Connection of circuit board

[Detailed Description of the Invention]

Field of the Invention The present invention relates to the connection method of the circuit board carried out suitably, in order to connect to other @N boards circuit boards, such as the semiconductor substrate, ceramic substrate and flexible substrate in which the projecting electrode was formed, - glass substrate, or a Alint board. PRIOR ART As a method of connecting the metal projection electrode of various kinds of above-mentioned circuit boards to the electrode of other circuit boards conventionally, it is projection 1! As a t pole material of the circuit board which should connect a pole, the method of carrying out metal junction of between electrodes is used using the material in which alloying with projection a4 pole material is possible. However, since the electrode material of the circuit board which should connect a projection electrode is limited according to this method, the technique of obtaining an electrical link is proposed in recent years by welding a metal projection electrode by pressure via direct or anisotropic conductive material on a circuit substrate electrode. Object of the Invention However, in order to cancel the instability of connection by the variation in the height of a metal projection electrode, the former needs to apply excessive pressure to an electrode part, and it is necessary to make it transform projection ti in the above-mentioned conjunctive. In order that there may be a problem that damage may be done to a circuit board and a Pinch person may use different Ledding and Electricity material, there is a problem that resolution is bad and stabilization 1 To of connection resistance is difficult in very small pitch electrode connection. the circuit board which the object of the present invention solves the above-mentioned problem, and has a metal projection electrode -- * -- arbitrary 1! the circuit board top of the others which have material very much -- an angular convolution -- it is connecting in the state it always having been stabilized also in very small pitch connection, without doing damage to a way board. Means for solving problem The process of applying adhesives to the projection $ best quality of the 1st circuit board alternatively when the present invention connects the 1st circuit board that has a projection electrode, and the projection electrode of this 1st circuit board and the 2nd circuit board by which the electrode was formed in the corresponding position, the process which makes conductive particles adhere to these adhesives, and the above -- an angular convolution -- it is a connection method of a circuit board pressurizing a way board face to face and including the process of carrying out the electrical connection of the projection electrode to the electrode of the above-mentioned corresponding position electrically via conductive particles, and the process of hardening the above-mentioned adhesives in this state. OPERATION In the connection method of the circuit board according to the present invention, Apply adhesives alternatively on the projection electrode of the 1st circuit board that has a projection electrode first, the 2nd time W@ board and the 1st circuit board by which the electrode was formed in the position corresponding to zero-order [ which next makes conductive particles adhere on these adhesives ] with the projection electrode of this 1st circuit board are made to counter, and it pressurizes mutually. In this state, the conductive particles on the 1st circuit board may change, and some adhesives are 'Xff(s) of the 2nd circuit board! It adheres upwards. And an angle circuit board is fixed by hardening adhesives in this state. Therefore, according to the present invention, the connection stabilized without doing damage to a 5-circuit board in order for conductive particles to change at the time of connection and to absorb it, even if the projection electrode has shown the variation in height can be obtained. Since conductive particles are arranged with high density only at an electrode part, electrode connection of a very small pitch is possible. EXAMPLE Drawing 1 is a sectional view showing the composition of circuit board 11.12 to which connection of an electrode was made according to the present invention. A diffusion zone is formed on substrates, such as silicon or gallium arsenide, and, as for semiconductor circuit boards 11, such as an integrated circuit, many transistors, diodes, etc. are formed of this. Electrode 14 is formed in the surface in the size corresponding to the position corresponding to [ on the other hand ] the above-mentioned electrode 13 in the surface of 1-circuit board 12 of semiconductor circuit board 11 which is connected with circuit board 12 on the other hand and which has been accomplished projection ':4 pole 1 The point 3. the top layer of semiconductor circuit board 11 -- electrode 15 -- formation -- FILff of the surface protection layer 2o which changes, for example from SjN, SiO, or polyimide to the portion which is not provided with some of h, electrodes 15, and an electrode is carried out. Electrode 15 is aluminum-8i Money included, for example. p4 i, T i, or W is comprised. projection 18 which Au(ing) and A u plating are carried out via middle quantity jJc layer 19-, and comprises f and 2 Cu on electrode 15 of semiconductor circuit board 11 -- formation -- h ing. Middle & stratification 19 is Electricity[at this example! Barrier metal layer 16 by the side of 15 and adhesion layer 17 by the side of projection 18 are comprised. Adhesion layer 17 is for improving adhesion nature with projection 18, for example, is CLl. Metal and those alloys, such as nickel, Au, Ag, and Pt, can be used. it is for preventing that projection 18 provided on the above-mentioned adhesion layer 17 diffuses barrier metal layer 16, and it reacts to electrode 15 -- for example, Ti and W -- Cr -- 1fLW Wyobi -- Money of them can be used. Projection electrode 13 is constituted including these electrodes 15, middle metal layer 19, and projection 18.

Height h of [i13 is 5~30 micrometers, for example. It is in the state which countered electrode 14 in which circuit board 12 corresponds, and is electrically connected via conductive particles 21 which have an outside diameter in 5~20 micrometers, for example, and semiconductor circuit machine W with which projection electrode 13 mentioned above was formed, and 11 are This by adhesives 22! L and others is being fixed. conductive particles 21 -- Au, Ag, Pt, Cu, nickel, C, I rI, and S rt -- it calls P b 13 and Pd -- metal -- being certain -- it can be, two or more kinds of 6 Clearly can go away, and it can use gold. As shown in Drawing 2, a polymer material may use for the surface of To become elastic particles 21b conductive particles 21 in which the conductive material formed 21a in 71 layers of Let's wave, in this case -- as elastic particles 21b -- 1, such as synthetic resins, such as polyimide system resin, epoxy system resin, and acrylic resin, silicon rubber, and urethane rubber, -- certain rubber can be used. As a conductive material of enveloping layer 21a, they are Au, Ag, and PL. Metal or these alloys, such as Cu, nickel, C, I rr, Sr+, Pb, and Pd, can be used as one layer or more than two-layer. At place 1 which forms enveloping layer 21 a above two-layer, For example, it can be immersed in the adhesion nature of elastic particle 21b/\, metal layers, such as nickel, can be formed first and methods, such as the sputtering method, the erection Lombie 21 method, or non-electric field plating, can be used as the method of covering with preferred covering metal layers, such as Au. Eight ib each Naruki fat, such as acrylic resin, polyester system resin, urethane system resin, epoxy system resin, or silicone series resin, can be used for adhesives 22, for example. With reference to Drawings 3 and 4, the connection method of the circuit board of the present invention is explained below. Drawing 3 is a sectional view for explaining the process of forming projection electrode 13 on semiconductor circuit board 11. As shown in Drawing 3 (1), on semiconductor circuit board ll, Electricity %15 is formed beforehand, and the circumference of electrode 15 is covered with surface protection layer 20. First, they are the vapor-depositing methods, such as the sputtering method and the electron beam method, about middle metal layer 19 for forming a projection electrode on the surface containing electrode 15 of semiconductor circuit board 11, In 8 these examples which is inserted in and attached and is formed by law etc., middle metal layer 19 considered it as two-layer structure, and used 4 gos, and Au (800 persons) /T i and W alloy (2400 persons) structure which were written as "/ (upper layer 17) (lower layer 16)." Next, as shown in 3rd [ The ] figure (2)~figure 3 <5>, a photograph process, a plating process, and an etching process are used for the predetermined field which should form projection $ pole 13, and projection 18 is formed in it. First, as shown in the 311stJ (2), photoresist film 23 is applied by methods, such as a spin code, a roll coat, or printing, on semiconductor circuit end rail ll with which middle metal layer 19 was formed. the [ next, ] -- exposing and developing the field corresponding to electrode 15 of photograph register second A film 23, as shown in 3[IJ (3) -- a desired size -- coming -- now, butter Ning of opening 24 which calls and has formation is performed. next, be shown in the 3[ff1 (4) -- like, via opening 24 formed of the above-mentioned butter Ning, electric Justice is performed using A ll plating liquid, and projection 18 is formed. Then, projection 18 of the shape shown in Drawing 3 (5) is formed on semiconductor circuit board 11 by removing photoresist Wi23. If talent is in the 30th (6) and Drawing 3 (7), etching removal of the middle metal layers 19 other than the portion which forms projection electrode 13 is carried out by using as a mask projection 18 formed by the described method. That is, it is since projection 18 uses Au in this example, using Au(upper 7FI17)/Ti-W (lower layer 16) as middle metal layer 19, [/1 liquid of Au which is upper layer 17 (etching removal of the middle metal layer 19 is carried out, using hydrogen peroxide system etchant as corrosive liquid of Ti-W which is Tears and lower layer 16 about potassium iodide system etchant as etchant >.) Although the surface of projection 18 is etched here at the time of etching of upper layer 17 since upper layer 17 is the same AU as projection 18 among middle metal layers 19, Since the thickness of A u of upper layer 17 is as thin as 800 persons, the amounts of Niche of the projection 18 surface are few, and projection electrode 13 is formed on semiconductor circuit board 11 in any way on a process of this which a problem does not produce. Next, with reference to Drawing 4, how to connect semiconductor circuit board 11 in which projection 5Tufi13 was formed as mentioned above to circuit machine W with which corresponding electrode 14 was formed, and 12 is explained. First, Drawing 4 (as shown in 1>, adhesives layer 22a is formed on 5 adhesives supply board 25 by methods, such as for example, Spin> and a coat, a roll coat, or printing.) adhesives which comprise material like the above-mentioned as adhesives, such as thermosetting and optical hardenability, -- business -- 0 To are made. Next, adhesives 22 are made to adhere on projection electrode 13 by pressing projection electrode 13 of semiconductor circuit board 11 on adhesives N 22 a of adhesives supply board 25, as shown in Drawing 4 (2). Next, projection electrode 13 on semiconductor circuit board 11 which used in this way and to which it made adhesives 22 adhere as shown in Drawing 4 (3), By pressing on conductive particles 21 arranged almost uniformly on conductive particle supply board 26, as shown in Drawing 4 (4), the adhesive power of adhesives 22 is used and it is Drawing 4 (it is made to adhere like 5>) about conductive particles 21 to projection electrode 13. Here, it is preferred for it to be necessary to choose appropriately according to the size (d) of conductive particles 21, and to usually be referred to as 1 =d/2, for example, the thickness (1) of adhesives layer 22a on adhesives supply board 25 is d= 5~20 micrometers. Next, it pressurizes, after carrying out position Agreement of the projection on semiconductor circuit board ll which used in this way and to which it made conductive particles 21 adhere on circuit board 12 in which electrode 14 which corresponds 13 very much was formed, as shown in Drawing 4 (6). By this pressurization, conductive particles 21 change so that the variation in the height of projection electrode 13 may be absorbed, and it is electrically connected with electrode 14 in which all the projection electrodes 13 correspond. Since conductive particles 21 change in this state, some adhesives 22 flow and it covers electrode 14 top on circuit board 12. Next, connection and fixation of both circuit board 11.12 are completed by hardening adhesives 22 in this state. In the above-mentioned example, although the case where the semiconductor circuit board in which the projection electrode was formed was connected with other circuit boards was explained, it is not necessary to limit to a semiconductor circuit board, and can carry out the present invention also in the circuit board of a pond. Details of an invention Since pressurization connection of the projection tI[I is made at an electrode corresponding via conductive particles according to the present invention as explained, it is possible to connect a projection electrode to arbitrary electrode materials. Even if it has produced the variation in height in projection 1 on the pole, conductive particles change at the time of connection, and the stable connection can be obtained, without doing damage to a circuit board, since it is possible to make it absorb. Since conductive particles are arranged with high density only at an electrode part, ti connection of the stable very small pitch is possible.

[Brief Description of the Drawings]

Drawings 1 are circuit machine [11 connected according to the present invention, and a sectional view explaining T4 pole connection structure of 12, The sectional view and Drawing 4 where the sectional view of conductive particles 21 which use Drawing 2 for the present invention, and Drawing 3 illustrate the formation method of projection electrode 13 are a sectional view explaining the connection method of both circuit board 11.12 by the present invention. 11 ... semiconductor circuit board, 12 ... circuit board, 13 ... projection electrode, 14 ... 'rh pole, 21 ... conductive particles, 22 ... adhesives The Figure Yabu