Chemical mechanical polishing slurry useful for copper substrates

A chemical mechanical polishing slurry precursor composition comprising urea and at least one metal oxide abrasive. Also disclosed is a method for polishing a substrate including at least one metal layer comprising the steps of: (a) admixing such a precursor composition and deionized water to form a chemical mechanical polishing slurry precursor composition; (b) admixing the precursor composition of step (a) with hydrogen peroxide to form a chemical mechanical polishing slurry composition; (c) applying the chemical mechanical polishing slurry composition of step (b) to the substrate; and (d) removing at least a portion of the metal layer from the substrate by bringing a pad into contact with the substrate and moving the pad in relation to the substrate.