Retroreflective product in which integrated circuit is sealed

Description of the invention

The present invention relates to an integrated circuit retroreflective product comprising an integrated circuit module having an integrated circuit (integrated circuits), a retroreflective element and a carrier layer (s).

In particular, the invention relates to an integrated circuit retroreflective product, wherein the chip module has at least one integrated RFID chip and a communication antenna (s) connected to the RFID chip. The product performs the information exchange procedure with the help of an integrated circuit module through its external connectors or antennas. Moreover, the presence of the product or the person holding the product can be noticed at a great distance due to the illumination of the product, in particular after dark, using the phenomenon of retroreflection.

The invention also relates to a retroreflective product with an integrated circuit in which the communication antenna is formed on the reflective surfaces of the retroreflective element.

A conventional microprocessor card (IC card) comprises an integrated circuit module having an embedded chip (s), a support layer on which the module is placed, this layer is formed on a core layer and / or an inner layer, and an upper protective layer and a lower protective layer covering respectively the upper and lower surfaces of the bearing layer. The laminate structure enables the exchange of information between the integrated circuit and the external units through external contacts located, for example, on the upper protective layer or through a communication antenna that is installed on the supporting layer.

Conventional contact microprocessor cards equipped with external contacts perform, for example, the procedure of exchanging electronic information signals with external reading-writing units (reader / writer) or enable energy supply through external contacts located on the external protective layer.

Known contactless microprocessor cards equipped with a communication antenna (or simply "antenna") receive the power signal and perform a data exchange procedure between the chip module, for example RFID, and any external reader / writer through an antenna installed on the support layer. Contactless microprocessor cards are also classified, depending on the communication range between the laminate housing the chip and the external reader / writer, for cards of the contact type (range up to 2 mm), proximity type (range up to 10 cm), short-range cards (range by 70 cm) and long-range cards (range over 70 cm). Generally, the short wave range is used for contact and proximity cards that emit signals over short distances; the long wave band is used for short-range cards; a microwave band for long range cards.

A number of different methods have been proposed for the manufacture of contactless microprocessor cards with an antenna installed inside them. Known methods of forming antennas include: forming an antenna by removing a pre-applied metallic layer using etching, forming the antenna by locally applying a metallic layer, forming an antenna using conductive paint, and winding a metallic thin wire coil.

Prior art examples disclosing methods of forming an antenna include Japanese Patent 11 (1999) -134461A to Horio and its US counterpart, US Patent 6,160,526; Japanese Patent 10 (1998) -320519AA to Ikefuji et al and its European counterparts, EP patents 1014301A1; Japanese Patent 8 (1996) -287208A to Orihara et al, and its US counterpart, US Patent 5,705,852; Japanese Patent 202-074301A to Okamura et al. and its US counterpart, US Patent 2002/24475; Japanese Patent 2000-251047A to Hayashi et al, and its European counterpart, EP 1033778A2; Japanese Patent 2000-105810A to Hayashi et al, and its European counterpart, EP 1039411A1. The disclosures of these documents can be cited when describing the techniques presented in them.

On the other hand, retroreflective coatings and injection-molded retroreflective articles that are installed with a set of retroreflective units (hereinafter referred to as "retroreflective coatings" in the text) are used to produce traffic signs, safety devices, reflective stickers for advertising and reflective elements of optical sensors , especially

In the field of safety devices and signs intended to be visible at night and which reflect light towards light sources.

In such retroreflective coatings, inside the coating are collections of multiple micro-pearl glass retroreflective units or cubic angular prism retroreflective units that are designed so that light incident on the retroreflective units from the light source is reflected towards the light source .

For example, US Patent 4,025,159 to McGrath discloses a retroreflective coating employing microbead glass retroreflective units; U.S. Patent 4,588,258 to Hoopman discloses a retroreflective coating employing cubic, angular, prism retroreflective units; US Patent 6,083,607 to Mimura discloses a retroreflective coating employing cubic, angular, prism retroreflective units with improved retroreflective tilt.

In addition, Japanese Application Publication JP Sho 59 (19984) -58630A issued to Tsukane et al. Discloses a product having a retroreflective coating composed of glass beads and a magnetic recording layer.

Japanese filing advertisement Hei 9 (1997) -508983A issued on Bantli, discloses an integrated retroreflective electronic display. This patent discloses, according to the information in the description, a retroreflective device for visual and electromagnetic data transmission, the device includes a retroreflective coating for retroreflecting incident light, the coating contains visual information thereon, and further comprises a base layer having a uniform a layer of microdroplets, which are placed in one of its surfaces, and ordinary light reflecting agents, which are placed below the microdroplets and separated therefrom by a transparent material; an antenna for electromagnetic communication; connecting means enabling connection to the antenna.

Japanese Application Notice Hei 11 (1999) -505050 issued to Bantli discloses an electronic registration plate containing an electronic identification device. According to this specification, the patent discloses an electronic license plate architecture used in an electronic traffic surveillance system in which a plurality of remote traffic management stations communicate with an electronic license plate containing a license plate portion having graphic identification marks and identification means storing restricted information. access, the restricted information includes at least one type of vehicle identification information, the restricted information cannot be changed by remote stations or the vehicle itself; information means for storing full access information, where the full access information can be changed by one of the remote stations or by the vehicle; communication means operably linked to the identification means and information means for carrying out a communication process with the remote stations; an antenna for sending and receiving communication links with remote stations; An attachment means, fixed to the vehicle, enabling the registration plate to be attached in such a way that it can be removed so that part of the registration plate can be replaced without the need to replace the information means.

Japanese Patent Hei 4 (1992) -229244A issued to Martin, discloses a method of producing retroreflective microprism coatings partially devoid of a metallic layer, the method involves locally forming an adhesive layer on a metallic deposit layer formed on the surfaces of retroreflective microprism coatings, and removing a portion of the metallic layer that is not protected by adhesive layer. It also discloses that the topically applied adhesive layer (coating of the protective material) is preferably made of a pressure sensitive material that will not be removed by the solvent in the subsequent etching steps. Moreover, printing techniques have been mentioned as one of the methods of providing such a layer.

In addition, Japanese patent Hei 1 (1989) -231004A issued to Martin discloses a method of producing retroreflective microprism coatings locally devoid of a metallic layer, which includes the formation of a metallic deposit layer on the surfaces of retroreflective microprisms, the local formation of an adhesive layer disposed on the metallic deposit layer, and the removal of the metallic deposit layer. in places not protected by the adhesive coating; and a method of making retroreflective, locally devoid of a metal layer microprism coatings, which comprises locally applying a coating material to the surfaces of the retroreflective microprisms, depositing metal vapors, and removing the locally applied coating material.

There are also methods of removing layers of vapor sediment using laser techniques.

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US Patent No. 4,200,875 to Galanos discloses a method of forming an image on retroreflective surfaces of an exposed lens according to a previously described method using a laser method.

Moreover, smart cards incorporating microprocessor circuits are known in the art.

From US5153842 A, a card with a microprocessor circuit, memory and input / output assemblies is known. The card stores information about the package. The card is attached to the package and acts as a label. In addition, the card includes a liquid crystal display that presents a bar code. Similar cards with an integrated microprocessor chip are used to store information on a group of shipments. The card containing information on the group of shipments is delivered with the shipments to the person responsible for the delivery of shipments.

From US20010002035 A1, a smart contactless card or a hybrid contact-contactless grating is known, comprising an antenna placed on a substrate, the antenna consisting of at least one coil of electrically conductive ink that is printed on the substrate, two card support elements on each side of the substrate each of the supports comprises at least one plastic layer and an integrated circuit or module connected to the antenna. The substrate is made of paper and has a cutout at each corner so that the plastic layers can be welded together.

However, none of the patents presented above disclose an integrated circuit retroreflective product which is characterized in that it comprises an integrated circuit module having an embedded integrated circuit (s), a retroreflective element and its support layer (s); in particular, an integrated circuit retroreflective product, wherein the integrated circuit module has an embedded radio frequency identification chip and a communication antenna coupled to the radio frequency identification chip; in addition, a retroreflective product with an integrated circuit in which the communication antenna is made on the surface of the reflective retroreflective unit.

The contact microprocessor cards described above have the disadvantage that the information stored in the microprocessor card cannot be transmitted without inserting the card into a reader / writer. In addition, contactless microprocessor cards have the disadvantage that they must be within the range that enables the card to be identified by radio, and this is because it is impossible to identify the card by radio which is out of range.

In addition, in the case of billing systems (known as automatic billing systems) that implement interactive communication using contactless microprocessor cards at toll collection points on the roads, there is a problem related to the need to install an internal reading-writing unit in each vehicle enabling communication with the microprocessor card, which is dictated by the considerable distance between the microprocessor card and the external reader-writer (roadside antenna).

In addition, until the vehicle does not approach the reader / writer (roadside communication antenna) close enough to establish a communication link with the vehicle's microprocessor card, the reader / writer has difficulty distinguishing between vehicles with microprocessor cards and normal vehicles whose drivers pay the fee in cash. In particular, there is a problem with toll booths that run concurrently in an automatic toll collection system and collect these tolls in cash, in particular at night, since toll chargers cannot perform visual recognition in advance.

In addition, although during the day it is possible to recognize the microprocessor stickers that the vehicle is equipped with ("microprocessor stickers") placed, for example, behind the windshield of the vehicle to confirm the right to park, identify employees, confirm the tax payment, identify the vehicle and so on similar, but after dark, especially from a distance, it is not possible to confirm the presence of stickers.

The present invention, as a means of solving the problems shown above, introduces a means of enabling toll chargers to spot the microprocessor card before the vehicle has moved a distance from which the reader / writer and the microprocessor card can communicate with each other, by introducing a plurality of retroreflective units into each of the microprocessor cards in which the integrated circuit modules are placed, these units reflect back incident light towards the light source.

PL 203 289 B1

In particular, the invention introduces a retroreflective product with an embedded integrated circuit, which is characterized in that it comprises an integrated circuit module in which an integrated circuit (s), a retroreflective element and a carrier layer (s) in which a set of retroreflective elements are installed are installed. on one side of the carrier layer (s), so that it is possible to reflect the incident light coming from outside towards the light source.

The "retroreflective element" used in the present invention is constructed of cubic, angular, prismatic retroreflective units (abbreviated as "CC units") or micro-bead retroreflective units.

In a preferred embodiment of the invention, the CC units have three retroreflective surfaces which are mutually perpendicular, it is possible to use pyramidal CC units, hexagonal hexagonal units or double pitch CC units. It is particularly advantageous to introduce pyramid-shaped CC units as they easily create microscopic retroreflective elements and thus enable the production of really thin products.

CC units can be used as spatial CC units that reflect light onto reflective prism surfaces as they are equipped with a thin metallic layer, such as pearlescent glass retroreflective units; or they can be used as total internal reflection retroreflective units according to the principle of total internal reflection, by introducing a layer of a low refractive index material, for example air, on their prismatic back surfaces. The latter totally internal reflection units do not require, unlike glass pearlescent units, a thin metallic layer to be deposited on their surface, so the color of the integrated circuit retroreflective product has not been darkened by the thin metallic layer. From the point of view of recognition ability, it is preferable to use CC units with total internal reflection.

In addition, for non-contact retroreflective products with an embedded chip, CC units with total internal reflection are preferred compared to micro-bead glass retroreflective units or cubic CC units due to the lack of a thin metallic layer that absorbs the radio waves used in the communication process. While a similar RF absorption effect can be achieved with micro-pearl glass retroreflective units without a thin metallic layer, the resulting reduction of the retroreflective area reduces the ability to recognize from a greater distance.

Microbead glass retroreflective units can be used in the form of closed lenses, which are made by optionally gluing a thin layer of resin to the glass microbeads preferably having a diameter in the range of 30 to 500 μm and a refractive index in the range of 1.4 to 2.5, allowing when necessary, changing the focal length, in addition, from 40 to 70% of the surface of the micro-glass beads is covered by a thin metallic layer, for example, aluminum or silver, sputtered or chemically applied to increase retroreflection.

In a preferred embodiment, the use of built-up retroreflective products, the retroreflective portion of which is formed of microbead retroreflective units with a diameter of 30 to 500 µm. The surface of the coating is coated with a smooth and transparent protective layer. In the case where the retroreflective units are smaller than 30 µm in diameter, the light scattering due to diffraction becomes excessive and adversely reduces retroreflection. At the same time, retroreflective units with a diameter exceeding 500 μ ^ ι create too thick and unfavorable coatings.

In another form of microbead glass retroreflective elements, it is possible to use encapsulated lenticular retroreflective units which are advantageously used to form retroreflective coatings, the retroreflective portion of which is constructed of micro glass bead retroreflective units with a diameter of 30 to 500 μm and a plastic layer acting as a smooth and a transparent protective surface layer. As in the case of a retroreflective coating composed of encapsulated lenticular retroreflective units, retroreflective units with diameters less than 30 μm cause excessive diffusion of light resulting from diffraction, and thus their retroreflective properties are adversely reduced,

While those units having a diameter greater than 500 µm adversely increase the thickness of the coating and reduce the sharpness of the images formed.

The support layer constituting the product according to the invention can be divided into core layer (s) on which an integrated circuit module (s) are placed and another inner layer (s) on which are placed the core layer, the retroreflective element and the antenna (s). It is also possible to introduce upper and lower protective layers placed on the supporting layer to protect the front and back of the product according to the invention.

On the top and bottom layers used in the invention, it is possible to install a plurality of retroreflective units and all necessary components, along with other layers such as printing layers, anti-tampering protective layers such as non-retroreflective metal thin layers, layers containing holograms or even layers containing elements. extruded.

In particular, the hologram layer has excellent security properties to prevent tampering with the product. A hologram layer may be formed on each layer by forming a non-uniform layer which forms the hologram in a known manner and, if necessary, by applying a thin metallic layer, for example aluminum. Moreover, in the step of producing a thin metal layer of the hologram, it is possible to locally apply a thin, removable layer of silicone resin on the lower surface of the metal layer to form a hologram. Such a solution creates a spatial separation between the removable layer and the metallic layer of the hologram, while trying to separate the once glued product according to the invention, such a solution makes it difficult to remove the coating, thus effectively preventing theft.

The resin forming the protective layer, core layer or inner layers, in particular the layers on which the retroreflective elements are placed, may be a clear resin coating with a total optical transparency of 50% or more, such as vinyl chloride resin, acrylic resins, polyester resin, resin polycarbonate or styrene resin. From the point of view of thermal resistance, acrylic resins, polyester resins and polycarbonate resins are particularly preferred. Particularly for retroreflective integrated circuit products installed in vehicles, it is advantageous to use resins that have high thermal resistance so that the retroreflective properties of the product do not deteriorate even at temperatures higher than 90 ° C, as the product may be exposed to high temperatures. for example when parking in direct sunlight.

Various pigments and dyes, fluorescent pigments, fluorescent dyes; it is also possible to add ultraviolet absorbers, light stabilizers, antioxidants or the like with the intention of improving weather resistance and thermal resistance. The use of fluorescent colorants is advantageous as this increases the visibility of the product in daylight.

The following are examples of preferred ultraviolet absorbers that can be added to the product.

Ultraviolet absorbers in the form of hydroquinone derivatives: hydroquinone, hydroquinone disalicylate, and the like.

Ultraviolet absorbers in the form of salicylic acid derivatives:

Phenyl salicylate, para-octylphenyl salicylate, and the like.

Ultraviolet absorbers in the form of benzophenone derivatives:

2-hydroxy-4-methoxybenzophenone,

2-hydroxy-4-n-octyloxybenzophenone,

2-hydroxy-4-methoxy-2-carboxybenzophenone,

2.4- hydroxybenzophenone,

2.2-hydroxy-4,4-dimethoxybenzophenone,

2-hydroxy-4-benzolyoxybenzophenone,

2.2- hydroxy-4-methoxybenzophenone,

2-hydroxy-4-methoxy-5-sulfobenzophenone,

2.2.4.4- tetrahydrooxybenzophenone,

2.2-hydroxy-4,4-dimethoxy-5-sulfobenzophenone sodium,

4-dodecyloxy-2-hydroxybenzophenone,

2-hydroxy-5-chlorobenzophenone, and the like.

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Ultraviolet absorbers in the form of benzotriazole derivatives:

2- (2-hydroxy-5-methylphenylene) benzotriazole, 2- (2-hydroxy-5-methylphenylene) -5-carboxylic acid benzotriazol-butyl ester,

2- (2-hydroxy-5-methylphenylene) -5,6-dichlorobenzotraizole,

2- (2-hydroxy-5-methylphenylene) -5-ethylsulfobenzotraizole,

2- (2-hydroxy-5-tri-butylphenylene) -5-chlorobenzotraizole,

2- (2-hydroxy-5-tri-butylphenylene) benzotraizole,

2- (2-hydroxy-5-amylphenylene) benzotraizole,

2- (2-hydroxy-3,5-dimethylphenylene) benzotraizole,

2- (2-hydroxy-3,5-dimethylphenylene) -5-methyxobenzotraizole,

2- (2-methyl-4-hydroxyphenylene) benzotraizole,

2- (2-stearyloxy-3,5-dimethylphenylene) -5-methylbenzotraisole, 2- (2-hydroxy-5-phenylenecarboxyl) benzotraisole ethyl ester, 2- (2-hydroxy-3-methyl-5-tri-butylphenylone) benzotraizole,

2- (2-hydroxy-3,5-di-tri-butylphenylone) -5-chlorobenzotraisole,

2- (2-hydroxy-5-methoxyphenylene) benzotraizole,

2- (2-hydroxy-5-phenylene) -5-chlorobenzotraizole,

2- (2-hydroxy-5-cyclohexlphenylene) benzotraizole, 2- (2-hydroxy-4,5-dimethylphenylene) carboxylic acid benzotriazolbutyl ester,

2- (2-hydroxy-3,5-dichlorophenylene) benzotraizole,

2- (2-hydroxy-4,5-dichloro) benzotraizole,

2- (2-hydroxy-3,5-dimethylphenylene) -5-ethylsulfonobenzotraizole,

2- (2-hydroxy-5-phenylene) benzotraizole,

2- (2-hydroxy-4-octyloxyphenylene) benzotraizole,

2- (2-hydroxy-5-methoxyphenylene) -5-methylbenzotraizole, 2- (2-hydroxy-5-methylphenylene) -5-carboxylic acid benzotriazol-butyl ester,

2- (2-acetoxy-5-methylphenyl) benzotriazole,

2- (2-hydroxy-3,5-di-tri-butylphenylene) -5-chlorobenzotriazole and the like.

Among these ultraviolet absorbers, benzophenones and benzotriazoles are the preferred absorbers. Among other effective means are compounds such as bezophenones:

2,3-dihydroxy-4,4-dimethoxybenzophenone,

2,2-dihydroxy-4-methoxybenzophenone i

2,2,4,4-tetrahydroxybenzophenone and benzotriazoles,

2- (2-hydroxy-5-methylphenylene) benzotriazole,

2- (2-hydroxy-5-methylphenylene) -5,6-dichlorobenzotriazole,

2- (2-hydroxy-5-tri-butylphenylene) benzotriazole,

2- (2-hydroxy-3-methyl-5-tri-butylphenylene) benzotriazole,

2- (2-hydroxy-3,5-di-tri-butylphenylene) -5-chlorobenzotriazole,

2- (2-hydroxy-5-phenylphenylene) -5-chlorobenzotriazole,

2- (2-hydroxy-3,5-di-tri-butylphenylene) -5-chlorobenzotriazole,

2- (2-hydroxy-5-octoxyphenylene) benzotriazole and the like.

It is also possible to use commercially available benzotriazole derivatives or benzophenones. As light stabilizers, hindered amine light stabilizers (HALS) are particularly preferred. Furthermore, it is possible to blend light stabilizers into the layer containing the fluorescent dye of the retroreflective coating of the invention so as to improve the weather resistance where necessary. When amine light stabilizers are used, it is particularly advantageous to use piperidine amine light stabilizers having a tertiary amine structure with a molecular weight of 600 or more as they can provide an extended period of weather resistance.

The amine light stabilizers may be mixed into the layer containing the fluorescent dye in an amount from 0.1 to 5% by weight, either alone or simultaneously with the ultraviolet absorber or antioxidant.

In addition, it is possible to insert light stabilizers into the resin skeleton

And forming a layer containing a fluorescent dye, in the form of an ester with, for example, (meth) acrylic acid. Examples of such reactive light stabilizers are 1,2,2,6,6-pentamethylpiperidylmethacrylate and 2,2,6,6-tetramethylpiperidylmethacrylate. Copolymerization of such light stabilizers with other reactive monomers produces a resin such as (meth) acrylate, vinyl acetate or vinyl chloride, and it is also possible to introduce groups of light stabilizers into the backbone of the resin.

Furthermore, it is possible to mix light stabilizers based on benzoate derivatives or the like into a layer containing a colorant such as a dye or a fluorescent dye, giving the layer the desired weather resistance.

Examples of useful antioxidants include: the amine antioxidant naphthylamine, diphenylamine, and phenylenediamine derivatives; and phenolic antioxidant in the form of quinoline, hydroquinone, monophenol, polyphenol and thiobiphenol derivatives.

On the lower protective layer, it is possible to install a plurality of retroreflective units forming the invention, it is also possible to install a printed layer, a metal vapor or hologram anti-tampering layer, magnetic strips or non-uniform embossing. Useful resins include vinyl chloride resin, acrylic resin, polyester resin, polycarbonate resin, or styrene resin. From the point of view of heat resistance, it is preferable to use an acrylic resin or a polycarbonate resin.

The upper and lower protective layers, core layer, and inner layers described above may be joined using a heat-responsive adhesive, a pressure-responsive ultraviolet cure adhesive, a thermosetting adhesive, an electron beam cured adhesive, or thermal melting techniques.

It is advantageous to introduce a layer of air on the prismatic surfaces of the reflection units of the layer on which the CC reflection units are installed. To create an air layer, it is possible to use a method such as that disclosed in the McGrath patent.

Moreover, it is possible to introduce an adhesive layer placed on the surface of the upper and lower protective layers for the purpose of sticking the microprocessor card to an external substrate such as glass or plastic. In general, the binder may be a heat responsive binder, a pressure responsive binder, or a cross-linking binder.

In particular, when the IC card is glued to a transparent substrate, for example on the inside of a vehicle window, it is preferable to use a pressure-responsive poly (meta) krill resin adhesive from the viewpoint of transparency and thermal resistance. It is also advantageous to add a ultraviolet absorber, light stabilizer, or antioxidant such as those added to the topcoat, each in an amount of from 0.05 to 5% by weight, to improve weather resistance and to increase heat resistance.

The integrated circuit module used in the invention is built from electronic circuits such as a central processing unit (CPU), random access memory (RAM), read only memory (ROM), programmable permanent erasable memory (EEPROM electronically). erasable programmable ROM) and the like, and is programmed to be able to perform processing functions, storage functions, and I / O control functions. In the case of microprocessor contact cards, external contacts are inserted.

Contactless microprocessor cards having no external contacts, which are a preferred embodiment of the invention, have an embedded contactless radio frequency identification chip, which is generally referred to as a radio frequency identification IC.

In addition, a communication antenna is installed that allows the RFID chip to communicate with external units. The antenna according to the invention can be formed on a supporting layer (core layer or inner layer) by mounting a metallic foil or depositing metal vapors in the form of a network, line or loop.

Both the RFID and the communication antenna are built inside the product according to the invention, no external power supply power connectors are needed, and no electromagnetic dielectric coupling structure for transmitting electrical signals is needed.

Therefore, the antenna and the chip module according to the invention are connected either directly or via a bridge which makes it possible to obtain thin, flexible sheet products. As

The coupling means may use electrically conductive adhesive, anisotropic bonding sheets, soldering, brazing or welding.

Contactless microprocessor cards are classified as contact type cards (range up to 2 mm), proximity type (range up to 10 cm), short-range cards (range up to 70 cm) and long-range cards (range above 70 cm), depending on the distance between individual integrated circuits embedded in the laminate and a read / write device sufficient to establish a communication connection and the type of antenna. Generally, contact-type cards and proximity-type cards include the use of short-range radio communication using shortwave; short-range cards use long waves, and long-range cards use microwaves.

To construct the antenna used in the present invention, a method of locally applying a thin metallic foil can be used; a method for locally removing a metallic thin foil or a mechanical processing method.

The local application method can be a method of forming a mask on the layer on which the antenna is to be installed, including printing, masking, lithography, and then installing a thin metallic foil of the desired antenna shape by vacuum deposition, sputtering, electroplating, chemical coating.

When installing the antenna on a retroreflective coating composed of glass microprobes using a local application method, it is possible to simultaneously install the antenna and a thin metallic layer on the same layer, thanks to the steps of embedding the glass microbeads in a retroreflective coating composed of glass micro-beads, applying, where necessary, masks on the surface of a layer of embedded glass micro-beads, covered with a thin layer of resin, and then vapor-coating a metal such as aluminum. An antenna created in this way has retroreflective properties. Also in the case of prism retroreflective coatings, this is how the antenna and a thin metal layer can be installed on the same layer at the same time on the reflective surfaces of the prisms.

In the local removal method, a thin metallic layer is previously formed on the layer on which the antenna is to be placed by metal vapor deposition, ion sputtering, electroplating or chemical coating, then the thin metallic layer is locally removed to form a pattern corresponding to the desired antenna shape by etching, dry-etching, laser-etching, or by a mechanical treatment process such as sandblasting.

In the case of an antenna installation on a retroreflective coating using a local strip removal method, a preferred method comprises the formation of a thin metallic layer of a metal such as aluminum or similar metal over the entire surface of the coating composed of microbead glass retroreflective units or a coating composed of prismatic retroreflective units as is known in the art. a method for example by depositing metal vapors; locally applying the etching solution in a pattern corresponding to the antenna using printing techniques so as to obtain the antenna by chemical etching, then neutralizing the etching solution, and washing the solution.

Various types of acids and bases can be used to create the pickling solution. Examples of the useful acids include aqueous solutions of hydrochloric acid, nitric acid, sulfuric acid and phosphoric acid, examples of the useful bases include aqueous solutions of sodium hydroxide and potassium hydroxide. The concentration of the chemical etch solution must be selected taking into account such factors as the nature of the acid or base, the thickness of the metal thin layer, and the etching degree, generally in the range of 5 to 40% by weight.

To perform a chemical etching process using a printing process, it is preferable to add various types of macromolecular components such as glycol polyethylene, polypropylene glycol, sodium alginate, polyacrylic acid salts, polyvinyl alcohol and various cellulose derivatives such as hydroxyethyl cellulose, carboxylated methyl cellulose and methyl cellulose acting as viscosity regulators improving printability. The type and concentration of the viscosity regulator used can be selected according to the printing method used and the printing speed, and are therefore not particularly limited.

In addition, it is advantageous to add surfactants to the etching solution to improve wettability or permeability to the thin metal layer. The type of surfactant used is not particularly limited. Application is preferred

Amine cationic surfactants such as ammonium salt, pyridine derivatives; anionic surfactants such as alkyl oil, fatty acid salts, alkyl ester oils, and alkyl sulfates; nonionic surfactants such as the partial fatty acid esters of polyhydric alcohols and fatty acid ethylene oxide adducts.

Although the method including printing techniques is not critical, gravure printing techniques, screen printing, and inkjet methods are the preferred techniques. In addition, other removal methods may include the use of dry etching, laser burning, or mechanical removal methods such as sandblasting.

In the case of mechanical processing means, it is possible to use a method of converting a metallic thin plate into an antenna of a suitable shape by means of laser cutting or burning, or by forming loop-like shapes from a thin metal wire, and then placing them on a support layer.

In any of the above-mentioned ways, the material used for the thin metallic layer or antenna may be selected from the group consisting of aluminum, aluminum-magnesium alloy, silver, copper, nickel, copper-nickel alloy, brass, phosphor bronze, and singly or in the form of a composite or laminate. The use of aluminum or copper is particularly advantageous due to the favorable properties in the field of receiving radio waves. The preferred thickness of the thin metallic layer constituting the antenna is from 0.5 to 500 µm. A thin metal layer thickness of less than 0.5 µm is disadvantageous because it tends to deteriorate the radio reception properties or to deteriorate the spectral reflectance characteristics when the thin metal layer has been used as the reflective layer of a retroreflective coating. A thin metal layer thickness in excess of 500 µ ^ ι is disadvantageous because it contributes to coating problems with lowered flexibility, bendability, and can also reduce the resolution during antenna formation, making it difficult to obtain a sharp antenna pattern.

Moreover, aluminum is particularly advantageous because it has excellent optical properties when used as a thin metal layer of a retroreflective coating. Apparatus suitable for carrying out the continuous deposition of aluminum vapor on a thin layer include a vacuum vessel capable of maintaining a low pressure of 7 to 9 x 10^-4 mmHg, the vacuum reservoir houses a feeder for feeding the primary prism coating composed of the base layer and the surface protective layer which is applied to the illumination surface of the base layer; a take-up winder for winding a prism type primary coating that has been subjected to a vacuum metal vapor deposition treatment; and a heating system installed between the feeder and take-up reel that can melt the aluminum in the graphite crucible with the electrical heating elements. Pure aluminum pellets with a purity of 99.99% by weight are placed in a graphite crucible, thanks to which it is possible to deposit aluminum vapors in the form of a thin metallic layer on the surfaces of retroreflective units, while maintaining a layer thickness of 0.2 to 2 μm, obtaining molten and evaporated aluminum at when using an alternating voltage AC of 350 to 360 V, and at a current of 115 to 120 A, the treatment speed is in the range of 30 to 70 m / min.

When the communication antenna is placed on the surfaces of the retroreflective prisms in the manner described above, the light is reflected towards the light source not only by the surface of the CC elements on which the antenna is not placed, but also by the surface of the CC elements with the communication antenna mounted, thanks to which excellent recognition is obtained. from a long distance even in night conditions. Conventional communication antennas can only be installed on flat surfaces, the communication antennas according to the invention, which are installed on prismatic reflective surfaces formed by CC units or crystalline reflective surfaces formed by glass microbeads, can safely increase the antenna surface due to surface unevenness increasing the communication properties of the antenna .

The "support layer" of the invention is a form of core layer (s) and / or inner layer (s) on which an integrated circuit module, communication antenna or external contacts are mounted. Moreover, retroreflective elements may be installed on any of the said layers.

PL 203 289 B1

The core layer has an opening or recess in which an integrated circuit is placed. The material from which the core layer is made may be freely chosen, it is preferable to use a material with high transparency. For example, it is possible to use a sheet made of clear resin, chloroethene resin, acrylic resin, polyester resin, polycarbonate resin, or styrene resin with 50% or greater transparency. In particular, acrylic resin, polyester resin and polycarbonate resin are preferable because of their high heat resistance.

An integrated chip is mounted on the upper and lower surfaces of the inner layer. The material of the inner layer is not critical, it is preferable to use a highly transparent material. For example, it is possible to use a sheet made of clear resin, chloroethene resin, acrylic resin, polyester resin, polycarbonate resin, or styrene resin with 50% or greater transparency. In particular, acrylic resin, polyester resin and polycarbonate resin are preferable because of their high heat resistance. It is possible to introduce two or more inner layers.

The upper and lower protective layers, the core layer (s), and the inner layer (s) described above are not particularly limited in terms of thickness and hardness. Nevertheless, it is necessary to take into account their thermal resistance, resistance to weather conditions, transparency, various types of mechanical properties defined for example by JIS X6321-11998, electrostatic properties, determined in accordance with the purpose of their use.

The shape of the product is not limited to "conventional microprocessor cards" (85.6mm x 54mm x 0.76mm), larger sizes and flexible shapes are possible.

The retroreflective integrated circuit products of the invention constructed as described above can reflect incident light towards the light source by having retroreflective elements installed on them, acting as a means of enabling the operator of an external reader / recorder to see the product from a distance even at night without needing to use of any special recognition means, before the product and the reader / writer communicating with it initiate the communication link.

In particular, integrated circuit retroreflective products according to the invention, which include integrated circuit modules having at least one embedded integrated circuit, a support layer formed on the core layer (s) and / or an inner layer (s) on which the module is mounted, and upper and lower protective layers protecting the upper and lower surfaces of the base layer, respectively, contain a set of retroreflective units installed on any of the layers so that incident light is reflected towards the light source, increasing the ability to recognize the product from a distance.

Contactless products, which are preferred embodiments of the invention, have an antenna mounted to communicate with external units. The antenna is made of a thin metallic foil or by a metal vapor deposition process on the core layer or one of the inner layers, in the form of a suitable pattern such as a mesh, line or loop pattern. By using such an antenna, products can communicate with external units without the need for special power supply couplers or electromagnetic coupling devices for exchanging electronic information between the antenna and the chip module.

In particular, in products of the invention in which multiple CC units are installed, the line antenna, loop antenna or the like, the antennas can be formed directly on the prism reflective surfaces of the CC units by using vapor deposition, electroplating or chemical coating with a metal such as aluminum or silver. . Alternatively, such antennas may be formed by metallizing the prismatic reflective surfaces of CC units with a metal such as aluminum or silver, using vapor deposition, electroplating or chemically plating with metal, and then removing the metal locally from a specific area by etching.

When the antenna is installed directly on the prismatic reflective surfaces of CC units as described above, the area where the antenna of the reflective surfaces is mounted may reflect light incident towards the light source, as well as other areas on the surface where the antenna is not mounted, increasing the ability to recognize the product according to the invention from a great distance at night. Again, install the antenna in a conventional location

In some solutions, it is limited to a flat surface, in the solution according to the invention the antennas can be installed on the prismatic reflective surfaces of CC units, and the antenna arranged in this way can have an antenna area about 1.5 times larger than a conventionally installed antenna of the same size, thanks to the unevenness of the reflective surface, such an antenna has excellent communication properties.

As described above, the retroreflective products of the invention have achieved a significant improvement increasing the ability to recognize the product from a long distance. In another application of the products of the invention, the products can be used as reflective elements, for example in photo-optical sensors of parking gates and toll stations. The set of retroreflective units installed in each of the products according to the invention introduces, for example, visual information that the operator of the parking lot or toll station can perceive from a distance, while simultaneously signaling the presence of an approaching vehicle by reflecting the light emitted by the light source of the reflective photo-optical sensor installed on the gate, to a photo-sensor installed near the light source.

The subject of the invention is illustrated in a preferred embodiment in the drawing, in which: Fig. 1 shows a conventional microprocessor card; Fig. 2 shows a conventional contactless microprocessor card; Fig. 3 shows an integrated circuit retroreflective contact product according to the invention, in which a plurality of retroreflective units is installed on the inner layer; fig. 4 shows an integrated circuit contactless retroreflective product according to the invention, in which a plurality of retroreflective units is installed on the core layer; Fig. 5 shows an integrated circuit contactless retroreflective product according to the invention, in which a plurality of retroreflective units is installed on the inner layer and an adhesive layer is placed on the top surface of the protective layer; fig. 5 shows a non-contact retroreflective product with an embedded integrated circuit according to the invention, in which a plurality of retroreflective units is installed on the inner layer and an adhesive layer is placed on the surface of the upper protective layer; Fig. 7 is a sectional view for explaining the structure of the product of Fig. 6; fig. 8 shows a contactless retroreflective product with an embedded integrated circuit according to the invention, in which a set of retroreflective units is installed and a thin metallic film (specular reflection surface) placed on the reflective surfaces of micro-glass beads acting as retroreflective units has been removed from the antenna.

With reference to the accompanying drawings, preferred embodiments of the present invention are described below.

Figure 1 shows the construction of a conventional known microprocessor card for comparison with the embodiment of the present invention. The microprocessor card comprises an integrated circuit module 5 having an embedded chip, a support layer 4 formed on the core layer 2 and an inner layer 3 carrying an integrated circuit module, and an upper protective layer 1 and a lower protective layer 7 protecting respectively the upper surface and the lower surface of the supporting layer 4, in whose chip module 5 performs communication functions via external contacts that are exposed and unprotected by the upper protective layer.

Figure 2 shows the construction of a conventional known contactless microprocessor card for comparison with the present invention. The microprocessor card comprises an integrated circuit module 5 having an embedded chip, a support layer 4 formed on the core layer 2 and an inner layer 3 carrying an integrated circuit module, and an upper protective layer 1 and a lower protective layer 7 protecting respectively the upper surface and the lower surface of the supporting layer 4, in the chip module 5 of which communicates with external units via a communication antenna 6.

Figure 3 shows a preferred embodiment of an embedded integrated circuit contact product according to the invention. The product comprises an integrated circuit module 5 having a built-in chip, an upper protective layer 1 protecting respectively the upper surface of the inner layer 3 on which this module is installed, the integrated circuit module 5 performs communication functions through external contacts that are exposed and unprotected by the upper protective layer.

The top protective layer 1 is made of an optically transparent resin on which a print layer containing visual information, a tamper-resistant layer and the like are provided. The inner layer 3 is also made of an optically transparent resin,

PL 203 289 B1 which has a set of retroreflective units reflecting the light incident towards the light source.

Figure 4 shows a preferred embodiment of an integrated circuit integrated non-contact product according to the invention. The product comprises an integrated circuit module 5 having an embedded chip, a support layer consisting of a core layer 2 and an inner layer 3 on which this module is mounted, and an upper protective layer 1 and a lower protective layer 7 protecting the upper and lower surfaces of the support layer, respectively, in which the integrated circuit module 5 performs communication functions via a loop-shaped antenna 6 mounted on the core layer.

The upper protective layer 1 is made of an optically transparent resin on which there is an overprint layer containing visual information and an anti-alteration layer. The core layer 2 is also made of an optically transparent resin on which a plurality of retroreflective units reflecting incident light towards the light source is disposed.

Figure 5 shows a preferred embodiment of an integrated circuit integrated non-contact product according to the invention. The product comprises an integrated circuit module 5 having an integrated chip, an inner layer 3 on which this module is mounted and an upper protective layer 1 and a lower protective layer 7 protecting the upper and lower surfaces of the support layer, respectively, in which the integrated circuit module 5 performs communication functions via a loop-shaped antenna 6 mounted on the core layer.

The upper protective layer 1 is made of an optically transparent resin on which a printing layer containing visual information and the like is provided. The inner layer 3 is also made of an optically transparent resin on which a plurality of retroreflective units reflecting incident light towards the light source is placed.

Moreover, a transparent adhesive layer 8 is provided on the top surface of the protective layer 1, which allows the product to stick to a transparent substrate such as the inner surface of a vehicle window pane.

Figure 6 shows a preferred embodiment of an integrated circuit integrated non-contact product according to the invention. The product comprises an integrated circuit module 5 having an embedded chip, a lower inner layer 3 on which this module is mounted, and a lower protective layer 7 protecting the lower surface of the lower support layer, an upper inner layer 3 on which a plurality of spatial angular prism retroreflective units are mounted, and top protective layer 1 to protect the top surface of the top inner layer. The integrated circuit module 5 performs communication functions through a loop-shaped antenna 6 mounted on the lower surface of the upper inner layer 3 on which a plurality of retroreflective units is installed.

The upper protective layer 1 is made of an optically transparent resin on which a printing layer containing visual information and the like is provided. On the upper inner layer 3 there is a set of spatial, angular retroreflective units also made of transparent resin. Since the loop-shaped antenna 6 is mounted on the lower surface of the upper inner layer, light entering the microprocessor card is reflected towards the light source across the entire surface of the microprocessor card.

Moreover, a transparent adhesive layer 8 is provided on the top surface of the protective layer 1, which allows the product to stick to a transparent substrate such as the inner surface of a vehicle window pane.

Figure 7 is a cross-sectional view of a retroreflective product embedded in the integrated circuit of Figure 6. A loop-shaped antenna 6 made of a thin metallic layer is mounted directly on the reflective surfaces of a set of spatial, angular prism retroreflective units. The chip module 5 is mounted on the upper inner inner surface 3, below which, thanks to the adhesive layer 13, a collection of spatial, angular, prismatic retroreflective units is placed. An anti-alteration layer 15 is formed on the surface of the upper protective layer 1, a print layer 11 is provided on the underside of the lower layer 1.

Moreover, the upper inner layer 3, under which the set of spatial, angular prismatic retroreflective units is placed, is hermetically closed on four sides by a lower inner layer 3 and a lower protective layer 7, forming an air layer 14 between them.

PL 203 289 B1

Figure 8 shows a non-contact retroreflective product with an embedded integrated circuit according to the invention, in which a retroreflective element 9 made of glass micro-beads is installed, and the antenna 6 was made by locally removing a thin metallic layer (mirror reflection layer) placed on the reflection surfaces of the micro-glass beads 10.

Antenna 6 can be made using a local removal method, i.e. by locally removing a thin metallic layer (mirror reflection layer) that is placed on the reflective surfaces of the glass microbeads 10 by means of etching or by a local deposition method, i.e. by placing a mask. on the surfaces of glass microbeads when depositing a thin metallic layer by means such as vapor deposition.

The antenna 6 is directly connected to the RF identification chip module 5, omitting any connectors or electromagnetic coupling devices acting through a dielectric. The chip module 5 can be connected to the support layer of the retroreflective element 9 made of glass micro-beads via an adhesive layer. The layer on which the retroreflective element 9 is placed, made of glass microbeads, is laminated on the retroreflective surface using an optically transparent upper protective layer 1, and on the other side using a lower protective layer 7, and forms a hermetically sealed structure, the edges of which are bonded with glue or welded. thermally. The upper protective layer 1 and the retroreflective element 9 made of glass micro-beads are joined by an adhesive 8.

A transparent adhesive layer 8 can be placed on the surface of the top protective layer 1, allowing the product to stick to a transparent substrate such as the inner surface of a vehicle window glass.