Chip-type piezoelectric resonance component

The invention relates to a chip-shaped block with piezoe tric resonance, which z. B. on a surface of a substrate can be mounted, and in particular to such a chip-type construction stone piezoelectric resonance, in which vibration energy in egg nem piezoelectric resonator eingefan by dynamic damping gen is.

As piezoelectric resonator for a kHz band Various Embodiments are used. This can eg. As to act a resonator of an expansion vibration mode rectangular shaped piezoelectric plate exploits, or to a resonator, a length vibration mode of a rod-shaped pie zoelektrischen body exploits. Such a resonator can but also be one which has a tuning fork.

In the realization of a piezoelectric resonator whose Reso nanzteil oscillates upon application of a voltage, it is necessary that keep resonator so that its resonance is not disturbed. At a piezoelectric resonator energy trap is the vibrational energy captured in its resonant member, so that the possibility of the keep resonator mechanically in an area outside the Re sonanzteils located. Such equipped with energy trap resonator is because of its good operating characteristics preferable as piezoelectric shear resonator for a kHz band used.

For a resonator with expansion vibration mode or with Längenvi brationsmode, commonly referred to as piezoelectric resonator in the kHz Band be used, but it is impossible, a vibration energy catch. According to<b>Fig.</b> 1A is therefore a conventional piezoelectric shear resonator <b>91</b>Wherein a length vibration mode is used, by spring terminals <b>92</b>. <b>93</b> held, the nodal points hold. Even when a rectangular piezoelectric resonator, exploits an expansion vibration mode and is not able to capture vibrational energy whose nodes by Fe deranschlüsse held. The above-mentioned piezoelectric resonators with expansion vibration mode or length vibration mode for a kHz therefore band have a rather complicated structure and it is extremely difficult, such a piezoelectric resonator as miniaturized form module that can be mounted on a surface.

Another conventional piezoelectric resonator is in <b>Fig.</b> 1B shown. This is a piezoelectric resonator<b>96</b> turned with tuning fork, in which vibration energy into vibrating parts will begin. This resonator<b>96</b> includes a piezoelectric plate <b>94</b>. which is polarized along its thickness, slots <b>94</b>a to <b>94</b>c within the piezoelectric plate <b>94</b> and vibrating electrodes <b>95</b>a two to Major surfaces of the piezoelectric plate <b>94</b> and around the central slot <b>94</b>b around (the vibrating electrode on the lower side is in <b>Fig.</b> 1B unrecognizable). The piezoelectric resonator<b>96</b> with Ab tuning fork may thus be as a surface-chip package are forming because its operating characteristics remain unchanged even if he in the edge <b>94</b>d and <b>94</b>e the piezoelectric Plätte <b>94</b> is maintained.

In this piezoelectric resonator <b>96</b> with tuning fork is ever but due to vibration limits the assured band width is only about 2% of the resonant frequency, although it is capable of Vibra dissociation energy capture. He can not, therefore, as a piezoelectric wide bandresonator be used, which can be used in the kHz band.

From DE 29 39 844 C2 a vibrator for transverse vibrations is already known, the resonance unit connected via bridge portions with elastic members includes. The elastic members are each adjoined by a fastening portion to which the transducer is mounted on holding plates on a continuous plate are mounted. The elastic members disposed between the fastening parts and the Re are sonanzeinheit provided thereby act as usual resilient hang point transmission medium for oscillating elements.

In the earlier application DE 43 21 949 A1, a piezoelectric resonator is be written, having a resonance unit that dynamic damper with Hal parts of the unit is coupled.

In another earlier application (DE 43 22 144 A1) is a piezoelectric Vibra shown gate unit having a resonance unit which via a dynamic Damper is connected to a holding element.

The invention is based on the object of another chip-type component of provide the aforementioned type which, in particular in various Fre quency bands, can also use the kHz band, and increased bandwidth having.

The solution of the problem is in the characterizing portion of claim 1 indicated. Advantageous embodiments of the invention are in the dependent claims refer to.

When chip-module piezoelectric resonance after He invention is the above-mentioned piezoelectric resonator with dynamic Shem damper inserted so that propagating vibrations through be suppressed or extinguished dynamic damping, so that on this way is limited and captured the vibration energy. The This phenomenon of the dynamic damper is described in detail in "Vibration Engineering" by Osamu Taniguchi, Corona Publishing Co., Ltd., pages 113 to 116. Briefly, in the dynamic damper the vibration of a main vibrator not attenuated, while others hand to the main vibrator a Subvibrator connected which for Vibration damping of a suitably selected natural frequency has. The aforementioned dynamic damper in the novel Block piezoelectric resonance corresponds to the Subvibrator, the from the main vibrator coming attenuates vibrations and in this way holds captured the vibration energy of the main vibrator.

In the piezoelectric resonator of the block according to the invention with piezoelectric resonance is with other words, the vibration Sener gy of the resonance unit kept trapped in an area of ​​up to the dynamic damper ranges. The piezoelectric resonator processing tet therefore as such an energy trap.

In accordance with the present invention is a retaining plate connected to the retaining part of the piezoelectric resonator to the Vi brationsteil enclose the piezoelectric resonator. By However, holding plate and the holding parts are the vibrations of vibrie -generating portion of the resonator is not obstructed, so not Schwin conditions of the piezoelectric resonance unit, the dynamic Damper or the vibrations of those portions over which the piezoe tric resonance unit and the dynamic damper ver together connected are. Further, the piezoelectric resonator according to the He making first and second housing portions secured to upper and lower preparation Chen of the piezoelectric resonator connected, but also the not impede vibrations of the components mentioned. Between the he first and second housing parts and the piezoelectric resonator are spaces available, in which the vibrating parts of piezoe tric resonator can move into it in terms of vibration. To this Way can be a chip-component piezoelectric Reso resonance form that is easily on the surface of the substrate can be mounted.

The piezoelectric resonance unit may be one z. B., in a length vibration mode, an expansion vibration mode of a pretty corner-shaped plate or a Scherungsvibrationsmode occurs. Thereby can be a chip-module piezoelectric resonance from Making High-energy event type in a wide frequency band can be used, which is also the kHz band, and the band MHz includes.

According to one embodiment of the invention, the piezoelectric resonators are tor and the spacer plate integral parts of the aforesaid Element plate. In this case, the spacer plate has a first and a second spacer plate, wherein the first spacer plate having first En the first and second holding parts of said piezoelectric resonator and the second spacer plate having second ends of the first and second Holding parts of the piezoelectric resonator are connected, so that by the first and second spacer plates and the first and second support plates, an opening portion is bounded, in which the piezoe lectric resonant unit and the dynamic dampers are. The first and second spacer plates and the piezoelectric resonator are integrally connected to each other so that a rectangularly frame-shaped support member is obtained, the said opening having. This is the fifth to ninth embodiments, the case. The piezoelectric resonator is, in other words of the law surrounded eckrahmenförmigen component that no connection or Ver having klebungsbereiche. It is therefore possible to provide a chip-type construction to obtain stone piezoelectric resonance, the order against the environment is better sealed.

Should the piezoelectric resonator and the spacer plates integrally be integrally connected to each other, it can be a rectangular Plate, z. B. a piezoelectric ceramic plate or a metal plate a piezoelectric thin film carries, by a laser beam or edit or restructure to accordingly by etching the rectangular frame-shaped spacer plate and the piezoelectric Re resonator to obtain. The preparation of the floorboard can thus be collected Lich be simplified, which is also beneficial to the manufacturing affects process of chip-type device of the invention. This building stone is very well protected against environmental influences, for example against the penetration of moisture, and the like, in various NEN frequencies to be used and is as easy to produce, rela tively low cost.

The invention will nä below with reference to the drawing ago described. Show it:

<b>Fig.</b> 1A and 1B are a perspective view and a top view of conventional piezoelectric resonators;

<b>Fig.</b> 2 shows an exploded view of a chip-shaped block with pie zoelektrischer resonance according to a first exemplary embodiment of the invention in perspective view;

<b>Fig.</b> 3A and 3B are a plan view of a piezoelectric resonator according to the first embodiment of the invention, as well as a top view on lower electrodes through a ceramic plate through;

<b>Fig.</b> 4 is a perspective view of a chip-shaped block with piezoelectric resonance according to the first embodiment dervor invention:

<b>Fig.</b> 5 is a perspective view of a modification of a housing;

<b>Fig.</b> 6 shows an exploded view of a chip-shaped block with pie zoelektrischer resonance according to a second embodiment of the prior invention in perspective view;

<b>Fig.</b> 7A and 7B are a plan view of a piezoelectric resonator in the second embodiment of the present invention and a typi cal plan view shapes of lower electrodes through a ceramic plate therethrough;

<b>Fig.</b> 8 is a perspective view of a chip-shaped block with piezoelectric resonance according to the second embodiment of the present invention;

<b>Fig.</b> 9 is a perspective view of a ceramic block to form egg existing ner according to the second embodiment of the invention Element plate;

<b>Fig.</b> 10 is a partial perspective view of a laminate, which he characterized will hold that ceramic blocks to form a piezoelectric Reso nators and a spacer plate are stacked;

<b>Fig.</b> 11 is a perspective view of a mother wafer to form Floorboards;

<b>Fig.</b> 12 is a cross sectional view showing the structure of a chip-chip piezoelectric resonance for a DRIT exemplary embodiment of the present invention;

<b>Fig.</b> 13 is an exploded view for explaining the construction of a chip-chip piezoelectric resonance for a four exemplary embodiment of the present invention;

<b>Fig.</b> 14 is a perspective view of a chip-shaped block with piezoelectric resonance according to a fifth embodiment of the present invention;

<b>Fig.</b> 15A and 15B are perspective views of a ceramic block to Formation of a piezoelectric resonator according to the fourth Ausfüh tion of the present invention as well as a piezoelectric Plate which is obtained by the ceramic block first polari is Siert and then cut;

<b>Fig.</b> 16 is a perspective view of a piezoelectric plate with a plurality of grooves or trenches;

<b>Fig.</b> 17 is a perspective view of the piezoelectric plate by <b>Fig.</b> 16, which is connected to ceramic blocks to the spacer plates to to obtain the two surfaces of the piezoelectric plate;

<b>Fig.</b> 18 is a perspective view for explaining a modification of the piezoelectric resonator according to the fourth embodiment the present invention;

<b>Fig.</b> 19 is a perspective view for explaining a step of Preparing an element plate for the fifth embodiment of the present invention;

<b>Fig.</b> 20 is a perspective view of the element plate in the fifth off guidance for the present invention;

<b>Fig.</b> 21A and 21B are a perspective view and a plan view for explaining an element plate for a sixth embodiment the present invention;

<b>Fig.</b> 22 is a perspective view of an element plate for a seventh Embodiment of the present invention;

<b>Fig.</b> 23 is a perspective view of an element plate for an eighth Embodiment of the present invention;

<b>Fig.</b> 24 is a perspective view of an element plate characterized is obtained, that a piezoelectric thin film on a metal plate is applied;

<b>Fig.</b> 25A and 25B is a plan view of an element plate for a ninth embodiment of the present invention and a typi cal plan view of lower electrodes by a piezoelectric Kera ceramic plate therethrough; and

<b>Fig.</b> 26 is an exploded view for explaining a method for producing a chip-shaped device with piezoelectric Reso resonance according to the invention.

The <b>Fig.</b> 2 shows an exploded view of a chip-shaped block piezoelectric resonance according to a first embodiment of the present invention. In this chip-module with piezoelectric resonance is a plate-shaped piezoelectric resonator <b>1</b> for use. The piezoelectric resonator<b>1</b> has a piezoelectric resonance unit <b>2</b> on, the length of a vibration mode exploits. Here, the piezoelectric resonator<b>1</b> as a resonator with Energy trap is formed as will be described in more detail below.

According to the <b>Fig.</b> 3A and 3B, the piezoelectric resonator <b>1</b> in its center a piezoelectric resonance unit <b>2</b> in which a elongated, rectangular structure. These piezoelectric resonances zeinheit <b>2</b> is uniform polarization of an elongated pie zoelektrischen ceramic plate obtained, the polarization along carried out the thickness of this plate. In this resonance electrodes come<b>2</b>a and <b>2</b>b on the upper and lower surfaces of the resonance unit <b>2</b> to lie. The piezoelectric ceramic plate to form the piezoelectric Reson anzeinheit <b>2</b> and a dynamic damper and a support member are, as will be explained, by editing a single Kera prepared ceramic plate to obtain a planar structure. Alternatively Kings NEN these components produced and mitein also independently be connected or integrated other, for example by a Kle ber, and the like.

A vibration transmission part <b>3</b> is connected to a side surface of a lon gitudinalen central portion of the piezoelectric resonance unit <b>2</b> verbun the, during a dynamic damper <b>4</b> with an outer end of Vi brationsübertragungsteils <b>3</b> coupled. The vibration transmission part <b>3</b> is a vibration node of the piezoelectric Reson anzeinheit <b>2</b> coupled, which in the longitudinal central portion of the Re sonanzeinheit <b>2</b> is present in order to prevent in this way that Vibrations in the direction of the vibration transmission part <b>3</b> out lick. However, it is not absolutely necessary, the Vibrationsübertra supply portion <b>3</b> with the lengthwise direction of the piezoelectric Resonanzein ness <b>2</b> couple lying central part because propagating Schwingun gene by the action of the dynamic damper <b>4</b> are suppressed, as will be described.

The dynamic damper <b>4</b> consists of a rectangular plates in part, the vibration, the resonance in the piezoelectric Re sonanzeinheit <b>2</b> via the vibration transmission part <b>3</b> transmitted who the, is excited to bending vibrations. A specific Vibrationsfre frequency of the dynamic damper <b>4</b> is substantially, and preferably equal to the resonance frequency of the piezoelectric resonance unit <b>2</b>. whereby it is possible, vibrations propagating through dynamic cal damping effectively suppress.

A coupling member <b>5</b>be, the z. B. formed as a rectangular plate can, is lying with the longitudinal central part of the outer side of the dynamic damper <b>4</b> connected, whereas a holding member <b>6</b> With rectangular shape to the other end of the coupling member <b>5</b> connected is. In this case, the holding part<b>6</b> a specific surface level (degree of area) or a predetermined area ratio.

A vibration transmission part <b>7</b>, A dynamic damper <b>8th</b>, A Kop plungsglied <b>9</b> and a retaining member <b>10</b> are also on the gegenüberlie ing side of the piezoelectric resonance unit <b>2</b> and are there in the same manner as the corresponding parts arranged on the side of dynamic damper <b>4</b>,

The resonance electrode <b>2</b>a is electrically connected to a terminal electrode <b>12</b>a connected, focusing on an upper surface of the holding part <b>6</b> is located, and via a connecting line <b>11</b>a. Similarly, the Reso nanzelektrode <b>2</b>b electrically connected to a terminal electrode <b>12</b>b a connecting line <b>11</b>b, wherein the terminal electrode <b>12</b>b on a lower surface of the holding part <b>10</b> is.

In the piezoelectric resonator <b>1</b> an AC voltage across the terminal electrodes <b>12</b>a and <b>12</b>b across the resonance electrodes <b>2</b>a and <b>2</b>b scheduled to stretching vibrations (length modes) of piezoelectric rule resonance unit <b>2</b> causing in the longitudinal direction thereof. The Vibrations licking toward the vibration transmission parts <b>3</b> and <b>7</b> are out and dynamically damped, namely due to the vibration the dynamic damper <b>4</b> and <b>8th</b>, In this manner, the vibration is in captured areas to the dynamic dampers <b>4</b> and <b>8th</b> rei Chen, whereby a piezoelectric resonator <b>1</b> obtain energy trap is, by the piezoelectric resonance unit <b>2</b>In the County genvibrationsschwingungen occur. This piezoelectric resonator<b>1</b> energy trap is a piezoelectric resonator for a frequency band, z. B. for a kHz band, formed and could not so forth previously be provided.

According to the <b>Fig.</b> 2 are first and second spacer plates <b>13</b> and <b>14</b> in this embodiment with the holding parts <b>6</b> and <b>10</b> the piezoe lektrischen resonator <b>1</b> connected. More specifically, the distance is plates <b>13</b> and <b>14</b> with the front sides of the retaining parts <b>6</b> and <b>10</b> connected or bonded. They extend along the holding parts<b>6</b> and <b>10</b> as Finally, perpendicular to them. In the present case, the distance plates <b>13</b> and <b>14</b> shaped such that they enclose the vibrating parts, Thus, the piezoelectric resonance unit <b>2</b>, The vibration transmission parts <b>3</b> and <b>7</b> and the dynamic damper <b>4</b> and <b>8th</b> the piezoelectric rule resonator <b>1</b> and last but not least, the coupling members <b>5</b>, there However, the vibrations caused by the spacer plates <b>13</b> and <b>14</b> not disabled. These spacer plates<b>13</b> and <b>14</b> can from suitable Materials are produced having a certain degree of stiffness on point. It can be with them to ceramic plates of alumina or be synthetic resin plates.

A floorboard <b>15</b> is obtained in that the spacer plates <b>13</b> and <b>14</b> with the piezoelectric resonator <b>1</b> get connected. First and second housing parts <b>16</b> and <b>17</b> in the form of rectangular plates come on the top and bottom surfaces of the plate element <b>15</b> to lie gen, wherein between the respective housing parts <b>16</b> and <b>17</b> on the one hand and the element plate <b>15</b> more layered adhesive bonds <b>18</b> and <b>19</b> lie. This adhesive bonds<b>18</b> and <b>19</b> have the rectangle shaped frame be formed. The housing parts<b>16</b> and <b>17</b> be made made of suitable materials, such as insulating Alumi oxide-ceramic plates or synthetic resin plates, etc. to as protective elements for the chip-type device with piezoelectric to serve resonance.

As mentioned above, the adhesive layers consist <b>18</b> and <b>19</b> from square shaped, flat frame with openings <b>18</b>a and <b>19</b>a, such as the <b>Fig.</b> 2 he can know. Through them enough space is made available, in the vibrating parts of the piezoelectric resonator <b>1</b> upward and can dodge below. For this purpose, the thickness of the adhesive layers<b>18</b> and <b>19</b> selected accordingly. In the assembled state of the resonator<b>1</b> So come as a result of the adhesive layers <b>18</b> and <b>19</b> the plates <b>16</b> and <b>17</b> at a distance from the elements <b>2</b>. <b>3</b>. <b>4</b>. <b>5</b>. <b>7</b>. <b>8th</b> and <b>9</b> to lie.

The adhesive layers <b>18</b> and <b>19</b> can be made of suitable material be and need only have a flat shape as illustrated. Through them, the first and second housing portions are <b>16</b> and <b>17</b> with the floorboard <b>15</b> connected or glued. For example, the in Form rectangular frame present adhesive layers <b>18</b> and <b>19</b> ei nem synthetic resin film be worn so that it differs from this on the floorboard <b>15</b> or on the housing parts <b>16</b> and <b>17</b> transfer leave. Alternatively, the adhesive layers may<b>18</b> and <b>19</b> but also by Kleber will be replaced, the both main surfaces of the plate element <b>15</b> or on the lower surface of the housing part <b>16</b> and on the upper surface of the housing part <b>17</b> aufgetra in the form of a rectangular frame gen is.

electrodes <b>16</b>a and <b>16</b>b are located on the upper surface of the first Ge housing part <b>16</b>, Similarly, there are electrodes on the lower surface of the second housing part <b>17</b>Wherein the electrodes extend along opposed edges.

The chip-module piezoelectric resonance after this he first exemplary embodiment is obtained by the in <b>Fig.</b> 2 ge showed elements stacked and interconnected who the. Subsequently, external electrodes<b>20</b> and <b>21</b> Einan at both the opposite ends of the laminated body arranged as the <b>Fig.</b> can recognize 4. The chip-module<b>22</b> piezoelectric Resonance to this embodiment can be reliable on the Surface of a printed circuit board, or the like Montie, ren, by means of an automatic machine, because the block in A rectangular plate is present, the external electrodes <b>20</b> and <b>21</b> on opposite end surfaces.

electrodes <b>16</b>a and <b>16</b>b, which is on the upper surface of the housin soul element <b>16</b> are, form parts of the external electrodes <b>20</b> and <b>21</b>, These electrodes <b>16</b>a and <b>16</b>b may be previously with the housing member <b>16</b> are connected, so that the external electrodes <b>20</b> and <b>21</b> only the need to cover both end surfaces of the laminated body. they then come up with the electrodes <b>16</b>a and <b>16</b>b in conjunction. But it is also possible on the previous training of the electrodes <b>16</b>a and <b>16</b>b on the upper surface of the housing member <b>16</b> to dispense and the ex internal electrodes <b>20</b> and <b>21</b> be designed such that it not only to the mutually opposite end surfaces of the resonant component <b>22</b> come to lie, but also on the upper and lower surfaces of the Housing. electrodes<b>20</b> and <b>21</b> safely grip the side edges of chip component <b>22</b>,

The <b>Fig.</b> 5 shows a perspective view of a housing part <b>27</b>, the a modification of the housing part <b>17</b> represents. The housing part<b>27</b> ge according to <b>Fig.</b> 5 has on its upper surface a rectangular, kon kaven areas <b>27</b>Å. If the housing part<b>27</b> instead of housing part <b>17</b> used, in this way a reliable space can defi kidneys, the movements of the vibrating parts of the piezoelectric resonator <b>1</b> can absorb. The vibrating parts shift Then into the concave portion <b>27</b>a into. The element plate<b>15</b> need then only on the housing part <b>27</b> to be launched, which ensures is that the above-mentioned space for accommodating the Schwingungsbewe tion is provided in each case. An adhesive is then used to connect the element plate <b>15</b> with the housing plate <b>27</b> along the edge region <b>27</b>b of the concave portion <b>27</b>a. In comparison to the use of the housing part <b>17</b> according to <b>Fig.</b> 2 can be used at the housing part <b>27</b> of the Space for receiving the vibrating parts of the piezoelectric Reso nators <b>1</b> safer define.

The upper housing part <b>16</b> can also by the housing part <b>27</b> corresponding housing part to be replaced, which then at its lower Surface having a concave recess in order here a rea to provide relevant and defined space available in the Move ten parts of the piezo <b>1</b> can swing into.

The <b>Fig.</b> 6 to 8 show a chip-type device with piezoelectric shear resonance according to a second embodiment of the present the invention.

According to <b>Fig.</b> 6, a piezoelectric resonator <b>31</b> by piezoe lectric resonant unit <b>32</b> formed a Expansionsvibrationsmo de a rectangular shaped, piezoelectric plate exploits. Other points of the second embodiment are similar to those of the first embodiment, and therefore corresponding parts corresponding reference numerals to reps avoid.

As the <b>Fig.</b> reveal 7A and 7B, the piezoelectric Re resonator <b>31</b> in its center, the piezoelectric resonance unit <b>32</b> on which an expansion vibration mode of a rectangular plate exploits. The piezoelectric resonance unit<b>32</b> is obtained by that resonance electrodes <b>32</b>a and <b>32</b>b on both major surfaces of a rectangular, the piezoelectric ceramic plate are arranged, which is uniformly polarized along its thickness. If on any joints lektroden <b>12</b>a and <b>12</b>b, an alternating voltage to the electrodes <b>32</b>a, <b>32</b>b applied, occurs in the piezoelectric resonance unit <b>32</b> an Reso resonance on the aforementioned expansion vibration. Nearest the ser expansion vibration mode located in the central preparation surfaces of the four sides of the rectangular, piezoelectric ceramic plate. For this reason, vibration transmission parts<b>3</b> and <b>7</b> With the central portions of two opposing sides coupled. Vibrations in the direction of vibration transmission parts <b>3</b> and <b>7</b> leaking, be dynamic damper <b>4</b> and <b>8th</b> damped or suppressed, by dynamic damping. In this way can capture the vibration energy in areas that extend to the dy namic dampers <b>4</b> and <b>8th</b> towards extending, similar to the piezoelectric resonator <b>1</b> according to the first embodiment of the Case was.

In accordance with the second embodiment, a pie zoelektrischer resonator energy trap obtained in which a Schwin supply vibration mode occurs, whereby a piezoelectric Wide bel dresonator obtained energy trap for a frequency band, the z. B. may be a kHz band.

Also in the second embodiment is an element plate <b>15</b> there by formed that spacer plates <b>13</b> and <b>14</b> with sides of piezoelectric resonator <b>31</b> are coupled in such a way that vi brier border areas of the piezoelectric resonator <b>31</b> not on Schwin gen are prevented. In addition, rectangular and plattenför mig trained body parts <b>16</b> and <b>17</b> with upper and lower preparation chen the floorboard <b>15</b> connected, through adhesive layers <b>18</b> and <b>19</b>To the in <b>Fig.</b> 8 shown chip-module with piezoe tric resonance to obtain, the reference numerals the <b>22</b> wearing.

Hereinafter, with reference to the <b>Fig.</b> 9 to 11 in detail a method for manufacturing a plate element according to the second OFF described implementation example, the ent the piezoelectric resonator holds.

The <b>Fig.</b> 9 shows by way of sectional view of the formation of a plurality of furrow <b>42</b> in both main surfaces of a ceramic block <b>41</b>Which in Direction of the arrow P is polarized. The furrows<b>42</b> are z. B. hineinge cut. Each of these grooves<b>42</b> is used to define areas, by the piezoelectric resonance unit <b>32</b>, Dynamic damper and holding parts are formed.

As the <b>Fig.</b> 10 can be further seen, the getting in this way NEN ceramic blocks <b>41</b>That furrows the <b>42</b> included, alternating with Kera mikblöcken <b>43</b> stacked, in turn, to the formation of Ab standing plates serve. By this stacking operation is a Mutterlami nat <b>44</b> receive.

This in <b>Fig.</b> 10 mother laminate shown <b>44</b> is then cut to a mother wafer <b>45</b> according to <b>Fig.</b> 11 to obtain. Thereafter, by Vacuum deposition or other appropriate means electrodes ge forms, and there are mother substrates <b>46</b> and <b>47</b> each with the top and lower portions of the mother wafer <b>45</b> connected. The resultant Layer body is then along the dotted lines A and B in Direction of its thickness cut. In this way, let Fertigpro manufacture products as a commodity, with a structure according to the second embodiment of the invention, but no end are available electrodes.

The mother substrate <b>47</b> with concave areas <b>47</b>a formation of Spaces provided, in which vibrating parts inside move, this being also the mother substrate <b>46</b> the case, although this is not in the individual is shown.

The method last described referring to the preparation of the Ele ment plate <b>15</b> according to the second embodiment, but may also for preparing the element board <b>15</b> after the first Ausführungsbei play are used in a similar finished products as Mas be able to produce senware.

The <b>Fig.</b> 12 shows a cross section for explaining a chip-type Block piezoelectric resonance for a third Ausfüh tion of the present invention. In this third Ausfüh tion for lying housing parts <b>52</b> and <b>53</b> in each case on an upper and on a lower surface of a plate-shaped piezoelectric resonators sector <b>51</b> energy trap type, which is capable of dynamic Dämp capture audit vibrations. Overall, a chip-module<b>54</b> similar piezoelectric resonance the first and second off obtain leadership example. In the present third Ausführungsbei game rooms are C and D present in which vibrating parts of piezoelectric resonator <b>51</b> can move into it. These spaces C and D are above and below a panel member <b>51</b> and obtained in that between the plate <b>51</b> and the housing parts <b>52</b>. <b>53</b> each adhesive layers <b>55</b> and <b>56</b> are present, the desired a having thickness. The housing parts<b>52</b> and <b>53</b> are each characterized it keep that synthetic resin films <b>52</b>b, <b>53</b>b on first surfaces of termisch curable resin plates <b>52</b>a, <b>53</b>a be applied. The GE housing parts <b>52</b>. <b>53</b> can therefore be made of suitable insulating materia lien produced, for example, synthetic resin films.

The <b>Fig.</b> 13 and 14 show a chip-shaped block with piezoe tric resonance according to a fourth embodiment of the present the invention.

According to the <b>Fig.</b> 13 is a piezoelectric resonator <b>61</b> out a piezoelectric resonance unit <b>62</b>Wherein a width Sche approximately vibration mode occurs. The piezoelectric resonance unit<b>62</b> is formed by a piezoelectric ceramic plate, a right having square planar shape. This ceramic plate is polarized so that Polarization axes in the direction of arrow P are aligned and paral lel run to the plate main surface.

The piezoelectric ceramic plate has on its upper surface a pair of of resonance electrodes <b>62</b>a, <b>62</b>b along both edges and parallel to the P direction on the polarization. By contrast, there are no resonance electrodes on the lower surface of the piezoelectric ceramic plate. The resonance electrodes <b>62</b>a, <b>62</b>b on the upper surface of the ceramic plate are electrically connected to terminal electrodes <b>12</b>a, <b>12</b>b connected, each to Weil located on an upper surface of a holding part. The Ver-called bond between the resonance electrodes and the terminal electrodes via conductive parts <b>63</b>a, <b>63</b>b.

In the present fourth embodiment, are both on circuit electrodes <b>12</b>a and <b>12</b>b each have an upper surface of the retainer partly as clear in <b>Fig.</b> can be seen. 13 Other configurations in the sem embodiment correspond to those of the first Ausfüh tion example.

The piezoelectric resonance unit <b>62</b> in <b>Fig.</b> 13 shows a latitude Scherungsschwingungsmodenresonanz, when an AC voltage via the terminal electrodes <b>12</b>a and <b>12</b>b across the resonance electrodes <b>62</b>a and <b>62</b>b is applied, as the piezo-electric resonance unit <b>62</b> in the The center of the piezoelectric resonator <b>61</b> is.

Furthermore, vibration transmission parts <b>3</b> and <b>7</b> with piezoe tric resonance unit <b>62</b> coupled while dynamic damper <b>4</b> and <b>8th</b> with the other ends of the vibration transmitting parts <b>3</b> and <b>7</b> ge are coupled. Vibration or vibration energy can thus be in Be capture rich, up to the dynamic dampers <b>4</b> and <b>8th</b> rich, similar to this is also the piezoelectric resonator <b>1</b> after the first Embodiment, the case was.

According to the fourth embodiment is thus a piezoelectric Resonator energy trap type obtained in the width shear vibrations are exploited.

Also in the fourth embodiment, spacer plates <b>13</b> and <b>14</b> With the side parts of the piezoelectric resonator <b>61</b> connected, each but the piezoelectric resonator <b>61</b> not prevent vibra gen. Overall, in turn, is a member plate <b>15</b> receive. rectangle shaped housing plates <b>16</b> and <b>17</b> are each provided with upper and lower Areas of the plate element <b>15</b> via adhesive layers <b>18</b> and <b>19</b> verbun the to a chip-shaped block <b>65</b> piezoelectric resonance to obtain, as in <b>Fig.</b> is shown the fourteenth electrodes<b>20</b> and <b>21</b> are at opposite end faces of the block <b>65</b> and are each Weil with the electrodes <b>12</b>a, <b>12</b>b in contact.

Referring to <b>Fig.</b> 15A to 17 is below a Ver method for the production of a plate element with a piezoelectric A resonator according to the fourth embodiment of the invention in individual NEN described.

According to <b>Fig.</b> 15A is a block <b>71</b> from a piezoelectric ceramic so prepared that in the whole area of ​​the upper and lower FLAE che the block <b>71</b> electrodes <b>71</b>a and <b>71</b>b are. Then, a DC voltage to the electrodes <b>71</b>a and <b>71</b>b down to the block <b>71</b> to polarize along the arrow P.

Thereafter, block <b>71</b> along the dashed lines Lines A cut to piezoelectric plates <b>72</b> according to <b>Fig.</b> 15B to receive. Such piezoelectric plate<b>72</b> is along the arrow P polarized, parallel to the main surface of the plate <b>72</b> runs.

Then, four grooves or trenches <b>73</b>a to <b>73</b>d in the upper surface the piezoelectric plate <b>72</b> introduced and four furrows <b>74</b>a to <b>74</b>d in the lower surface of the piezoelectric plate <b>72</b>, in fact by a suitable cutting technique. This state is shown in<b>Fig.</b> 16 ge shows.

Finally, ceramic blocks <b>75</b> and <b>76</b> the formation of distance plates each having the upper and lower surfaces of the piezoelectric plate <b>72</b> connected or glued, in accordance <b>Fig.</b> 17. It is now a so-called parent block <b>77</b> in front. To undertake a variety of element plates<b>15</b> to obtain, is this nut block <b>77</b> along the dashed Li nien B cut. The sectional planes running perpendicular to it extension direction of the trenches or furrows <b>73</b>. <b>74</b>Which are all parallel to each other.

While the resonance electrodes <b>62</b>a, <b>62</b>b, the conductive Verbindungstei le <b>63</b>a, <b>63</b>b, and the terminal electrodes <b>12</b>a and <b>12</b>b From the fourth guidance for the invention, all on the upper surface of piezoe tric resonator <b>61</b> come to lie, in which a width Sche approximately vibration mode occurs, these elements may alternatively on the side surfaces of the piezoelectric resonator <b>61</b> available be as the <b>Fig.</b> reveals 18th According to the<b>Fig.</b> are 18 to resonance electrodes <b>82</b>a and <b>82</b>b on two opposite sides surfaces of a piezoelectric ceramic plate along the arrow P is polarized, which runs parallel to the main surface of the ceramic plate lies. The piezoelectric ceramic plate is part of a piezoelectric resonance unit <b>82</b> a piezoelectric resonator <b>81</b>, Manager Ver connecting parts <b>83</b>a, <b>83</b>b and terminal electrodes <b>12</b>a, <b>12</b>b extend up if along the side surfaces of the piezoelectric resonator <b>81</b>, Other configurations of this embodiment are similar denje Nigen the piezoelectric resonator <b>61</b> the fourth Ausführungsbei , game and are provided with the same reference numerals. They will not again described.

In each of the aforementioned first to fourth embodiments are the piezoelectric resonator and the spacer plates by sepa rate parts formed, which are then joined together to to obtain an element plate. The respective production steps are somewhat more complicated and it is necessary for the Ab standing panels to the side parts of the piezoelectric resonator to connect. The connection portions in the first embodiment for example, in <b>Fig.</b> 2 marked with the arrows A. Specifically lie gene the connecting portions A between the piezoelectric resonator <b>1</b> and the spacer plates <b>13</b> and <b>14</b>Wherein the connection between the said parts is done by insulating adhesive material. The Verbin However tion areas A may have a defect that they do not fully permanently sealed so that the inside of the piezoe external pollutants can reach tric resonator. There may be, for. Example to Feuch act activity.

The fifth to ninth Ausführungsbeispie described below le of chip-modules piezoelectric resonance after Invention to environmental influences better protected, since in them not happen again said connecting areas A.

Each of the fifth to ninth embodiments stands out a special structure of the element plate, while the other Structures of any of the first to fourth embodiments, ver for the first and second housing parts and the formation of the spaces can be used, into which move the vibrating parts can. In each of the fifth to ninth embodiments are he ste and second spacer plates and first and second holding members by a Support member formed, which is in the form of a rectangular frame.

The <b>Fig.</b> 19 shows a perspective view of a piezoelectric Ke ramikplatte <b>121</b> to form a piezoelectric resonator according to the fifth embodiment of the invention. These piezoelectric Kera ceramic plate <b>121</b> is by editing a rechteckför get mig formed piezoelectric ceramic base plate. in the each containing the piezoelectric ceramic plate <b>121</b> a Trägerele ment <b>122</b> in the form of a rectangular frame and a piezoe tric ceramic plate part <b>123</b> to form a piezoelectric Re sonators, located in an opening <b>122</b>a of the rectangular-shaped Frame support member <b>122</b> is. Here, the frame<b>122</b> and the element <b>123</b> integrally connected to each other.

The elongated, rectangular and plate-like design pie zoelektrische ceramic part <b>123</b> located in the center to form a piezoelectric resonance part, while the both sides resonant part <b>123</b> dynamic damper <b>126</b> and <b>127</b> are associated with the piezoelectric ceramic plate part <b>123</b> via vehicle parts <b>124</b> and <b>125</b> are connected. This dynamic damper<b>126</b> and <b>127</b> to lead Vibrations. Central portions of the outer side surfaces of the dynamic dampers <b>126</b> and <b>127</b> are connected in series with the rechteckrah menförmigen support element <b>122</b> via vehicle parts <b>128</b> and <b>129</b>,

In this present embodiment, there are a Reso nanzelektrode <b>133</b>, A conduit part <b>134</b> and a terminal electrode <b>135</b> and a dummy electrode <b>136</b> on an upper surface of the piezoelectric rule ceramic plate <b>121</b>While a second resonance electrode, the resonance of the electrode <b>133</b> opposite, a senior member of with the second resonance electrode is connected, and a terminal electric de, which is connected to the conductive portion of the electrode <b>136</b> against lies on the lower surface of the ceramic plate <b>121</b> are so that in this way an element plate <b>130</b> is defined.

The aforementioned electrodes are conductive by applying Mate rials to the upper and lower surface of the piezoelectric ceramic plate <b>121</b> obtained, for example by vacuum deposition, plating or sputtering.

In the floorboard <b>130</b> according to this embodiment, the rectangular frame-shaped support member <b>122</b> and the piezoelectric Re resonator integrally joined together, as already mentioned. they form along the piezoelectric ceramic plate <b>121</b>, in the <b>Fig.</b> 19 to he is know. This support element<b>122</b> forms in other words, from stand plates <b>13</b> and <b>14</b> and the holding parts <b>6</b> and <b>10</b> according to <b>Fig.</b> 2 of he first exemplary embodiment. The element plate<b>130</b> instead of the Ele ment plate <b>15</b> the piezoelectric resonant component according to <b>Fig.</b> 2 ver be used. As mentioned above, the connecting portions A can in the first embodiment between the spacer plates <b>13</b> and <b>14</b> and the piezoelectric resonator is not completely sealed be, while the other hand, in the present embodiment a pie zoelektrische resonance component is obtained, the order opposite to the environment is reliably sealed, since they no longer said Ver connecting areas having.

The <b>Fig.</b> 21A and 21B show a perspective view and a Top view of a plate element <b>140</b> for use in a sixth Embodiment.

To prepare the plate element <b>140</b> of this embodiment is a piezoelectric ceramic plate with a laser beam or by edited etching to a plate <b>143</b> to obtain, the rectangular frame a like support element <b>141</b> and an inside of the support member <b>141</b> lie lowing part in the formation of a piezoelectric resonator <b>142</b> having, integral with the support member <b>141</b> or integral with ver is connected similarly to the fifth embodiment. Due to the mentioned processing, the complicated link between Ab ent stand plates at the side parts of the piezoelectric resonator fall, as was the case also in the fifth embodiment.

The present embodiment is characterized in that the piezoelectric resonator <b>142</b> such energy trap is, the so Vibration absorption regions has. Otherwise in it occurs Shear mode on. In particular, the piezoelectric cal resonator <b>142</b> an elongated piezoelectric plate <b>144</b> on the so- is polarized such that the polarization axis extends along the arrow P, al so in longitudinal direction of the elongated plate <b>144</b>, These piezoelectric Plat th <b>144</b> carries on its upper surface first and second resonant electrodes <b>145</b>. <b>146</b>Extending along the two edges of the plate <b>144</b> extend.

Moreover, third and fourth grooves <b>149</b>. <b>150</b> in areas before present, with respect to the first and second furrows <b>147</b> and <b>148</b> continue outside are, in the longitudinal direction of the plate <b>144</b> seen, and represent extend beyond parallel to the first and second furrows. On the se manner dynamic damper <b>151</b> and <b>152</b> receive. This dyna mix damper <b>151</b> and <b>152</b> serve to vibrations under press that leak out from the resonant part.

Areas of the piezoelectric ceramic plate and with the third fourth furrows <b>149</b> and <b>150</b> are provided, are connected in series with the previously mentioned rectangular frame type support member <b>141</b>, The first and second resonance electrodes <b>145</b> and <b>146</b> are electrically connected to terminal electrodes <b>153</b> and <b>154</b> connected, that of on the upper surface rectangular frame type support member <b>141</b> . are In the present Case extend the electrodes <b>153</b>. <b>154</b> respectively perpendicular to the resonance electrodes <b>145</b>. <b>146</b>,

The element plate <b>140</b> this embodiment has a piezoe tric resonance unit in which a shear mode is excited when an alternating voltage across the terminal electrodes <b>153</b>. <b>154</b> is applied. The resonance energy is effectively in the Reson captured anzeinheit which is designed such that it is a specific Ab measurement relationship b / a has.

Assume that the letter b, the longer side and the Spelled be a defining the shorter side of the resonance unit, a rectangular and having planar shape, and is further σ the Poisson ratio of the piezoelectric ceramic, as is the ratio b / a within a Be Empire of ± 10% are at a value around, the following equation (1) enough:

b / a = n (0,3σ + 1.48) ... (<b>1</b>)

Herein, n is an integer.

Due to the dynamic damper <b>151</b> and <b>152</b>That outside the Resonance unit are, are out leaking vibrations or Vibrations safely dampened or extinguished. The vibration energy is thus held in areas just to the dynamic dampers <b>151</b> and <b>152</b> . rich

The carrier element <b>141</b> and said piezoelectric resonator <b>142</b> form a a one-piece part, that is a single piezoelectric ceramic plate similarity, Lich as is the case in the fifth embodiment. This is ensures that a fully sealed piezoelectric Reso nanzkomponente obtained.

The <b>Fig.</b> 22 is a perspective view of an element plate <b>161</b> for a seventh embodiment. The element plate<b>161</b> has a rectangular frame-shaped support member <b>162</b> and a piezoelectric resonator <b>163</b> on the inside an opening <b>162</b>a of rechteckrah menförmigen support member <b>162</b> is arranged. Here, the pie will zoelektrische resonator <b>163</b> and the support member <b>162</b> by corre sponding machining a rectangular, piezoelectric ceramics plate obtained so that they lie in a plane, as well as the five exemplary embodiment of the case was.

The seventh embodiment differs from the fifth Ausfüh tion, for example in that the structure of the piezoelectric resonators sector <b>163</b>That in the opening <b>162</b>a of the support member <b>162</b> is a ande re is.

The piezoelectric resonator <b>163</b> has a rectangular piezoe tric ceramic plate <b>164</b> , which is polarized so that the polarization axis in the direction of the arrow P. For the rectangular piezoelectric cal ceramic plate <b>164</b>That on a long side and a short side b a has the ratio b / a is chosen so that it is within a range of ± 10% is a value which satisfies the following equation (2):

b / a = n (-1,47σ + 1.88) ... (<b>2</b>)

Herein, n is an integer and σ the Poisson ratio of piezoe tric ceramics.

The piezoelectric ceramic plate <b>164</b> carries on its upper surface first and second resonance electrodes <b>165</b> and <b>166</b>Extending along its longitudinal edges extend. The first and second resonance electrodes<b>165</b>. <b>166</b> are electrically connected to first and second terminal electrodes <b>167</b> and <b>168</b> connected, not via unspecified management areas as well as the terminal electrodes <b>167</b> and <b>168</b> on the upper surface of the support member <b>162</b> lie.

According to this embodiment, in the piezoelectric resonant in part stimulated a width vibration mode when an alternating tension voltage across the first and second connecting electrodes <b>167</b> and <b>168</b> is puts is. Since dynamic damper<b>170</b> and <b>171</b> with the outer sides the resonating part are connected via respective support members, lets her be wipe or damp leaking vibration energy, by the effect of the dynamic damper <b>170</b> and <b>171</b>, The vibration or Vibrational energy is thus held effectively in areas which only up to the dynamic dampers <b>170</b> and <b>171</b> . rich

Also in the seventh embodiment are the carrier element <b>162</b> and the piezoelectric resonator <b>163</b> integrally with each other So that they and ensures easy to manufacture, that is connected obtain a completely sealed against environmental influences block is similar to the according to the fifth embodiment.

The <b>Fig.</b> 23 is a perspective view of an element plate <b>181</b> for an eighth embodiment. This element plate<b>181</b> is we sentlichen equal to the element plate <b>161</b> the seventh Ausführungsbei game, however, the resonant part of the piezoelectric differs resonator <b>183</b> from that of the seventh embodiment, wel cher in an opening <b>162</b>a of a support element <b>162</b> is. Of the Resonant part is in the eighth embodiment in the form of a rectangle shaped piezoelectric ceramic plate <b>184</b>A formed, the gleichför mig polarized along its thickness. resonance electrodes<b>185</b> cover completely both main surfaces of the piezoelectric ceramic plate <b>184</b>a, where in <b>Fig.</b> 23 is not the resonance electrode on the lower side can be seen. The upper resonance electrode<b>185</b> is electrically connected via a Line connection with a first terminal electrode <b>186</b> connected. By contrast, the lower resonance electrode through another Leitungsver bond with a second port also not shown electric de connected to the at the lower side of the ceramic plate or support member <b>162</b> is. The second connection electrode on the unte ren surface is the electrode <b>187</b> compared to that in the present case a Dummy electrode (dummy electrode).

Other details of this embodiment correspond denje of those under the seventh embodiment, wherein like parts are provided with the same reference numerals and are not again described be ben.

Also in this embodiment form the piezoelectric resonators gate <b>183</b> and the support member <b>162</b> a one-piece part, resulting in an Ver simplification of the manufacturing process of the block leads and a better sealing against environmental influences. Vibration energy at Exciting the aforementioned width expansion vibration mode will effectively limited or trapped in parts to the dyna mix dampers <b>170</b> and <b>171</b> . rich The piezoelectric resonator <b>163</b> can thus according to the eighth embodiment as a piezoelectric shear resonator are referred to an energy trap.

It has already been pointed out that the rectangular piezoelectric Ke ramikplatte to the formation of the carrier element and the piezoelectric Resonator processed by a laser beam or in appropriate Manner may be etched, namely in connection with the fifth to eighth embodiments. However, for the processing of rectangular piezoelectric ceramic plate, other methods be used. For example, can be a rectangular metal plate use, which is then punched or etched to form a square- frame-shaped support member <b>212</b> and a region <b>213</b> to obtain, of a piezoelectric resonator is formed, as the <b>Fig.</b> recognize 24 leaves. Thereafter, a piezoelectric thin film<b>214</b> on the upper FLAE che the range <b>213</b>Forming a piezoelectric resonator, is assigns. Then, resonance electrodes (not shown) on the upper surface of the piezoelectric thin film <b>214</b> postponed. In this case , the range <b>213</b> the metal plate of the piezoelectric resonators tor forms, also known as resonance electrode on the lower surface of the piezoe lektrischen thin film <b>214</b> be used.

As far as the resonance electrode on the upper surface of the piezoelectric thin film <b>214</b> is concerned, an insulating layer can an area are applied, the carrier element on the <b>212</b> and the dynamic rule damper <b>215</b> and <b>216</b> away runs. Kings In this insulating layer you can then transmit a conductive connecting portion and a terminal electrode to be brought.

The example of <b>Fig.</b> 24, the modification of the fifth Ausfüh a tion example illustrates, can also in the sixth, seventh and eighth from leadership example are used. Moreover, the metal plate also be replaced by a plate of a semiconductor material. The piezoelectric thin film may, for. Example, of a piezoelectric Ke ramic or consist of a piezoelectric single crystal.

The <b>Fig.</b> 25A is a plan view of an element plate <b>231</b> for a nine TES embodiment of the present invention, while <b>Fig.</b> 25B shows the progress of the lower electrode, as viewed by a piezoelectric plate.

The element plate <b>131</b> according to this embodiment, with which an can form piezoelectric dual mode filter includes first and second piezoelectric resonance units <b>232</b> and <b>233</b> on, in which County can produce genvibrationsmoden. The piezoelectric Resonanzein units <b>232</b> and <b>233</b> each include elongated rectangular piezoelectric cal ceramic plates pola uniformly in the thickness direction of the plates are ized. These ceramic plates carry electrodes<b>232</b>a and <b>233</b>a for Formation of resonance electrodes and other electrodes <b>232</b>b and <b>233</b>b, which serve as grounding electrodes. Here, the Reso are nanzelektroden on first upper major surfaces, while the He tion electrodes befin ​​on the lower main surfaces of the ceramic plates the.

As mentioned above, fall into the first and second piezoelectric rule resonance units <b>232</b> and <b>233</b> stimulate length vibration modes. Nodes of these oscillations are interconnected by a coupling element <b>234</b> connected. The lower on the surfaces of Re sonanzeinheiten <b>232</b> and <b>233</b> electrodes <b>232</b>b and <b>233</b>b electrically connected via a conductive connecting member with each other, which extends to the lower surface of the coupling element <b>234</b> is. Thus, a piezoelectric double-mode filter can be formed, the sym having and asymmetrical modes, through USAGE formation of electrodes <b>232</b>a or <b>233</b>a as input or output electric de and using the electrodes <b>232</b>b and <b>233</b>b as Erdelektro the.

This embodiment is characterized in that two piezoe lectric resonance units <b>232</b> and <b>233</b> available. Other Off configurations corresponding to those in the fifth embodiment.

In particular, there are dynamic damper <b>235</b> and <b>236</b>, The bending have vibrational resonances at the outer sides of the first and second piezoelectric resonance units <b>232</b> and <b>233</b> and with These connected via vibration transmission parts. The outer En the dynamic damper <b>235</b> and <b>236</b> are a rechteckrah menförmigen support element <b>237</b> coupled via coupling members. With In other words, are the first and second piezoelectric Re sonanzeinheit <b>232</b> and <b>233</b> within an opening <b>237</b>a rectangle of frame-shaped support member <b>237</b>,

The first and second piezoelectric resonance unit <b>232</b> and <b>233</b>. the opening in the <b>237</b>a lie, are integral with the Trä gerelement <b>237</b> connected. For this purpose, for. Example, a single machined or etched who piezoelectric ceramic plate according to in order to obtain an integral component, which in the <b>Fig.</b> 25A and has shown 25B form. The processing of the ceramic plate can also be effected by means of a laser beam.

As described, in each of the fifth to ninth Ausführungsbei play a piezoelectric ceramic plate used. Instead of However, the piezoelectric ceramic plate can also be a piezoelectric Single crystal are used.

To the element plate for each of the fifth to ninth Ausführungsbei games produce, preferably, a mother board <b>221</b> used in the <b>Fig.</b> is shown 26th The mother board<b>21</b> is by laser beam processing structured or by a suitable etching process. On the se manner can be integral piezoelectric interconnected many cal resonant element parts <b>223</b> and rectangular frame-shaped Trägerele producing elements. Then, electrodes suitable piezoe on tric resonant element parts <b>223</b> formed, for example, by Nie tate in a vacuum, by plating, sputtering, etc. Subsequently later permanent mother substrates <b>224</b> and <b>225</b> on the upper and lower Main area of ​​the nut plate <b>221</b> arranged and ver with these z. B. sticks. In this way, a mother laminate to form is piezoelectric receive shear resonance blocks. This mother laminate is in wide ren course cut in the thickness direction in order in this way a lot get number of chip-type component piezoelectric resonance.

As in <b>Fig.</b> can be seen 26, are located on the plate of <b>221</b> Trains facing surfaces of the mother substrates <b>224</b> and <b>225</b> concave regions <b>225</b>a to the formation of cavities, in which the piezoelectric Reso nanzelemente can move into it, if this is to vibrations be upset. Will mother substrates used, no such concave portions <b>225</b>a show, so need to form the Hohlräu me appropriate spacers between the plate <b>221</b> and the sub straten <b>224</b> and <b>225</b> be present, similar to that already in Ausfüh embodiment according <b>Fig.</b> can be seen second