Probe head having a membrane suspended probe

This patent application is something which insists the profit of the American temporary patent application 60/586,299th number which is applied with 2004 July 7 date by Keneth Smith, Michael Jolley and Victoria Van Sycle it was invented concerning the probe head which has the membrane suspension probe.

This invention is done, the integrated circuit (ICs) being in common to inspection, the probe assembly of the type which is used, especially, pitch minutely, the pole which possesses compliance low regards the probe assembly which offers the probe of inductance.

The single baseplate, namely on it is possible with integrated circuit technology to process the many individual electronic circuit element the wafer top. After processing, as for the electronic circuit on the die/di of the husband where the wafer is divided by the many rectangular tip/chip, namely the die/di, is divided, vis-a-vis this input/output the rectangle which can connect or the metal which possesses the arrangement which has other regularity it has the contact pad or the connection pad which was covered. The individual die/di the packaging is done separately to final, but as for the circuit where it is formed on the die/di of husband in order to assure the improvement of efficiency, while the die/di has still engaged on the wafer, it is desirable to inspect. With one example of typical process, it supports the wafer in regard to even stage, namely, the wafer the chuck the probe point which has been extended from the probe assembly X, by making Y and Z axial direction move vis-a-vis the head of the probe assembly, it makes from the die/di to the other die/di move when it is done, the contact pad of the die/di of husband it is possible to make engage continually. In addition, when connecting the signal, electric power and the ground conductor who correspond to the probe point, the circuit of husband connecting continually, whether or not it is the operational equipment, with the inspection equipment is inspected.

With the probe assembly of the first type which is used in order to inspect the integrated circuit, the many needle-shaped contact section which distribution facilities is done is used for the pattern which matches the pattern of the contact pad which is on the device of the inspection object. Figure 1 and Figure 2 has shown the probe assembly 20 which includes the needle card probe head 22 which has the arrangement of the needle-shaped probe 24 which is restrained needle card by the needle card 28 of 26 above and underneath. Needle card, IC where it is inspected by probe assembly 20 or the hole of the pattern which corresponds to the contact pad distribution facilities of the other devices is provided in needle card 28 of 26 above these and underneath. The bottom of probe 24 of husband extending is present through one hole of needle card 28 underneath, the terminal does as the probe point which becomes pointed. The top of probe 24 of husband is restrained by the hole inside needle card 26 above. Furthermore, because the hole of needle card 26 above has covered (as the bracket it is shown) on the surface of space transformer 30 by the electric conduction pad 32 which distribution facilities is done, the pushing pressure pad and the bottom of the probe which is on the device of the inspection object pushing pressure the occasion where it engages, the top of the probe passing by inside the needle card above, sliding is prevented. This space transformer, inside the plate electric electric conduction contact section has 32 and 36 for the opposition aspect which is connected electrically extending by the electric conduction trace 34 which is present, it is the rigid multilayer plate. In addition, space transformer 30 rather than from pattern of minute pitch of needle probe 24, being obtained on probe card 38, by the printed circuit board where the inspection equipment is connected to the probe assembly, transmits the electric information to rough pitch pattern.

Typical probe assembly 20 space transformer has intapoza 39 where is arranged with 30 and probe card 38. This intapoza 39 in order to do the electric connection which corresponds to the both sides of the circuit baseplate, through the circuit baseplate, has the many elastic variable contact section which it is connected electrically generally. In addition, the electric connection where the reliability to which from the fact that the conductor possesses compliance, change of the distance which are separated from the terminal of space transformer 30 and the terminal of probe card 38 is compensated, in between those is high is promoted.

Generally, as for needle probe 24, the top of the probe has done the offset, the bottom is a vicinity, abbreviation parallel top and it has the wire which includes the complimentary crookedness section which forms lower part. The offset of hole pattern of needle card 28 underneath and hole pattern of needle card 26 above corresponds to the offset of the probe end. The bottom of the probe being overpowered, the pushing when it engages in the contact pad on the die/di, the probe which substantially is cylindrical condition being crooked in the offset section, works the spring. Probe length, it can correspond to the change of cross level of the probe head and the change of wafer microstructure with the compliance due to the elastic crookedness of this probe.

The needle card probe assembly was regularly used the case of wafer inspection, but the electronic product, especially, IC product, a higher frequency, had smaller circuit element and geometric structure, with the probe assembly of this type it became clear vis-a-vis the trend which has become more complicated circuit, for various restrictions to occur. As for the pitch width which is distance between the first, probes, from production tolerance and assembly characteristic important matter, the contact pad has done pitch minutely, it is restricted to approximately 125 millimicrons which are widely different from the interval which is made ideal in many IC. In addition, because it oxidizes the metal make contact pad of the die/di quickly, when by the fact that the point of the probe can be sharpened, pushing to the surface of the contact pad, it can obtain the high conductivity where it is necessary for accurate measurement. But, as for this, there is an apprehension which causes the quick slowdown of the probe end which can be sharpened, the frequent crookedness or breaking of the probe, and the damage of the contact pad when penetration is large. In addition, in many cases, because the contact pad material comes in contact with the probe, washing which accompanies the damage of the probe becomes frequently necessary. Inductance of the parallel conductor is function of distance between leader and the conductor conductor. Generally, it is long relatively, as for the needle-shaped probe whose interval is narrow, single pass inductance becomes with 1 - 2nH, this inductance twists the high frequency signal suitably, restricts the practicality of the needle type probe which inspects the high frequency device.

The probe assembly of the second type which is invented the patent literature 1 (the American patent 6,708,386B2 number bill) by Gleason and others which is stated is something which is invoked to this invention. As shown in Figure 3, the data from the equipment and the probe card distribution facilities are done 52 where signal conductor 48 and 50 is wired and membrane probe assembly 42 in membrane probe assembly 40. As shown in Figure 3 and 4, membrane probe assembly 42 has the support element 54 which is formed by the incompressible lumbering charge such as the hard polymer. As for that element, volt/bolt 56 (as for volt/bolt of husband , it passes into installation arm 60 of the support element which corresponds to that, individual back element 62, installation and removal is connected unrestrictedly on probe card top tightening pressure of volt/bolt to the whole back by the support element is dispersed uniformly) with by the nut 58 which corresponds to that. Can exchange in order the probe to inspect the device where arrangement of the contact pad differs, quickly according to need to with another probe assembly which possesses the contact arrangement which differs.

As shown in Figure 4 and 5, you install support element 54 and, you have the rear base 64 which has been connected with arm 60 just. In addition, also the plunger 66 which has been extended outside from the forward support section namely the even base is included in support element 54. This front support section, in order to focus on even support section surface 70, has had the side section 68 which inclines, it has become pyramid trapezoidal shape. Way it shows in Figure 4, as for flexible membrane assembly 72, after being lined up making use of the alignment pin 74 which is provided on the base, it is installed in the support section. This flexible membrane assembly is formed by the insulated polyimide film above more, in order to form data/signal conductor 76, flexible conductive layer or the strip distribution facilities is done between layer or with respect to layer.

As shown in Figure 5, when support element 54 is installed above probe card 52, support section 66 of the front it becomes the arrangement where the contact section which distribution facilities is done is ideal on central limits 80 of the elastic membrane assembly by projecting through the central open part 78 inside the probe card, the contact pad of the die/di of the inspection object or in addition the device and pushing pressure of the inspection object engages. As shown in Figure 4, while extending we having the arm segment 82 which is present for the radial pattern which has divided due to the edge 84 where the membrane assembly designates the form as four me cross condition, has curved inside paralleling to the side section 68 where, these segments incline inclining, surrounding the pad extending by being present, if there is a part which projects it clears that. Because consecutive contact pad 86 is provided in the terminal of data/signal conductor 76, when it can install the support element, the data on the probe card/signal conductor 48 the contact section with respect to the central limits is connected electrically by engaging electrically in the terminal pad where these pads were provided above the probe card and correspond.

It is possible the contact pad where the surface is oxidized over many contact cycle, probably will be also, densely the contact pad which distribution facilities is done, with the general electric connection whose reliability of the contact section and the pad in the individual cycle is high, as for probe assembly 42, the probe to process. Because of that, as for the membrane assembly, these pads pushing pressure when it engages, the contact section on the membrane assembly, wipe due to local control means over the cross direction of the contact pad in order or to polish, it constructs, connects to the support element.

As for Figure 8, it is the enlarged view of concrete example of the central limits 80a in membrane assembly 72a, it is something which shows the contact section 88 which is arranged in the quadrangular condition pattern which is suited for the engagement of the contact pad on the die/di which is arranged in quadrangular condition pattern. As for the membrane assembly, contact section 88 of the super minute pitch which arranges densely the empty, up to contact section 86 of a rougher pitch, the terminal is processed the space transformer which has been provided data/signal conductor 76.

In addition, as shown in the figure 9A which is the cross section diagram on line 9A-9A in Figure 8, quite it has thick rigid beam 90 for the contact section of the husband whom rigid contact bump 92 forms in the one end. This contact bump has contact section 93 on that, the knob of rhodium make is installed in that contact bump. With electroplating, the beam of husband forming the piled connection with the end of yes characteristic electric conduction trace 76a, forms those connection sections. The electric conduction trace which is connected with rear conductive layer 94 offers the data or signal conductor which possesses the impedance which is controlled to the contact section effectively. Because the size is set making use of photo lithography processing.

As for the membrane assembly you connect to even support surface 70 with the elastomer layer 98 where it spreads to the identical surface, with the support surface, it is possible, was put between to form with the silicone rubber compound. As for the even support surface which mentions, it is desirable to be produced from incompressible material such as the hard dielectric for example such as polysulfone or the glass. As shown in Figure 10, when contact pad 100 of the die/di to which one of contact section 88 corresponds and pushing pressure it engages, because as a result power and the bump 90 structure which remove the center from of the rigid beam 90 which it occurs, resist the elastic restitutive force from of elastomer pad 98, the beam revolves or means with to incline. Front section 102 of the beam facing toward even support surface 70, it localizes this inclination operation, rear section 104 of that beam compared to at the point which moves big distance. From this, driving the contact section, there is an effect where the side it wipes over the whole of the contact pad and takes and operates, in addition, start position of contact to on the pad on the dotted line, it has shown contact end position in the solid line. By this method, because accumulation of the insulated oxide on the contact pad of husband is ground, electric connection between the appropriate contact section pad is guaranteed.

It wipes the contact section of the membrane probe assembly, locally and it is possible, to arrange with the minute pitch which engages physically in the contact pad on the small device by being taken, while having the durability and resistance of wear and the damage, it reaches the point where it can contact with high conductivity. In addition, as for the membrane suspension probe, the big territory it to be possible to connect at short length, because the general needle probe compared to low it becomes inductance, use in the high frequency territory becomes possible, it is possible to make the distortion of the signal in all frequency zones small.

<p><patcit num="1"><text>The American patent 6,708,386B2 number bill</text></patcit></p>

<p num="0017"> But, the probe and the signal/data line is formed on the surface of the membrane, is connected to the probe card terminal which is provided around periphery of the membrane. The signalling channel could use the center of the probe assembly to pass the former probe card and the spatial converter, the center shaft of the probe assembly with the needle card type probe head which is arranged substantially parallel, but with the membrane suspension probe to we had not been able to have decided to use. From this, pitch it was done minutely, the needle type probe head and the part of the probe assembly which is used the device and the method using that trying finishes are desired the strong low inductance membrane suspension probe. </p>

<figref num="1">It is the disassembly strabismus figure of the needle type lobe assembly. </figref><figref num="2">It is the cross section diagram of the needle card probe head for the needle type probe assembly. </figref><figref num="3">It is the strabismus figure of the wafer which is supported on the chuck of the position where it is suited for the probe processing the membrane probe assembly and its assembly which were tightened with bolt to the probe head. </figref><figref num="4">Low it is the surface which shows the various parts of the probe assembly where it has the support element and the yes characteristic membrane assembly, includes the partial view of the probe card which possesses the data/signal conductor which is connected to the line to which the top of the membrane assembly corresponds shows in Figure 3 figure. </figref><figref num="5">It is the passing flight position of the membrane probe assembly where portion of the membrane assembly is cut off in order to expose the part where the support element hides, shows in Figure 3. </figref><figref num="6">It is the top view of the typical support element. </figref><figref num="7">It is the support element of the kind of inclination which matches the start position of the device of the inspection object and the outline passing flight position of the membrane assembly. </figref><figref num="8">It is the top view which expands the central limits of constitution of the membrane assembly which shows in Figure 4. </figref><figref num="9">It is the cross section diagram in the line 9a-9b in Figure 8, figure 9a before contacting, shows the contact section, contacting, moving vis-a-vis the pad which corresponds, wipes figure 9b and, after operating, shows the same contact section. </figref><figref num="10">The dotted line section displays the contact early contact section in figure 9a-9a, the solid line section furthermore exceeding to vertical direction, is the outline passing flight position which displays the pad which it moved. </figref><figref num="11">It is the outline disassembly strabismus figure of the probe assembly which has the needle type probe head which is suited for the space transformer and the probe head which possesses the membrane suspension probe. </figref><figref num="12">It is the outline cross section diagram of the probe assembly which shows in Figure 11. </figref><figref num="13">It is the outline cross section diagram of the point of the membrane suspension probe which contacts with the contact pad of the device which the inspection object is. </figref><figref num="14">It is the outline cross section diagram of the probe head which installed the second execution form of the membrane suspension probe, is suited for the needle card type space transformer. </figref><figref num="15">It is low the surface figure of the space transformer which has the many probe tile in the membrane suspension probe. </figref><figref num="16">It is the cross section diagram of the probe head tile which includes the membrane suspension probe.</figref>

As shown in detail in the figure where the mark which resembles concerning the part where it resembles is attached, the main functional part which is included in the execution form of the probe assembly 20 which concretely, is used as the needle type probe which shows in Figure 1 is, probe card 38, intapoza 39, space transformer 30, probe head 22. In addition, as shown in Figure 2, needle-shaped probe 24 inside the probe head the semiconductor wafer or the other device of the inspection object (DUT) offers the expedient which connects to the contact pad on the die/di which is included inside temporarily, input/output does the signal in the internal circuit on DUT. The signal from the die/di input/output it does the needle-shaped probe, electric conduction terminal 32 or through the pad on space transformer 30 from probe head 22. Generally, you can gather the signal of the needle card type probe assembly, in the central vicinity of the probe assembly, there is a normal direction vis-a-vis the device of the inspection object. Because the needle probe the probe is used IC for in order to process frequently, it comes to the point of with being able to provide various restrictions, minutely it possesses the feature which pitch is done, IC or the other devices which is used in the high frequency territory the probe processing under optimum conditions it becomes impossible.

On the one hand, because the membrane probe becomes the inductance which is lower than the needle type probe suitably, the membrane probe the probe can process the high frequency circuit. Furthermore, as for the point of the membrane suspension probe, in order in the usual needle type probe, in order to do the wiping taking with the local contact which carries out the insulated oxide layer which is formed on IC contact pad without making the contact pad material the probe point accumulate, distribution facilities it is possible to do. As for the former membrane suspension probe, with the needle type probe the probe it was not possible to process the assembly which is used. Because, as for the probe and the membrane suspension probe and the electric conduction trace which connect with the probe card, on the surface of the elastic membrane distribution facilities to be done, trace in radial pattern extending by the fact that it is present, in the periphery vicinity of the elastic membrane you connect to the probe card terminal which distribution facilities is done over on the surface of the membrane. As for the inventors, as for profitable feature of the membrane suspension probe, the membrane suspension probe to the probe point of the membrane the space transformer and the electric conduction which are located on opposite side when it is possible to connect, the needle type probe where use of the probe assembly is supposed there are times when it can use it concluded. Figure 11 and Figure 12 includes the probe head 102 which possesses many elastic membrane suspension probe 104, the needle probe type probe head the probe assembly 100 which has the part which can use is shown. This needle card type probe assembly removes the needle card type probe head, can modify in the probe assembly which possesses the membrane suspension probe the space transformer which can do the needle card type probe head and to face, by replacing to 102 to the membrane probe which faces. In addition, in the outline cross section diagram which shows in Figure 12, exaggerating several elements and the part, by the fact that you draw, it makes the figure clear.

But probe 38 (has shown just 2 of many insides) the generality which has many terminal 120 until recently is the circuit baseplate of technology on that surface. The equipment (not to illustrate this terminal,) it becomes interface for the wire 122 which is connected to the probe assembly. As illustrated, wire 122 it can make the terminal connect 120 which, is on the side of one side of probe card 38 next, by electric conduction bias 124 terminal 126 of opposite side of the circuit baseplate or to trace it is connected. In addition, the addition part such as the active electronic part, the passive electronic part, the connector and its similar ones etc (it does not illustrate), can install on probe card 38, can connect to addition terminal 120. Probe card 38 is circle generally, approximately 30cm (12 inches) it possesses the diameter of order. Terminal 122 on the circuit baseplate and 126 often 2.54mm (100mil) distribution facilities is done at pitch interval or clearance.

Several probe assemblies do not use intapoza 39, but this probe assembly 100 probe card has intapoza 39 where is arranged with 38 and space transformer 30. It has the electric contact section where as for intapoza 39, the part of both sides side of the baseplate electric conduction in order to connect, distribution facilities is done on the surface of opposite side of the baseplate, is connected. In order to promote the conductive connection whose reliability with the terminal of the probe card and the terminal of the space transformer is high, intapoza is used frequently in the probe assembly. In addition, as for intapoza, probe card it is useful to making the various thermal expansions correspond in 38 and space transformer 30. Baseplate it extends intapoza 39, to the borehole inside 128 and its baseplate, (only 2 are shown) have many fuzz button 130. Fuzz button 130 is compressed by small cylinder form to husband , has the minute wire which becomes the elastic wire mass which has conductivity. At the time of general arranging, as for fuzz button 130, distribution facilities it is done with the kind of pitch which matches that of terminal 126 of probe card 38. The end of one side of conductive fuzz button 130 contacts with the terminal of probe card 138, the fuzz button the end of one side contacts with the terminal 140 on space transformer 30 already. As for elastic fuzz button 130, in order the probe card and the compliance in order to be adapted to the variety of clearance between the various terminals of the space transformer to possess, in order to raise the conductivity in the pushing overpowering and contact section, it operates the pressure.

Extending the fuzz button 130 which has been present contacts the electric conduction terminal 140 which is on the side of one side of space transformer 30 inside baseplate 128 of intapoza 39. Is shown) space transformer 30 distribution facilities is done on the intapoza 39 adjacent surface, (as the bracket (only 2 of many insides are shown) the many terminal (the zone of contact, the pad) and distribution facilities are done on the surface of opposite side, (only 2 of many insides are shown) the many terminal (the zone of contact, the pad) called the multilayer ceramic baseplate which it possesses, it has ideal circuit baseplate 142. In typical probe assembly 100, intaboza 39 adjacent contact pad 140 is arranged with pitch of the terminal of probe card 38, on the surface of opposite side of space transformer 30 the contact pad 144 which distribution facilities is done is arranged with pitch of the needle type probe which is included in the needle card probe where it is supposed that the space transformer faces, and the minute pitch which corresponds to arrangement. When pitch of the terminal of probe card 38 approximately 2.54mm (100mil) being, the needle type probe can make minute pitch interval to approximately 125 millimicrons. Electric conduction trace 146 inside multilayer baseplate 142 of space transformer 30, rather than from the probe head and minute pitch pattern in order to face, in the printed circuit board such as probe card 38, transmits electric connection to rough pitch pattern.

Because the various baseplates of probe assembly 100 are laminated, it laminates these parts, it can adopt the optional ideal mechanism which makes the electric contact whose reliability is high secure. As illustrated, probe assembly 100 the rigid rear installation board has the rigid front installation board 152 where is arranged on the surface of opposite side of 150 which distribution facilities is done and the probe card for the aspect of one side of probe card 38. Volt/bolt 154 restrains front installation board 152 in rear installation board 150. The rectangular stand off section 156 which possesses the central open part which receives space transformer 30 is installed in the front installation board. It is desirable to be produced from the spring material such as the phosphoric acid copper the flexible tub can install extending as for the installation ring 158 which possesses the pattern which is present, when space transformer 30 is arranged in the installation ring and between stand off with volt/bolt 160, in stand off 156.

It is shown) multilayer baseplate (as the bracket grasping the probe head 102 which has 160 and many conductive membrane suspension probe 104, you keep installation ring 156. Probe 104, generally, beam contact section 166 is a vicinity of one end of the beam, probe point 168 other than the beam projects from the edge adjacent beam, it has the beam 160 which is thick suitably, is locked. There are times when other forms and it is possible to utilize the material, but generally, probe point 168 has the form of the truncated pyramid, when the projection edge of the probe point it covers at layer of the nickel or rhodium, repeats in the contact pad on the device of the inspection object and pushing pressure the occasion where it engages, offers high conductivity and resistance abrasiveness. It possesses the based section of cylinder condition or the prism condition to which beam contact section 166, barely is smaller than section, and the contact button of the mushroom condition which has the contact button which possesses the circular edge which promotes the movement contact with the terminal 144 of space transformer 30 connects to the contact button of the beam. Beam contact section 166 projects from the side of beam 164 facing toward opposite direction, in the opposite side of beam point 168. As shown in Figure 12, because the beam contact section projects or becomes same plane at least from the surface of multilayer baseplate 160, it exposes in the surface of the baseplate, it makes that electric conduction it contacts in the terminal 144 to which space transformer 30 corresponds possible. Because ratio of the cross-sectional area for length is large suitably in membrane suspension probe 104 general needle probe 24 compared to, as for the membrane suspension probe, the local wiping you take unlike the needle probe, namely, you become pointed in order to penetrate the oxide which is accumulated on the contact pad of DUT and you do not need the point which is shaved. Membrane probe head 102 has the single pass inductance which is lower than 0.5nH suitably, the single pass inductance of 0.2nH has done regarding execution example. As a result, it can use with the frequency zone to which as for the membrane suspension probe, from the fact that the distortion of the signal is small suitably, inductance is larger than 1nH generally, often is higher than that of the needle type probe which becomes large to 2nH.

The American patent 6,708,386B2 number bill of Gleason and others which is something which is invoked to this invention produces the membrane probe bottom-up method and has disclosed top down method. As for both methods, it can use for the production of membrane probe head 102. Because lining up with smaller pitch, than as many as 100 millimicrons to construct it is possible the membrane suspension probe 104 which is produced by these methods, it becomes possible to use the membrane suspension probe vis-a-vis the inspection device which possesses the contact pad which is arranged more densely than the needle probe where pitch is restricted 125 millimicrons or more generally by production tolerance and assembly characteristic. It is covered portion of the beam contact section 104 which is connected to terminal 144 and by nickel or rhodium layer, strengthens conductivity and resistance abrasiveness.

Multilayer baseplate 160, elastic membrane 170 and many flexible insulating layer has 172 and 174. Elastic membrane 170 is done, or contacting that in the vicinity of the surface of space transformer 30, distribution facilities. As for elastic membrane 170, the sill guard of ELMER'S STICK of the Borden corporation make ALLJ and the Dow Corning corporation make (Sylgard) you called 182, it includes the silicon rubber component, when the surface of the membrane becomes deformed, it is possible to operate elastic restitutive force that surface. Multilayer baseplate 160 of the probe head, flexible first insulating layer or component has 172, and flexible second insulating layer or component 174. First insulating layer 172 base layer distribution facilities is done with surface layer of beam 164 of 176 of elastic membrane 170 and probe 104. Second insulating layer 174 to the depth which becomes the length which approximately is identical with the thickness of the beam part 164 of probe 104 from base layer of first insulating layer extending has been present in the lower part. First insulating layer 172 and second insulating layer 174 is thin, yes characteristic to normal direction has had vis-a-vis the surface, but the side section of probe 104 is locked, has possessed sufficient rigidity on the surface vis-a-vis parallel direction. When polyimide is included, there is, a first insulating layer 172 and second insulating layer 174, but also it is possible to make the optional other dielectric material which has ideal physical quality.

As shown in Figure 13, because probe point 168 pushing pressure is engaged in contact pad 200 on device 202 of the inspection object which corresponds to that, in order as a result for the contact force which it occurs the probe point to push up facing toward position 168 ', it works. As for upper part displacement of probe 104, space transformer contact section you resist with the contact force in the contact area of 144 and beam contact section 166. As a result, as for probe 104 turning facing toward position 104 ', the end of probe point 168 on contact pad 200 displaces to cross direction. This cross direction displacement, namely it wipes and takes and (S), it wears the insulated oxide which is formed on the contact pad, the probe point it guarantees the electric conduction with 168 whose reliability is high and the contact pad. It moves also yes characteristic first insulating layer 172 to the upper part from the fact that probe point 168 displaces to the upper part, beam 166 due to the movement which from on the elastic membrane is pushed to upward. The surface of the membrane to be extended, because it is twisted, first insulating layer the power which reconstructs 172 and probe 104 to rest position affects from the elastic membrane. When the surface of elastic membrane 170 contacts the surface of space transformer 30, because upper part displacement of probe 104 the membrane the pushing overpowers the lower part surface of the elastic membrane, further restitutive force is granted to first insulating layer 172. With the restitutive force from of elastic membrane 170 on yes characteristic insulating layer 172, the contact force in probe point 168 is released, when DUT202 is made to alienate from probe head 102, probe point 104 is reset to initial position.

With second execution form of the membrane suspension probe 215 which it shows in Figure, 14 possesses probe head 250, with the space transformer 30 which possesses the projection contact section 258 such as solder sphere there are times when it is used. Probe 251 has the beam 252 which possesses the probe point 254 which has been extended from the end of one side of the beam. The elastic membrane and passing by inside open part 266 where it passes by first insulating layer 262, it exposes the beam contact section 256, from the surface of elastic membrane 260. It contacts in the beam contact section which as for the space transformer contact section 258 which it has extended, beam is the vicinity of the beam edge of opposite side and to 252 and probe point 254 exposes. The contact pad 200 of DUT202 being overpowered, the pushing when it contacts with probe point 254, probe 251 turns, around beam contact section 256 produces the wiping taking operation which removes the oxide which is accumulated in the contact pad.

As shown in Figure 15 and 16, regarding the other execution forms of the probe head which possesses membrane suspension probe 300, one or membrane suspension probe 104 above that, it is included on tile 302 where it is possible to install on the surface of space transformer 30. Tile 302, one which possesses the beam part 164 or probe 104 above that, elastic membrane 304, as the depth of the beam part of the probe has the second insulating member 308 which to the same length extending is present approximately in the lower part from the first insulating member 306 which is inserted with the beam part of the probe and the base of the elastic membrane and the first insulating member. As for tile 302, it is locked to the surface of space transformer 30 by the two-sided installation contact area 310 which becomes framework of the surface in the elastic membrane 304 of the tile. The needle card type probe head the space transformer 30 which supposes that in the first place it makes face removes the needle card type probe head, in order for contact button 166 of the probe to contact with space transformer contact section 144, in order to arrange, one or one which includes plural membrane suspension probes 104 in the surface of the space transformer or by the fact that tile 302 above that is installed, can exchange with the membrane suspension probe. Probe point 168 being overpowered, the pushing when it contacts the contact pad on DUT, probe 104 turns contact button around the boundary aspect of contact section 144 of 166 and the space transformer. The end of the probe point 168 adjacent beam part 164 turning to the upper part, causes the local wiping taking of the probe point, twists the surface of the elastic membrane 304 where first insulating layer 306 resists the distortion of restitutive force. One or in order to make the surface which continues the probe head, can plural blank filling up tiles 312, install in the vicinity of the surface of space transformer 30.

As for the probe head which has the membrane suspension probe, the needle type probe compared to densely pitch it is possible, to do, it seems that can make suitably low inductance, it is possible to convert to the needle card type probe assembly which can utilize the membrane suspension probe. Because it decreases the distortion of the signal suitably, is operated at, the measurement where the precision in the inspection and optional frequency of the device which a higher frequency is high becomes possible.

Description above, from concrete many detailed explanation, it can understand this invention in detail. But, also there are no these detailed statements, if it is this trader, sufficiently to be execution it is widely known possible. It tried not to become something where this invention is indistinct by not explaining in detail other execution examples, widely known method, expedient, concerning the part and the circuit being able to meet.

All quotation literatures inside the bill are something which is invoked to this invention.

Terminology or expression of statement are not something which restricts this invention inside the bill, in addition, this terminology and use of expression are something which is restricted to the range of patent claim in only the range of invention of statement are not something which intends the fact that those which possess equal feature are excluded.