EP1575084A3

Method for depositing a solder material on a substrate

Abstract

The present invention is related to a method for providing solder material on a predetermined area on a substrate, comprising the steps ofproviding a substrate (1),producing a confinement layer (7) extending on a first area of a first surface of the substrate, said confinement layer comprising a confinement material, the confinement material and the solder material repelling each other,producing a wetting layer (9), extending on a second area, comprising a wetting material, the second area lying within the first area, the wetting material attracting the solder material,depositing the solder material (10) on a part of the wetting layer, said solder material being indium,reflowing the solder material until the wetting layer is covered with a layer of solder material. Further a novel packaging method is disclosed. Also a novel type of package is described.

EP1575084A3, drawing sheet 1
Sheet 1 of 1

Term

Term ended

Projected expiry passed 28 February 2025, 1.6 years ago.

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