Integrated circuit enclosed retroreflective product
Abstract
A retroreflective product in which an integrated circuit is sealed having at least one integrated circuit module incorporating a built in integrated circuit, a light retroreflective element, and a holder therefor.
Term
No projected expiry on record.
- Priority
- Filed
- Today
24 claims: 19 independent, 5 dependent
- 1A retroreflective product housing an integrated circuit, characterized by comprising an integrated circuit module having an integrated circuit incorporated therein, a retroreflective element and its carrier layer(s). 1. Un producto retrorreflector que aloja un circuito integrado, caracterizado porque comprende un módulo de circuito integrado tiene un circuito integrado incorporado en el mismo, un elemento retrorreflector y su(s) capa(s) portadora(s).
- 4The retroreflective product that houses an integrated circuit according to any of claims 1 to 4. El producto retrorreflector que aloja un circuito integrado de conformidad con cualquiera de las reivindicaciones 1 a 3, caracterizado porque el elemento retrorreflector comprende una multiplicidad de unidades retrorreflectoras de tipo de prisma con esquina de cubo. 3, characterized in that the retroreflective element comprises a multiplicity of cube corner prism type retroreflective units.
- 55. El producto retrorreflector que aloja un circuito integrado de conformidad con la reivindicación The retroreflective product that houses an integrated circuit in accordance with claim 4, caracterizado porque las unidades retrorreflectoras de tipo de prisma con esquina de cubo son prismas con esquina de cubo de tipo de reflexión total interna . 4, characterized in that the cube corner prism type retroreflective units are "total internal reflection" type cube corner prisms.
- 7The retroreflective product that houses an integrated circuit according to any of claims 1 to 3, characterized in that the retroreflective element is composed of a multiplicity of glass microsphere-type retroreflective units. 7. El producto retrorreflector que aloja un circuito integrado de conformidad con cualquiera de las reivindicaciones 1 a 3, caracterizado porque el elemento retrorreflector está compuesto de una multiplicidad unidades retrorreflectoras de tipo de microesferas de vidrio.
- 10The retroreflective product that houses an integrated circuit according to any of claims 1 to 9, characterized in that the carrier layer is formed by a core layer(s). 10. El producto retrorreflector que aloja un circuito integrado de conformidad con cualquiera de las reivindicaciones 1 a 9, caracterizado porque la capa portadora está formada por una capa(s) de núcleo.
- 11El producto retrorreflector que aloja un circuito integrado de conformidad con cualquiera de las reivindicaciones 1 a 9, caracterizado porque la capa portadora está formada por una capa(s) interna(s). eleven. The retroreflective product that houses an integrated circuit according to any of claims 1 to 9, characterized in that the carrier layer is formed by an inner layer(s).
- 12The retroreflective product that houses an integrated circuit according to any of claims 1 to 9, characterized in that the carrier layer is formed by a core layer(s) and an inner layer(s). 12. El producto retrorreflector que aloja un circuito integrado de conformidad con cualquiera de las reivindicaciones 1 a 9, caracterizado porque la capa portadora está formada por una capa(s) de núcleo y una capa(s) interna(s).
Independent claims7
169 paragraphs in 7 sections, as filed
<td>SIGNATURE OF THE APPLICANT Dr. Santiago Guarderas Izquierdo Mat.No.2680 CAQ</td><td>SIGNATURE OF ATTORNEY Dr. Santiago Guarderas Izquierdo Mat.No.2680 CAQ</td>
TECHNICAL MEMORY
FIELD OF THE INVENTION
The present invention relates to a retroreflective product housing an integrated circuit, comprising an integrated circuit module having integrated circuit(s) incorporated therein, a retroreflective element and its layer(s). (s) carrier(s).
More specifically, the invention relates to a retroreflective product housing an integrated circuit in which an integrated circuit module has at least one radio frequency identification integrated circuit incorporated therein and a communication antenna(s) connected to it. (s) to the integrated radio frequency identification circuit. The product conducts information exchange with the integrated circuit module through its external terminals or the antenna(s). Furthermore, the presence of the product or the approach of a person holding the product can be recognized from afar by lighting it, particularly at night, according to the principle of retroreflection.
More specifically, the present invention relates to a retroreflective product housing an integrated circuit, in which the communication antenna is formed on reflective surfaces of that retroreflective element.
BACKGROUND OF THE INVENTION
A conventional integrated circuit (IC) card comprises an integrated circuit module having integrated circuit(s) incorporated therein, a carrier layer for carrying that module, which is formed by a core layer and/or an inner layer, and an upper protective layer and a lower protective layer to protect the upper face and the lower face of the carrier layer respectively. This laminar unit exchanges information between the integrated circuit and external units through external contact terminals provided, for example, on the upper protective layer, or a communication antenna that is installed on the carrier layer.
A conventional contact type IC card provided with external contact terminals performs, for example, electronic signal information exchange with external read and write units (reader/writer), or receives power supply, through the External contact terminals provided on top protective layer.
A known non-contact type IC card installed with a communication antenna (or simply antenna) is supplied with power and exchanges electronic signal information between its integrated circuit module, eg, identification system ICs of radiofrequency and any reader/writer, through the antenna installed on its carrier layer. Non-contact type IC cards are further classified, according to the distance between the laminar unit housed in the concerned IC and external readers/writers communicable therewith, into the close mating type (within 2mm). , proximity coupling type (within 10 cm), neighborhood coupling type (within 70 cm), and distance coupling type (more than 70 cm). In general, short waves are used for proximity and close coupling types that emit radio waves at short ranges; longwaves are used for the neighborhood type of coupling, and microwaves for the distance type of coupling.
Various methods have been proposed for forming the non-contact type IC card with an antenna installed therein. As methods for forming the antenna, there are known: a method for forming an antenna by partially removing a metal layer previously installed through means such as etching, a method for forming an antenna by partially installing a metal layer, a method for forming a antenna by using a conductive ink, and a method of forming an antenna by winding a thin metallic wire into a spiral.
Prior art examples describing these antenna formation methods include: Japanese Patent Publication No. 11(1999)--34461A to Horio and its US counterpart, US Patent No. 6,160,526; Japanese Patent Publication No. 10(1998)-320519 to Ikefuji et al., and its European counterpart, EP1014301A1, Japanese Patent Publication No. 8(1996)-287208A to Orihara et al., and its North American counterpart, Patent US No. 5,705,852, Japanese Patent Publication No. 2002-074301A to Oka/mura et al., and its North American counterpart, No. US2002/24475A1, Japanese Patent Publication No. 2000-251047A to Hayashi et al., and its European counterpart, EP1033778A2; and Japanese Patent Publication No. 2000-105810A to Hayashi et al., and its European counterpart, No. EP1039411A1. The descriptions of these references may be referred to for further explanation of their techniques.
On the other hand, retroreflective sheeting and retroreflective molded articles that are installed with a multiplicity of retroreflective units (hereinafter collectively referred to as retroreflective sheeting) are used for traffic signs, safety instruments, reflective decals, commercial sign boards, and optical sensor reflectors, particularly for security instruments and visual representation at night, They reflect light back towards their light sources.
In retroreflective sheeting, a multiplicity of glass bead type or cube corner prism type retroreflective units are installed inside the sheet, which are designed so that incident light entering the retroreflective units from one source of light is reflected from the light source.
For example, US Patent No. 4,025,159 to McGrath describes retroreflective sheeting using glass bead type retroreflective elements and US Patent No. 4,588,258 to Hoopman describes retroreflective sheeting using corner prism type retroreflective elements. bucket; and US Patent No. No. 6,083,607 to Mimura describes a retroreflective sheeting using cube corner type retroreflective units whose retroreflective angularity is improved.
In addition, as a product equipped with a retroreflective sheet and a storage medium, Japanese Patent Publication No. 59 (1984)-58630A to Tsukane et al., describes a product having a retroreflective layer made up of glass beads and a magnetic recording layer.
Japanese Patent Publication No. 9 (1997)-508983A of
Bantli describes an integrated retroreflective electronic display device. In accordance with the descriptions in its specification, that patent describes a retroreflective apparatus for communication of visual and electromagnetic information, the apparatus comprises a retroreflective sheet to retroreflect incident light, the sheet having visual information on it, and comprises a base sheet that has a monolayer of retroreflective microspheres that are embedded in one of its surfaces and a regular light reflection medium that is arranged below the microspheres separated from them by a transparent material; antenna means for electromagnetic communication; and coupling means to allow coupling with the antenna means.
Japanese Patent Publication No. 11(1999)-505050 to Bantli describes an electronic license plate having a security identification device. According to its specification descriptions, that patent describes an electronic license plate architecture for use in an electronic vehicle communication system in which a plurality of remote traffic management stations communicate with the electronic license plate, which comprises a license plate portion including visual identification information and identification means for storing restricted information, the restricted information includes at least one type of vehicle identification information and wherein the restricted information cannot be altered by at least one of the remote stations or by a vehicle; information means for storing unrestricted information wherein the unrestricted information can be altered by at least one of the remote stations or by the vehicle, communication means, operationally connected to the identification means and to the information means, to process communications with remote stations; antenna means for transmitting and receiving communications with the remote stations, and setting means attached to the vehicle for replaceably setting the license plate portion on the vehicle, such that the license plate portion can be replaced without having to replace the media.
Japanese Patent Application Publication No. 4 (1992)229244A to Martin describes a method for making a partially free retroreflective microprism sheet from a metal layer, the method comprises partially forming an adhesive layer on a metal deposit layer formed on the surfaces of retroreflective microprisms and by removing a portion of the metallic layer that is not protected by the adhesive layer. It also states that the partially provided adhesive layer (resisting material) is desirably a pressure sensitive adhesive that will not be adversely affected during the solvent treatment step in later processing. Further, printing is described as one of the methods for providing the layer.
Furthermore, Japanese Patent Publication No. 1 (Martin 1980-231004A describes a method of making a partially free retroreflective microprism sheet from a metallic layer, comprising forming a metallic deposit layer on surfaces of retroreflective microprisms, by partially forming an adhesive layer on the deposit layer metallic and by removing the metallic layer in the areas not protected by the adhesive layer; and a method of making a partially free retroreflective microprism sheet from a metallic layer, comprising partially installing a covering material on the surfaces of a retroreflective microprism, then applying metal vapor deposition thereon and removing the covering material. partially laid cover.
Methods for removing vapor deposited layers by laser have also been generally practiced.
US Patent No. 4,200,875 to Galanos describes a method of forming an image on a lens-type retroreflective sheeting in accordance with a predetermined pattern by a laser method.
However, none of the above patents discloses an integrated circuit housing retroreflective product which is characterized by comprising an integrated circuit module having integrated circuit(s) built therein, a retroreflective element and its carrier layer(s); more specifically, a retroreflective product housing an integrated circuit in which the integrated circuit module has a radio frequency identification type integrated circuit built therein, and a communication antenna connected to the radio frequency identification type integrated circuit. radiofrequency is installed, in an even more specific way, a retroreflective product housing an integrated circuit in which the communication antenna is formed on the reflective surfaces of retroreflective units.
PROBLEMS TO BE SOLVED BY THE INVENTION
The above contact type IC card has a problem that information stored in the IC card cannot be communicated without inserting the card into a reader/writer. In addition, a non-contact type IC card has a problem that the IC card must reach to a distance at which the radio waves can recognize the card, and therefore, the radio waves cannot pre-recognize the card. card out of recognition distance.
In addition, in the case of a toll setting system (hereinafter known as seamless vehicle charging system) by interactive radio communication by using a non-contact type IC card on a toll road, there is a problem that it is generally necessary for each vehicle to install a read-and-write unit in the vehicle to help communication with the IC card, due to the long distance between the IC card and an external reader/writer (roadside antenna).
In addition, until a vehicle approaches the reader/writer (roadside communication antenna) close enough to allow communication with the IC card in the vehicle, it is difficult for the reader/writer to distinguish vehicles carrying cards of those ordinary vehicles that pay the fee in cash. In particular, there is a problem at the toll booth where a non-stop automatic payment system is used concurrently and cash payment is collected, especially at night, when toll collectors cannot make a visual distinction by advanced.
In addition, although it is impossible to recognize in advance from a distance during the day an IC card embedded in vehicle identification stickers (IC stickers) affixed, for example, to the glass windows of vehicles for the purpose of certifying the parking permit , personnel identification, tax payment, vehicle identification, etc., it is impossible overnight to confirm, particularly from a distant location, the presence of the stickers.
MEANS TO SOLVE THE PROBLEMS
As a means to solve the problems noted above, the present invention provides means to enable toll collectors to recognize the presence of IC cards in advance of their approach at a distance at which IC cards and reader/writers they can communicate with each other, by installing a multiplicity of retroreflector units on each IC card in which an integrated circuit module(s) is housed, the units retroreflect incoming light from the outside onto the light source.
More specifically, the invention provides a retroreflective product that houses an integrated circuit characterized by comprising at least one integrated circuit module in which an integrated circuit(s) is incorporated therein), a retroreflective element, and its carrier layer(s), in which the multiplicity of retroreflective elements are installed on any of the carrier layer(s), whereby retroreflection of incoming light from outside to the light source is allowed.
The retroreflective element used for the present invention is composed of cube corner prism type retroreflective units (occasionally abbreviated as CC units) or glass microsphere type retroreflective units.
In preferred embodiments of the retroreflective element according to the invention, CC units can be used each having three reflective surfaces that are perpendicular to one another, such as triangular pyramidal CC units, hexagonal CC units, or CC units formed in the form of a tent. Particularly, triangular pyramidal CC units are preferred because they easily form a micro-sized retroreflective element and thus allow for the formation of thin products.
These DC elements can be used as mirror-type reflective DC units that reflect light onto their prism reflecting surfaces, provided with a metallized thin-film layer as in glass bead-type retroreflective units; can be used as total internal reflection type DC units that reflect light onto their prism reflecting surfaces in accordance with the principle of total internal reflection by, by providing a low refractive index layer over their prismatic backs, just like air. Total internal reflection type DC units do not require deposition of a metallized thin film layer, unlike glass bead type retroreflective units, and thus the appearance of retroreflective products housing an integrated circuit is not they are darkened by the color of the metallized thin film layer. Therefore, the use of those total internal reflection type DC units is advantageous from the viewpoint of forward recognition capability.
In addition, in the case of a retroreflective product housing a non-contact type integrated circuit, total internal reflection type DC units are preferred, compared to glass bead type retroreflective units or high-intensity DC units. mirror type of reflection due to the lack of a metallic thin film layer that absorbs radio waves used for communication. Although a similar effect of preventing radio waves from being absorbed can be achieved by using glass bead type retroreflective units where no metallized thin film layer is provided, the resulting reduction in retroreflective area causes a drawback. recognition of decreased progress.
The glass bead type retroreflective units can be used in the form of a housed lens which is prepared by optionally adhering a thin film layer of resin onto glass beads preferably having a diameter of 30 to 500 gm and a refractive index of 1.4 to 2.5 to adjust their focal length where necessary, and then cover 40% to 70% of the surface area of the glass beads with a metallized thin film layer of, for example, aluminum or silver, by means such as vapor deposition or chemical electrodeposition to increase its retroreflectivity.
A preferred embodiment of using such retroreflective units is a retroreflective sheet whose retroreflective portion is formed by glass microsphere type retroreflective units of 30 to 500 μπι diameter. The surface of that sheet is covered with a protective layer with a smooth and transparent surface. Where the retroreflective units have a diameter of less than 30 μΜ, the diffusion of light due to diffraction becomes excessive to undesirably reduce the retroreflectivity. Meanwhile, retroreflective units having a diameter that exceeds 500 μΜ make the thickness of the sheet too great and are undesirable.
In another form of glass bead type retroreflective element, encapsulated lens type retroreflective units can be used, which is preferably used for a retroreflective sheet whose retroreflective portion is composed of 30 to 500 glass bead type retroreflective units. pm diameter and the plastic film that serves as its surface protective layer has a smooth surface and is transparent. Similar to the housed lens-type retroreflective sheeting, retroreflective units having diameters less than 30 gm cause excessive light scattering due to diffraction effect and their retroreflectivity is undesirably reduced, while those with diameters greater than 500 | im make the thickness of a sheet inadequately large and the sharpness of the formed images decreases.
The carrier layer constituting the product of the invention can be divided into a core layer(s) for carrying an integrated circuit module(s) and an inner layer(s) for carrying the core layer, an element retroreflector or antenna(s). It is also permissible to provide top and bottom protective layers on the carrier layer to protect the front and back of the product of the present invention.
This integrated circuit module(s) and retroreflective element can be installed on top and bottom protective layers or carrier layer composed of core layer(s) and/or inner layer(s), in the product of the present invention.
In the upper and lower protective layers used in the present invention, a multiplicity of retroreflective units can be installed, and subsequently as necessary, other layers such as a printed layer, a tamper prevention layer such as a layer of non-retroreflective metallic thin film or a hologram layer, and a layer of non-uniform embossing or magnetic tapes.
In particular, a hologram layer has an excellent effect in preventing tampering. It can be formed in each layer, by forming a non-uniform layer that forms a hologram by a method known per se, further provides a metallic thin layer for hologram, peel-off layer such as silicone resin, or can be partially provided on the surface bottom of the metallic layer for hologram. This causes partial separation between the release layer and the hologram metal thin layer in an attempt to separate a once-adhered product of the present invention, and make removal of the foil as a whole difficult, thereby avoiding his theft effectively.
As a resin to be used for the upper protective layer, core layer or inner layer, in particular, the layer on which the retroreflective units are installed, a transparent resin sheet having a total light transmittance of 50 can be used. % or more, such as a vinyl chloride resin, acrylic resin, polyester resin, polycarbonate resin or styrene resin. Those particularly preferred are acrylic resin, polyester resin or polycarbonate resin, from the viewpoint of heat resistance. Particularly, for products housing a retroreflective integrated circuit, it is desirable to use a resin having a high heat resistance so that the retroreflective property of the products is not deteriorated even at a high temperature of 90°C because the product it can be exposed to high temperatures while parking in the bright sun.
Coloring agents such as various pigments, dyes, fluorescent pigments or fluorescent dyes can be added to the top resist to improve appearance; or an ultraviolet absorber, light stabilizer, antioxidant or the like, in order to improve wear resistance and heat resistance. The use of a fluorescent coloring agent is advantageous in that it is superior in invisibility during the day.
The following are examples of preferable ultraviolet absorbers that can be added.
Ultraviolet absorbers derived from hydroquinones: hydroquinone, hydroquinone disalicylate, etc.
Ultraviolet absorbers derived from salicylic acids:
phenyl salicylate, para-octylphenyl salicylate, etc.,
Ultraviolet absorbers derived from benzophenones:
2- hydroxy-4-methoxybenzophenone,
2- hydroxy-4-n-octoxybenzophenone,
2-hydroxy-4-methoxy-2-carboxybenzophenone,
2,4-dihydroxybenzophenone,
2,2-dihydroxy-4,4-dimethoxybenzophenone,
2-hydroxy-4-benzoyloxybenzophenone,
2,2-dihydroxy-4-methoxybenzophenone,
2-hydroxy-4-methoxy-5-sulfonbenzophenone,
2,2,4, 4-tetrahydroxybenzophenone,
2,2,dihydroxy-4,4-dimethoxy-5-sodiosulfobenzophenone,
4-dodecyloxy-2-hydroxybenzophenone,
2-hydroxy-5-chlorobenzophenone, etc.
Ultraviolet absorbers derived from benzotriazoles:
2-(2-hydroxy-5-methylphenyl)benzotriazole, 2-(2-hydroxy-5-methylphenyl)-5-carboxylic acid tert-butyl ester benzotriazole,
2-(2-hydroxy-5-methylphenyl)-5,6-dichlorobenzotriazole,
2-(2-hydroxy-5-methylphenyl)-5-ethylsulfonbenzotriazole,
2-(2-hydroxy-5-tert-butylphenyl)-5-chlorobenzotriazole,
2-(2-hydroxy-5-tert-butyphenyl)benzotriazole,
2-(2-hydroxy-5-amylphenyl)benzotriazole,
2-(2-hydroxy-3,5-dimethylphenyl)benzotriazole,
2-(2-hydroxy-3,5-dimethylphenyl)-5-methoxybenzotriazole,
2-(2-methyl-4-hydroxyphenyl)benzotriazole,
2-(2-Stearyloxy-3,5-dimethylphenyl)-5-methylbenzotriazole, 2-(2-hydroxy-5-phenylcarboxylate)benzotriazole ethyl ester
2-(2-hydroxy-3-methyl-5-tert-butypheny)benzotriazole,
2-(2-hydroxy-3,5-di-tert-butylphenyl)-5-chlorobenzotriazole,
2-(2-hydroxy-5-methoxyphenyl)benzotriazole,
2-(2-hydroxy-5-phenylphenyl)-5-chlorobenzotriazole,
2-(2-hydroxy-5-cyclohexylphenyl)benzotriazole, 2-(2-hydroxy-4,5-dimethylphenyl-5-carboxylic acid, benzotriazole butyl ester,
2-(2-hydroxy-3,5-dichlorophenyl)benzotriazole,
2-(2-hydroxy-4,5.dichloro)benzotriazole,
2-(2-hydroxy-3,5-dimethylphenyl)-5-ethylsulfonbenzotriazole,
2-(2-hydroxy-5-phenylphenyl)benzotriazole,
2-(2-hydroxy-4-octoxyphenyl)benzotriazole,
2-(2-Hydroxy-5-methoxyphenyl)-5-methylbenzotriazole, 2-(2-hydroxy-5-methylphenyl)- acid ester benzotriazole
5-carboxylic,
2-(2-acetoxy- 5-methylphenyl)benzotriazole,
2-(2-hydroxy-3,5-di.tert-butylphenyl)-5-chlorobenzotriazole, etc.
Among these ultraviolet absorbers, benzophenones and benzotriazoles are preferred. Among others, such as benzophenones,
2,3-dihydroxy-4,4-dimethoxybenzophenone,
2,2-dihydroxy-4-methoxybenzophenone and
2,2,4,4-tetrahydroxybenzophenone are effective; and as a benzotriazole type,
2-(2-hydroxy-5-methylphenyl)benzotriazole,
2-(2-hydroxy-5-methylphenyl)-5,6.dichlorobenzotriazole,
2-(2-hydroxy-5-tert-butylphenyl)benzotriazole,
2-(2-hydroxy-3-methyl1-5-tert-butylphenyl)benzotriazole,
2-(2-hydroxy-3,5-di-tert-butylphenyl)-5-chlorobenzotriazole,
2-(2-hydroxy-5-phenylphenyl)-5-chlorobenzotriazole,
2-(2-hydroxy-3,5-di-tert-butylphenyl)-5-chlorobenzotriazole,
2-(2-hydroxy-5-octoxyphenyl)benzotriazole, etc., are effective.
Commercial ultraviolet absorbers derived from benzotriazole or benzophenone may also be used. As examples of the benzotriazole-derived ultraviolet absorber, SEESORB™ 701, 702, 703, 704, 706 or 709 made by Shipro Kasei Kaisha, Lid.; ADKSTAB LA31 or LA32 made by Asahi Denka Co., Ltd.; SUMISORB™ 250 made by Sumitomo Chemical Company, Limited.; or VIOSORB™ made by Kyodo Chemical Co., Ltd. In addition, examples of benzophenone-derived ultraviolet absorbers include ADKSTAB™ 1413 or LA51 made by Asahi Denka Co., Ltd.; SEESORB™ 1001 or 103 made by Shipro Kasei Kaisha, Ltd.; or SUMISORB™ 110S made by Sumitomo Chemical Company Limited.
As the light stabilizer, hindered amine light stabilizers are particularly preferred. Furthermore, it is possible to combine a hindered amine light stabilizer in a fluorescent dye-containing layer of a retroreflective sheet of the present invention in order to improve wear resistance, as necessary. As the hindered amine light stabilizers useful in such occasions, piperidine type hindered amine light stabilizers having a tertiary amine structure with a molecular weight of 600 or more are particularly preferred because it can retain long wear resistance. .
As examples of useful commercial products, TINUVIN™ 622LD, 765, 144 or CHIMASSORB™ 119FL made by Ciba Specialty Chemicals KK JAPAN; ADKSTAB™ LA52 or LA62 made by Asahi Denka Co., Ltd.; and SANOL™ LS2626 made by Sankyo Co., Ltd.
The hindered amine light stabilizers can be mixed into the fluorescent dye-containing layer in an amount in the range of 0.1 to 5% by weight as such or concurrently with an ultraviolet absorber or antioxidant.
Furthermore, it is possible to introduce the light stabilizer into the base structure of a resin constituting the layer containing a fluorescent dye, in the form of an ester with, for example, a (meth)acrylic acid. As examples of such a reaction type light stabilizer, 1,2,2,6,6-pentamethylpiperidyl methacrylate and 2,2,6,6-tetramethylpiperidyl methacrylate can be named. By copolymerizing that light stabilizer with another reactive monomer constituting the resin such as (meth)acrylate, vinyl acetate or vinyl chloride, it is possible to introduce the light stabilizer group into the resin base structure.
In addition, it is possible to mix a benzoate-derived light stabilizer or the like into the layer containing a coloring agent such as a dye or a fluorescent dye, to impart wear resistance to the layer. As an example of a benzoate-derived light stabilizer, a benzoate-derived extinguishant such as TINUVIN™ 120 made by Ciba Specialty Chemicals can be named.
KK JAPAN.
Examples of useful antioxidants include: as amine-containing antioxidants: those derived from naphthylamine, diphenylamine or phenylenediamine; and as phenolic antioxidants, those derived from quinoline, hydroxyquinoline, monophenol, polyphenol or thiobisphenol.
It is also possible to install a multiplicity of retroreflective units on top of the lower protective layer used for the present invention or to install thereon a printed layer, a tamper-preventing layer formed from vapor-deposited metal or hologram, magnetic tapes, or an embossed layer. as necessary. As the useful resin, vinyl chloride resin, acrylic resin, polyester resin, polycarbonate resin or styrene resin can be used in the form of a sheet. From the viewpoint of heat resistance, the use of acrylic resin, polyester resin or polycarbonate resin is particularly advantageous.
As described above, the top and bottom protective layers, the core layer, and the inner layer(s) may be integrated by means such as a heat sensitive adhesive, a pressure sensitive adhesive, or an interlocking type adhesive. thermosetting, ultraviolet curing or electron beam curing, or thermal fusion.
It is preferable to provide an air blanket over the reflective surfaces of the prism reflector units of the layer on which total internal reflection DC units are installed. To form the air layer, it is possible to use the method described in the McGrath patent.
Furthermore, an adhesive layer for adhering the IC card to an external support such as glass or plastic may be provided on top and bottom protective layer surfaces. As the adhesive, heat sensitive adhesive, pressure sensitive adhesive or interlocking type adhesive can be suitably used.
Particularly, where the IC card is to be adhered to a light transmission substrate such as the inside of a glass window of a vehicle, it is preferable to use a poly(meth)acrylic resin type pressure sensitive adhesive. from the points of view of light transmission and heat resistance. It is also preferable to add the same ultraviolet absorber, light stabilizer or antioxidant as those used for the above top protective layer at a rate of 0.05 to 5% by weight, to improve wear resistance and heat resistance.
An integrated circuit module used for the present invention is composed of electronic circuits such as CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory) and EEPROM (Electronically Erasable Programmable ROM). ) and the like, and is designed to be able to execute a processing function, a storage function and an input/output control function. In the case of a contact type IC card, external contact terminals are provided.
A non-contact type IC card having no external terminal, which is a preferred embodiment of the present invention, has a non-contact type radio frequency identification type integrated circuit incorporated therein, which is generally referred to as RF-ID (Radio Frequency Identification IC) on the module.
In addition, a communication antenna is installed which makes it possible for that radio frequency identification IC to communicate with external units. The antenna according to the present invention can be formed on the carrier layer (core layer or inner layer) by mounting a metal film or vapor deposited metal in the form of a grid, line or loop.
Both the radio frequency identification integrated circuit and the communication antenna are housed in the product of the present invention, and a power supply connector for supplying power from an external source or an electromagnetic coupling structure through a dielectric for carrying electronic signs are not required. Therefore, the antenna and the integrated circuit module of the present invention are coupled either directly or through a bridge, which makes it possible to provide thin, foldable sheet-shaped products. As the coupling means, a conductive adhesive, anisotropic bonding foil, solder, weld, or electric weld can be used.
Non-contact type IC cards are classified into close mating type (2mm or less), proximity mating type (10cm or less), neighborhood mating type (70cm or less) and the type of distance (more than 70 cm) depending on the distance between the laminar unit housed in the integrated circuit and the reader/writer for communicating therewith and the type of an antenna used. In general, the close coupling type and the proximity coupling type that cover a short radio range use short waves; the neighborhood coupling type uses long waves and the distance coupling type uses microwaves.
To form the antenna to be used for the present invention, a partial installation method for partially installing a metallic thin film layer, a partial removal method for partially removing a metallic thin film layer can be used; or a mechanical processing method.
As the partial installation method, it is possible to use a method comprising laying a cover on the layer on which an antenna is to be installed, by means such as printing, coating or lithography, and then installing a metal thin film layer of a desired antenna shape by means such as vacuum deposition, sputtering, electrodeposition or chemical deposition.
In the case of installing an antenna on a glass bead type retroreflective sheeting by the partial installation method, it is possible to install the antenna and a metal thin film layer simultaneously on an identical layer, through the steps of embed glass beads into glass bead type retroreflective sheeting, apply, where necessary, a coating on the surface covered by the thin resin film layer covered with the layer having embedded glass microspheres and subsequently by vapor depositing a metal such as aluminum thereon. The antenna thus formed exhibits retroreflective performance. Also, in the case of a prism type retroreflective sheet, it is possible to similarly install an antenna and a metallic thin film layer on the same layer at the same time on the reflective surface of the prism.
In the partial removal method, an advancing metallic thin film layer is formed over the layer on which the antenna is to be installed, by means such as vapor deposition, sputtering, electrodeposition or chemical deposition, and subsequently the layer of metallic thin film is partially removed in a pattern corresponding to the desired shape of the antenna by means such as chemical etching, dry etching, laser illumination or a mechanical removal method such as sandblasting.
In the case of installing an antenna on a retroreflective sheet by the partial removal method, a preferred method comprises forming a layer of metallic thin film such as aluminum or the like on the entire surface of or a glass bead type retroreflective sheet or a prism-type retroreflective sheeting by means known per se such as vapor deposition; partially applying an acid etching solution in a pattern corresponding to the desired shape of the antenna by an impression method to form the antenna through chemical etching, and then neutralizing the etching solution and washing it.
As the chemical agent to be used as the etching solution, various kinds of acids and alkalis can be used. Examples of useful acids include aqueous solutions of hydrochloric acid, nitric acid, sulfuric acid, and phosphoric acid, and examples of useful alkalis include aqueous solutions of sodium hydroxide and potassium hydroxide. Although it is necessary to properly select the concentration of etching solution according to factors such as the type of an acid or alkali, thickness of the metal thin film layer, and etch rate, generally it can be 5 to 40% by weight. .
To perform chemical etching by the printing method, it is preferable to add various kinds of macromolecular compounds such as polyethylene glycol, polypropylene glycol, sodium alginate, polyacrylic acid salts, polyvinyl alcohol, and various kinds of cellulose derivatives such as hydroxyethylcellulose, carboxylated methylcellulose, and methylcellulose as viscosity modifiers to improve print quality. Meanwhile, the kind and concentration of a useful viscosity modifier can be properly selected according to a printing method and printing speed and therefore are not subject to special limitation.
Furthermore, it is preferable to add a surface active agent to the etching solution in order to improve the wettability or permeability in the metallic thin film layer. The type of useful surface active agents is not particularly restricted. Meanwhile, cationic surfactants such as amine type, ammonium salt type and pyridine derivatives are preferred; anionic surfactants such as sulfated oil, fatty acid salts, sulfated ester oils and alkyl sulfates, and nonionic surfactants such as partial fatty acid esters of polyhydric alcohols and ethylene oxide-fatty acid adducts.
Although the printing method is not critical, gravure printing method, screen printing method or ink jet method are preferred. In addition, as another removal method, it is possible to use the dry etching method, or the laser illumination method, or the mechanical removal method such as sandblasting.
As the mechanical processing means, a method of processing a thin metal plate into an antenna shape by punching or laser processing or a processing of a thin metal wire into a loop shape and mounting the antenna thus can be put into practice. processed on the carrier layer.
In any of the above methods, the metal to be used as the metal thin film layer material or antenna can be suitably selected from aluminum, aluminum-magnesium alloy, aluminum-manganese alloy, silver, copper, nickel , copper-nickel alloy, brass and phosphor bronze, which can be used either singly or by combination or lamination. Aluminum and copper are particularly preferable because they are superior in radio wave reception performance.
A preferable thickness of the metallic thin film layer forming the antenna is 0.5 to 500 gm. A metallic thin film layer thickness of less than 0.5 gm is undesirable because it may cause problems that the RF reception performance deteriorates or the mirror surface reflection characteristic deteriorates when the metallic thin film layer is used. as the reflective layer of the retroreflective sheeting. Meanwhile, a metallic thin film layer thickness of more than 500 gm is undesirable because it can easily cause problems that the thickness of a sheet becomes excessive, the flexibility of the sheet deteriorates, the bending property also deteriorates. or causes resolution deterioration in the case of antenna formation to make it difficult to obtain a sharp antenna pattern.
Furthermore, aluminum is particularly preferable because it shows superior optical characteristics when used as the metallic thin film layer of the retroreflective sheeting. A suitable apparatus for continuous vapor deposition of a metallic thin film layer of aluminum comprises a vacuum vessel that is capable of maintaining a degree of vacuum at about 7 to 9 x 10'.<sup>4</sup> mmHg, the vacuum vessel accommodates therein a feeder for feeding an original prism sheet formed from a base sheet and a surface protective layer that is laminated onto the light-entry side surface of the base sheet, a receiving winder for winding the original prism sheet which has been treated with vacuum deposition, and a heating system installed between the feeder and receiving winder, which is capable of melting aluminum in a graphite crucible with an electric heater. Pure aluminum tablets having a purity of at least 99.99% by weight are placed in the graphite crucible and a metallic thin film layer can be vacuum deposited on the surfaces of the retroreflective units at thicknesses of, eg. , 0.2 to 2 μη with molten and vaporized aluminum atoms under conditions of v.gr., at an AC voltage of 350 to 360 V, an electric current of 115 to 120 A, and a treatment speed of 30 to 70 m /min.
When the communication antenna is provided on the reflective surfaces of the prisms in the manner described above, not only the area of the DC element on which the antenna is not mounted, but also all other areas of the communication element
CC on which the communication antenna is mounted can reflect incoming light back to the light source, resulting in excellent recognition from distant locations even at night. Although communication antennas can be installed only in flat regions, communication antennas in accordance with the present invention that are installed on prism reflective surfaces formed by DC units of mirror reflective surfaces by glass microspheres, can ensure areas of antenna increased due to the irregular surface configuration and therefore are superior in communication property.
The carrier layer of the present invention is formed by a core layer(s) and/or an inner layer(s) and any or each of these contains an integrated circuit module, communication antenna or external terminals. Furthermore, a multitude of retroreflective units can be installed in each of those layers.
The core layer has a through hole or detent into which the circuit module is inserted. Although a construction material of the core layer can be appropriately selected, it is preferable to use a material having high transparency. For example, it is possible to use a transparent resin sheet made of vinyl chloride resin, acrylic resin, polyester resin, polycarbonate resin or styrene resin having total light transmittance of 50% or more. In particular, acrylic resin, polyester resin or polycarbonate resin is preferred because of its high heat resistance.
An inner layer is used to mount an embedded module on the upper or lower surface thereof. Although the construction material of the inner layer is not critical, it is preferable to use a material that has high transparency. For example, it is possible to use a transparent resin sheet made of vinyl chloride resin, acrylic resin, polyester resin, polycarbonate resin or styrene resin having total light transmittance of 50% or more. In particular, acrylic resin, polyester resin or polycarbonate resin is preferred because of its high heat resistance. Two or more inner layers may be provided.
The above-described top and bottom protective layers, core layer(s), inner layer(s), and adhesive layer(s) are not subject to specific thickness or hardness limitations. However, it is necessary to consider heat resistance, wear resistance, light transmittance, various mechanical resistances specified, for example, by JIS X6321-1998, and electrostatic characteristics according to the purpose of its use.
As for the shape of a product, it is not necessarily limited to the size of IC card (85.6 x 54 x 0.76mm), but larger sizes and flexible shapes can be appropriately selected.
Effect
Retroreflective products housing an integrated circuit of the present invention constituted as described above are able to reflect incoming light toward a light source because a multiplicity of retroreflector units are mounted thereon, as a means of allowing an operator to a reader/writer recognizes the presence of the product from afar even at night without using any special means of recognition, before the product and the reader/writer communicating with it initiate mutual communication.
More specifically, the retroreflective products housing an integrated circuit of the present invention each comprising an integrated circuit module having at least one integrated circuit incorporated therein, a carrier layer formed by a layer(s) ) of core and/or an inner layer(s) to carry the module, and top and bottom protective layers to protect the top and bottom surfaces of the carrier layer, they contain a multiplicity of retroreflector units installed on any of the layers and by which they reflect incoming light back towards their light source, to improve forward recognition.
Non-contact type products, which are preferred embodiments of the present invention, have an antenna mounted thereon for communication with external units. The antenna is formed of a metal foil or a metal vapor deposited on the core layer or one of the inner layers, in a suitable pattern such as a wire mesh, line or loop pattern. With those antenna means, the products can communicate with external units without any special external coupler to supply power or electromagnetic coupler to mediate the exchange of electronic formation between the antenna and the IC module.
Particularly, in the products of the present invention on which a multiplicity of DC units are installed, the line antenna, loop antenna or the like can be directly formed on the prism reflective surfaces of the DC units by means such as steam deposition, spitting or chemical deposition of a metal such as aluminum or silver. Alternatively, the antennae can be formed by first metallizing the prism reflective surfaces, via vapor deposition, sputtering, or chemical deposition, and then partially removing the metal from the prescribed area by means such as etching.
When the antenna is installed directly on the reflective surfaces of the DC units prism as before, the antenna-mounted area of the reflective surfaces can reflect incoming light back to the light source, just like other areas of the surfaces on which the antenna is mounted, which imparts excellent forward recognition to the product of the present invention at night. Again, although the installation site of an antenna in the conventional technique is limited to a flat region, in the present invention the antennas can be installed on prism reflective surfaces of DC units, and the antennas so installed can have an area of antenna of as much as about 1.5 times that of the conventionally installed antenna of the same size due to the irregular reflective surface configuration and can realize excellent communication.
As described above, the retroreflective products in accordance with the present invention have achieved a marked improvement in visual advance recognition capability. As another way of using the products of the present invention, they can be used as a reflector, for example, in optical path sensors in parking gates or toll booths. The multiplicity of retroreflective units installed in each product in accordance with the present invention provide, for example, visually recognizable progress information for a toll collector or parking manager and at the same time indicate the presence of an approaching vehicle(s). (n) by retroreflecting the light that is emitted by the light source from the gate-mounted reflection-type sensor to a photoreceptor installed near the light source,
BRIEF DESCRIPTION OF THE FIGURES
<td></td><td></td><td>Figure 1 is an illustration.</td><td>that</td><td>sample</td><td>a</td><td>card</td><td>of</td><td>CI</td><td>of</td>
<td>guy</td><td>of</td><td>conventional contact;</td><td></td><td></td><td></td><td></td><td></td><td></td><td></td>
<td></td><td></td><td>Figure 2 is an illustration.</td><td>that</td><td>sample</td><td>a</td><td>card</td><td>of</td><td>CI</td><td>of</td>
<td>guy</td><td>of</td><td>no conventional contact;</td><td></td><td></td><td></td><td></td><td></td><td></td><td></td>
<td></td><td></td><td>Figure 3 is an illustration.</td><td>that</td><td>sample</td><td>a</td><td>product</td><td></td><td></td><td></td>
retroreflector housing a contact type integrated circuit of the present invention, in which a multiplicity of retroreflector units are installed on an inner layer;
Fig. 4 is an illustration showing a retroreflective product housing a non-contact type integrated circuit of the present invention, in which a multiplicity of retroreflective units are installed on a core layer;
Fig. 5 is an illustration showing a retroreflective product housing a non-contact type integrated circuit of the present invention in which a multiplicity of retroreflective units are installed on an inner layer and an adhesive layer is formed on the surface of the top protective layer;
Fig. 6 is an illustration showing a retroreflective product housing a non-contact type integrated circuit of the present invention in which a multiplicity of retroreflective units are installed on an inner layer and an adhesive layer is formed on the surface of the top protective layer;
Figure 7 is a sectional view to explain Figure 6; and
Fig. 8 is an illustration showing a retroreflective product housing a non-contact type integrated circuit of the present invention, in which a multiplicity of retroreflective units are installed and a metallic thin film layer (mirror reflective surface) provided. on the reflective surfaces of glass microspheres that serve as a retroreflective element is partially removed to form an antenna.
BEST MODE FOR CARRYING OUT THE INVENTION
The preferred embodiments of the present invention are described below, with reference to the figures.
Fig. 1 shows a structure of a conventional, known contact type IC card for comparison with the present invention. The IC card comprises an integrated circuit module (5) having an integrated circuit incorporated therein, a carrier layer (4) formed by a core layer (2) and/or an inner layer (3) to carry the module and an upper protective layer (1) and a lower protective layer (7) to protect the upper face and the underside of the carrier layer (4) in which the integrated circuit module (5) performs communication through the external terminals that are exposed on the upper protective layer.
Fig. 2 shows a structure of a conventional, known non-contact type IC card for comparison with the present invention. The IC card comprising an integrated circuit module (5) having an integrated circuit incorporated therein, a carrier layer (4) formed by a core layer (2) and/or an inner layer (3) to carry the module and an upper protective layer (1) and a lower protective layer (7) to protect the upper and lower faces. carrier layer (4) in which a communication antenna (6) is installed on the core layer (2) and the integrated circuit module (5) performs communication with external units through the communication antenna ( 6) .
Figure 3 shows a preferred embodiment of a retroreflective product housing a contact type integrated circuit of the present invention. The product comprises an integrated circuit module (5) having an integrated circuit incorporated therein and an upper protective layer (1) to protect the upper face of an internal layer (3) that carries the module, and the circuit module integrated (5) performs communication through external terminals that are exposed on the upper protective layer.
The upper protective layer (1) is made of optically transparent resin, on which is provided a printed layer containing visual information, a tamper-preventing layer and the like. The inner layer (3) is also made of an optically transparent resin, on which a multiplicity of retroreflective units are installed to reflect incoming light towards a light source.
Figure 4 shows a preferred embodiment of a retroreflective product housing a non-contact type integrated circuit of the present invention. The product comprises an integrated circuit module (5) having an integrated circuit incorporated therein, a carrier layer consisting of a core layer (2) and an inner layer (3) for carrying the module, and an upper protective layer. (1) and lower protective layer (7) to respectively protect the upper and lower faces of the carrier layer, in which the integrated circuit module (5) performs communication through a loop communication antenna (6) mounted on the core layer.
The upper protective layer (1) is made of an optically transparent resin, on which is formed a printed layer containing visual information and a tamper-preventing layer for. The core layer (2) is also made of an optically transparent resin, on which a multiplicity of retroreflective units are installed to reflect incoming light towards a light source.
Figure 5 shows a preferred embodiment of a retroreflective product housing a non-contact type integrated circuit of the present invention. The product an integrated circuit module (5) having integrated circuits built into it, an inner layer (3) to carry the module and an upper protective layer (1) and a lower protective layer (7) to respectively protect the faces top and bottom of the inner layer, in which the integrated circuit module (5) performs communication through a loop communication antenna (6) mounted on the core layer.
The upper protective layer (1) is made of an optically transparent resin, below which a printed layer containing visual information or the like is installed. The inner layer (3) is also made of an optimally transparent resin, and on which a multiplicity of retroreflector units are installed to reflect incoming light towards a light source.
In addition, a transparent adhesive layer (8) is provided on the surface of the top protective layer (1) to enable the product to be adhered to a light-transmitting substrate such as an internal surface of a vehicle window glass.
Figure 6 shows a preferred embodiment of a retroreflective product housing a non-contact type integrated circuit of the present invention. The product comprises an integrated circuit module (5) having an integrated circuit incorporated therein, a lower inner layer (3) for carrying the module, a lower protective layer (7) for protecting the bottom surface of the lower inner layer , an upper inner layer (3) on which a multiplicity of cube corner prism type retroreflective units are installed, and an upper protective layer (1) to protect the upper surface of the upper inner layer. The integrated circuit module (5) performs communication through a loop communication antenna (6) mounted on the bottom surface of the upper inner layer (3) on which a multiplicity of retroreflective units is installed.
The upper protective layer (1) is made of an optically transparent resin, on which a printed layer containing visual information and the like is formed. The upper inner layer (3) has a multiplicity of cube corner prism type retroreflective units also made of an optically transparent resin, installed thereon. Since the loop communication antenna (6) is mounted on the lower surface of the upper inner layer, light input to the IC card is reflected in the direction of a light source on the entire surface of the card. of CI.
Furthermore, on the surface of the upper protective layer (1), a transparent adhesive layer (8) is formed to adhere to a light transmission substrate such as the inner face of a glass window of a vehicle.
Figure Ί shows a cross-sectional view of the retroreflective product housing a non-contact type integrated circuit shown in Figure 6. The loop communication antenna (6) made of a thin metal layer is installed directly on the reflective surfaces of the multiplicity of cube corner prism type retroreflective units. The integrated circuit module (5) is mounted on the upper inner layer (3), below which a multiplicity of cube corner prime type retroreflective units are installed via an adhesive layer (13). A tamper-preventing layer (15) is formed on the surface of the upper protective layer (1) and a printed layer (11) is formed on the bottom of the layer (1).
In addition, the upper inner layer (3), below which a multiplicity of cube-corner prism-type retroreflective units are installed, is hermetically enclosed on its four sides with the lower inner layer (3) and the lower inner layer (3). inner surface protector (7) to form an air layer (14).
Fig. 8 shows a retroreflective product housing a non-contact type integrated circuit according to the present invention, in which the glass bead type retroreflective element (9) is installed, and an antenna (6) is formed. by removing the metallic thin film layer (mirror surface reflective layer) fixed on the reflective surfaces of those glass microspheres 10.
This antenna (6) can be formed by a partial removal method, i.e. by partially removing the metal film layer (mirror surface reflective layer), which is provided on the reflective surfaces of the glass microspheres (10). by means such as etching, or by a partial installation method, i.e., by placing a cover on the surfaces of the glass microspheres in the case of providing the metallic thin film layer by means such as vapor deposition.
The antenna (6) is directly connected with the radio frequency identification integrated circuit module (5), and a connector or an electromagnetic coupling structure through a dielectric is not used. The integrated circuit module (5) can be attached to the layer that carries the retroreflective element of the glass microsphere type (9) by means of an adhesive layer. The layer carrying the glass microsphere-type retroreflective element (9) is laminated with an optically transparent upper protective layer (1) on the retroreflective surface thereof and with a lower protective layer (7) on its other side to form a hermetically enclosed structure, with its sides joined by means such as adhesion or thermofusion. The upper protective layer (1) and the glass bead type retroreflective element (9) are joined by an adhesive (8).
A transparent adhesive layer (8) can be provided on the surface of the top protective layer (1), to allow adhesion to a light-transmitting substrate such as the inside of a glass vehicle window.
Contents7
44 members in 17 offices
Priority claims1
| Document | Office | Kind | Date |
|---|---|---|---|
| 2001185404 | Japan | A |
Members44
| Document | Office | Kind | |
|---|---|---|---|
| CA2455305A1 | Canada | A1 | |
| WO02103629A1 | World Intellectual Property Organization (WIPO) | A1 | |
| TW200400470A | Taiwan Province of China | A | |
| ECSP034906AThis record | Ecuador | A | |
| MXPA03011245A | Mexico | A | |
| EP1411465A1 | European Patent Office (EPO) | A1 | |
| TW589582B | Taiwan Province of China | B | |
| BR0210316A | Brazil | A | |
| ZA200309620B | South Africa | B | |
| CN1529871A | China | A | |
| JPWO2002103629A1 | Japan | A1 | |
| US2004218273A1 | United States of America | A1 | |
| PL364432A1 | Poland | A1 | |
| HK1069910A | Hong Kong, China | A | |
| HK1069910A1 | Hong Kong, China | A1 | |
| EP1411465A4 | European Patent Office (EPO) | A4 | |
| EP1748382A2 | European Patent Office (EPO) | A2 | |
| CN1302431C | China | C | |
| US7224279B2 | United States of America | B2 | |
| EP1748382A3 | European Patent Office (EPO) | A3 | |
| US2007194133A1 | United States of America | A1 | |
| EP1903481A1 | European Patent Office (EPO) | A1 | |
| EP1411465B1 | European Patent Office (EPO) | B1 | |
| AT403912T | Austria | T | |
| ATE403912T1 | Austria | T1 | |
| DE60228090D1 | Germany | D1 | |
| ES2306770T3 | Spain | T3 | |
| JP4184951B2 | Japan | B2 | |
| JP2008282427A | Japan | A | |
| PL203289B1 | Poland | B1 | |
| US7598874B2 | United States of America | B2 | |
| EP1903481B1 | European Patent Office (EPO) | B1 | |
| AT447213T | Austria | T | |
| ATE447213T1 | Austria | T1 | |
| DE60234224D1 | Germany | D1 | |
| ES2332826T3 | Spain | T3 | |
| MY141672A | Malaysia | A | |
| EP1748382B1 | European Patent Office (EPO) | B1 | |
| AT473491T | Austria | T | |
| ATE473491T1 | Austria | T1 | |
| DE60236973D1 | Germany | D1 | |
| ES2345834T3 | Spain | T3 | |
| MY146850A | Malaysia | A | |
| CA2455305C | Canada | C |
Numbers
- Application
- 4906
Titles2
- Spanish
- PRODUCTO RETRORREFLECTOR QUE ALOJA UN CIRCUITO INTEGRADO
- English
- RETRORREFLECTOR PRODUCT THAT LODGES AN INTEGRATED CIRCUIT
Classification
- CPC, 9
- G06K19/077
- G02B5/124
- G02B5/128
- G06K19/07749
- G06K19/07769
- G06K19/08
- G06K19/083
- G06K2019/0629
- G07B15/063
- IPC, 7
- G02B5 124
- G02B5 128
- G06K19 06
- G06K19 07
- G06K19 077
- G06K19 08
- G09F13 16