Nova Patents
EP2275166A2

Visual prosthesis

Abstract

An implantable device, comprising: an electrically non-conductive substrate; a plurality of electrically conductive feedthroughs through said electrically non-conductive substrate; an electrical circuit attached to said electrically non-conductive substrate and electrically connected to a said plurality of electrically conductive feedthroughs; and a cover bonded to said electrically non-conductive substrate, said cover, said electrically non-conductive substrate and said electrically conductive feedthroughs forming a hermetic package.

EP2275166A2, drawing sheet 1
Sheet 1 of 37

Term

Term ended

Projected expiry passed 3 March 2020, 6.6 years ago.

  1. Priority
  2. Filed
  3. Published
  4. Projected expiry
  5. Today

12 claims: 10 independent, 2 dependent

  1. 1
    An implantable device, comprising:an electrically non-conductive substrate;a plurality of electrically conductive feedthroughs through said electrically non-conductive substrate;an electrical circuit attached to said electrically non-conductive substrate and electrically connected to a said plurality of electrically conductive feedthroughs;and a cover bonded to said electrically non-conductive substrate, said cover, said electrically non-conductive substrate and said electrically conductive feedthroughs forming a hermetic package.
  2. 4
    The implantable device according to claims 2 or 3, wherein said cover is brazed to said electrically non-conductive substrate.
  3. 5
    The implantable device according to any of claims 1 - 4, further comprising a plurality of electrodes electrically coupled to said plurality of electrically conductive feedthroughs.
  4. 6
    The implantable device according to any of claims 1 - 5, wherein said cover includes a metal ring and a metal cap laser welded to said metal ring.
  5. 7
    The implantable device according to any of claims 1 - 6, wherein said feedthroughs are straight feedthroughs.
  6. 8
    The implantable device according to any of claims 1 - 7, further comprising capacitors electrically coupled to said feedthroughs and supported by said electrically non-conductive substrate.
  7. 9
    The implantable device according to any of claims 1 - 8, wherein said circuit is flip-chip bonded by conductive bumps to said non-conductive substrate.
  8. 10
    The implantable device according to any of claims 1 - 9 wherein said non-conductive substrate, has a certain width, said cover has a certain height perpendicular to said width, and said width is greater than said height.
  9. 11
    The implantable device according to any of claims 1 - 10, wherein said implantable device is a visual prosthesis.
  10. 12
    The implantable device according to any of claims 1 - 10, wherein said implantable device is a retinal prosthesis.