through the supply ports 13A, 14A of the plural first and second supply members 13, 14 respectively.

In the following description, pure water is supplied by the liquid supply mechanism 10 as an example of the liquid 1 for liquid immersion exposure. When pure water is used, it can penetrate even when using ArF excimer laser light as the exposure light source EL. In addition, bright rays (g-line, h-line, i-line) in the ultraviolet region and far ultraviolet light (DUV) such as KrF excimer laser light (wavelength 248nm) can also penetrate pure water. In addition, the optical element 2 at the tip of the projection optical system PL is formed of fluorite. The affinity of fluorite and pure water is good, so the liquid 1 can be closely adhered to the liquid contact surface 2a of the optical element 2 almost completely. In this embodiment, the supply is a liquid (pure water) 1 having a high affinity with the liquid contact surface 2a of the optical element 2. Therefore, the liquid contact surface 2a of the optical element 2 can be used for close contact with the liquid 1. Quartz with high sex and high affinity for water. In addition, the liquid contact surface 2a of the optical element 2 may be subjected to hydrophilization (lyophilization) treatment to further enhance the affinity with the liquid 1.

The liquid recovery mechanism 30 is used to recover the liquid 1 on the substrate P. The liquid recovery mechanism 30 is provided with: a plurality of first and second recovery members 31, 32, which are provided with recovery ports 31A, 32A on the surface close to the substrate P; and first and second liquid recovery parts 33, 34, and their systems The first and second recovery members 31 and 32 are connected to the first and second recovery members 31 and 32 through recovery pipes 33A and 34A, respectively. The recovery pipe 33A is respectively connected to a plurality of first recovery members 31, and the recovery pipe 34A is also respectively connected to a plurality of second recovery members 32, but some of them are omitted in FIG. 2. The plurality of first recovery members 31 are arranged in a substantially arc shape in the throwing On the -X side of the shadow area AR1, the recovery port 31A faces the surface of the substrate P. In addition, the plurality of second recovery members 32 are arranged on the +X side of the projection area AR2 in a substantially circular arc shape, and the recovery ports 32A thereof are directed toward the surface of the substrate P. The plurality of first recovery members and second recovery members 31 and 32 are arranged so as to surround the first and second supply members 13 and 14 of the liquid supply mechanism 10 and the projection area AR1.

The first and second liquid recovery parts 33, 34 have suction devices such as vacuum pumps, and storage tanks for storing the recovered liquid 1, and are recovered through the first and second recovery members 31, 32, and recovery pipes 33A, 34A. Liquid 1 on the substrate P. The liquid recovery operations of the first and second liquid recovery units 33 and 34 are controlled by the control device CONT. The control device CONT can control the liquid recovery amount (recovery capacity) of the first and second liquid recovery units 33 and 34 per unit time. The liquid 1 supplied to the substrate P from the supply ports of the first and second supply members 13, 14 is supplied in a sufficient amount to expand between the lower end surface of the front end portion (optical element 2) of the projection optical system PL and the substrate P Unfold. In addition, the liquid 1 flowing out of the first and second supply members 13, 14 with respect to the projection area AR1 is derived from the first and second supply members 13 and 14 located outside the projection area AR1. The recovery ports of the second recovery members 31 and 32 are used for recovery.

FIG. 3 is an enlarged cross-sectional view of the first supply member 13. The first supply member 13 in FIG. 3(a) is provided with: a main body member 40; a sliding member 41 located below the main body member 40 and slidable in the X direction relative to the main body member 40; and a baffle member 42, which The supply port 13A provided at the lower end of the sliding member 41 can be slid in the X direction relative to the sliding member 41 to change the size of the supply port 13A. The sliding member 41 and the baffle member 42 are slid by a driving device not shown. As shown in FIG. 3(b), when the sliding member 41 moves in the +X direction relative to the main body member 40, the position of the supply port 13A moves to the +X side. Furthermore, as shown in FIG. 3(c), moving the sliding member 41 in the -X direction relative to the main body member 40 will cause the position of the supply port 13A to move to the -X side. Furthermore, as shown in FIG. 3(d), by moving the shutter member 42 toward the inside of the supply port 13A, the supply port 13A can be reduced.

In addition, the second supply member 14, the first recovery member 31, and the second recovery member 32 each have a structure equivalent to the first supply member 13. Therefore, the second supply member 14 can change the position and size of the supply port 14A. Furthermore, the supply ports 13A and 14A may be changed to only one of the position and the size. Similarly, the first and second recovery members 31, 32 can change the positions and sizes of the recovery ports 31A, 32A, respectively. Similarly, only one of the position and the size of the recovery ports 31A and 32A may be changed.

The schematic diagram shown in FIG. 4 shows how the liquid supply positions of the first and second supply members 13 and 14 and the liquid recovery positions of the first and second recovery members 31 and 32 are changed. The control device CONT drives the drive devices of the first and second supply members 13, 14 and the drive devices of the first and second recovery members 31, 32, whereby, as shown in FIG. 4(a), the first The liquid supply positions of the first and second supply members 13 and 14 are close to the projection area AR1 of the projection optical system PL, and the liquid recovery positions of the first and second recovery members 31 and 32 can be kept away from the projection area AR1. In addition, as shown in FIG. 4(b), the control device CONT drives the drive devices of the first and second supply members 13, 14 and the drive devices of the first and second recovery members 31, 32 to enable the first and The liquid supply positions of the second supply members 13 and 14 are away from the projection area AR1, and the liquid recovery positions of the first and second recovery members 31 and 32 can be made close to the projection area AR1. In addition, the liquid supply positions of the first and second supply members 13, 14 and the liquid recovery positions of the first and second recovery members 31, 32 can be adjusted independently.

What will be explained next is a method of projecting and exposing the pattern image of the mask M on the substrate P through the projection optical system PL and the liquid 1 in the liquid immersion area AR2 using the above-mentioned exposure device EX.

Here, the exposure apparatus EX in the present embodiment moves the mask M and the substrate P in the X-axis direction (scanning direction) while projecting and exposing the pattern image of the mask M to the substrate P. When the exposure device EX performs scanning exposure, the partial pattern image of the mask M corresponding to the illumination area IA is projected to the projection area AR1 in a slit shape (rectangular shape) directly below the front end of the projection optical system PL. At the same time, the mask M faces the -X direction with respect to the projection optical system PL at a speed V When moving in the direction (or +X direction), the substrate P is synchronized with it, that is, it moves in the +X direction (or -X direction) through the XY stage 53 at a speed of βV (β is the projection magnification). In addition, a plurality of shots are set on the substrate P. After the exposure of one shot is completed, the substrate P moves to the scan start position of the next shot by stepping. Hereinafter, while the substrate P is moved by the step-and-scan method, scanning exposure processing is sequentially performed on each shot area SA at the same time.

Furthermore, as shown in the block diagram of FIG. 5, the memory device MRY stores information (liquid immersion condition database) regarding the liquid immersion conditions for liquid immersion exposure. Specifically, a complex array of corresponding data is stored in the memory device MRY, the content of which is the affinity of the film member SP formed by the contact surface of the liquid 1 on the substrate P with the liquid 1 during liquid immersion exposure, and the affinity The relationship between immersion conditions corresponding to sex. Here, the information related to the affinity between the membrane member SP and the liquid 1 includes the contact angle of the liquid 1 to the membrane member SP. Furthermore, in the memory device MRY, the liquid immersion exposure conditions corresponding to the component characteristics (such as volatility, viscosity, density, surface tension, etc.) of the liquid 1 are stored in advance. Furthermore, as described later, various membrane members SP and the types of liquids suitable for the membrane members SP can be investigated in advance, the combination of the membrane members SP and the types of liquids suitable for the membrane member, and suitable The optimal liquid immersion conditions for this combination are stored in the memory device MRY.

When the liquid immersion exposure process is performed, the input of the film member information of the substrate P to be exposed is obtained through the input device 60 connected to the control device CONT. The inputted film member information includes information about the contact angle between the film member SP and the liquid 1. The control device CONT is based on the input film member information (contact angle related information), referring to the affinity (contact angle) of the film member SP and the liquid 1 stored in the memory device MRY in advance, and the affinity (contact angle) The relationship (corresponding data) of the corresponding liquid immersion conditions is to select the best liquid immersion condition for the substrate P to be exposed.

The liquid immersion conditions here include conditions for supplying the liquid 1 for liquid immersion exposure onto the substrate P. In addition, the supply conditions of the liquid 1 include the position and unit of the liquid supply on the substrate P At least one of the amount of liquid supplied.

Furthermore, the liquid immersion conditions include conditions for recovering the liquid 1 for liquid immersion exposure from the substrate P. In addition, the recovery conditions of the liquid 1 include at least one of the liquid recovery position on the substrate P and the liquid recovery amount per unit time (liquid recovery capacity).

For example, the control device CONT adjusts the liquid supply amount of the liquid supply mechanism 10 and the liquid recovery amount of the liquid recovery mechanism 30 in accordance with the contact angle of the liquid 1 to the membrane member SP.

Specifically, when the liquid 1 has a large contact angle to the film member SP, the film member SP has liquid repellency (water repellency) to the liquid 1. Therefore, when the liquid 1 is supplied to the substrate P (membrane member SP) , The liquid 1 will not spread too much. When the supply of the liquid 1 to the membrane member SP is as described above, for example, the liquid supply amount of the liquid supply mechanism 10 per unit time can be increased. In this way, the liquid 1 can be well diffused on the surface of the substrate P (membrane member SP), and the liquid immersion area AR2 can be formed smoothly. In addition, when the film member SP has liquid repellency, once the substrate P is scanned and moved for scanning exposure, the liquid 1 is easily peeled from the substrate P (film member SP). However, the increase in the supply amount of liquid can be suppressed. Liquid 1 peeled off.

Furthermore, when the membrane member SP has liquid repellency (water repellency) to the liquid 1, the liquid 1 does not spread too much, so the liquid recovery mechanism 30 can more easily recover the liquid 1 from the substrate P (membrane member SP). Therefore, even if the liquid recovery capability (driving force of the liquid recovery part) of the liquid recovery mechanism 30 is reduced, that is, the liquid recovery amount per unit time is reduced, the liquid 1 can be recovered smoothly. Therefore, the vibration caused by the driving of the liquid recovery part can be suppressed.

On the other hand, when the liquid 1 has a small contact angle to the membrane member SP, the membrane member SP is lyophilic (hydrophilic) to the liquid 1. Therefore, when the liquid 1 is supplied to the substrate P (membrane member SP) , The liquid 1 is easier to spread. Therefore, when the liquid 1 is supplied to the film member SP, even if the liquid supply amount per unit time of the liquid supply mechanism 10 is reduced, the liquid 1 can be well diffused on the surface of the substrate P (membrane member SP), and the liquid can be formed smoothly. Dip area AR2. In addition, since the liquid supply amount of the liquid 1 is reduced, the waste of the liquid 1 can be suppressed, and the flooding caused by the liquid supply part can be suppressed. Vibration caused by movement.

In addition, when the membrane member SP is lyophilic (hydrophilic) to the liquid 1, the liquid 1 is likely to spread on the substrate P (membrane member SP). Therefore, it may be difficult for the liquid recovery mechanism 30 to separate from the substrate P (membrane member SP). SP) to recover liquid 1. Therefore, the liquid recovery capability (the driving force of the liquid recovery part) of the liquid recovery mechanism 30 is increased, that is, the liquid recovery volume per unit time. In this way, the liquid recovery mechanism 30 can recover the liquid 1 smoothly.

For example, the control device CONT may also adjust the liquid supply position of the liquid supply mechanism 10 and the liquid recovery position of the liquid recovery mechanism 30 in accordance with the contact angle of the liquid 1 to the membrane member SP.

For example, when the liquid 1 has a large contact angle to the film member SP, the film member SP has liquid repellency (water repellency) to the liquid 1. Therefore, when the liquid 1 is supplied to the substrate P (membrane member SP), the It is difficult for the liquid 1 to spread. Therefore, when the liquid 1 is relatively moved to the substrate P for scanning exposure, the liquid 1 is more likely to be peeled from the substrate P (film member SP). If the liquid supply position of the liquid supply mechanism 10 is placed far away from the projection area AR1 of the projection optical system PL, that is, the distance from the liquid supply position to the projection area AR1 of the projection optical system PL is extended to form a larger In the liquid immersion area AR2, the liquid 1 can be suppressed from peeling off when the substrate P is scanned and moved by this method. The adjustment of the liquid supply position can be achieved by referring to FIG. 3 so that the sliding member 41 slides relative to the main body member 40 of the supply members 13 and 14.

In addition, when the membrane member SP has liquid repellency (water repellency) to the liquid 1, since it does not spread too much, as described above, the liquid recovery mechanism 30 is easier to attach from the substrate P (membrane member SP). Recover liquid 1. Therefore, even if the liquid recovery position in the liquid recovery mechanism 30 is close to the projection area AR1 of the projection optical system PL, that is, the distance from the liquid recovery position to the projection area AR1 of the projection optical system PL is shortened, the liquid 1 can still be recovered smoothly. Therefore, the space occupied by the liquid recovery mechanism 30 can be reduced.

On the other hand, when the liquid 1 has a small contact angle to the membrane member SP, the membrane member SP is lyophilic (hydrophilic) to the liquid 1. Therefore, when the liquid 1 is supplied to the substrate P (membrane member SP), the liquid 1 Easy to spread. Therefore, when the liquid 1 is supplied to the film member SP as described above, if the liquid supply position provided by the liquid supply mechanism 10 is located close to the projection area AR1 of the projection optical system PL, that is, the liquid supply position is shortened to The distance of the projection area AR1 of the projection optical system PL can prevent the liquid 1 from leaking to the outside.

In addition, when the membrane member SP is lyophilic (hydrophilic) to the liquid 1, the liquid 1 is likely to spread on the substrate P (membrane member SP). Therefore, it may be difficult for the liquid recovery mechanism 30 to separate from the substrate P (membrane member SP). SP) to recover liquid 1. If the liquid recovery position of the liquid recovery mechanism 30 is far away from the projection area AR1 of the projection optical system PL, that is, the distance from the liquid recovery position to the projection area AR1 of the projection optical system PL is lengthened, the liquid recovery mechanism 30 can smoothlyofRecovered liquid 1. That is, when the liquid 1 is easy to diffuse, the liquid is recovered at a location far away from the liquid supply position. By this method, the liquid 1 supplied is in a state where the flow rate of the supplied liquid 1 has been reduced during the recovery. Therefore, when recovering the liquid 1 which is lyophilic to the membrane member SP, it is desirable to set the liquid recovery position away from the liquid supply position, that is, away from the projection area AR1.

In addition, the control device CONT can adjust the size of the liquid supply ports 13A, 14A of the liquid supply mechanism 10 and the size of the liquid recovery ports 31A, 32A of the liquid recovery mechanism 30 according to the contact angle of the liquid 1 to the membrane member SP.

For example, when the liquid 1 has a large contact angle with the film member SP, the film member SP has liquid repellency (water repellency) to the liquid 1, and therefore, the liquid 1 is easily peeled from the substrate P. At this time, if the liquid supply ports 13A and 14A are reduced, the flow potential of the liquid 1 supplied to the substrate P can be increased, and the peeling phenomenon can be suppressed. The adjustment of the size of the liquid supply port can be achieved by moving the baffle member 42 of the supply member 13 and 14 as shown in FIG. 3.

In addition, when the liquid 1 has liquid repellency (water repellency) to the membrane member SP, as described above, the liquid recovery mechanism 30 can more easily recover the liquid 1 from the substrate P (membrane member SP). At this time, the liquid recovery ports 31A and 32A of the liquid recovery mechanism 30 can be reduced. By reducing the size of the liquid recovery ports 31A, 32A, it is difficult for air to penetrate when recovering the liquid 1, so the liquid recovery mechanism 30 can recover the substrate smoothly. Liquid on P1.

On the other hand, when the liquid 1 has a small contact angle to the membrane member SP, the membrane member SP is lyophilic (hydrophilic) to the liquid 1. Therefore, even if the liquid supply port 13A for supplying the liquid 1 to the substrate P is enlarged , 14A, the liquid immersion area AR2 can still be formed smoothly.

In addition, when the membrane member SP is lyophilic (hydrophilic) to the liquid 1, the liquid 1 is likely to spread on the substrate P (membrane member SP). Therefore, it may be difficult for the liquid recovery mechanism 30 to separate from the substrate P (membrane member SP). SP) to recover liquid 1. Here, the liquid recovery ports 31A and 32A are enlarged so that the liquid 1 can be recovered in a larger range, so that the liquid 1 on the substrate P can be recovered smoothly.

As explained above, in the present invention, the optimal liquid immersion conditions (supply amount, recovery amount, supply position, recovery position, etc.) corresponding to the contact angle (affinity) of the liquid 1 to the membrane member SP are obtained in advance, and The relevant information of the optimal liquid immersion conditions is stored in the memory device MRY in advance, and the control device CONT obtains the relevant information of the film member SP of the substrate P to be exposed through the input device 60 (contact of the liquid 1 to the film member SP) Angle information), select the best immersion condition from the multiple array of immersion conditions in memory, and set the optimum liquid supply amount, liquid recovery amount, or liquid according to the selected liquid immersion condition as described above Supply position, liquid recovery position. In this state, the substrate P is subjected to liquid immersion exposure by the control device CONT.

The liquid immersion exposure treatment is performed as follows. The control device CONT uses the substrate transport system to place the substrate P on the substrate stage PST, and then drives the liquid supply mechanism 10 to start the supply of liquid on the substrate P. The liquid 1 sent from the first and second liquid supply parts of the liquid supply mechanism 10 to form the liquid immersion area AR2 passes through the first and second piping systems 15, 16 and then passes through the first and second supply members 13 , 14 is supplied to the substrate P, so that a liquid immersion area AR2 is formed between the projection optical system PL and the substrate P. The supply ports 13A, 14A of the first and second supply members 13, 14 are arranged on both sides of the projection area AR1 in the X-axis direction (scanning direction). The control device CONT simultaneously supplies the liquid 1 onto the substrate P from the supply ports 13A and 14A. Accordingly, the liquid 1 supplied to the substrate P forms a liquid immersion area on the substrate P that is at least larger than the projection area AR1 AR2.

In this embodiment, when the liquid 1 is supplied to the substrate P from both sides of the projection area AR1 in the scanning direction, the control device CONT controls the liquid supply operations of the first and second liquid supply units 11, 12 of the liquid supply mechanism 10 so that The amount of liquid supplied per unit time in front of the projection area AR1 in the scanning direction is greater than the amount of liquid supplied from the opposite side. For example, when the substrate P moves in the +X direction while performing the exposure process, the liquid supply amount from the -X side of the projection area AR1 (that is, the supply port 13A) of the liquid supply amount set in the control device CONT is more The amount of liquid from the +X side (that is, the supply port 14A). On the other hand, when the substrate P is subjected to exposure processing while moving in the -X direction, the amount of liquid from the +X side of the projection area AR1 is greater than the amount of liquid from the -X side.

In addition, the control device CONT controls the first and second liquid recovery parts 33 and 34 of the liquid recovery mechanism 30 to perform the liquid recovery operation on the substrate P in parallel with the supply operation of the liquid 1 of the liquid supply mechanism 10. Accordingly, the liquid 1 flowing from the supply ports 13A, 14A of the first and second supply members 13, 14 to the substrate P outside the projection area AR1 is passed through the recovery ports 31A, 31A of the first and second recovery members 33, 34 32A and recycled. In this way, the liquid recovery mechanism 30 recovers the liquid 1 on the substrate P from the recovery ports 31A and 32A surrounding the projection area AR1.

Here, when the liquid immersion condition is selected, the control device CONT may also consider the moving condition of the substrate P. For example, when scanning and exposing while moving the substrate P, if the film member SP of the substrate P is lyophilic to the liquid 1, even if the liquid 1 is supplied from only one side of the scanning direction, the liquid 1 can still be made good. By spreading on the substrate P, the liquid immersion area AR2 can be formed smoothly. For example, when liquid immersion exposure is performed while moving the substrate P in the +X direction, the liquid supply mechanism 10 can supply the liquid 1 from the first supply member 13 and stop the supply of liquid from the second supply member 14; or The liquid supply amount of the second supply member 14 is smaller than the liquid supply amount from the first supply member 13. On the other hand, when the film member SP of the substrate P has liquid repellency to the liquid 1, the liquid 1 can be supplied from both sides in the scanning direction to smoothly form the liquid immersion area AR2.

In addition, the control device CONT determines the liquid immersion conditions based on the speed or acceleration of the substrate P in the X-axis direction (scanning direction). For example, when the substrate P has a higher scanning speed (or acceleration), the control device CONT increases the liquid supply to the substrate P while also increasing the liquid recovery capability on the substrate P. On the other hand, when the substrate P has a relatively low scanning speed (or acceleration), even if the control device CONT reduces the amount of liquid supplied to the substrate P and reduces the liquid recovery capability on the substrate P, the liquid immersion can still be formed smoothly. Area AR2.

In addition, when the scanning speed (or acceleration) of the substrate P is increased, the liquid 1 is likely to be peeled off. Therefore, the liquid supply mechanism 10 increases the liquid supply amount per unit time and sets the supply position to the self-projection optical system PL. The projection area AR1 is far away to enlarge the liquid immersion area AR2. In this way, the peeling of the liquid 1 can be suppressed. Similarly, as the scanning speed (or acceleration) of the substrate P increases, the recovery of the liquid 1 on the substrate P becomes increasingly difficult. Therefore, while the liquid recovery mechanism 30 increases the liquid recovery capability, the recovery position is It is set at a position away from the projection area AR1 of the projection optical system PL, and the liquid 1 is recovered at a position where the flow potential of the liquid 1 has slowed down. Accordingly, the liquid 1 can be recovered smoothly.

Furthermore, the control device CONT determines the liquid immersion conditions according to the moving direction of the substrate P, including the scanning direction (X-axis direction) and the step movement direction (Y-axis direction) of the substrate P. For example, when the substrate P moves in the Y-axis direction step by step, the liquid supply operation of the liquid supply mechanism 10 is stopped, or a lower liquid supply amount than during scanning exposure is provided. Alternatively, the control device CONT may make the recovery members 31 and 32 arranged on the Y-direction side of the projection area AR1 have a larger amount of liquid recovery among the plural recovery members 31 and 32 arranged around the projection area AR1.

In addition, the control device CONT may change the shape of the liquid supply ports 13A, 14A or the shape of the liquid recovery ports 31A, 32A, which is one of the liquid immersion conditions, in accordance with the membrane member SP. In this embodiment, by driving the baffle member 42, the supply port or the recovery port can be switched between a wide slit (substantially square shape) and a narrow line (rectangular shape). For example, the circle can be selected according to the film member SP. Supply ports and recovery ports in various shapes such as rectangular, elliptical, or polygonal shapes.

In addition, as disclosed above, in the exposure apparatus EX of this embodiment, the liquid that can be supplied to the substrate P can be switched between pure water as the first liquid and fluorine-based oil as the second liquid. The control device CONT changes the liquid 1 supplied to the substrate P in accordance with the film member SP of the substrate P to be exposed. For example, when the membrane member SP is a substance easily soluble in pure water, such as an amine-based substance, it is preferable to use a fluorine-based oil as the liquid 1 for liquid immersion exposure. After obtaining the relevant information of the membrane member SP through the input device 60, the control device CONT controls the liquid supply mechanism 10 to select the liquid 1 to be supplied to the substrate P. Then, the control device CONT determines its immersion conditions according to the liquid 1 used.

The pre-memory in the memory device MRY also includes the affinity between the membrane member SP and the liquid (second liquid) 1 and the relationship between the affinity and the corresponding liquid immersion conditions. The control device CONT determines the liquid immersion conditions according to the substrate P (film member SP) to be exposed, including the liquid supply amount, the recovery amount, or the liquid supply position and the recovery position.

When the liquid 1 supplied to the substrate P is changed according to the membrane member SP, the membrane member SP, the combination of the liquid suitable for the membrane member SP, and the liquid immersion conditions using the combination can be stored in the memory device MRY in advance. In this way, when the operator of the exposure apparatus selects (inputs) the film member SP, the liquid immersion conditions including the liquid can be automatically determined. That is, the selection of the liquid can also be regarded as one of the liquid immersion conditions. Furthermore, the pre-memorized content of the film member SP may include photoresist material, manufacturer, product number, etc.

In addition, the liquid immersion conditions may be changed according to the characteristics of the members of the liquid 1 supplied on the substrate P. For example, when the liquid 1 is a volatile liquid, the liquid supply amount per unit time can be increased. Therefore, even if the liquid 1 is volatile, the liquid immersion area AR2 can be formed smoothly. In addition, when the volatile liquid 1 is used, it has an effect of being removed from the substrate P due to volatilization, and therefore, the liquid recovery capability can also be reduced. That is, the control device CONT can adjust the liquid immersion conditions based on the volatilization characteristics among the member characteristics of the liquid 1 supplied on the substrate P.

Also, when the liquid 1 supplied on the substrate P has high viscosity, for example, in response to the The viscosity of the component characteristics enables the control device CONT to adjust its liquid immersion exposure conditions by increasing the substrate holding force applied to the substrate P by the substrate holder. That is, when the liquid 1 has high viscosity, during scanning exposure, the substrate P may be affected by the pulling force of the liquid 1 due to the viscosity of the liquid 1, which may cause the position of the substrate P under exposure to deviate from the substrate holder. In this embodiment, the control device CONT can adjust the holding force of the substrate P applied by the substrate holder according to the viscosity of the liquid 1. Specifically, if the substrate holder of this structure holds the substrate P by means of vacuum suction, the vacuum suction force to the substrate P can be enhanced by the control device CONT. On the other hand, when the viscosity of the liquid 1 is low, the substrate P is less likely to deviate from position during scanning exposure. Therefore, considering the warpage of the substrate P, the control device CONT can reduce the vacuum suction force of the substrate P .

Furthermore, when the liquid 1 is changed, the specific heat of the liquid 1 also changes accordingly. Therefore, for example, the light quantity of the exposure light source EL can be adjusted, or the refractive index change of the liquid 1 accompanied by the temperature change of the liquid 1 can be considered. The focus position and tilt of the substrate P can be controlled. For example, compensation control can also be applied to the focus position detection result of the focus detection system 4.

In addition, if the affinity (contact angle) of the liquid 1 and the membrane member SP is changed, the pressure of the liquid 1 applied to the substrate P will also be changed. Therefore, the pressure change of the liquid 1 applied to the substrate P can also be considered to control the substrate P Focus position and tilt.

In addition, when the liquid 1 is changed, the imaging characteristics of the image formed through the projection optical system PL and the liquid 1 will change. At this time, the control device CONT can drive the imaging characteristic control device 3 according to the component characteristics and optical characteristics of the liquid 1 stored in the memory device MRY in advance to compensate for the change in the imaging characteristics caused by the change of the liquid 1. Furthermore, the control device CONT can also adjust the position of the substrate stage PST in the Z-axis direction, or the posture in the θ X and θ Y directions, so that the surface energy of the substrate P can be changed to the position of the image plane that changes according to the change of the liquid 1. Unanimous.

The corresponding data stored in the memory device MRY can be updated at any time. Furthermore, when exposing a substrate P having a different kind of film member SP, or when using a new kind of liquid 1, for example For example, the corresponding data of the new kind of membrane member SP or the liquid 1 can be created by experiments to update the corresponding data stored in the memory device MRY. In addition, the corresponding data update method can also be performed through a communication device including the Internet, which provides data update to the exposure device EX (memory device) in a remote manner.

In addition, the liquid supply mechanism 10 in the above-mentioned embodiment can supply two kinds of liquids in response to the membrane member SP. However, it may be a structure that only supplies one kind of liquid, and it is also preferable that it can supply more than three kinds of liquids.

In addition, in the above embodiment, the affinity between the mesangial member SP and the liquid 1 and the relationship between the affinity and the corresponding liquid immersion conditions are memorized in the memory device MRY. However, the membrane member SP is known in advance When the type of liquid 1 is used, the relationship between the membrane member SP and the liquid immersion conditions can be stored in the memory device MRY, and the liquid immersion can be directly determined by the information of the membrane member SP selected (input) by the operator condition.

Furthermore, in this embodiment, when the liquid immersion conditions are determined according to the contact angle (affinity) between the film member SP and the liquid 1, the moving conditions of the substrate P (for example, the speed or acceleration of the substrate P during scanning exposure, or However, the moving conditions of the substrate P (for example, the speed or acceleration of the substrate P during scanning exposure, or both) may be determined based on the contact angle (affinity) between the film member SP and the liquid 1. For example, when the liquid 1 has a higher affinity for the film member SP, the speed or acceleration of the substrate P during scanning exposure is increased. When the membrane member SP has a high affinity with the liquid 1, the liquid 1 is likely to spread on the substrate P. Therefore, even if the speed or acceleration of the substrate P is increased, the liquid immersion area AR2 can be formed smoothly. Conversely, when the liquid 1 has a low affinity for the membrane member SP, it is more difficult for the liquid 1 to spread on the substrate P. Therefore, if the speed or acceleration of the substrate P is too fast, the liquid 1 may be peeled off. The liquid 1 cannot be filled between the projection optical system PL and the substrate P. When the liquid 1 has a low affinity for the film member SP, the speed or acceleration of the substrate P during scanning exposure is slowed down.

In addition, the moving conditions of the substrate P may be determined based on the liquid immersion conditions determined by the film member SP. For example, when the liquid recovery mechanism 30 is determined to have a smaller liquid recovery capability according to the membrane member SP, the scanning speed or acceleration of the substrate P can be slowed down to prevent the liquid 1 from peeling off or leaking.

In addition, in the configuration of this embodiment, the contact angle (affinity) between the membrane member SP and the liquid 1 is obtained in advance through experiments, and the liquid immersion conditions corresponding to the known contact angle are memorized in the memory device in advance. However, It is also possible to measure the affinity between the film member SP formed on the liquid contact surface on the substrate P and the liquid 1 with the measuring device installed in the exposure apparatus EX before the exposure process, and determine the liquid based on the measurement result. Immersion conditions.

What is shown in FIG. 6 is a schematic diagram of a measuring device 70 for measuring the affinity between the membrane member SP and the liquid 1. The measuring device 70 in this embodiment is installed on the transport path of the substrate P. The measuring device 70 in FIG. 6(a) is provided with: a loading arm 71, which constitutes a part of the substrate transport system; On the substrate P held; and the detection unit 73, which can be used to detect droplets of the liquid 1. The mounting arm 71 mounts the substrate P to be exposed to the substrate stage PST. The loading arm 71 has a rotation drive portion 74 that can drive the loading arm 71 to rotate around the axial direction, and is in a state where the substrate P is held during rotation. The driving system of the rotation driving unit 74 is controlled by the control device CONT. The detection unit 73 is used to output a detection signal of the liquid drop to the control device CONT.

When measuring the affinity (contact angle) between the film member SP and the liquid 1, the liquid 1 is dropped from the dropping portion 72 to the film member SP of the substrate P while the loading arm 71 is holding the substrate P horizontally. drop. Once the drop of the liquid 1 falls on the film member SP of the substrate P, the loading arm 71 rotates in the direction indicated by the arrow r in FIG. 6(a), causing the substrate P to be held to tilt. According to the inclination of the substrate P, as shown in FIG. 6(b), the liquid 1 rolls off from the surface of the substrate P (film member SP). The falling liquid is detected by the detection unit 73. The detection signal is output to the control device CONT, and the control device CONT calculates the inclination angle (roll-down angle) θ of the substrate P based on the driving amount of the rotation driving portion 74 at this time. The roll-off angle θ is the angle at which the droplets of the liquid 1 roll off the surface of the film member SP of the substrate P when the substrate P is inclined to the horizontal plane. The roll-off angle θ corresponds to the liquid 1 and the film member SP The contact angle. For example, when the roll-off angle θ is small, the film member SP has liquid repellency to the liquid 1, and its contact angle is large. Therefore, by obtaining the roll-off angle θ, the contact angle of the liquid 1 to the film member SP can be known. The control device CONT sets liquid immersion conditions based on the contact angle measured by the measuring device 70, and applies liquid immersion exposure to the substrate P placed on the substrate stage PST by the loading arm 71.

Furthermore, in this embodiment, as shown in FIG. 3, the supply members 13, 14 and the recovery members 31, 32 are respectively provided with sliding mechanisms, which change the liquid supply position and the liquid recovery position by driving the sliding mechanism. However, the structure may be as shown in FIG. 7 in which a flexible tube 80 constitutes a part of the supply member and the recovery member. By bending the tube 80, it can be as shown in FIGS. 7(a) and (b). Change its supply location and recovery location.

Furthermore, in the exposure apparatus EX in the above embodiment, pure water and fluorine-based oil can be used alternately for the liquid 1 used. Among them, the advantage of using pure water is that it is easy to obtain in large quantities in a semiconductor manufacturing plant, and at the same time, for the substrate P The photoresist or optical element (lens) on the surface has no adverse effects. In addition, pure water not only has no adverse effects on the environment, but also has extremely low impurity content. It also has a cleaning effect on the surface of the substrate P and the surface of the optical element provided on the front end surface of the projection optical system PL.

In addition, the refractive index n of pure water (water) with respect to the exposure light source EL with a wavelength of 193nm is approximately 1.44. If ArF excimer laser light (wavelength 193nm) is used as the exposure light source EL, it can be 1/n on the substrate P. (That is, 134nm) has the effect of shortening the wavelength and achieving high resolution. Moreover, compared with the air, the focal depth is n times, that is, it is enlarged to about 1.44 times. When the focal depth is the same as in the air, the numerical aperture of the projection optical system PL can be increased. And it also has the effect of improving the resolution.

In this embodiment, the optical element 2 is installed at the tip of the projection optical system PL, and the lens can adjust the optical characteristics of the projection optical system PL, such as aberrations (spherical aberration, coma, etc.). In addition, the optical element installed at the front end of the projection optical system PL may also be an optical sheet for adjusting the optical characteristics of the projection optical system PL. Or the parallel of the transparent light source EL Flat panels are also available. If the optical element in contact with the liquid 1 uses a parallel plane plate that is cheaper than the lens, even when the exposure apparatus EX is transported, assembled, and adjusted, the plane parallel plate is attached with silicon-based organic matter, etc., which is not conducive to the projection optical system PL The transmittance, the illuminance of the exposure light source EL on the substrate P, or the uniformity of the illuminance distribution. In this case, it is only necessary to replace the parallel plane plate before the liquid 1 is supplied, which is better than using a lens as contact with the liquid One of its advantages is that the exchange cost of 1 optical element has been reduced. That is, the scattered particles generated from the photoresist due to the irradiation of the exposure light source EL and the adhesion of impurities in the liquid 1 may contaminate the surface of the optical element in contact with the liquid 1, so that the optical element must be replaced regularly. However, By using an inexpensive parallel plane plate as the optical element, compared with the use of lenses, the cost of replacement parts is reduced, and the time required for replacement is shorter, which can suppress the increase in maintenance costs (operating costs) or the decrease in productivity.

Furthermore, when a large pressure is generated between the front optical element of the projection optical system PL and the substrate P due to the flow of the liquid 1, the optical element can also be used in a non-replaceable type, and a fixed method can be adopted to avoid being driven by the pressure. Optical element.

In addition, the structure of this embodiment is that the liquid 1 is filled between the projection optical system PL and the surface of the substrate PL. However, in an application example, if an outer cover glass composed of a parallel plane plate is mounted on the surface of the substrate P, it is in this state Filling with liquid 1 is also feasible.

On the other hand, for example, with F₂When the laser is used as the exposure light source EL, because the F₂Laser light cannot penetrate water, so it can penetrate F₂As the liquid 1, a fluorine-based fluid such as the above-mentioned fluorine-based oil of laser light is a preferable choice. At this time, the part in contact with the liquid 1, for example, is formed of a fluorine-containing molecular structure with a low polarity to form a thin film for lyophilization treatment. Regarding the liquid 1, in addition to being transparent to the exposure light source EL, the refractive index is as high as possible, and stable to the projection optical system PL or the photoresist coated on the surface of the substrate P (for example, cypress oil), use. At this time, the surface treatment is also applied according to the polarity of the liquid 1 used.

In addition, the substrate P of the above embodiments is not limited to semiconductor wafers used in the manufacture of semiconductor devices, and glass substrates used in display panels, ceramic wafers used in thin-film magnetic reading heads, and even The photomask used in the exposure device, and even the original version of the reticle (synthetic quartz, silicon wafer), etc., are all applicable.

The exposure device EX is applicable to the scanning exposure device (scanning stepper) of the step-and-scan method that moves the photomask M and the substrate P synchronously to implement the scanning exposure of the photomask M pattern, and can also be applied to, In the static state of the photomask and the substrate, the pattern of the photomask M is exposed in one fell swoop, and then the substrate is sequentially moved, that is, a projection exposure device (stepper) in a step-and-repeat manner. Furthermore, the present invention is also applicable to a step and stitch exposure device that overlaps at least two patterns on the substrate P for transfer.

In addition, the present invention is also applicable to a dual stage type exposure device. The structure and exposure operation of a dual stage exposure device, such as Japanese Patent Laid-open No. 10-163099 and No. 10-214783 (corresponding to US Patent Nos. 6,341,007; 6,400,441; 6,549,269; and 6,590,634); Japanese Patent No. 2000-505958 No. (corresponding to U.S. Patent No. 5,969,441) or U.S. Patent No. 6,208,407 and other patent contents. Within the scope of the laws and regulations of the countries designated (or selected) in this international application, these disclosures are cited as the contents of this document. Part.

The applicable exposure device EX is not limited to the exposure device for semiconductor device manufacturing that exposes the pattern of the semiconductor device on the substrate P. Any exposure device for liquid crystal display device manufacturing or display manufacturing, thin film magnetic reading heads, Exposure devices such as imaging elements (CCD), photomasks, and reticles are all suitable.

In addition, when the substrate stage PST or the exposure device stage MST uses a linear motor, either an air-floating type using a gas bearing or a magnetic levitation type using Lorentz force or resistive force are optional. In addition, each stage PST and MST may be a method that moves along a guide rail, or a guide rail (trackless type) is not provided. Examples of linear motors used on the carrier are as disclosed in US Patent Nos. 5,623,853 and 5,528,118. Within the scope of the laws and regulations of the countries designated (selected) in this international application, the above disclosure is cited as part of the description in this article.

The drive mechanism of each stage PST and MST can use a planar motor, which has a two-dimensional configuration The magnet unit formed by placing the magnet and the armature unit formed by the two-dimensional arrangement of coils are opposed to each other to drive the stages PST and MST by the electromagnetic force generated. At this time, either the magnet unit or the armature unit may be connected to the stages PST and MST, and the other of the magnet unit or the armature unit may be provided on the moving surface side of the PST or MST.

In order to prevent the reaction force formed by the movement of the substrate stage PST from being transmitted to the projection optical system PL, a frame member may be used to mechanically arrange it to the ground (earth). An example of the processing method of this reaction force, as detailed in U.S. Patent No. 5,528,118 (Japanese Patent Laid-Open No. 8-166475), is quoted within the scope permitted by laws and regulations of the country designated (or selected) in this international application. These disclosures are part of the record in this article.

In order to prevent the reaction force formed by the movement of the mask stage MST from being transmitted to the projection optical system PL, a frame member can be used to mechanically arrange it to the ground. An example of the processing method of this reaction force, as detailed in U.S. Patent No. 5,874,820 (Japanese Patent Laid-Open No. 8-330224), is quoted within the scope permitted by laws and regulations of the country designated (or selected) in this international application. These disclosures are included as part of the record in this article.

In the implementation form of this application disclosed above, the manufacturing method of the exposure device EX is based on various subsystems (including the constituent elements listed in the scope of the patent of this application) with predetermined mechanical, electrical, and optical accuracy. Assembly. In order to ensure the above-mentioned various precisions, various adjustments are made before and after the assembly. For example, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are adjusted to achieve optical accuracy. Reach electrical accuracy. The process of assembling various sub-systems into an exposure device also includes the mechanical connection between the various sub-systems, the wiring of the circuit, and the piping connection of the air pressure circuit. Before the various sub-systems are assembled into an exposure device, of course, there must be a separate assembly process for each sub-system. Once the process of assembling the exposure device from the various subsystems is completed, comprehensive adjustments are made to ensure the various accuracy of the exposure device as a whole. Furthermore, it is better to manufacture the exposure device in a clean room where temperature and cleanliness are strictly controlled.

The manufacturing process of small components such as semiconductor components is shown in Figure 8. Step 201 performs the function and performance design of the small components, and then according to the design step, the mask (reticle) is made from step 202, and then step 203 A substrate as a component base material is manufactured, and the mask pattern is exposed to the substrate by the exposure processing step 204 using the exposure device of the above embodiment, and the component assembly step (including cutting process, bonding process, packaging process) 205 and inspection step 206 Wait to complete the manufacturing.

According to the present invention, the liquid immersion conditions for the substrate can be determined according to the film member formed on the liquid contact surface on the substrate, and the liquid immersion exposure can be carried out smoothly for a plurality of substrates provided with different types of film members Processing, with excellent versatility. In particular, in a production line with various exposure processing objects such as semiconductor elements or liquid crystal display elements, the present invention can quickly switch liquid immersion conditions, so that high-capacity elements can be produced with high productivity.