Nova Patents
AT444564T

Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers and a method of making the same

Abstract

This record has no abstract on file.

Term

No projected expiry on record.

  1. Priority
  2. Filed
  3. Granted
  4. Today

18 members in 6 offices

This recordMember, by publication datePriority claim

Priority claims2

Priority claims
DocumentOfficeKindDate
93868601United States of AmericaA
0234339United States of AmericaW

Members18

Family members, oldest first
DocumentOfficeKind
US2003080419A1United States of AmericaA1
WO03038861A2World Intellectual Property Organization (WIPO)A2
AU2002353894A1AustraliaA1
US2003127735A1United States of AmericaA1
US6784547B2United States of AmericaB2
US6797537B2United States of AmericaB2
US2005037540A1United States of AmericaA1
EP1576649A2European Patent Office (EPO)A2
WO03038861A3World Intellectual Property Organization (WIPO)A3
EP1576649A4European Patent Office (EPO)A4
US7239012B2United States of AmericaB2
EP2101349A2European Patent Office (EPO)A2
EP1576649B1European Patent Office (EPO)B1
AT444564TThis recordAustriaT
ATE444564T1AustriaT1
DE60233902D1GermanyD1
EP2101349A3European Patent Office (EPO)A3
EP2711976A2European Patent Office (EPO)A2