Flip chip type LED lighting device and its manufacturing method

BACKGROUND OF THE INVENTION

1. Field of the Invention:

0001The present invention relates to a lighting device manufacturing method and more particularly, to a simple method of making flip chip type LED lighting devices without wire bonding.

2. Description of the Related Art:

0002A lighting device is a requisite in our daily life. It lights up the space when dark. Following fast development of high technology, flip chip LEDs have been intensively used to substitute for conventional incandescent lamps.

0003<figref idref="f0001">FIG. 1</figref> is a schematic sectional view of a flip chip type LED lighting device made according to the prior art. According to this design, the flip chip type LED lighting device <b>1</b> comprises a submount <b>12,</b> bond fingers <b>16, 18</b> provided at two sides of the submount <b>12,</b> and a plurality of flip chip LEDs (light emitting diodes) <b>10</b> bonded on the submount <b>12</b> and electrically connected to the bond fingers <b>16, 18</b> by wire bonding. According to this design, a die bonding and a wire bonding procedures must be employed to have the legs of the LEDs <b>10</b> connected to the bond fingers <b>16, 18.</b> This wire bonding procedure is complicated. During wire bonding, the LEDs <b>10</b> or submount <b>12</b> may be damaged accidentally.

0004Therefore, it is desirable to provide a flip chip type LED lighting device manufacturing method, which eliminates the aforesaid problem.

SUMMARY OF THE INVENTION

0005The present invention has been accomplished under the circumstances in view. It is one object of the present invention to provide a flip chip type LED lighting device manufacturing method, which eliminates the application of wire bonding. It is another object of the present invention to provide a flip chip type LED lighting device manufacturing method, which has the bottom wall of the submount exposed to the outside for the bonding of a heat conducting/dissipating member to improve the heat dissipation effect of the lighting device. To achieve these and other objects of the present invention, the flip chip type LED lighting device manufacturing method comprises the steps of a) providing a strip, the strip comprising a plurality of strip elements, the strip elements having a respective metal lead frame respectively electrically connected to one another; b) providing a submount and a plurality of flip chip LEDs (light emitting diodes) installed in the submount; c) forming a metal bonding layer between the strip bond pad, that has been pre-fixed in the strip, and the submount to form a lighting structure; and d) cutting the lighting structure thus obtained into individual flip chip type LED lighting devices based on each strip element. The method of the invention further comprises the step of bonding a heat conducting/dissipating member to the submount of each individual flip chip type LED lighting device.

BRIEF DESCRIPTION OF THE DRAWINGS

0006<ul id="ul0001" list-style="none" compact="compact"><li><figref idref="f0001">FIG. 1</figref> is a schematic sectional view of a flip chip type LED lighting device made according to the prior art.</li><li><figref idref="f0002">FIG. 2</figref> is a block diagram showing the flow of a flip chip type LED lighting device manufacturing method according to the present invention.</li><li><figref idref="f0003">FIG. 3</figref> is a schematic drawing of a strip for the fabrication of a flip chip type LED lighting device according to the present invention.</li><li><figref idref="f0004">FIG. 4</figref> is a schematic sectional view of a flip chip type LED lighting device made according to the present invention.</li><li><figref idref="f0005">FIG. 5</figref> is a schematic sectional view of a light module based on a flip chip type LED lighting device according to the present invention.</li></ul>

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

0007Referring to <figref idref="f0002">FIG. 2</figref>, a flip chip type LED lighting device manufacturing method in accordance with the present invention includes the steps of: <ul id="ul0002" list-style="none" compact="compact"><li>S10-providing a strip, as <figref idref="f0003">FIG. 3</figref> shown, wherein the strip is prepared having a plurality of strip elements <b>20</b>, each strip element <b>20</b> having a metal lead frame <b>21</b>, the metal lead frames <b>21</b> of the strip elements <b>20</b> being respectively electrically connected together;</li><li>S12-providing a submount, for example, silicon or low temperature co-firing ceramic(LTCC) submount is provided, and a plurality of light emitting elements, for example, light emitting diodes are installed on the silicon submount by flip chip;</li><li>S14-formation of metal bonding layer where a metal bonding layer is formed on the bottom wall of the strip or the top wall of the submount with a low temperature solder material for example, tin base alloy, bismuth base alloy, or indium base alloy, or by means of eutectic bonding, or gold to gold ultrasonic bonding to form a lighting structure;</li><li>S16-bonding of sub-mount to strip where the submount is attached to the bottom side of the strip and at the same time the submount is heated to melt the metal bonding layer to fix the submount to the strip and to electrically connect the metal lead frames to the bond pads of the submount, or using a lower bonding temperature by associating with ultrasonic energy; and</li><li>S18-cutting where the structure thus obtained is cut into individual flip chip type LED lighting devices each containing one strip element.</li></ul>

0008After the aforesaid step S 18, a heat conducting/dissipating member is provided under and fixedly fastened to each individual flip chip type LED lighting device. The heat conducting/dissipating member could be bonded to the flip chip type LED lighting device by means of the application of a conductive adhesive containing silver or copper filler. Alternatively, a low temperature solder material may be directly applied on the bottom wall of the flip chip type LED lighting device and following treated with thermal process (Ex. reflow) to achieve the bonding. It is also constructive to bond a heat conducting/dissipating member to the bottom wall of each individual flip chip type LED lighting device by means of eutectic bonding.

0009After bonding of a heat conducting/dissipating member to the bottom wall of each individual flip chip type LED lighting device, a light condensing element, for example, condenser lens or reflector is used to adjust the light path of the lighting device, enhancing the radiation brightness.

0010<figref idref="f0004">FIG. 4</figref> is a sectional view of a flip chip type LED lighting device <b>2</b> made according to the present invention. As illustrated, the flip chip type LED lighting device <b>2</b> comprises a strip element <b>20,</b> a metal lead frame <b>21</b> embedded in the strip element <b>20,</b> a flip chip embedded submount <b>22</b> bonded to the strip element <b>20,</b> flip chip LEDs <b>24</b> bonded to circuits on the strip element <b>20,</b> and a metal, for example, conductive or Ag paste bonding layer <b>26</b> between the strip element <b>20</b> and the sub-mount <b>22</b>.

0011<figref idref="f0005">FIG. 5</figref> is a light module based on the aforesaid flip chip type LED lighting device. As illustrated, the light module comprises a flip chip type LED lighting device <b>2</b>, a heat conducting/dissipating member <b>30</b> bonded to the bottom wall of the submount <b>22</b> by means of a thermal interface material (TIM), for example, silver glue, copper glue, low temperature solder material, and a light condensing element <b>32</b> covering the top side of the flip chip type LED lighting device <b>2</b> to concentrate the light of the flip chip LEDs <b>24</b>.

0012As indicated above, The method of the present invention comprises the step of providing a strip, the step of providing a submount, the step of forming a metal bonding layer on the strip or submount, the step of bonding the submount to the strip, and the step of cutting the structure thus obtained into individual flip chip type LED lighting devices. This method eliminates the procedure of wire bonding as is commonly seen in the prior art designs. Therefore, the invention simplifies the fabrication of flip chip type LED lighting devices.

0013Although a particular embodiment of the invention has been described in detail for purposes of illustration, various modifications and enhancements may be made without departing from the scope of the appended claims.