Thin film battery on a semiconductor or semiconductor device apparatus and method

Thin film battery on semiconductor or semiconductor device and manufacturing method thereof

THIN FILM BATTERY ON A SEMICONDUCTOR OR SEMICONDUCTOR DEVICE APPARATUS AND METHOD

The present invention relates to the deposition and fabrication of elastic solid-state, thin-film, secondary and primary electrochemical devices, including batteries, on semiconductor surfaces or conductive or insulating surfaces of semiconductor devices such as integrated circuit wafers or on circuits such as printed circuit boards. The device, composition and method on the board.

A typical electrochemical device includes multiple electrically active layers such as an anode, a cathode, an electrolyte, a substrate, and a current controller. These anode layers, such as those containing lithium, are composed of materials that are very sensitive to the environment. The substrate can be, for example, a non-separable battery element, but a semiconductor surface or a conductive or insulating packaging surface fabricated on a semiconductor device.

Such batteries need to be encapsulated to protect the aforementioned environmentally sensitive materials. For example, gold foil can be used to encapsulate the sensitive layer of the electrochemical device. Other methods are to use pouches made of metal and plastic to seal the periphery of the device.

Exemplary embodiments of the present invention include fabricating batteries on semiconductor chips or flexible printed circuit boards. The battery may include, for example, a first electrical contact, a bonding layer connected to the first electrical contact and having a first conductor, and at least one of the selective electrical contact with the first electrical contact through the first conductor A battery cell structure, a semiconductor surface, or a conductive or insulating packaging surface of a semiconductor device.

The adhesive layer coupled with the semiconductor surface or the conductive or insulating packaging surface of the semiconductor device may have a plurality of conductors, such as optional, second embedded conductors, which in turn make the semiconductor surface or semiconductor device conductive or insulating There is optional and selective electrical contact between the packaging surface and the first electrical contact. In either case, the adhesive layer and the at least one battery cell structure are sandwiched between the first contact layer and the semiconductor surface or the conductive or insulating packaging surface of the semiconductor device.

The first electrical contact may include, for example, packaging metal. The adhesive layer can be an adhesive material, insulating material, plastic, polymer material, glass, and/or fiber glass. The insulation enhancement layer can be embedded in the adhesion layer. The enhancement layer can be selectively conductive. The conductor can be, for example, a gasket, metal wire, metal strip, metal ribbon, polymetallic wire, polymetallic sheet, polymetallic strip, wire mesh, perforated metal, coating Metal coating on the adhesive layer, or disk. The conductor may be woven in the adhesive layer and the adhesive layer may include a slit in which the embedded conductive system is woven.

The cell structure can include an anode, an electrolyte, a cathode, and a barrier layer. The cathode can be fabricated by convection high temperature furnace, rapid thermal annealing or laser annealing and/or non-annealing of crystallization, low temperature annealing, or high temperature annealing.

Another embodiment of the present invention includes a method of manufacturing a thin film battery, the method includes the following steps in no particular order: generating a selective conductive adhesive layer, coupling the adhesive layer and the first contact layer, coupling the first side of the battery cell structure and the semiconductor The surface or the conductive or insulating surface of the semiconductor device, and the second side of the coupling cell structure and the adhesive layer. Examples of this embodiment include: generating a battery cell structure with anode, cathode, and electrolyte layers; embedding a conductor in an adhesive layer; braiding at least one wire through the adhesive layer, wherein the wire exposes some selected parts; heating the adhesive layer and The conductor pressed in the adhesive layer; and the use of insulating materials to insulate the battery. This example embodiment may include providing an insulation enhancement layer in the adhesion layer. This enhancement layer can be selectively conductive.

Another embodiment of the present invention includes a battery on a flexible printed circuit board, wherein the first side of the battery slot structure at least directly mechanically contacts the flexible printed circuit board. The battery includes a first electrical contact; an adhesive layer coupled to the first electrical contact and including a first conductor; at least one battery cell structure is selectively in contact with the first electrical contact through the first conductor Electrical contact; connected to the first electrical contact and includes an adhesive layer of a second embedded conductor, which has selective electrical contact between the first electrical contact and the elastic printed circuit board. The adhesive layer and at least one battery cell structure are sandwiched between the first contact layer and an elastic printed circuit board.

Another embodiment of the present invention includes a battery on a flexible printed circuit board, wherein the battery slot structure does not have direct contact with the flexible printed circuit board, but at least the adhesive layer separates the two. The battery includes a first electrical contact; an adhesive layer coupled to the first electrical contact and having a first embedded conductor; at least one battery cell structure, which communicates with the first electrical contact through the first embedded conductor The sexual contact has selective electrical contact; it is coupled to the first flexible printed circuit board and has an adhesive layer with an optional second embedded conductor; the second embedded conductor is then connected between the flexible printed circuit board and the first electrical An arbitrary and selective electrical contact is generated between the contacts. The adhesive layer and at least one battery cell structure are sandwiched between the first contact layer and an elastic printed circuit board.

In another embodiment, a method of manufacturing a thin film battery includes: generating a selectively conductive adhesive layer, coupling the adhesive layer and a first contact layer; coupling a first side of a battery cell structure with a flexible printed circuit board; And coupling a second side of the battery slot structure and the adhesive layer.

In another embodiment, a method of manufacturing a thin film battery includes: generating a selectively conductive adhesive layer; coupling the adhesive layer with a first contact layer, and coupling a first side of a battery cell structure with the first contact layer; And coupling a second side of the battery cell structure and the selective conductive adhesive layer; and coupling the adhesive layer and the flexible printed circuit board.

Another embodiment of the present invention includes an electrical connection between the battery container and the semiconductor surface or the conductive packaging surface of the semiconductor device. The electrical connection between the battery slot and the semiconductor surface or the conductive packaging surface of the semiconductor device can be produced by direct physical contact or by metal wire bonding.

In another aspect, before fabricating the battery on or on the semiconductor surface or the conductive or insulating packaging surface of the semiconductor device or the flexible printed circuit board, it can be made into a separate device and then integrated with the substrate and packaging into one Complete installation.

Another embodiment of the present invention includes electrical connections between the multi-cell stack and the semiconductor surface or the conductive packaging surface of the semiconductor device.

Figure 1A shows a side view of an electrochemical device according to an exemplary embodiment of the present invention. In this embodiment, the first contact 101 is connected to the adhesive layer 110, and a part of the first contact 101 exceeds the adhesive layer 110. The adhesive layer 110 can be adhered to the battery cell structure 115, for example. The semiconductor surface or the conductive or insulating surface 105 of the semiconductor device is located under the battery cell structure 115. The insulating surface 105 of the semiconductor device may be, for example, the insulating packaging surface of the semiconductor device or the insulating surface of the upper layer of the semiconductor device. The conductive surface may include, for example, conductive contact pads, wires, conductive holes, or other conductive layers formed on the surface of the device. The conductive surface can also be formed together with an insulating surface, such as a conductive surface formed on the packaging surface of a semiconductor device. As shown in the figure, embedded in the adhesive layer 110 is the first conductor 120. The first conductor 120 generates a selective conductive adhesive layer, for example. The selective conductive adhesive layer 110 enables conduction from the battery cell structure 115 through the adhesive layer 110 to a specific point of the first contact 101, and provides insulation between the first contact 101 and the semiconductor surface or the conductive or insulating surface 105 of the semiconductor device . It can also include other types of battery slot structures.

The electrochemical device may have a second conductor 121 that selectively produces electrical contact between the first contact 101 and the semiconductor surface or the conductive or insulating packaging surface 105 of the semiconductor device. In this case, the semiconductor surface or the conductive or insulating packaging surface 105 of the semiconductor device must be between the contact points where the first conductor 120 and the second conductor 121 contact the semiconductor surface or the conductive or insulating (eg, packaging) surface 105 of the semiconductor device Selective insulation.

Figure 1B shows an electrochemical device according to an exemplary embodiment of the present invention. In this embodiment, the first contact 101 is coupled to the battery slot structure 115. The adhesive layer 110 is coupled to the battery cell structure 115 and part of the first contact 101, and the first contact extends beyond the adhesive layer 110. The semiconductor surface or the conductive or insulating surface 105 of the semiconductor device is coupled to the adhesive layer 110. Located in the adhesive layer 110 is the first conductor 120. The first conductor 120, for example, generates a selective conductive adhesive layer. The selective conductive adhesive layer 110 allows conduction from the battery cell structure 115 through the adhesive layer 110 to a specific point on the semiconductor surface or the conductive or insulating (eg, package) surface of the semiconductor device, and is provided between the first contact 101 and the semiconductor surface or semiconductor Insulation between conductive or insulating surfaces 105 of the device. The electrochemical device may have a second conductor 121 that selectively makes electrical contact between the first contact 101 and the semiconductor surface or the conductive or insulating surface 105 of the semiconductor device. In this case, the semiconductor surface or the conductive or insulating surface 105 of the semiconductor device must be selectively insulated at the contact point where the first conductor 120 and the second conductor 121 contact the semiconductor surface or the conductive or insulating surface 105 of the semiconductor device. The first conductor 120 and the second conductor 121 can be placed in the adhesive layer 110 in different ways. For example, metal pads, metal wires, metal sheets, metal belts, multi-metal wires, multi-metal sheets, multi-metal belts, metal wire meshes, perforated metal sheets, metal coatings coated on the adhesive layer, or metal discs can be used Sheet, metal-coated fiber glass or a combination of the above. In these examples, the first conductor 120 and the second conductor 121 may provide electrical conduction between the battery cell structure 115 and the first contact 101, and the adhesive layer 110 may be provided between the first contact 101 and the semiconductor surface or semiconductor device. Insulation between conductive or insulating surfaces 105. In some embodiments, the conductors 120 and 121 may be woven in the adhesive layer 110. The conductors 120 and 121 can be, for example, discs embedded in the adhesive layer 110. In some embodiments, slits can be created in the adhesive layer 110 to weave or place the conductors 120 and 121 through the adhesive layer 110. Furthermore, for example, holes or other methods can also be used to place the conductors 120 and 121 through the adhesive layer 110.

In another embodiment of the present invention, the reinforcing material may be placed in the adhesive layer. For example, the fiberglass material can cover half of the surface of the adhesive layer, pass through the layer and cover the other half of the layer. The above-mentioned fiberglass layer without conductive coating can insulate the material between the fiberglass. The conductive material can be used to cover the local area of the fiber glass. The above conductive coating can cover the fiber glass area on the upper and lower surfaces of the adhesive layer. In the above-described embodiment, for example, fiber glass may conduct between the upper contact and the battery. The conductive material can be arranged on the fiber glass by inkjet, silk screen, plasma deposition, electron beam deposition, spraying and/or painting. Materials other than fiberglass can also be used, such as Kevlar<img file="TWI419397B_D0001.tif" he="25" id="i0001" img-content="character" img-format="tif" inline="no" orientation="portrait" wi="23" />, Plastic, glass or other insulating materials.

Another embodiment of the present invention is to provide insulation between the first contact and the through hole of the battery cell structure in the adhesive layer. In such an embodiment, the perforation in the adhesive layer can maintain the first contact in contact with the battery cell structure. For example, the above can be laminated together to create contact. Alternatively, conductive glue or ink is applied on or near the hole area of the adhesive layer to create contact between the layers. Lithium can also be used.

The conductors 120 and 121 and/or the first contact, for example, can be made of gold, platinum, stainless steel, titanium, vanadium, chromium, manganese, iron, cobalt, Nickel, copper zirconium, niobium, molybdenum, hafnium, tantalum, tungsten, aluminum, indium, tin, silver, carbon , Bronze, brass, beryllium, or the above-mentioned oxides, nitrides, carbides, and alloys. The first contact may be a thin metal sheet, for example, it may be made of stainless steel or other metal materials with necessary or suitable characteristics and properties such as a necessary amount of conductivity. The metal flakes may preferably include solderable alloys, such as copper alloys, nickel, or tin. The thickness of the first contact can be, for example, less than 100 microns, less than 50 microns, or less than 25 microns.

The electrochemical device 115 may include a cathode, an anode, and an electrolyte. For example, the cathode may contain lithium cobalt oxide (LiCoO₂), the anode may contain lithium and the electrolyte may contain lithium phosphorus oxynitride (LiPON). Other electrochemical devices can also be used as needed.

The electrochemical device 115 can be coupled to the semiconductor surface or the conductive or insulating surface 105 of the semiconductor device in various ways. In one embodiment, for example, glue can be used to couple the electrochemical device and the semiconductor surface or the conductive or insulating surface of the semiconductor device. The glue used in this application can be stretched to any material to adhere the electrochemical device 115 and the semiconductor surface or the conductive or insulating surface 105 of the semiconductor device. Glue can produce mechanical or chemical bonding between the two layers. Glue can also make chemical bonding between the two layers without introducing other materials or layers. Glue, for example, may include, but is not limited to, cement glue and resin glue. The glue can be conductive, semi-conductive or insulating.

In another embodiment, the semiconductor surface or the conductive or insulating (eg, encapsulating) surface 105 of the semiconductor device is used as the substrate of the battery. Providing a semiconductor surface or a conductive or insulating packaging surface 105 of the semiconductor device allows the electrochemical device 115 to be deposited thereon. The electrochemical device 115 can also be glued on the semiconductor surface or the conductive or insulating packaging surface 105 of the semiconductor device.

In an exemplary embodiment, the lithium cobalt oxide cathode layer is deposited on the semiconductor surface or the conductive or insulating packaging surface 105 of the semiconductor device. Some conventional deposition techniques include, but are not limited to, reactive or non-reactive radio frequency (RF) magnetron sputtering, reactive or non-reactive pulsed DC magnetron sputtering, reactive or non-reactive DC diodes Sputtering, reactive or non-reactive thermal (resistance) evaporation, reactive or non-reactive electron beam evaporation, ion beam assisted deposition, plasma enhanced chemical vapor deposition, or include, for example, spin coating, inkjet , Thermal spray deposition, immersion coating and other deposition methods. As part of the manufacturing process, for example, thermal annealing methods such as low temperature annealing, high temperature annealing, or convection high temperature furnace or rapid thermal annealing methods can be used to anneal the cathode. Another post-deposition anneal may include laser annealing to improve lithium cobalt oxide (LiCoO₂) Crystallization of the layer in order to optimize its chemical properties, such as electrochemical potential, energy, power efficiency, electrochemical reversible lattice parameters and thermal cycling.

After the cathode layer is deposited, the electrolyte can be deposited on the cathode followed by the anode. Likewise, these layers can be deposited by other conventional processes. Once the electrochemical device 115 is deposited on the semiconductor surface or the conductive or insulating packaging surface 105 of the semiconductor device, the adhesive layer 110 can be located between the electrochemical device and the first electrical contact 101. In the specific embodiments shown in FIGS. 1A and 1B, the metal encapsulation layer 101 may also be the first contact. As described above, the first contact may be a thin metal sheet, for example, it may be made of stainless steel or other metal materials having necessary or suitable characteristics and properties such as necessary amount of conductivity. The metal flakes may preferably include solderable alloys, for example, copper alloys, nickel, or tin. The thickness of the first contact may be less than 100 microns, less than 50 microns, or less than 25 microns, for example.

The adhesive layer 110 may include, for example, an adhesive material, an insulating material, a polymer material, glass, Kevlar<img file="TWI419397B_D0002.tif" he="24" id="i0002" img-content="character" img-format="tif" inline="no" orientation="portrait" wi="24" />, Reinforced materials and fiber glass, etc. The conductors 120 and 121 may include, for example, metal pads, metal wires, metal sheets, metal tapes, multi-wires, multi-metal sheets, multi-metal strips, metal wire meshes, perforated metals, metal coatings coated with adhesive layers, and discs. piece.

Figure 2 shows a second embodiment of a thin film battery on a chip. In this embodiment, the battery may include a semiconductor surface or a conductive or insulating packaging surface 105 of a semiconductor device, a cathode layer 145, an electrolyte 150, an anode 165, a regulating layer 160, a package 155, an anode current controller 170, and an insulator 175. For example, the cathode 145 may include lithium cobalt oxide, the anode 160 may include lithium, and the electrolyte 150 may include phosphorous lithium oxynitride (LiPON). Other electrochemical devices can also be used. The package 155 may include a ceramic-metal composite sheet of alternating layers of zirconium nitride and zirconium or titanium nitride and titanium.

The electrochemical device may include a cathode layer 145, an electrolyte 105, and an anode 155, which may be a semiconductor surface arranged in various ways or a conductive or insulating packaging surface 105 of a semiconductor device. In one embodiment, the electrochemical device, for example, can be coupled with a semiconductor device 105 having a substantially conductive, semiconductor surface, or a conductive or insulating packaging surface using glue. The glue used in the present invention extends to any material to adhere the electrochemical device to the semiconductor surface or the conductive or insulating packaging surface 105 of the semiconductor device. Glue can create a mechanical or chemical bond between the two layers. The glue can also chemically bond two layers without introducing other materials or layers. The glue may be conductive so that the semiconductor surface or the conductive or insulating packaging surface 105 of the semiconductor device can be used as a current controller. The glue, for example, may include, but is not limited to, conductive cement glue and resin glue.

The cathode 145 can be deposited directly on the semiconductor surface or the conductive or insulating packaging surface 105 of the semiconductor device. In a specific embodiment, a cathode layer of lithium cobalt oxide is deposited on the semiconductor surface or the conductive or insulating packaging surface 105 of the semiconductor device. Some conventional deposition techniques include, but are not limited to, reactive or non-reactive radio frequency (RF) magnetron sputtering, reactive or non-reactive pulsed DC magnetron sputtering, reactive or non-reactive DC diodes Sputtering, reactive or non-reactive thermal (resistance) evaporation, reactive or non-reactive electron beam evaporation, ion beam assisted deposition, plasma enhanced chemical vapor deposition, or include, for example, spin coating, inkjet , Thermal spray deposition, immersion coating and other deposition methods. As part of the manufacturing process, for example, post-deposition laser annealing can be used to improve the crystallization of the cathode layer 145 to optimize its chemical properties, such as electrochemical potential, energy, power efficiency, and electrochemical properties. The reversible lattice parameters and thermal cycling.

The semiconductor surface or the conductive or insulating packaging surface of the semiconductor device in the above embodiments can be a part of any integrated circuit, and can include a memory device, a processor, or other logic circuits.

Another embodiment of the present invention includes a battery deposited on a flexible printed circuit board, which includes, for example, a first electrical contact; an adhesive layer coupled with the first electrical contact and having an embedded conductor; at least one Battery slot structure; and a flexible printed circuit board. The adhesive layer and at least one battery cell structure can be sandwiched between the first contact layer and the flexible printed circuit board. The adhesive layer can selectively conduct electricity through the embedded conductor. The battery tank structure is further selectively electrically connected to the first contact through the embedded conductor.

Figure 3A shows a side view of an electrochemical device according to another embodiment of the present invention. In this embodiment, the first contact 301 is connected to the adhesive layer 310 by the part of the first contact 301 extending beyond the adhesive layer 310. The adhesive layer 310 can be, for example, adhered to the battery cell structure 315. The flexible printed circuit board 305 is arranged under the battery slot structure 315. Inside the adhesive layer 310 is the first conductor 320. The first conductor 320 can, for example, produce a selective conductive adhesive layer. The selective conductive adhesive layer 310 allows conduction from the battery cell structure 315 through the adhesive layer 310 to a specific point of the first contact 301, and provides insulation between the first contact 301 and the flexible printed circuit board 305. Similarly, the second conductor 321 is located in the adhesive layer 310. The second conductor, for example, produces a selective conductive adhesive layer. The selective conductive adhesive layer 310 allows conduction from the elastic printed circuit board 305 to the specific point of the first contact 301 through the adhesive layer 310 and provides insulation between the first contact 301 and the elastic printed circuit board 305. Other types of batteries can also be included.

Figure 3B shows a side view of an electrochemical device according to another embodiment of the present invention. In this embodiment, the first contact 301 is coupled with the adhesive layer 315. The adhesive layer 310 is coupled to the battery cell structure 315 and the first contact 301 extending beyond the adhesive layer 310. The flexible printed circuit board 305 is coupled with the adhesive layer 310. In the adhesive layer 310 is the first conductor 320. The first conductor 320, for example, produces a selective conductive adhesive layer. The selective conductive adhesive layer 310 allows conduction from the battery cell structure 315 through the adhesive layer 310 to a specific point on the flexible printed circuit board 305 and provides insulation between the first contact 301 and the flexible printed circuit board 305. The electrochemical device has a second conductor 321 which selectively generates electrical contact between the first contact 301 and the flexible printed circuit board 305. In this case, the flexible printed circuit board 305 must be selectively insulated between the points where the first conductor 320 and the second conductor 321 contact the flexible printed circuit board 305.

FIG. 3C is a top view of an example of an electrochemical device having a flexible printed circuit board 305, such as the example devices shown in FIGS. 3A and 3B. As shown in FIG. 3C, conductive traces 330 and 331 are formed on the surface of the circuit board 305. Other types of conductive surfaces, such as contact pads, wires, exposed conductive holes, or combinations of the above, can be formed on the surface of the circuit board to receive electrochemical devices. In plan view, the first conductor 320 exceeds the adhesive layer 310 to make an electrical contact with conductive traces 330, and the second conductor 321 exceeds the adhesive layer 310 to make an electrical contact with conductive traces 331. It can be understood that similar arrangements related to the semiconductor surface or the conductive or insulating packaging surface of the semiconductor device can also be used, as shown in FIGS. 1A and 1B above.

The flexible printed circuit board 305 may include, for example, multiple circuit board layers with and without traces, single or double-sided, semi-rigid, film, and/or polyimide.

The conductors 320 and 321 can be located in the adhesive layer 310 in various ways. For example, metal pads, metal wires, metal sheets, metal belts, multi-metal wires, multi-metal sheets, multi-metal belts, metal wire meshes, perforated metal sheets, perforated metals, metal coatings coated on the adhesive layer, Metal discs, metal-coated fiber glass, or a combination of the above can be used. In each example, the first conductor 320 can provide selective electrical conduction between the battery well structure 315 and the first contact 301 or the flexible printed circuit board 305, and between the battery well structure 315 and the first contact 301 or flexible Insulation between printed circuit boards 305. Furthermore, in each example, the second conductor 321 can provide selective electrical conduction between the first contact 305 and the flexible printed circuit board 301, and between the first contact 301 or the flexible printed circuit board 305 insulation. In some embodiments, the conductor 320 may be woven into the adhesive layer 310. The conductor 320 may be, for example, a disc embedded in the adhesive layer 310. In some embodiments, slits may be formed in the adhesive layer 310 to weave or place the conductor 320 in the adhesive layer 310. Similarly, holes or other methods can be used to place the conductor 320 in the adhesive layer 310.

The electrochemical device 315 may include a cathode, an anode, and an electrolyte. For example, the cathode may include lithium cobalt oxide, the anode may include lithium, and the electrolyte may include phosphorous lithium oxynitride. Other electrochemical devices can be used as needed.

The electrochemical device 315 can be coupled with the flexible printed circuit board 305 in various ways. In one embodiment, for example, glue can be used to couple the electrochemical device 315 and the flexible printed circuit board 305. The glue used in the present invention extends to any material to adhere the electrochemical device to the semiconductor surface or the conductive or insulating packaging surface 105 of the semiconductor device. Glue can produce mechanical or chemical bonding between the two layers. The glue can also chemically bond the two layers without introducing other materials or layers. The glue may be conductive so that the semiconductor surface or the conductive or insulating packaging surface 105 of the semiconductor device acts as a current controller. The glue, for example, may include, but is not limited to, conductive cement glue and resin glue. The glue can be conductive, semi-conductive, or insulating.

In another embodiment, the flexible printed circuit board 305 is used as the base material of the battery, and the battery is deposited on it.

The above exemplary embodiments may also include multiple electrochemical devices stacked on the semiconductor surface or the conductive or insulating (eg, package) surface of the semiconductor device.

This exemplary embodiment provides another way to encapsulate the chemical and mechanical sensitive layers of the electrochemical device, which is less expensive than the conventional encapsulation method using gold foil. The above exemplary embodiments also avoid the problem of rupture due to high temperature when metal and plastic capsules are used to encapsulate electrochemical devices in the conventional method. The high temperature causes the gas in the metal and plastic capsules to expand and/or compress.

The above exemplary embodiments also provide rechargeable secondary batteries that are directly fabricated on semiconductor devices such as integrated circuits. Such a battery can still provide power when the circuit is interrupted, and it can be charged quickly and easily when the power is restored. The above-mentioned battery can provide local energy for the main circuit. Exemplary embodiments also provide more cost-effective and more reliable packaging methods, as well as better ways to provide electrical conductive contacts, including packages that are substantially thinner than conventional packaging methods. Example embodiments also provide flexible integrated circuits and/or flexible printed circuit boards with thin-film flexible batteries coupled thereto.

Although the conductive material described in the above embodiment has openings, such as slits, in the adhesive layer; it is understood that the electrical connections between the battery cell structure 115, 315 and the first electrical contacts 101, 301 can be provided in various ways. Sexual contact. For example, the adhesive layer 110, 310 formed by inserting conductive powder into the adhesive material can provide electrical conduction between the battery cell structure 115, 315 and the first contact 101, 301. Conductive powder such as metal powder (eg, nickel powder) may be placed in one or more selected areas of the adhesion layer 110, 310, and between the contacts 101, 301 and the battery cell structure 115, 315. Those familiar with this technology should understand that other conductive materials can also provide selective conduction, such as conductive balls, metal slugs, wire meshes, etc., can be selectively provided in the adhesive layer. Two methods can be used to achieve electrical conduction between the battery cell structure 115, 315 and the first contact 101, 301 and to provide insulation between the electrical contact and the battery cell structure, and should not be limited to those described in the example Example.

The same principle can be applied to the electrical contact between the battery cell structure 115 and 315 and the semiconductor surface or the conductive or insulating packaging surface 105 of the semiconductor device or the flexible printed circuit board 305. The same principle can be applied to the electrical contact between the first electrical contacts 101 and 301 and the semiconductor surface or the conductive or insulating packaging surface 105 of the semiconductor device or the elastic printed circuit board 305.

In addition, it should be understood that the electrochemical device may include a discrete device (for example, a substrate and its own packaging for complete encapsulation) on a semiconductor device, a conductive or insulating surface of the semiconductor device, or a flexible printed circuit board. For example, before being integrated on a semiconductor surface or a conductive or insulating surface of a semiconductor device or on a flexible printed circuit board, the electrochemical device can be fabricated as a discrete device, and then assembled into a whole with a substrate and a package.

The present invention is disclosed in the above-mentioned preferred embodiments. It is understood that those skilled in the art can easily substitute other equivalent embodiments or components without departing from the spirit of the present invention. In addition, many modifications and changes will not depart from the scope of the teachings of the present invention. Therefore, the present invention does not limit the above-disclosed best embodiment, but should be defined by the scope of the appended patent application.

<p>101. . . First contact</p><p>110. . . Adhesive layer</p><p>115. . . Electrochemical device</p><p>105. . . Semiconductor surface</p><p>120. . . First conductor</p><p>121. . . Second conductor</p><p>145. . . cathode</p><p>150. . . Electrolyte</p><p>165. . . anode</p><p>160. . . Adjustment layer</p><p>155. . . Encapsulation</p><p>170. . . Anode current controller</p><p>175. . . Insulator</p><p>301. . . First contact</p><p>310. . . Adhesive layer</p><p>315. . . Battery slot structure</p><p>305. . . Flexible printed circuit board</p><p>320. . . First conductor</p><p>321. . . Second conductor</p><p>330. . . Conductive trace</p>

The drawings of the present invention are as follows: Fig. 1A is a side view of a thin film battery located on a semiconductor surface or a conductive or insulating surface of a semiconductor device or a flexible printed circuit board in an embodiment of the present invention; Fig. 1B is a side view of a thin film battery according to the present invention Another side view of the thin film battery located on the semiconductor surface or the conductive or insulating surface of the semiconductor device or on the flexible printed circuit board in the embodiment; Figure 2 is the conductive or insulating located on the semiconductor surface or the semiconductor device in the embodiment according to the present invention Another side view of a thin-film battery on the surface; Figure 3A is another side view of a thin-film battery on a semiconductor surface or a conductive or insulating surface of a semiconductor device or on a flexible printed circuit board according to an embodiment of the present invention; Figure 3B Another side view of the thin film battery located on the semiconductor surface or the conductive or insulating surface of the semiconductor device or on the flexible printed circuit board in the embodiment according to the present invention; Figure 3C is located on the semiconductor surface or the semiconductor surface in the embodiment according to the present invention Another side view of the devices conductive or insulating surface or thin film battery on a flexible printed circuit board.