Nova Patents
EP1565931A4

Strained finfet cmos device structures

Abstract

A semiconductor device structure, includes a PMOS device (200) and an NMOS device (300) disposed on a substrate (1, 2) the PMOS device including a compressive layer (6) stressing an active region of the PMOS device, the NMOS device including a tensile layer (9) stressing an active region of the NMOS device, wherein the compressive layer includes a first dielectric material, the tensile layer includes a second dielectric material, and the PMOS and NMOS devices are FinFET devices (200, 300).

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Term ended

Projected expiry passed 25 November 2022, 3.8 years ago.

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Citations
DocumentRelationOfficeCited during
US2002093046A1CitesUnited States of AmericaSearch report
US2003040158A1CitesUnited States of AmericaSearch report
US6342410B1CitesUnited States of AmericaSearch report
US6573172B1CitesUnited States of AmericaSearch report
SHIMIZU A ET AL: "Local mechanical-stress control (LMC) a new technique for CMOS-performance enhancement", INTERNATIONAL ELECTRON DEVICES MEETING 2001. IEDM. TECHNICAL DIGEST. WASHINGTON, DC, DEC. 2 - 5, 2001, NEW YORK, NY : IEEE, US, 2 December 2001 (2001-12-02), pages 1941 - 1944, XP010575160, ISBN: 0-7803-7050-3Non-patentSearch report
ITO S ET AL: "Effect of mechanical stress induced by etch-stop nitride: impact on deep-submicron transistor performance", MICROELECTRONICS AND RELIABILITY, ELSEVIER SCIENCE LTD, GB, vol. 42, no. 2, February 2002 (2002-02-01), pages 201 - 209, XP002332483, ISSN: 0026-2714Non-patentSearch report
ITO S ET AL: "Mechanical stress effect of etch-stop nitride and its impact on deep submicron transistor design", ELECTRON DEVICES MEETING, 2000. IEDM TECHNICAL DIGEST. INTERNATIONAL DECEMBER 10-13, 2000, PISCATAWAY, NJ, USA,IEEE, 10 December 2000 (2000-12-10), pages 247 - 251, XP010531755, ISBN: 0-7803-6438-4Non-patentSearch report
See also references of WO 2004049406A1Non-patentSearch report