Piezoelectric resonance parts

Description: TECHNICAL FIELD [Detailed description of the invention]

【0001】

[Industrial application field]

The present invention relates to an energy confined type piezoelectric resonance component, and in particular, a chip type piezoelectric resonance that can be surface-mounted on a printed circuit board or the like by using a sliding vibration mode such as a thickness sliding vibration or a width sliding vibration. It is about parts.

【0002】

[Conventional technology]

FIG. 2 is a perspective view showing an example of a piezoelectric resonator portion of an energy confinement type piezoelectric resonance component using a conventional width slip vibration mode. The piezoelectric resonator 1 has a structure in which excitation electrodes 3 and 4 are formed on both side surfaces of an elongated rectangular piezoelectric substrate 2. The piezoelectric substrate 2 is polarized in the direction of arrow P. The excitation electrodes 3 and 4 are formed so as to sandwich the piezoelectric substrate 2 and face each other, and vibration is excited by the portions where the excitation electrodes 3 and 4 face each other. Further, the excitation electrodes 3 and 4 are formed so as to reach different ends of the piezoelectric substrate 2, whereby the piezoelectric resonator 1 is electrically connected to the outside at both ends of the piezoelectric substrate 2 and is mechanically connected. Is held in.

【0003】

When the above-mentioned piezoelectric resonator 1 is used to form a chip-type piezoelectric resonant component for surface mounting, a pair of piezoelectric resonators 1 are placed on both side surfaces via a gap so as not to interfere with the vibrating portion of the piezoelectric substrate 2. The spacer plates of the above are arranged, and further, they are sandwiched between a pair of case substrates via a frame member or the like that serves as a spacer so as not to interfere with vibration above and below them to form a chip-type laminate.

【0004】

In the energy confinement type piezoelectric resonator 1, the excited vibration is confined in the portion where the excitation electrodes 3 and 4 face each other, that is, the vibrating portion, and the vibration is sufficiently damped near both ends of the piezoelectric substrate 2. .. Therefore, even when the piezoelectric substrate 2 is mechanically held at both ends, deterioration of the resonance characteristics is unlikely to occur.

【0005】

[Problems to be Solved by the Invention]

The piezoelectric resonator 1 is usually mass-produced by forming the excitation electrode of the mother on the piezoelectric substrate of the mother and then cutting the piezoelectric substrate of the mother. Therefore, in order to increase the number of piezoelectric resonators that can be manufactured from one mother piezoelectric substrate in order to improve mass productivity, it is desired to reduce the length L of the piezoelectric substrate 2. Further, as with other electronic components, the piezoelectric resonator is also required to be miniaturized, and from this, it is also required to shorten the length L of the piezoelectric substrate 2.

【0006】

However, if the length L of the piezoelectric substrate 2 is shortened, the damping of vibration near both ends of the piezoelectric substrate becomes insufficient. Therefore, when both ends of the piezoelectric substrate are mechanically held, there arises a problem that the resonance characteristics deteriorate. In particular, in the piezoelectric resonator 1 shown in FIG. 2, the resonance characteristics are determined by the width of the piezoelectric substrate 2, but when the width is widened to obtain a low frequency region, the piezoelectric substrate 2 is subjected to the resonance characteristics. The vibration cannot be sufficiently damped unless the length L is also lengthened. Therefore, it has been very difficult to obtain sufficient resonance characteristics by shortening the length L of the piezoelectric substrate 2.

【0007】

An object of the present invention is to solve the conventional problem, to provide a sliding vibration mode in which the energy of the sliding vibration mode can be more effectively confined in the vibrating portion and the length of the piezoelectric substrate can be shortened. The purpose of the present invention is to provide an energy confined type surface mountable piezoelectric resonance component.

【0008】

[Means for solving problems]

The piezoelectric resonance component of the present invention is a resonance plate composed of a piezoelectric resonator, a pair of spacer plates arranged through a gap for not interfering with vibration of a vibrating portion of the piezoelectric resonator, and a piezoelectric resonator and a spacer plate. It includes a pair of case substrates to be bonded together. The piezoelectric resonator used in the present invention includes at least one piezoelectric vibrating section using a slip mode, a first connecting section connected to the piezoelectric vibrating section, and a dynamic vibration absorbing section connected to the first connecting section. It has a second connecting portion connected to the dynamic vibration absorbing portion and a holding portion connected to the second connecting portion. That is, the piezoelectric resonance component of the present invention is a piezoelectric resonance component configured by using an energy confinement type piezoelectric resonator that utilizes a dynamic vibration absorption phenomenon.

【0009】

The piezoelectric resonator is provided with at least one piezoelectric vibrating portion, and therefore may be configured as an oscillator or the like provided with a single piezoelectric vibrating portion, or two or more piezoelectric vibrating portions may be provided. It may be configured as a provided filter.

【0010】

Further, the first connecting portion, the dynamic vibration absorbing portion, the second connecting portion and the holding portion are connected to the at least one piezoelectric vibrating portion, and the structure of the first connecting portion to the holding portion is at least. It may be connected to only one side of the portion provided with one piezoelectric vibrating portion, or may be connected to both sides. Preferably, by forming a first connecting portion, a dynamic vibration absorbing portion, a second connecting portion and a holding portion on both sides of the portion provided with the piezoelectric vibrating portion, the symmetry is excellent and the piezoelectric vibrating portion is supported. A piezoelectric resonance component having a stable structure can be obtained.

【0011】

The piezoelectric resonator and the pair of spacer plates form a resonance plate in the finally obtained piezoelectric resonance component. In the resonance plate, a pair of spacer plates are fixed on both sides of the piezoelectric resonator, and the piezoelectric plate is piezoelectric. The vibrating part of the resonator will be surrounded. Therefore, it is possible to obtain a piezoelectric resonance component in which the vibrating portion is sealed.

【0012】

Further, preferably, the piezoelectric resonator and the spacer plate are integrally formed of a single member. In this way, when the resonance plate is composed of a single member, the resonance plate is formed by the frame-shaped member having an opening in which the vibrating portion of the piezoelectric resonator is arranged. Moreover, since the vibrating portion of the piezoelectric resonator is arranged in the opening and its side is surrounded by the frame-shaped support portion, it is possible to obtain a piezoelectric resonant component having excellent environmental resistance.

【0013】

The piezoelectric vibrating part of the piezoelectric resonator in the present invention is a piezoelectric ceramic such as lead zirconate titanate ceramic or LiTaO.₃Or LiNbO₃It can be composed of a piezoelectric material such as a piezoelectric single crystal such as. Alternatively, the piezoelectric vibrating portion may be formed by forming a piezoelectric thin film on a metal plate or a semiconductor plate.

【0014】

The piezoelectric vibrating portion using the slip mode broadly includes the piezoelectric vibrating portion using various known slip modes including the width slip mode. Further, the electrode structure provided in the piezoelectric vibrating portion in order to excite the slip mode is not particularly limited, and an appropriate excitation electrode is formed in order to strongly excite the vibration of the target slip mode. Will be done.

【0015】

As a preferred specific embodiment of the present invention, in a piezoelectric resonator in which a first connecting portion, a dynamic vibration absorbing portion, a second connecting portion and a holding portion are provided on both sides of at least one piezoelectric vibrating portion, the following electrodes are provided. The structure is provided. That is, in the piezoelectric resonator, a plurality of excitation electrodes for exciting the slip mode are formed. Further, a drawer electrode electrically connected to the excitation electrode is formed in the holding portion. The extraction electrode is electrically connected to the excitation electrode by a connecting conductive portion formed so as to pass through a first connecting portion, a dynamic vibration absorbing portion, and a second connecting portion. Further, a terminal electrode for connection with the outside is formed on the outer surface of the piezoelectric resonance component, and the terminal electrode is electrically connected to the above-mentioned extraction electrode. Therefore, the terminal electrodes formed on the outer surface of the piezoelectric resonance component can be surface-mounted on a printed circuit board or the like in the same manner as other chip-type electronic components. That is, the piezoelectric resonance component of the present invention can be configured as a chip-type piezoelectric resonance component by forming terminal electrodes on the outer surface as described above.

【0016】

INDUSTRIAL APPLICABILITY

The piezoelectric resonance component of the present invention is characterized in that the energy confinement efficiency is improved by utilizing the dynamic vibration absorption phenomenon. Details of the dynamic vibration absorption phenomenon are described, for example, in "Vibration Engineering" by Osamu Taniguchi, pp. 113-116 (published by Corona). It can be said that this is a phenomenon in which the vibration of the main vibrating body is suppressed by connecting the sub-vibrating bodies and appropriately selecting the natural frequency of the sub-vibrating body.

【0017】

In the present invention, a dynamic vibration absorbing unit utilizing the above dynamic vibration absorbing phenomenon is configured between the piezoelectric vibration unit and the holding unit. This dynamic vibration absorbing section is provided to suppress the vibration leaked from the first connecting portion between the piezoelectric vibration section and the dynamic vibration absorbing section by the dynamic vibration absorbing phenomenon.

【0018】

As described above, since the dynamic vibration absorbing part is provided between the piezoelectric vibrating part and the holding part, the vibration leaked from the piezoelectric vibrating part is suppressed by the dynamic vibration absorbing part, and the vibration absorbing part is suppressed to the holding part. The transmission of vibration can be effectively prevented.

【0019】

As described above, in the piezoelectric resonator using the sliding mode used in the piezoelectric resonance component of the present invention, the transmission of vibration to the holding portion is effectively suppressed by the dynamic vibration absorption phenomenon. In other words, the piezoelectric resonator used in the present invention is a so-called energy confinement type piezoelectric resonator in which vibration energy is confined in a portion up to the dynamic vibration absorbing portion.

【0020】

In the present invention, since the vibration energy is effectively confined in the portion up to the dynamic vibration absorbing portion, it is possible to provide a piezoelectric resonance component utilizing a smaller sliding mode without causing deterioration of the resonance characteristic.

【0021】

That is, in the present invention, the dynamic vibration absorbing portion is provided between the piezoelectric vibration portion and the holding portion, but the vibration suppressing effect of the dynamic vibration absorbing portion causes the distance between the piezoelectric vibrating portion and the holding portion to have a resonance characteristic. Can be shortened without degrading. Therefore, the distance between the piezoelectric vibrating portion and the holding portion can be shortened as compared with the distance between the vibrating portion and the end portion of the piezoelectric substrate in the piezoelectric resonator using the conventional sliding mode. Good resonance characteristics can be realized.

【0022】

Therefore, in the present invention, as described above, the piezoelectric resonance component is configured by using a piezoelectric resonator that utilizes a slip mode that is compact but does not easily deteriorate the resonance characteristics. This piezoelectric resonance component is configured by laminating a case substrate on the top and bottom of a resonance plate composed of the piezoelectric resonator and a pair of spacer plates, and the vibrating portion is configured inside the piezoelectric resonance component, so that resonance occurs. It is possible to provide a piezoelectric resonance component having excellent characteristics and using a sliding mode.

【0023】

[Explanation of Examples]

Hereinafter, the present invention will be clarified by explaining examples of the present invention. FIG. 3 is a perspective view showing an energy confined piezoelectric resonator utilizing the width sliding vibration of the first embodiment of the present invention.

【0024】

The piezoelectric resonator 11 is configured by using a rectangular piezoelectric substrate 12 having an elongated planar shape. The piezoelectric substrate 12 is made of a piezoelectric material such as piezoelectric ceramics, and is polarized in the arrow P direction, that is, in the length direction.

【0025】

An excitation electrode 13 is formed on one side surface of the piezoelectric substrate 12. After the excitation electrode 13 is formed on one side surface, grooves 15a and 15b extending in the width direction from one side surface to the other side surface are formed, and the dynamic vibration absorbing portion 16 is formed by the grooves 15a and 15b. An excitation electrode 14 is also formed on the other side surface, and after the excitation electrode 14 is formed, the dynamic vibration absorbing portion 18 is formed by forming the grooves 17a and 17b.

【0026】

The excitation electrodes 13 and 14 are arranged so as to face each other in the central region of the piezoelectric substrate 12 in the length direction. By applying an AC voltage between the excitation electrodes 13 and 14, width slip vibration is excited in the piezoelectric substrate portion where the excitation electrodes 13 and 14 face each other. Therefore, the piezoelectric substrate portion on which the excitation electrodes 13 and 14 face each other constitutes the piezoelectric vibration portion. The excitation electrode 13 is electrically connected to the terminal electrode described later at its end 13a, and the excitation electrode 14 is electrically connected to the terminal electrode at its end 14a. Therefore, with respect to the excitation electrode 13, the portion farther than the grooves 15a and 15b does not function as an electrode, and with respect to the excitation electrode 14, the portion farther than the grooves 17a and 17b does not function as an electrode.

【0027】

In the piezoelectric resonator 11 of this embodiment, the dynamic vibration absorbing portions 16 and 18 are formed by forming the grooves 15a, 15b, 17a, and 17b, respectively. Further, the piezoelectric substrate portion on the side of the grooves 15a and 17a is the first connecting portion, the piezoelectric substrate portion on the side of the grooves 15b and 17b is the second connecting portion, and the piezoelectric substrate portion on the outside of the grooves 15b and 17b. Consists of the holding part. The dynamic vibration absorbing units 17 and 18 vibrate in response to the vibration leaked from the vibrating unit, and suppress the vibration by the dynamic vibration absorbing phenomenon. Therefore, preferably, the shapes of the dynamic vibration absorbing parts 17 and 18 are determined so that the natural frequencies of the dynamic vibration absorbing parts 16 and 18 are equal to the frequency of the vibration propagating from the vibration parts.

【0028】

In the piezoelectric resonator 11 of this embodiment, the vibration that is not confined in the piezoelectric vibrating portion, that is, the vibration that leaks from the vibrating portion toward both end surfaces of the piezoelectric substrate is sufficiently dampened by the dynamic vibration absorbing portions 16 and 18. To. Therefore, the vibration energy is surely confined between the regions where the dynamic vibration absorbing portions 16 and 18 are formed. Therefore, even if the length of the piezoelectric substrate 12 is shortened, almost no vibration is transmitted to the piezoelectric substrate portion outside the dynamic vibration absorbing portions 16 and 18, so that the piezoelectric substrate 12 does not deteriorate in resonance characteristics. The vicinity of both ends in the length direction can be mechanically held.

【0029】

FIG. 1 is a perspective view showing a combined state of chip-type piezoelectric resonance components incorporating the piezoelectric resonator 11 shown in FIG. As shown in FIG. 1, a pair of spacer plates 21 and 22 are arranged on both side surfaces of the piezoelectric resonator 11. The spacer plates 21 and 22 are formed with recesses 21a and 22a, respectively, so as not to interfere with the vibration of the vibrating portion of the piezoelectric resonator 11. The combined resonance plate 25 is formed so that the ends of the spacer plates 21 and 22 are in contact with both side surfaces of the piezoelectric resonator 11. Terminal electrodes 23 and 24 are formed on the upper surfaces of both ends of the resonance plate 25. Since the piezoelectric resonator 11 is formed with a groove as described above, the terminal electrode 23 is electrically connected only to the excitation electrode 14 of the piezoelectric resonator 11. Further, the terminal electrode 24 is electrically connected only to the excitation electrode 13 of the piezoelectric resonator 11.

【0030】

The upper and lower parts of the resonance plate 25 are sandwiched and laminated by the case substrates 28 and 29 via the spacer frame materials 26 and 27, respectively. The spacer frame members 26 and 27 are interposed to provide a gap so that the case substrates 28 and 29 do not come into contact with the vibrating portion of the piezoelectric resonator 11 and hinder the vibration. Instead of such spacer frame materials 26 and 27, an adhesive layer may be formed with a sufficient thickness to serve as a spacer. Further, a recess may be formed in the inner portions of the case substrates 28 and 29, and a gap may be provided so as not to interfere with the vibration of the vibrating portion of the piezoelectric resonator 11. External connection electrodes 30 and 31 are formed at both ends of the upper surface of the case substrate 28.

【0031】

FIG. 4 is a perspective view showing a laminated body obtained by laminating case substrates 28 and 29 on the top and bottom of the resonance plate 25 via spacer frame members 26 and 27 in the combined state shown in FIG. .. As shown in FIG. 4, end face electrodes 32 and 33 are formed on both end faces of the laminated body. The end face electrode 32 is electrically connected to the external connection electrode 31 on the case substrate 28, and the end face electrode 33 is electrically connected to the external connection electrode 30. Further, the terminal electrode 24 shown in FIG. 1 is electrically connected to the end face electrode 32, and the terminal electrode 23 shown in FIG. 1 is electrically connected to the end face electrode 33.

【0032】

FIG. 5 is a perspective view showing an example of a manufacturing process for mass-producing the resonance plate 25 shown in FIG. As the spacer plate of the mother, the spacer plate 41 of the mother having a plurality of rows of recesses 41a formed on the upper surface, the spacer plate 42 of the mother having a plurality of rows of recesses 42a formed on the upper surface and the lower surface, and a plurality of rows on the lower surface. Prepare the mother spacer plate 43 on which the recess 43a is formed, first place the mother spacer plate 41 at the bottom, and then place the mother piezoelectric resonator 44 along the row of the recess 41a. Put it on. Next, the mother spacer plate 42 is placed on this, the piezoelectric resonator 44 of the mother and the spacer plate 42 of the mother are alternately placed on it, and finally the spacer plate 43 of the mother is placed on the top, and the mother. To prepare a laminate of. By slicing this laminated body on the upper surface of the spacer plate 43 of the mother as shown by the dotted line, a resonance plate of the mother in which a plurality of resonance plates are arranged in the vertical direction and the horizontal direction is obtained. Using the resonance plate of this mother, the spacer frame material and the mother of the case substrate can be laminated so as to be arranged as shown in FIG. 1, and the mother of the laminated body to be the piezoelectric resonance component can be obtained. After the mother thus obtained is fired, each unit to be a piezoelectric resonance component can be cut and taken out to form an end face electrode or the like to form a piezoelectric resonance component.

【0033】

FIG. 6 is a perspective view showing a portion of the piezoelectric resonator in the piezoelectric resonance component of another embodiment according to the present invention, and shows an example of the piezoelectric resonator using the thickness slip vibration mode. The piezoelectric resonator 51 is configured by using a rectangular piezoelectric substrate 52 having an elongated planar shape. The piezoelectric substrate 52 is made of a piezoelectric material such as piezoelectric ceramics, and is polarized in the arrow P direction, that is, in the length direction.

【0034】

An excitation electrode 53 is formed on the upper surface of the piezoelectric substrate 52 so as to extend from one end surface 52a to the central region. On the other hand, an excitation electrode 54 is formed on the lower surface of the piezoelectric substrate 52 so as to extend from the other end surface 52b to the central region. The excitation electrodes 53 and 54 are arranged so as to face each other on the front and back sides via the piezoelectric substrate 52 in the central region of the piezoelectric substrate 52 in the length direction. Therefore, by applying an AC voltage between the excitation electrodes 53 and 54, the thickness slip vibration is excited in the piezoelectric substrate portion where the excitation electrodes 53 and 54 face each other. In this way, the piezoelectric substrate portion with the excitation electrodes 53 and 54 facing each other constitutes the piezoelectric vibration portion.

【0035】

On the upper surface of the piezoelectric substrate 52, grooves 57a and 57b extending in the width direction are formed between the vibrating portion and the end surface 52b. Similarly, on the lower surface of the piezoelectric substrate 52, grooves 55a and 55b extending in the width direction are formed in a region between the vibrating portion and the end surface 52a.

【0036】

In the piezoelectric resonator 51 of this embodiment, the dynamic vibration absorbing portion 58 is formed by forming the grooves 57a and 57b, and the dynamic vibration absorbing portion 56 is formed by forming the grooves 55a and 55b. Further, the piezoelectric substrate portion above or below the grooves 55a, 57a is the first connecting portion, the piezoelectric substrate portion above or below the grooves 55b, 57b is the second connecting portion, and the piezoelectric substrate outside the grooves 55b, 57b. The substrate portion constitutes the holding portion. Therefore, in the piezoelectric resonator 51 of the present embodiment, the vibration leaking from the vibrating portion in the direction of the end faces 52a and 52b of the piezoelectric substrate is sufficiently damped by the dynamic vibration absorbing portions 56 and 58. Therefore, it is possible to mechanically hold the vicinity of both ends of the piezoelectric substrate 52 in the length direction without causing deterioration of the resonance characteristics.

【0037】

FIG. 7 is a perspective view showing a state in which spacer plates are arranged on both side surfaces of the piezoelectric resonator 51 shown in FIG. 6 to form a resonance plate. A spacer plate 61 is arranged on one side surface side of the piezoelectric resonator 51, and a spacer plate 62 is arranged on the other side surface side. Recesses 61a and 62a are formed in the spacer plates 61 and 62 in order to form a gap so as not to interfere with the vibration of the piezoelectric resonator 51. A terminal electrode 63 is formed on the upper surfaces of the spacer plates 61 and 62 on the one end surface 52a side of the piezoelectric resonator 51, and this terminal electrode 63 is electrically connected to the excitation electrode 53 of the piezoelectric resonator 51. .. Further, although not shown, on the lower surface of the piezoelectric resonator 53 on the end surface 52b side, the terminal electrode electrically connected to the excitation electrode 54 (shown in FIG. 6) formed on the lower surface of the piezoelectric resonator 51 is a spacer plate. It is formed on the lower surfaces of 61 and 62.

【0038】

A case substrate can be attached to the top and bottom of the resonance plate shown in FIG. 7 in the same manner as in the embodiment shown in FIG. 1 to form a chip-type piezoelectric resonance component.

【0039】

FIG. 8 is a perspective view showing a piezoelectric resonator in a piezoelectric resonance component according to still another embodiment of the present invention, and shows an example of a double mode piezoelectric filter using a thickness slip vibration mode. The energy confinement type double mode piezoelectric filter 71 is configured by using an elongated rectangular piezoelectric substrate 72. The piezoelectric substrate 72 is made of a piezoelectric material such as piezoelectric ceramics and is polarized in the direction of arrow P. Excitation electrodes 73a and 73b are formed on the upper surface of the piezoelectric substrate 72 so as to face each other via a slit having a predetermined width. Similarly, the excitation electrodes 74a and 74b are formed on the upper surface of the piezoelectric substrate 72 at a portion separated from the excitation electrodes 73a and 73b and facing each other through a slit having a predetermined width.

【0040】

As shown by projection in FIG. 8, an excitation electrode 75 is formed on the lower surface of the piezoelectric substrate 72 so as to face the excitation electrodes 73a and 73b, and an excitation electrode 76 is formed so as to face the excitation electrodes 74a and 74b. Has been done.

【0041】

On the upper surface side of the piezoelectric substrate 72, the terminal electrode 77a provided at the end and the excitation electrode 73a are electrically connected by the connecting conductive portion, and the excitation electrode 74b and the terminal electrode 77b are electrically connected by the connecting conductive portion. Is connected. Further, the excitation electrode 73b and the excitation electrode 74a are electrically connected to each other by the connecting conductive portion. Similarly, on the lower surface of the piezoelectric substrate 72, the excitation electrodes 75 and 76 are electrically connected to each other by the connecting conductive portion. Has been done.

【0042】

In this embodiment, the first resonance portion is formed in the portion where the excitation electrodes 73a, 73b, 75 are formed, and the second resonance portion is formed in the portion where the excitation electrodes 74a, 74b, 76 are formed. .. Further, a 3-terminal type double mode piezoelectric filter is configured in which the terminal electrodes 77a and 77b are input / output ends and the excitation electrodes 75 and 76 are connected to a reference potential.

【0043】

In this embodiment, grooves 78a, 78b, 80a, 80b extending in the width direction are formed on the lower surface of the piezoelectric substrate 72, whereby the dynamic vibration absorbing portions 79 and 81 have the first resonance portion and the second resonance portion, respectively. It is formed between the portion and the end portion of the piezoelectric substrate 72. Further, the piezoelectric substrate portion above the grooves 78b and 80b holds the first connecting portion, the piezoelectric substrate portion above the grooves 78a and 80a holds the second connecting portion, and the piezoelectric substrate portion outside the grooves 78a and 80a holds the second connecting portion. It constitutes a part.

【0044】

The size of the dynamic vibration absorbing parts 79 and 81 is determined so as to sufficiently attenuate the vibration propagating from the resonance part. Therefore, also in this embodiment, the leakage of vibration to the end portion of the piezoelectric substrate 72 can be almost certainly prevented by the action of the dynamic vibration absorbing portions 79 and 81. Similar to the embodiment shown in FIG. 1, the piezoelectric resonator shown in FIG. 8 can also be made into a chip-type piezoelectric resonance component by providing spacer plates on both side surfaces to form a resonance plate and bonding the upper and lower portions thereof with a case substrate. it can.

【0045】

FIG. 9 is a perspective view showing a piezoelectric resonator used in the piezoelectric resonance component of the fourth embodiment of the present invention. The piezoelectric resonator 91 is an energy confined type piezoelectric resonator that utilizes a width slip vibration mode. The elongated rectangular piezoelectric substrate 92 is polarized in the direction of arrow P. Excitation electrodes 93 and 94 are formed on the upper surface of the piezoelectric substrate 92 along one side edge from the end faces 92a and 92b, respectively. The excitation electrodes 93 and 94 are formed so as to face each other in the central region on the upper surface of the piezoelectric substrate 92, and the terminal electrodes 95 having a relatively large area in the portion of the excitation electrodes 93 and 94 extending to the end faces 92a and 92b. , 96 are formed.

【0046】

Grooves 97a, 97b, 99a, 99b are formed from the side surface of the piezoelectric substrate 92 toward the inside as shown in the drawing, whereby the dynamic vibration absorbing portions 98, 100 are formed. The dynamic vibration absorption units 98 and 100 are provided to suppress the vibration transmitted from the vibration unit toward the end of the piezoelectric substrate 92 by the dynamic vibration absorption phenomenon, and are formed so as to have appropriate dimensions for suppressing the vibration. Has been done.

【0047】

The piezoelectric resonator shown in FIG. 9 is also made into a chip-type piezoelectric resonance component by providing spacer plates on both side surfaces to form a resonance plate and bonding the upper and lower portions thereof with a case substrate as in the embodiment shown in FIG. be able to. Even in such a piezoelectric resonance component, the action of the dynamic vibration absorbing portions 98,100 prevents the transmission of vibration to the end portion of the piezoelectric substrate 92, so that the length thereof can be shortened without deteriorating the resonance characteristics. This makes it possible to reduce the size of the chip-type piezoelectric resonance component.

【0048】

FIG. 10 is a perspective view showing a piezoelectric resonator used in the piezoelectric resonance component of the fifth embodiment of the present invention. The piezoelectric resonator 101 is an energy confined type piezoelectric resonator that utilizes a sliding mode. The elongated rectangular plate-shaped piezoelectric substrate 102 is polarized in the arrow P direction, that is, in the width direction orthogonal to the length direction. Grooves 103 and 104 are formed on one side surface of the piezoelectric substrate 102, and grooves 105 and 106 are formed on the other side surface. In the piezoelectric substrate portion sandwiched between the grooves 104 and the grooves 105, a piezoelectric vibrating portion using a slip mode is configured. That is, in the piezoelectric substrate portion between the grooves 104 and 105, the excitation electrodes 107 and 108 are formed on the upper surface of the piezoelectric substrate 102. The excitation electrodes 107 and 108 are formed so as to extend in the width direction as shown in the figure. Therefore, by applying an AC voltage from the excitation electrodes 107 and 108, the piezoelectric vibrating portion is vibrated in the sliding mode.

【0049】

On the other hand, dynamic vibration absorbing portions 109 and 110 are formed on the outside of the grooves 104 and 105, respectively. Further, holding portions 111 and 112 are formed on the outside of the grooves 103 and 106.

【0050】

That is, in this embodiment, the dynamic vibration absorbing portions 109 and 110 and the holding portions 111 and 112 are configured on both sides of the piezoelectric vibration portion by forming the grooves 103 to 106 on the piezoelectric substrate having a rectangular planar shape. The first connecting portion of the present invention is a piezoelectric substrate portion having a narrow lateral width in which the grooves 104 and 105 are formed, and the second connecting portion is a lateral width of the portion in which the grooves 103 and 106 are formed. It is a thin piezoelectric substrate part.

【0051】

Drawer electrodes 113,114 are formed on the holding portions 111,112, and the drawer electrodes 113,114 are electrically connected to the excitation electrodes 107,108.

【0052】

Also in this embodiment, the dynamic vibration absorption units 109 and 110 are provided to suppress the vibration leaking from the piezoelectric vibration unit toward the end of the piezoelectric substrate 102 by the dynamic vibration absorption phenomenon.

【0053】

By using the piezoelectric resonator 101 of the fifth embodiment in place of the piezoelectric resonator of the first embodiment, the piezoelectric resonance component according to the fifth embodiment can be obtained. Even in the piezoelectric resonance component obtained in the fifth embodiment, the vibration energy is confined to the parts of the dynamic vibration absorbing parts 109 and 110 by the action of the dynamic vibration absorbing parts 109 and 110, so that the length of the piezoelectric substrate 102 is not deteriorated without deteriorating the resonance characteristics. Can be shortened. Therefore, the size of the chip-type piezoelectric resonance component can be reduced.

【0054】

As is clear from the second to fifth embodiments, in the present invention, various piezoelectric resonators with a built-in dynamic vibration absorber using a slip mode are used instead of the piezoelectric resonators of the first embodiment. be able to. Another example of such an energy confined piezoelectric resonator with a built-in dynamic vibration absorber will be described with reference to FIGS. 11 to 13.

【0055】

The piezoelectric resonator 121 shown in FIG. 11 is configured by using an elongated rectangular piezoelectric substrate 122. In the piezoelectric substrate 122, the dynamic vibration absorbing portions 131 to 134 are formed by forming the grooves 123 to 126 on one side surface side and forming the grooves 127 to 130 on the other side surface side. Further, the piezoelectric substrate portion between the grooves 124 and 125 constitutes the piezoelectric vibration portion 135 in the present invention. Further, holding portions 136 and 137 are formed on the outer sides of the grooves 123 and 126, respectively. The first connecting portion of the present invention is a piezoelectric substrate portion sandwiched between the grooves 124 and 128 and a piezoelectric substrate portion sandwiched between the grooves 125 and 129, and the second connecting portion is a piezoelectric substrate portion sandwiched between the grooves 123 and 127. It is a substrate portion and a thin piezoelectric substrate portion between the grooves 126 and 130.

【0056】

In the piezoelectric vibrating unit 135, the piezoelectric plate is polarized so as to be in the direction of arrow P in the figure, that is, in the length direction of the piezoelectric substrate 122. On the other hand, the excitation electrodes 138 and 139 are formed on the upper surface of the piezoelectric substrate 122 in parallel with the polarization direction P. That is, the excitation electrodes 138 and 139 are formed on the upper surface of the piezoelectric substrate 122 in the piezoelectric vibration unit 135.

【0057】

Therefore, by applying an AC voltage from the excitation electrodes 138 and 139, the piezoelectric vibrating unit 135 is excited in the sliding mode. On the other hand, the dynamic vibration absorption units 131 to 134 are configured to suppress the vibration leaking from the piezoelectric vibration unit 135 via the first connecting portion by the dynamic vibration absorption phenomenon. Therefore, even in the piezoelectric resonator 121, the vibration energy is confined up to the portion where the dynamic vibration absorbing portions 131 to 134 are provided.

【0058】

The lead-out electrodes 140 and 141 are formed on the holding portions 136 and 137. In the piezoelectric resonator 121 shown in FIG. 11, the leaked vibration is transmitted by forming a plurality of grooves so as to face each other from both side surfaces of the piezoelectric substrate 122 toward the center in the width direction as described above. The dynamic vibration absorbing parts 131, 133 and 132, 134 are configured on both sides of the portion.

【0059】

FIG. 12 is a modification of the piezoelectric resonator 121 shown in FIG. The difference from the piezoelectric resonator 121 is that in the piezoelectric resonator 151, the piezoelectric vibrating portion 135 is polarized in the direction of the arrow P in the figure, that is, parallel to the width direction of the piezoelectric substrate 122, and the excitation electrodes 138 and 139 are in the width direction. It is formed to extend. Since the other configurations are almost the same as those of the piezoelectric resonator 121, the description thereof will be omitted by assigning the same reference numbers to the same parts.

【0060】

FIG. 13 is a perspective view showing still another modification of the piezoelectric resonator 121 shown in FIG. In the piezoelectric resonator 161, the piezoelectric vibrating portion 135 is polarized in the direction of the arrow P in the figure, that is, in the length direction of the piezoelectric substrate 122. The difference from the piezoelectric resonator 121 is the formation position of the electrode.

【0061】

That is, in the piezoelectric resonator 161, the excitation electrodes 138 and 139 are formed on both side surfaces of the piezoelectric substrate 122 in the piezoelectric vibrating portion 135. Therefore, by applying an AC voltage from the excitation electrodes 138 and 139, the piezoelectric vibrating unit 135 is excited in the sliding mode.

【0062】

Further, in the piezoelectric resonator 161, the extraction electrodes 140 and 141 are formed on the side surfaces of the piezoelectric substrate 122 in the holding portions 136 and 137, respectively. Further, a connecting conductive portion that electrically connects the extraction electrodes 140, 141 and the excitation electrodes 138, 139 is also formed along the side surface of the piezoelectric substrate 122.

【0063】

Also in the piezoelectric resonator 161, the piezoelectric vibrating unit 135 is excited in the sliding mode by applying an AC voltage between the excitation electrodes 138 and 139. Further, as is clear from the piezoelectric resonator 161, the excitation electrode for exciting the sliding mode may be formed not only on the upper surface and the lower surface of the piezoelectric plate constituting the piezoelectric vibrating portion but also on the side surface. Further, for example, in the piezoelectric resonator 121 shown in FIG. 11, one resonance electrode 139 may be formed on the lower surface of the piezoelectric substrate 122, or in the piezoelectric resonator 161, one excitation electrode 138 or 139 may be formed. However, it may be formed on one main surface side of the piezoelectric substrate 122.

【0064】

Further, in the above-described embodiment, the piezoelectric vibrating portion, the first and second connecting portions, the dynamic vibration absorbing portion and the holding portion constituting the piezoelectric resonator are configured by machining a single piezoelectric substrate. However, these parts may be composed of separate members. For example, as shown in FIG. 14, the substrate 174 may be formed by joining the insulating plates 172 and 173 having the same thickness to the rectangular piezoelectric plate 171 for forming the piezoelectric vibrating portion. The substrate 174 may be used to form, for example, the piezoelectric resonator 11 used in the first embodiment or other piezoelectric resonator. In the substrate 174 shown in FIG. 14, the dynamic vibration absorbing portions 175,176 and the holding portions 177,178 are integrally formed on the insulating plates 172,173, but each of these portions may also be composed of separate members.

【0065】

Further, in the piezoelectric resonator used in the above-described embodiment, the holding portion is formed wider than the second connecting portion, and is configured to have the original width of the rectangular piezoelectric substrate. , As shown in FIG. 15, substrate portions 179,180 of the same width may be formed on the outside of the dynamic vibration absorbing portions 175,176. In this case, the substrate portions 179,180 also serve as the second connecting portion and the holding portion, so that the holding portion is configured to have the same width as the second connecting portion.

【0066】

Further, in the piezoelectric resonance component of the first embodiment, the resonance plate 25 is configured by joining the spacer plates 21 and 22 to the sides of the piezoelectric resonator 11, but the piezoelectric resonator 11 and the spacer plate 21 are formed. , 22 may be integrated to form a resonance plate. An example of a piezoelectric resonance component using a resonance plate composed of an integral member is shown in an exploded perspective view in FIG.

【0067】

In the piezoelectric resonance component shown in FIG. 16, the resonance plate 201 is used. The resonance plate 201 has a rectangular frame-shaped support portion 202, and a piezoelectric vibration portion and a dynamic vibration absorption portion are arranged in an opening 203 surrounded by the rectangular frame-shaped support portion 202. That is, the resonance plate 201 is essentially configured in the same manner as the resonance plate 25 shown in FIG.

【0068】

Therefore, the description thereof will be omitted by assigning a corresponding reference number to the corresponding part. The resonance plate 201 can be obtained by preparing a piezoelectric plate having a rectangular planar shape and hollowing out the piezoelectric plate by etching with a laser or the like.

【0069】

Since the resonance plate 201 is constructed by using a single piezoelectric plate, it has excellent environmental resistance. That is, in the resonance plate 25 shown in FIG. 1, since the joint portion A (FIG. 1) between the piezoelectric resonator 11 and the spacer plates 21 and 22 was present, the adhesion at the joint portion A was insufficient. In some cases, there is a problem that moisture or the like is likely to enter. On the other hand, in the resonance plate 201, since such a joint portion A does not exist, the vibrating portion is surely sealed. Therefore, a piezoelectric resonance component having excellent environmental resistance can be obtained.

【0070】

In the above embodiment, the dynamic and vibration absorbing parts are formed on both sides of the vibrating part of the piezoelectric substrate, but the dynamic and vibration absorbing parts do not necessarily have to be formed on both sides of the vibrating part, and the dynamic and vibration absorbing parts are formed on one side of the vibrating part. It may be formed only in. Even in such a case, the vibration energy can be more effectively confined as compared with the conventional piezoelectric resonator.

【0071】

Further, a plurality of dynamic vibration absorbing portions may be formed between the vibrating portion and the end face of the piezoelectric substrate. In this case, a plurality of the piezoelectric substrates may be formed only on one surface side, or a plurality of the piezoelectric substrates may be formed on both sides of the one surface and the other surface.

[Simple explanation of drawings]

[Figure 1]

The perspective view which shows the piezoelectric resonance component of 1st Example of this invention.

[Figure 2]

The perspective view which shows the conventional energy confinement type piezoelectric resonator.

[Fig. 3]

The perspective view which shows the energy confinement type piezoelectric resonator used in 1st Example.

[Fig. 4]

The perspective view which shows the state which was bonded and laminated in 1st Example.

[Fig. 5]

The perspective view for demonstrating an example of the process of manufacturing the piezoelectric resonance component of 1st Example.

[Fig. 6]

The perspective view which shows the piezoelectric resonator used in the 2nd Example of this invention.

[Fig. 7]

The perspective view which shows the state which combined the spacer plate with the piezoelectric resonator shown in FIG. 6 to form a resonance plate.

[Fig. 8]

The perspective view which shows the piezoelectric resonator used for the piezoelectric resonance component of 3rd Example according to this invention.

[Fig. 9]

The perspective view which shows the piezoelectric resonator used for the piezoelectric resonance component of 4th Example according to this invention.

[Fig. 10]

The perspective view which shows the piezoelectric resonator used for the piezoelectric resonance component of 5th Example.

[Fig. 11]

The plan view which shows the piezoelectric resonator used in the 6th Example.

[Fig. 12]

The plan view which shows the modification of the piezoelectric resonator used in this invention.

[Fig. 13]

The perspective view which shows the other modification of the piezoelectric resonator used in this invention.

[Fig. 14]

The perspective view for demonstrating the modification of the substrate used in this invention.

[Fig. 15]

The perspective view which shows the other modification of the substrate used in this invention.

[Fig. 16]

The exploded perspective view for demonstrating the piezoelectric resonance component of the modification of the Example shown in FIG.

[Explanation of symbols]

11 ... Piezoelectric resonator 13,14 ... Excitation electrode 16,18 ... Tuned mass damper 21,22 ... spacer plate 21a, 22a ... Recesses formed in the spacer plate 23,24 ... Terminal electrodes 25 ... Resonant plate 26,27 ... Spacer frame material 28,29 ... Case board 101 ... Piezoelectric resonator 102 ... Piezoelectric substrate 107,108 ... Excitation electrode 109,110 ... Tuned mass damper 111,112 ... holding part 113,114 ... Drawer electrode 121 ... Piezoelectric resonator 122 ... Piezoelectric substrate 131 ~ 134 ... Tuned mass damper 136,137 ... holding part 138,139 ... Excitation electrode 140,141 ... holding part 151,161 ... Piezoelectric resonator