EP1524705A3

Flip chip type led lighting device manufacturing method

Abstract

A flip chip type LED lighting device manufacturing method includes the step of providing a strip (20), the step of providing a submount (22), the step of forming a metal bonding layer (26) on the strip or submount, the step of bonding the submount (22) to the strip (20), and the step of cutting the structure thus obtained into individual flip chip type LED lighting devices.

EP1524705A3, drawing sheet 1
Sheet 1 of 1

Term

Term ended

Projected expiry passed 12 January 2025, 1.7 years ago.

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1 sheet

  1. Sheet 1