Semiconductor device and manufacturing method thereof
Abstract
There are provided a structure of a semiconductor device in which low power consumption is realized even in a case where a size of a display region is increased to be a large size screen and a manufacturing method thereof. A gate electrode in a pixel portion is formed as a three layered structure of a material film containing mainly W, amaterial film containing mainly Al, and a material film containing mainly Ti to reduce a wiring resistance. A wiring is etched using an IPC etching apparatus. The gate electrode has a taper shape and the width of a region which becomes the taper shape is set to be 1 µm or more.

Term
Term ended
Projected expiry passed 28 February 2022, 4.6 years ago.
- Priority
- Filed
- Published
- Projected expiry
- Today
1 sheet
Sheet 1
Every citation, both ways
| Document | Relation | Office | Category | Cited during | Relevant claims |
|---|---|---|---|---|---|
| EP1001467A2 | Cites | European Patent Office (EPO) | – | Search report | – |
| EP1005094A2 | Cites | European Patent Office (EPO) | – | Search report | – |
| EP1049167A2 | Cites | European Patent Office (EPO) | – | Search report | – |
| JP2000269505A | Cites | Japan | – | Search report | – |
| KR20010015419A | Cites | Republic of Korea | – | Search report | – |
| JP2001053283A | Cites | Japan | – | Search report | – |
| US5396084A | Cites | United States of America | – | Search report | – |
| US5694061A | Cites | United States of America | – | Search report | – |
| US5821138A | Cites | United States of America | – | Search report | – |
| US6130443A | Cites | United States of America | – | Search report | – |
| JPH07169967A | Cites | Japan | XAI | Search report | 8,14 |
| JP7169967A | Cites | Japan | – | – | – |
33 members in 8 offices; this record represents the family
Priority claims4
| Document | Office | Kind | Date |
|---|---|---|---|
| 2001056063 | Japan | – | |
| 2001056063 | Japan | A | |
| 2001302687 | Japan | – | |
| 2001302687 | Japan | A |
Members33
| Document | Office | Kind | |
|---|---|---|---|
| EP1237195A2 | European Patent Office (EPO) | A2 | |
| KR20020070864A | Republic of Korea | A | |
| CN1373384A | China | A | |
| US2002158288A1 | United States of America | A1 | |
| JP2003174173A | Japan | A | |
| US6657260B2 | United States of America | B2 | |
| US2004164296A1 | United States of America | A1 | |
| CN1555098A | China | A | |
| US2005092996A1 | United States of America | A1 | |
| CN1614743A | China | A | |
| JP2005191564A | Japan | A | |
| US6984550B2 | United States of America | B2 | |
| SG118117A1 | Singapore | A1 | |
| TWI249761B | Taiwan Province of China | B | |
| MY128437A | Malaysia | A | |
| CN1311558C | China | C | |
| CN101026172A | China | A | |
| JP4079655B2 | Japan | B2 | |
| US7405115B2 | United States of America | B2 | |
| KR100865244B1 | Republic of Korea | B1 | |
| US2009035922A1 | United States of America | A1 | |
| CN100474595C | China | C | |
| SG160191A1 | Singapore | A1 | |
| JP4593256B2 | Japan | B2 | |
| CN1555098B | China | B | |
| US8053339B2 | United States of America | B2 | |
| CN1614743B | China | B | |
| US2012043580A1 | United States of America | A1 | |
| SG179310A1 | Singapore | A1 | |
| EP1237195A3This record | European Patent Office (EPO) | A3 | |
| US8735889B2 | United States of America | B2 | |
| US2014256116A1 | United States of America | A1 | |
| US9330940B2 | United States of America | B2 |
32 legal events, as the office reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | |
|---|---|---|
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Application withdrawnWithdrawn18W | 18W | |
| Information on the status of an ep patent application or granted ep patentGrantedSTATUS: THE APPLICATION HAS BEEN WITHDRAWNSTAA | STAA | |
| First examination report despatched17Q | 17Q | |
| Designation fees paidAKX | AKX | |
| Request for examination filed17P | 17P | |
| Designated contracting statesAK | AK | |
| Request for extension of the european patentAX | AX | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Search report despatchedORIGINAL CODE: 0009013PUAL | PUAL | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Information provided on ipc code assigned before grantRIC1 | RIC1 | |
| Designated contracting statesAK | AK | |
| Request for extension of the european patentAL;LT;LV;MK;RO;SIAX | AX | |
| Public reference made under article 153(3) epc to a published international application that has entered the european phaseORIGINAL CODE: 0009012PUAI | PUAI |
Numbers
- Publication
- 1237195
- Application
- 20046702
Titles3
- German
- Halbleiterbauelement und dessen Herstellungsverfahren
- English
- Semiconductor device and manufacturing method thereof
- French
- Dispositif sémi-conducteur et son procédé de fabrication
Classification
- CPC, 16
- G02F1/13454
- H10D30/67
- H10W70/05
- G02F1/13458
- G02F1/136286
- G02F1/13629
- G02F1/136295
- H10D86/00
- H10D86/441
- H10D86/60
- H10D86/0225
- H10D30/673
- H10D30/6739
- H10D30/6719
- H10D30/6715
- H10P14/29
- IPC, 18
- H01L27 12
- H01L21 84
- G02F1 1362
- H01L21 77
- H01L29 423
- H01L29 49
- H01L29 786
- H10D30 67
- H10D62 40
- H10D86 85
- H04N23 51
- H04N23 56
- H10B10 00
- H10D30 01
- H10D64 27
- H10D64 66
- H10D84 03
- H10D86 01
Designated states2
- Contracting states, 1
- Türkiye
- Extension states, 1
- Slovenia