Nova Patents
IL108271A

High temperature adiabatic cooking device

Abstract

This record has no abstract on file.

IL108271A, drawing sheet 1
Sheet 1 of 6

Term

No projected expiry on record.

  1. Priority
  2. Filed
  3. Published
  4. Today

7 claims: 1 independent, 6 dependent

  1. 1
    WHAT IS CLAIMED IS; 1. A high temperature adiabatic cooking device comprising:an inner pot made of a thermally conductive material and having an outer surface and an upper flange extending laterally outwardly from the outer surface;an inner lid for covering said inner pot, said inner lid having an outer surface;an outer pot having a thermally insulated construction, said outer pot having an inner surface and a shoulder provided at an inner upper part of said outer pot to receive said upper flange of said inner pot such that said inner pot is removably supported in said outer pot by the upper flange on the shoulder so as to maintain a space between the entire outer surface of said inner pot and the entire inner surface of said outer pot;and an outer lid having a thermally insulated construction for covering said outer pot, thereby completely enclosing said inner pot covered with said inner lid, and said upper flange, in an air tight manner, said outer lid having an inner surface spaced from the entire outer surface of said inner lid;wherein said outer pot is comprised of an inner shell made of a rigid material, an outer shell and a heat insulating material disposed between the inner and outer shells having a thickness of from 10 to 40 mm to achieve a heat preservation capability of maintaining the temperature of the material within the inner pot above 93°C for one hour after said material in said inner pot is heated to 100°C and placed in said outer pot.
  2. 7
    8. The cooking device according to claim 7, wherein said heat insulating material between the inner and outer shells of the outer pot has a thermal conductivity (K) of less than 0.10 w/mC. '9. The cooking device according to claim 8, wherein said heat insulating material between the inner and outer shells of the outer pot has a thermal conductivity (K) of less than 0.05 w/mC.