EP1576649A4

Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers and a method of making the same

Abstract

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Term

Term ended

Projected expiry passed 25 October 2022, 3.9 years ago.

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Citations
DocumentRelationOfficeCited during
US6184060B1CitesUnited States of AmericaSearch report
US6235552B1CitesUnited States of AmericaSearch report