Semiconductor device and its fabricating method
Abstract
The present invention is characterized by forming a metal film, an insulating film, and an amorphous semiconductor film in sequence over a first substrate; crystallizing the metal oxide film and the amorphous semiconductor film; forming a first semiconductor element by using the crystallized semiconductor film as an active region; attaching a support to the first semiconductor element by using an adhesive; causing separation between the metal film and the insulating film; attaching a second substrate to the separated insulating film; separating the support by removing the first adhesive; forming an amorphous semiconductor film over the first semiconductor element; and forming a second semiconductor element using the amorphous semiconductor film as an active region.

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Projected expiry passed 19 December 2023, 2.8 years ago.
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1 sheet
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Every citation, both ways
| Document | Relation | Office | Cited during |
|---|---|---|---|
| JP2001292276A | Cites | Japan | Search report |
| US5273910A | Cites | United States of America | Search report |
| US6437370B1 | Cites | United States of America | Search report |
| CAREY PAUL G ET AL: "Polysilicon thin film transistors fabricated on low temperature plastic substrates", JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY: PART A, AVS /AIP, MELVILLE, NY., US, vol. 17, no. 4, 1 July 1999 (1999-07-01), pages 1946 - 1949, XP012004648, ISSN: 0734-2101, DOI: 10.1116/1.581708 | Non-patent | – | Search report |
| LU J P ET AL: "Flat panel imagers with pixel level amplifiers based on polycrystalline silicon thin-film transistor technology", APPLIED PHYSICS LETTERS, A I P PUBLISHING LLC, US, vol. 80, no. 24, 17 June 2002 (2002-06-17), pages 4656 - 4658, XP012031235, ISSN: 0003-6951, DOI: 10.1063/1.1481788 | Non-patent | – | Search report |
26 members in 8 offices
Priority claims3
| Document | Office | Kind | Date |
|---|---|---|---|
| 2003002667 | Japan | – | |
| 2003002667 | Japan | A | |
| 03780931 | European Patent Office (EPO) | A |
Members26
| Document | Office | Kind | |
|---|---|---|---|
| WO2004068582A1 | World Intellectual Property Organization (WIPO) | A1 | |
| AU2003289448A1 | Australia | A1 | |
| TW200503256A | Taiwan Province of China | A | |
| US2005056842A1 | United States of America | A1 | |
| KR20050094428A | Republic of Korea | A | |
| EP1583148A1 | European Patent Office (EPO) | A1 | |
| CN1735968A | China | A | |
| JPWO2004068582A1 | Japan | A1 | |
| US2007015302A1 | United States of America | A1 | |
| EP1583148A4 | European Patent Office (EPO) | A4 | |
| CN100392861C | China | C | |
| US7449718B2 | United States of America | B2 | |
| US7501306B2 | United States of America | B2 | |
| US2009212285A1 | United States of America | A1 | |
| EP2256807A2 | European Patent Office (EPO) | A2 | |
| TWI338362B | Taiwan Province of China | B | |
| KR101026644B1 | Republic of Korea | B1 | |
| US7919779B2 | United States of America | B2 | |
| JP4693413B2 | Japan | B2 | |
| JP2011109116A | Japan | A | |
| JP5352572B2 | Japan | B2 | |
| JP2014003307A | Japan | A | |
| JP5736422B2 | Japan | B2 | |
| JP2015144300A | Japan | A | |
| EP2256807A3This record | European Patent Office (EPO) | A3 | |
| JP6242831B2 | Japan | B2 |
15 legal events, as the office reported them to INPADOC
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| Event | Code | |
|---|---|---|
| Application deemed to be withdrawnWithdrawn18D | 18D | |
| Information on the status of an ep patent application or granted ep patentGrantedSTATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWNSTAA | STAA | |
| Designated contracting statesAK | AK | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Search report despatchedORIGINAL CODE: 0009013PUAL | PUAL | |
| Divisional application: reference to earlier applicationAC | AC | |
| Designated contracting statesAK | AK | |
| Public reference made under article 153(3) epc to a published international application that has entered the european phaseORIGINAL CODE: 0009012PUAI | PUAI |
Numbers
- Publication
- 2256807
- Application
- 100098037
Titles3
- German
- Halbleiterbauelement und dessen Herstellungsverfahren
- English
- Semiconductor device and its fabricating method
- French
- Dispositif semiconducteur et son procédé de fabrication
Classification
- CPC, 21
- H10D86/0214
- H10F77/16
- H10F39/107
- H10D86/60
- H10D86/421
- H10D86/411
- H10D86/481
- H10D86/40
- H10D30/0314
- H10D30/0321
- H10D30/6731
- H10D30/6745
- H10P72/7434
- H10W72/252
- H10W90/724
- H10W72/923
- H10W72/9223
- H10W72/942
- H10W72/922
- H10W72/952
- H10F39/12
- IPC, 10
- H01L27 12
- H01L21 84
- H01L21 336
- H01L29 786
- H01L21 20
- H01L27 146
- H01L29 66
- H01L27 144
- H10P95 00
- H10P14 40
Designated states1
- Contracting states, 1
- Netherlands (Kingdom of the)