Method for shaping a periphal edge of a wafer

The invention relates to a method for shaping an edge region of a wafer with the method steps: (a) a wafer having a first and a second surface is provided; (b) at least one layer is applied to an inner region of the first surface such that at least a portion of an edge region on the first surface remains uncovered by the at least one layer; (c) the edge region of the wafer is removed until all edge regions on the first surface are covered by the at least one layer; (d) The wafer is thinly ground from the second surface to a predetermined thickness.