Nova Patents
AT304040T

Chemical mechanical polishing slurry useful for copper substrates

Abstract

This record has no abstract on file.

Term

No projected expiry on record.

  1. Priority
  2. Filed
  3. Granted
  4. Today

30 members in 13 offices

This recordMember, by publication datePriority claim3 more offices are in the list below

Priority claims3

Priority claims
DocumentOfficeKindDate
76370596United States of AmericaA
89164997United States of AmericaA
94403697United States of AmericaA

Members30

Family members, oldest first
DocumentOfficeKind
EP0846742A2European Patent Office (EPO)A2
WO9826025A1World Intellectual Property Organization (WIPO)A1
AU5373998AAustraliaA
EP0846742A3European Patent Office (EPO)A3
JPH1121546AJapanA
US5954997AUnited States of AmericaA
IL130393D0IsraelD0
KR20000057476ARepublic of KoreaA
US6126853AUnited States of AmericaA
TW419714BTaiwan Province of ChinaB
US6309560B1United States of AmericaB1
US2002033382A1United States of AmericaA1
US6362106B1United States of AmericaB1
US2002145127A1United States of AmericaA1
US6569350B2United States of AmericaB2
US6593239B2United States of AmericaB2
EP1559762A2European Patent Office (EPO)A2
EP0846742B1European Patent Office (EPO)B1
AT304040TThis recordAustriaT
ATE304040T1AustriaT1
DK0846742T3DenmarkT3
DE69734138D1GermanyD1
DE69734138T2GermanyT2
ES2248831T3SpainT3
EP1559762A3European Patent Office (EPO)A3
KR100690470B1Republic of KoreaB1
MY134702AMalaysiaA
JP4494538B2JapanB2
EP1559762B1European Patent Office (EPO)B1
MY185089AMalaysiaA