Doping of particulate semiconductor materials
Abstract
A method for doping semiconductor particles to change the concentration of vehicle and / or the type of semiconductor material, the method comprising mixing a quantity of semiconductor particles, which have a particle size in the range of 1 nm to 100 µm, with a salt ionic or a preparation of ionic salts, so that the semiconductor particle layer as a whole is doped by adsorption or absorption of one or more ionic species from the ionic salt or the preparation of ionic salts.

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35 claims: 4 independent, 31 dependent
- 1REIVINDICACIONES 1. Un método para dopar partículas semiconductoras para cambiar la concentración de vehículo y/o el tipo del material semiconductor, comprendiendo el método mezclar una cantidad de partículas semiconductoras, que tienen un tamaño de partícula en el intervalo de 1 nm a 100 µm, con una sal iónica o una preparación de sales iónicas, de modo que capa partícula semiconductora como un todo se dopa mediante adsorción o absorción de una o más especies iónicas de la sal iónica o la preparación de sales iónicas.
- 2Un método de acuerdo con la reivindicación 1, caracterizado porque la sal iónica o la preparación de sales iónicas comprende uno o más haluros metálicos.
- 3Un método de acuerdo con la reivindicación 2, caracterizado porque la sal iónica o la preparación de sales iónicas comprende uno o más haluros alcalinos, haluros de tierras raras o haluros de metales de transición.
- 4Un método de acuerdo con la reivindicación 1, caracterizado porque la sal iónica o la preparación de sales iónicas comprende una o más sales de metales alcalinos.
- 5Un método de acuerdo con la reivindicación 1, caracterizado porque la sal iónica o la preparación de sales iónicas comprende una o más sales de tierras raras.
- 6Un método de acuerdo con la reivindicación 1, caracterizado porque la sal iónica o la preparación de sales iónicas comprende una o más sales de metales de transición.
- 7Un método de acuerdo con la reivindicación 1, caracterizado porque la sal iónica o la preparación de sales iónicas comprende sulfatos, carbonatos, nitratos o complejos aniónicos similares.
- 8Un método de acuerdo con la reivindicación 1, caracterizado porque la sal iónica o la preparación de sales iónicas comprende un compuesto que comprende un catión metálico y un grupo aniónico.
- 9Un método de acuerdo con una cualquiera de las reivindicaciones 1 a 8, caracterizado porque comprende la adición de una preparación de sales iónicas con un exceso de una especie catiónica, alcanzado mediante la adición de la base de la sal correspondiente, a una cantidad de partículas semiconductoras.
- 10Un método de acuerdo con la reivindicación 9, caracterizado porque la especie catiónica es un metal alcalino, un metal de las tierras raras, un metal de transición u otro ion metálico cargado positivamente.
- 11Un método de acuerdo con la reivindicación 9 o la reivindicación 10, caracterizado porque la sal es cloruro sódico (NaCl) y la base es hidróxido sódico (NaOH).
- 12Un método de acuerdo con la reivindicación 9 o la reivindicación 10, caracterizado porque la sal es cloruro magnésico (MgCl2) y la base es hidróxido magnésico (Mg(OH)2).
- 13Un método de acuerdo con una cualquiera de las reivindicaciones 1 a 8, caracterizado porque comprende la adición de una preparación de sales iónicas con un exceso de una especie aniónica, alcanzado mediante la adición del ácido de la sal correspondiente, a una cantidad de partículas semiconductoras.
- 14Un método de acuerdo con la reivindicación 13, caracterizado porque la especie aniónica es un halógeno, sulfato, carbonato, nitrato u otra especie o complejo cargados negativamente.
- 15Un método de acuerdo con la reivindicación 13 o la reivindicación 14, caracterizado porque la sal es cloruro sódico (NaCl) y el ácido es ácido clorhídrico (HCl).
- 16Un método de acuerdo con la reivindicación 13 o la reivindicación 14, caracterizado porque la sal es cloruro magnésico (MgCl2) y el ácido es ácido clorhídrico (HCl).
- 17Un método de acuerdo con una cualquiera de las reivindicaciones precedentes, caracterizado porque las partículas semiconductoras comprenden un elemento del grupo IV;un semiconductor de compuesto binario, ternario o cuaternario;un óxido;o un material semiconductor de calcogenuro.
- 18Un método de acuerdo con la reivindicación 17, caracterizado porque las partículas semiconductoras comprenden silicio.
- 19Un método de acuerdo con la reivindicación 17 o la reivindicación 18, caracterizado porque las partículas semiconductoras comprenden material intrínseco.
- 20Un método de acuerdo con la reivindicación 19, caracterizado porque las partículas semiconductoras comprenden silicio intrínseco.
- 21Un método de acuerdo con la reivindicación 17 o la reivindicación 18, caracterizado porque las partículas semiconductoras comprenden material tipo n.
- 22Un método de acuerdo con la reivindicación 21, caracterizado porque las partículas semiconductoras comprenden silicio de calidad metalúrgica.
- 23Un método de acuerdo con una cualquiera de las reivindicaciones 1 a 22, caracterizado porque las partículas semiconductoras tienen un tamaño de partícula en el intervalo de 10 nm a 1000 nm.
- 24Un método de acuerdo con la reivindicación 23, caracterizado porque las partículas semiconductoras tienen un tamaño de partícula en el intervalo de 50 nm a 500 nm.
- 25Un método de acuerdo con la reivindicación 24, caracterizado porque las partículas semiconductoras comprenden nanopolvo de silicio nominalmente intrínseco con un tamaño de partícula medio de 60 nm.
- 26Un método de acuerdo con la reivindicación 24, caracterizado porque las partículas semiconductoras comprenden nanopolvo de silicio de calidad metalúrgica con un tamaño de partícula medio de 200 nm.
- 27Una composición imprimible que comprende partículas semiconductoras dopadas de acuerdo con el método de una cualquiera de las reivindicaciones 1 a 26, un aglutinante y un disolvente.
- 28Una composición imprimible de acuerdo con la reivindicación 27, caracterizada porque las partículas semiconductoras están dopadas con la sal iónica o una preparación de la sal antes de mezclar con el aglutinante y/o el disolvente.
- 29Una composición imprimible de acuerdo con la reivindicación 27, caracterizada porque las partículas semiconductoras están mezcladas con el aglutinante y/o el disolvente antes de la adición de la sal iónica o una preparación de la sal.
- 30Una composición imprimible de acuerdo con una cualquiera de las reivindicaciones 27 a 29, caracterizada porque el aglutinante es acetato butirato de celulosa (CAB).
- 31Una composición imprimible de acuerdo con una cualquiera de las reivindicaciones 27 a 30, caracterizada porque el disolvente es cloroformo, acetona o diluyentes.
- 32Una composición imprimible de acuerdo con una cualquiera de las reivindicaciones 27 a 29, caracterizada porque el aglutinante es un poliéster o un éster autopolimerizante (monómero) y el disolvente es un alcohol, acetona o diluyentes.
- 33Una composición imprimible de acuerdo con la reivindicación 32, caracterizada porque el alcohol es etanol.
- 34Un material compuesto semiconductor formado por una mezcla de partículas semiconductoras dopadas de acuerdo con el método de una cualquiera de las reivindicaciones 1 a 26, y un aglutinante.
- 35Un dispositivo semiconductor que comprende un sustrato, capas primera y segunda de partículas semiconductoras depositadas sobre el sustrato en contacto entre sí, y contactos eléctricos respectivos hechos con las capas primera y segunda, caracterizado porque cada una de las capas primera y segunda comprende una composición imprimible de acuerdo con una cualquiera de las reivindicaciones 27 a 33, teniendo una de las capas primera y segunda propiedades tipo n y teniendo la otra de las capas primera y segunda propiedades tipo p, de modo que se defina una unión p-n entre las capas.
Independent claims35
74 paragraphs in 4 sections, as filed
p00001Doping of particulate semiconductor materials
BACKGROUND OF THE INVENTION
p00002This invention relates to a method of doped particulate semiconductor material. In particular, the invention relates to doped semiconductor nanoparticles, but has general applicability to doped particles with a wide range of sizes.
p00003Semiconductor nanoparticles, with a characteristic size of a few nanometers to several hundred nanometers, are a widely studied type of material, in which the effects of size dominate the properties of the mass material. In general, depending on the specific material and its application, three different phenomena related to size can change the electronic, optical, thermal and mechanical properties of such nanoparticles:
<dl><dt>1.</dt><dd> a different structure and composition compared to the known mass phases; </dd></dl>
<dl><dt>2.</dt><dd> the superior surface to volume ratio of the particles compared to the mass phase, which makes the surface states and processes dominate; and</dd></dl>
<dl><dt>3.</dt><dd> quantum confinement effects when the object size is similar or smaller than the wavelength and coherence length of a fundamental excitation (electronic state, optical wavelength or phonic excitation). </dd></dl>
p00004A specific problem concerns the control of the level of doped either of semiconductor particles, of the semiconductor layer or of the composite semiconductor material, as the case may be. In known processes, use has been made of previously doped mass material that is milled to a small particle size. Another possibility is to incorporate doping atoms in the nanomaterial during the synthesis by molecular nanotechnology (bottom-up) of nanoscale aggregates. In all cases, even if the type of doped (nop) is normally maintained at the nanoscale, the electrical characteristics of the particles, and the compositions thereof, can differ significantly from the mass prototype, and be difficult to control.
p00005In US-A-5926727, semiconductor particles such as silicon spheres are doped by spreading phosphorus in the particle.
p00006An object of the invention is to provide an alternative method for doping particulate semiconductor material.
SUMMARY OF THE INVENTION
p00007According to a first aspect of the invention, there is provided a method for doping semiconductor particles as indicated in claim 1.
p00008By "doping" It is understood to change the concentration of the vehicle and / or the type of semiconductor material.
p00009The ionic salt or the preparation of ionic salts may comprise one or more metal halides.
p00010Alternatively, the ionic salt or the preparation of ionic salts comprises one or more alkali halides, rare earth halides or transition metal halides; one or more alkali metal salts; one or more rare earth salts; one or more transition metal salts; or sulfates, carbonates, nitrates or similar anionic complexes. The ionic salt or the preparation of ionic salts may comprise a compound comprising a metal cation and an anionic group.
p00011The method may comprise the addition of a preparation of ionic salts with an excess of a cationic species, achieved by adding the base of the corresponding salt, to an amount of particulate semiconductor material.
p00012The cationic species can be an alkali metal, a rare earth metal, a transition metal or other positively charged metal ion.
p00013For example, the salt may be sodium chloride (NaCl) and the base may be sodium hydroxide (NaOH).
p00014By way of another example, the salt can be magnesium chloride (MgCl2) and the base can be magnesium hydroxide (Mg (OH) 2).
p00015The method may comprise the addition of an ionic salt preparation with an excess of an anionic species, achieved by adding the corresponding salt, to an amount of particulate semiconductor material.
p00016In this case, the anionic species may be a halogen, sulfate, carbonate, nitrate or other negatively charged species or complex.
p00017For example, the salt can be sodium chloride (NaCl) and the acid can be hydrochloric acid (HCl).
p00018In another example, the salt can be magnesium chloride (MgCl2) and the acid can be hydrochloric acid (HCl).
p00019The particulate semiconductor material may comprise an element of group IV; a semiconductor of binary, ternary or quaternary compound; an oxide; or a chalcogenide semiconductor material.
p00020In a preferred embodiment, the particulate semiconductor material comprises silicon.
p00021The particulate semiconductor material may comprise intrinsic material such as intrinsic silicon.
p00022Alternatively, the particulate semiconductor material may comprise an n-type material such as metallurgical grade silicon.
p00023The semiconductor particles have a particle size in the range of 1 nm to 100 µm.
p00024Preferably, the particulate semiconductor material has a particle size in the range of 10 nm to 1000 nm, and most preferably in the range of 50 nm to 500 nm.
p00025In one embodiment, the particulate semiconductor material comprises nominally intrinsic silicon nanopowder with an average particle size of 60 nm.
p00026In another embodiment, the particulate semiconductor material comprises metallurgical grade silicon nanopolymer with an average particle size of 200 nm.
p00027According to a second aspect of the invention, a printable composition is provided comprising semiconductor particles doped according to the method defined above, a binder and a solvent as indicated in claim 27.
p00028The printable composition may comprise particulate semiconductor material that has been doped with an ionic salt or a salt preparation before mixing with the binder and / or solvent.
p00029Alternatively, the particulate semiconductor material may comprise particulate semiconductor material that has been mixed with the binder and / or solvent before the addition of an ionic salt or salt preparation. The binder may be cellulose acetate butyrate (CAB), and the solvent may be chloroform, acetone or diluents.
p00030Alternatively, the binder may be a polyester or a self-polymerizing ester (monomer) and the solvent may be an alcohol, acetone or diluents.
p00031In case the solvent is an alcohol, it can be ethanol.
p00032According to a third aspect of the invention, there is provided a semiconductor composite material formed by a mixture of doped semiconductor particles according to the method defined above and a binder as indicated in claim 34.
p00033According to a fourth aspect of the invention, a semiconductor device is provided comprising a substrate, first and second layers of semiconductor particles deposited on the substrate in contact with each other, and respective electrical contacts made with the first and second layers, in the that each of the first and second layers comprises a printable composition as defined above, having one of the first and second layers of type n properties and having the other of the first and second layers of p-type properties, so that a pn junction is defined between the layers as indicated in claim 35.
BRIEF DESCRIPTION OF THE DRAWINGS
p00034Figures 1 (a) and 1 (b) are schematic diagrams illustrating the chemical mechanism of a doping process according to the invention;
p00035Figures 2 (a) and 2 (b) are graphs illustrating changes in the Hall coefficient of nanoparticulate silicon inks 5 doped with NaCl and MgCl2, respectively;
p00036Figures 3 (a) and 3 (b) are a transmission electron micrograph and a corresponding elementary map, respectively, of silicon nanopowder doped with 10% NaCl by weight;
p00037Figures 4 (a) and 4 (b) are schematic side and top views, respectively, of a prototypical diode structure according to the invention; and
p00038Figure 5 is a graph showing the current-voltage characteristics of an example of the diode structure of Figure 4.
DESCRIPTION OF EMBODIMENTS
p00039The invention relates to a method for doping particulate semiconductor material in general, and nanoparticles in particular, as well as compositions and composite materials made therefrom. This is achieved through
p00040fifteen addition of an ionic salt, or a preparation of different ionic salts, to an amount of the particulate material or particles as a dopant.
p00041The term & quot; salt & quot; It should be interpreted broadly enough to include any material generally called a salt, including an alkaline halide, e.g. ex. NaCl, a rare earth halide, p. ex. MgCl2, or that includes any complex anionic group, such as sulfates, nitrates, carbonates, acetates.
p00042The salt can be added to the semiconductor material by first dissolving it in water, or another suitable solvent, mixing with the particulate semiconductor material and then drying. Alternatively, the doping salt can be mixed directly into a composition consisting of the particulate semiconductor, a binder and / or a solvent.
p00043In the method of the invention, doped semiconductor particles are produced by doping which is effected
p0004425 on the semiconductor particles themselves, rather than on mass semiconductor material, of which the particles are constituted, as would normally be the case in conventional semiconductor technology. In conventional semiconductor materials, p-type doping, for example, is typically produced by the addition of a trivalent atom that accepts an electron, thus ionizing negatively, due to its incorporation into the crystalline structure. In other circumstances, the opposite occurs. In a chemical reaction, the same atom will be positively ionized by donating one or more electrons.
p00045Because the entire particle is doped, the method of the invention is therefore applicable to all particulate semiconductors, along all size scales from nanometers to tens, or hundreds, of microns, and composed of any material suitable including elementary semiconductors such as silicon, binary and tertiary compounds, chalcogenides and oxides. In addition, the method is applicable to particles
p0004635 in any structural phase, be it crystalline, amorphous or a mixture of both.
p00047The addition of an ionic salt to a quantity of semiconductor particles leads to the adsorption of the salt on the surface of each particle or, more rarely, to the absorption therein of an ion, which changes the concentration of free vehicle of the entire particle , thus influencing its electronic properties, as well as those of a composite material that contains many such particles. The addition of an ionic salt can be used not only to modify the density of the vehicle, but also to change the particulate semiconductor of type na and type vice versa. This allows much lower tolerances on the purity and electrical properties of the material used to produce the particles. In particular, metallurgical grade silicon, which is generally type n, can be modified without prior refining to produce pn junctions and other similar semiconductor device structures.
p00048The detailed mechanisms of the doping process caused by the addition of a
p00049Four. Five ionic salt Currently, there are two possible mechanisms, shown in Figure 1. The simplest hypothetical framework is the absorption or adsorption of an ion, by a particle that is then neutralized. A positively charged cation will then accept an electron from the particle, resulting in a type or global doping. Similarly, a negatively charged anion would donate an electron, leading to global n-type doping.
p00050In Figure 1 (a) a free C + (positive) cation is adsorbed or absorbed by a semiconductor particle 10 containing a total of n electrons and p holes. The cation is neutralized by removing an electron from the particle
p00051semiconductor The C ° neutral species can remain bound to particle 10.
p00052In the second case, if the ion is adsorbed, but maintains its state of charge, in order for the charge to be preserved, the particle has to change its global charge to the opposite of that of the ion. For this to happen, the ion will most likely be adsorbed on the surface of the particle. In this case, if an anion is adsorbed, the particle will lose an electron. In a liquid environment, this will most likely occur by neutralizing a positively charged species, such as a cation, or by ionizing a neutral species in solution.
p00053In Figure 1 (b), a free A- (negative) anion is adsorbed or absorbed by a semiconductor particle 10 containing a total of n electrons and p holes. The C + cation retains its state of charge and, in order to maintain global neutrality, an electron has to be removed by neutralizing a free cation or ionizing a neutral species.
p00054In any situation, the doping can be adjusted by buffering the saline solution with the acid corresponding to the anion, e.g. ex. HCl in the case of NaCl, or the base corresponding to the cation, e.g. ex. NaOH in the case of NaCl. Buffering with hydrochloric acid (HCl) adds chloride ions (Cl-) while buffering with sodium hydroxide (NaOH) adds sodium ions (Na +), thus changing the Na: Cl ratio of the solution.
p00055The doping method described above was performed on a semiconductor nanoparticulate ink prepared from a commercially available silicon nanopolymer, medium size 60 nm, from MTI Crystals Corp. Printed layers, produced using an ink comprising the Si nanopowder specified above and different inert binders, all showed light n conductivity as observed by the Hall effect measurements, although the powder as supplied is nominally intrinsic. In the third example, the powder used was ground to an average size of 200 nm from class 2305 metallurgical silicon provided by Silicon Smelters (Pty) Ltd, South Africa.
p00056Example 1: doped type p with NaCl
p00057In the first example of doping semiconductor nanoparticles according to the invention, sodium chloride was used to change the level of doping and the type of doping of the nanoparticulate ink, produced from the previously obtained intrinsically commercially obtained nanopowder, by adding it in various proportions by weight in relation to the amount of powder. The amount of binder was kept constant, in an amount equivalent to 8% by volume of the undoped composition. A self-polymerizing ester was used as a binder, using ethanol as a solvent.
p00058Figure 2 (a) shows the behavior of the Hall coefficient, which is inversely proportional to the net vehicle concentration, as a function of the amount of NaCl added to the mixture. With 2% by weight of NaCl, the printed layer is still type n, but has a slightly lower vehicle concentration, and a more negative Hall coefficient than undoped material. Between 2% and 4% of NaCl added, the material has changed from a semiconductor type to one type p. For 4% and more NaCl added, the Hall coefficient is positive, and decreases with increasing concentration. With 10%, the Hall coefficient is very low, but still positive.
p00059It can be inferred from the above data that the amount of NaCl added to the mixture should be in the range of about 0 to 10% by weight [about 0 to 5 mole%].
p00060The elementary mapping, using a scanning electron microscope with scanning (STEM) of 120 keV, clearly shows that the chlorine is adsorbed on the nanoparticles, and is not collected in the surrounding matrix of binder material. Figures 3 (a) and 3 (b) show the elementary map for chlorine and the corresponding micrograph for a powder doped with 10% NaCl. The position of the chlorine clearly corresponds to the position of the particles.
p00061Example 2: doped type py type n with MgCl2
p00062In the second example of doping according to the invention, magnesium chloride was used to change the level of doping and the type of doping of the nanoparticulate ink, produced from the commercially obtained nano-powder nominally intrinsically specified above, by adding it in various proportions by weight in relation to the amount of powder. The amount of binder was kept constant, in an amount equivalent to 8% by volume of the undoped composition.
p00063Figure 2 (b) shows the behavior of the Hall coefficient, which is inversely proportional to the net vehicle concentration, as a function of the amount of MgCl2 added to the mixture. For 4% doping, it was not possible to observe a Hall voltage, indicating that the vehicle concentration is zero and the Hall coefficient is undefined. This suggests that the initial doped is produced by entrapment or elimination of conduction electrons of the n-type particles.
p00064For MgCl2 additions between 4% and 16% by weight, the Hall coefficient is positive, but decreases with increasing concentration, indicating p-type conductivity. For 20% MgCl2, the conductivity becomes type n again. However, in this case, it seems that the Hall coefficient slightly crosses zero, which could be interpreted as a change in the type of net doped caused by competition between two effects. This could be either co-absorption of anionic or cationic species or adsorption of one type of ion in two different charge states. It can be seen that the amount of MgCl2 added to the mixture should be in the range of about 0-20% by weight [0-3.3 mol%].
p00065Example 3: PN junction with metallurgical grade silicon doped with NaCl
p00066The above-mentioned 2305 grade metallurgical silicon was ground for 180 minutes in an orbital sprayer and used for both p and n layers of a diode structure. The average particle size obtained under these milling conditions was 200 nm, with a large size distribution.
p00067400 mg of the powder was used in its initial state to produce an ink type n. To produce the p-type ink, 400 mg of the powder was mixed with a solution of NaCl in deionized water, so that the proportion of NaCl was 6% by weight of the dry silicon. After mixing, the solution was dried in the oven for three days at 60 ° C to evaporate the water.
p00068Inks were produced from both doped and non-doped powders by mixing the powder with 200 µl of the same self-curing binder described above, and about 400 µl of the same commercial lacquer diluent to adjust the viscosity.
p00069Figures 4 (a) and 4 (b) show, schematically, a prototypical diode manufactured as a test structure to demonstrate the rectifying properties of a pn junction obtainable using the powders described above. The diode structure was formed on a substrate 10 comprising 100 micron polyester film. The substrate was cut from a sheet of Xerox standard photocopy transparency material. A first conductor 12 was printed by cliché on a substrate using Dupont 5000 silver contact material, to define a contact layer 20 microns thick and 7 mm wide. A layer 14 of p-type ink, approximately 11 mm square and 50 microns thick, was dripped onto the silver bottom contact 12. After further drying for one day under ambient conditions, a type n layer 16 formed by dripping ink type n ink over the center of the p type layer 14 to form a layer approximately 60 microns thick and 7 mm square. After further drying, a thick top contact layer 18 was painted over the center of the p-type layer 16 to allow a cable 20 to be applied to the device.
p00070Figure 5 shows the current / voltage characteristics of the device described above. The rectifying behavior of the pn junction formed between the two printed silicon layers 14 and 16 is clearly shown, with an initial voltage of approximately 1 V.
p00071Potential applications of semiconductor nanoparticles produced by the method of the invention include their use in electroluminescent materials and dye-sensitized solar cells (DSC); Organic and inorganic semiconductor inks, printed semiconductor layers and printed devices. Depending on the application, individual particles can be randomly dispersed in a matrix (quantum dots, OLED, DSC cells, organic semiconductor inks), can be arranged regularly (photonic arrangements), or can form an interconnected structure (inorganic semiconductor inks). The latter can be a narrow packed structure, a random network or a fractal agglomeration of aggregates of different sizes. In some applications, when a single or multi-layer structure is required, the size restriction can be relaxed so that the larger semiconductor particles in the micrometric or even submillimeter scale form the semiconductor component of the composite material or the printable composition.
Contents4
4 sheets
Sheet 1 Sheet 2 Sheet 3 Sheet 4
16 members in 10 offices
Priority claims2
| Document | Office | Kind | Date |
|---|---|---|---|
| 200506752 | South Africa | – | |
| 200506752 | South Africa | A |
Members16
| Document | Office | Kind | |
|---|---|---|---|
| WO2007023362A1 | World Intellectual Property Organization (WIPO) | A1 | |
| EP1926843A1 | European Patent Office (EPO) | A1 | |
| CN101248222A | China | A | |
| KR20080098356A | Republic of Korea | A | |
| JP2009505930A | Japan | A | |
| US2009092855A1 | United States of America | A1 | |
| ZA200801815B | South Africa | B | |
| US7763530B2 | United States of America | B2 | |
| EP1926843B1 | European Patent Office (EPO) | B1 | |
| AT518024T | Austria | T | |
| ATE518024T1 | Austria | T1 | |
| PT1926843E | Portugal | E | |
| ES2370519T3This record | Spain | T3 | |
| JP5193041B2 | Japan | B2 | |
| KR101345277B1 | Republic of Korea | B1 | |
| CN101248222B | China | B |
Numbers
- Publication
- 2370519
- Application
- 6779969
Titles2
- Spanish
- DOPADO DE MATERIALES SEMICONDUCTORES PARTICULADOS.
- English
- DOPADO OF PARTICULATED SEMICONDUCTING MATERIALS.
Classification
- CPC, 9
- B82Y10/00
- C09D11/52
- C30B31/00
- C30B29/605
- C30B31/04
- H10P32/16
- B82Y30/00
- H10P32/00
- H10P30/20
- IPC, 5
- C30B31 00
- C09D11 00
- H01L21 00
- H10P95 00
- H10P32 16