A device and method for fabricating a small area of contact between electrodes

<u>BACKGROUND OF THE INVENTION</u>

A. <u>Field of the Invention</u>

0001The present invention relates generally to semiconductor fabrication techniques and, more particularly, to a method for fabricating a small contact area between an upper and lower electrode for use in phase changeable memory devices such as, for example, chalcogenide memory cells.

B. <u>Description of the Prior Art</u>

0002The use of electrically writable and erasable phase change materials, i.e., materials that can be electrically switched between generally amorphous and generally crystalline states or between different resistive states while in crystalline form, for electronic memory applications is well known in the art. The use of phase change materials is disclosed, for example, in U.S. Patent No. 5,296,716, in the names of Ovshinsky et al., the disclosure of which is incorporated herein by reference. U.S. Patent No. 5,296,716 is believed to indicate generally the state of the art, and to contain a discussion of the current theory of operation of chalcogenide materials.

0003Generally, as disclosed in the Ovshinsky patent, such phase change materials can be electrically switched between a first structural state where the material is generally amorphous and a second structural state where the material has a generally crystalline local order. The material may also be electrically switched between different detectable states of local order across the entire spectrum between the completely amorphous and the completely crystalline states. That is, the switching of such materials is not required to take place between completely amorphous and completely crystalline states, but rather, the material can be switched in incremental steps reflecting changes of local order to provide a "gray scale" represented by a multiplicity of conditions of local order spanning the spectrum from the completely amorphous state to the completely crystalline state.

0004Chalcogenide material exhibits different electrical characteristics depending upon its state. For example, in its amorphous state the material exhibits lower electrical conductivity than it does in its crystalline state. The operation of chalcogenide memory cells requires that a region of the chalcogenide memory material, called the chalcogenide active region, be subjected to a current pulse typically with a current density between 10⁵ and 10⁷ amperes/cm², to change the crystalline state of the chalcogenide material within the active region contained within a small pore. This current density may be accomplished by first creating a small opening in a dielectric material that is itself deposited onto a lower electrode material. A second dielectric layer, typically of silicon nitride, is then deposited onto the dielectric layer into the opening. The second dielectric layer is typically about 40 Angstroms (10Å = 1nm) thick. The chalcogenide material is then deposited over the second dielectric and into the opening. An upper electrode material is then deposited over the chalcogenide material. Carbon is commonly used as the electrode material, although other materials have also been used, for example, molybdenum and titanium nitride. A conductive path is then provided from the chalcogenide material to the tower electrode material by forming a. pore in the second dielectric layer by a well-known firing process.

0005Firing involves passing an initial high current pulse through the structure that passes through the chalcogenide material and then provides dielectric breakdown of the second dielectric layer, thereby providing a conductive path via the pore created through the memory cell. Electrically firing the thin nitride layer is not desirable for a high density memory product due to the high current required and the large amount of testing time required for the firing.

0006The active regions of the chalcogenide memory cells within the pores are believed to change crystalline structure in response to applied voltage pulses of a wide range of magnitudes and pulse durations. These changes in crystalline structure alter the bulk resistance of the chalcogenide active region. The wide dynamic range of these devices, the linearity of their response, and lack of hysteresis provide these memory cells with multiple bit storage capabilities.

0007Factors such as pore dimensions (i.e., diameter, thickness and volume), chalcogenide composition, signal pulse duration and signal pulse waveform shape have an effect on the magnitude of the dynamic range of resistances, the absolute endpoint resistances of the dynamic range, and the currents required to set the memory cells at these resistances. For example, relatively large pore diameters, e.g., about one micron, will result in higher programming current requirements, while relatively small pore diameters, e.g., about 500 Angstroms, will result in lower programming current requirements. The most important factor in reducing the required programming current is the pore cross sectional area.

0008The energy input required to adjust the crystalline state of the chalcogenide active region of the memory cell is directly proportional to the dimensions of the minimum lateral dimension of the pore, e.g., smaller pore sizes result in smaller energy input requirements. Conventional chalcogenide memory cell fabrication techniques provide minimum lateral pore dimension, diameter or width of the pore, that is limited by the photolithographic size limit. This results in pore sizes having minimum lateral dimensions down to approximately 0.35 microns. However, further reduction in pore size is desirable to achieve improved current density for writing to the memory cell.

0009JP-A-07058204 discloses method of manufacturing a semiconductor device wherein a patterned aluminium film is thickly formed on a board. The aluminium film is covered by a first silicon oxide film and the pattern of the aluminium film is flattened by removing the first silicon oxide film. First aluminium wiring and a conductive pillar are formed by simultaneously etching the first aluminium film and the first silicon oxide film using a resist as a mask. The conductive pillar and the first aluminium wiring are buried by a second silicon oxide film, and the step of the conductive pillar is flattened by removing the second silicon oxide film. Second aluminium wiring is formed and is electrically connected to the first aluminium wiring through the intermediary of the conductive pillar. Consequently, as the steps on the first aluminium wiring are reduced to one step, the step on the circumference of the conductive pillar can be filled up easily by the second silicon oxide film.

0010EP-A-5265 discloses a process for contacting the electrode of an electrical component that is connected to an electrically-conductive carrier plate by means of an insulating adhesive. The electrode is arranged on the side of the component adjacent to the adhesive, wherein the layer of adhesive is removed at one or more places, by contact-forming means, during the joining and bonding step that is carried out under the influence of heat and pressure. The process is characterised in that the adhesive layer is applied to the carrier plate before the joining step, and projections that are embossed on the adhesive-coated carrier plates, and that are higher than the adhesive layer, are used as the contact-forming means.

0011WO 96/41380 discloses a memory device having a plurality of memory arrays. Each array has a plurality of memory cells, each memory cell including an electrode defining a respective contact area. Each memory array is formed by depositing a continuous chalcogenide layer. This chalcogenide layer, even when continuous, will have active areas formed above the electrodes, and a conductive layer electrically coupling at least a portion of the plurality of electrodes. The electrodes can be contacts, plugs or pillars deposited in etched openings in the dielectric volume.

0012US-A-4845533 discloses thin film electrical structures, such as threshold switching devices and phase change memory cells, preferably utilizing electrically stable, relatively inert, conductive electrodes including a non-single- crystal deposited film of carbon material. The film of carbon material, which is preferably amorphous and substantially pure, is disposed adjacent to a layer of active material such as an amorphous semiconductor, and serves to prevent undesired degradation of the active material, especially when the device is carrying appreciable current in its on-state. A method of making such structures with high quality interfaces between the semiconductor layer and the conductive carbon barrier layers adjacent thereto by successively depositing such layers in a continuously maintained partial vacuum is disclosed. The method may include a step performed in the vacuum for hermetically sealing all of or at least the electrically switchable portion of, the active layer against subsequent contamination. Thin film structures suitable for threshold switching or memory applications and employing insulating pores having substantially sloped side walls are also disclosed.

0013US-A-4915779 discloses a residue-free plasma etch of high temperature aluminium copper metallization provided by the use of a single plasma etcher. The metallization layer is covered by a single etcher and a vacuum is established. The protective oxide layer is then etched and without breaking the vacuum or removing the structure from the etcher the metal layer is also etched. This results in the etched surface being residue-free.

<u>SUMMARY OF THE INVENTION</u>

0014The present invention is directed at overcoming, or at least reducing the effects of, one or more of the problems set forth above. In particular, the present invention provides a method for fabricating a small contact area between electrodes of chalcogenide memory cells, such that the contact area provides minimum dimensions below the photolithographic limit, thereby reducing the required energy input to the chalcogenide active region in operation. The electrodes are further selected to provide material properties that permit enhanced control of the current passing through the chalcogenide memory cell. As a result, the memory cells may be made smaller to provide denser memory arrays, and the overall power requirements for the memory cells are minimized.

0015Additional advantages of the invention will be set forth in part in the description that follows, and in part will be obvious from the description, or may be learned by practice of the invention.

0016In a first aspect, the present invention comprises an integrated circuit device in accordance with Claim 1.

0017In another aspect, the present invention comprises a method of fabricating a chalcogenide memory cell in accordance with Claim 10.

0018It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.

<u>BRIEF DESCRIPTION OF THE DRAWINGS</u>

0019The accompanying drawings, which are incorporated in and constitute a pan of this specification, illustrate one embodiment of the present invention and, together with the description, serve to explain the principles of the invention. In the drawings: <ul id="ul0001" list-style="none" compact="compact"><li>FIG. I is a fragmentary cross sectional view of the deposition of a layer of polysilicon onto a substrate of titanium nitride in accordance with a preferred embodiment of the present invention;</li><li>FIG. 2 is a fragmentary cross sectional view of the deposition of a layer of silicon oxide and a layer of resist material onto the layer of polysilicon;</li><li>FIG. 3 is a fragmentary cross sectional view of a contact pattern that is etched in the layer of resist material and the silicon oxide layer using etching, masking, and photoresist stripping techniques;</li><li>FIG. 4(a) is an overhead view of a generally rectangular contact pattern formed from the resist material and silicon oxide layers;</li><li>FIG. 4(b) is an overhead view of a generally circular contact pattern formed from the resist material and silicon oxide layers;</li><li>FIG. 5 is fragmentary cross sectional view of the device after the resist material layer has been stripped away using strip etching techniques;</li><li>FIG. 6 is a fragmentary cross sectional view of a portion of the layer of polysilicon material not covered by the silicon oxide layer pattern that is etched using conventional undercut isotropic etching techniques to form a frusto-conical shaped tip in the layer of polysilicon material;</li><li>FIG. 7 is a fragmentary cross sectional view of the device after the contact pattern has been removed using conventional wet etch techniques;</li><li>FIG. 8 is a fragmentary cross sectional view of the depositing of a layer of insulative material onto the layer of polysilicon material, including the tip, using conventional thin film deposition methods to isolate the layer of polysilicon material, including the tip;</li><li>Fig. 9 is a fragmentary cross sectional view of planarization of the layer of insulative material using a conventional chemical mechanical planarization (CMP) process;</li><li>FIG. 10 is a fragmentary cross sectional view of a chalcogenide material layer that is deposited using conventional thin film deposition methods;</li><li>FIG. 11 is a fragmentary cross sectional view of a layer of conductive material deposited over the chalcogenide layer using conventional thin film deposition techniques;</li><li>FIG. 12 is a fragmentary cross sectional view of the layer of chalcogenide material and the second layer of conductive material after they are etched back using conventional masking and etching techniques;</li><li>FIG. 13 is a fragmentary cross sectional view of a second layer of insulative material that is applied using conventional thin film deposition techniques;</li><li>FIG. 14 is a fragmentary cross sectional view of the second layer of insulating material after it is etched back; and</li><li>FIG. 15 is a fragmentary cross sectional view of the complete chalcogenide memory cell including an upper conductive grid layer.</li></ul>

<u>DESCRIPTION OF THE PREFERRED EMBODIMENT</u>

0020A method of fabricating a small area of contact between electrodes of chalcogenide memories is presented that provides an area of contact with the lower electrode by the upper electrode, via the chalcogenide material, that is smaller than that presently provided using conventional photolithographic techniques. In particular, the preferred embodiment of the present invention provides a method of fabricating electrodes for chalcogenide memories in which a minimum area of contact of the lower electrode with the upper electrode is formed by creating a tip on the lower electrode. In this manner, the lower electrode having a minimum area of contact as small as 0.00785 µm² is obtained. The present preferred embodiment thus provides enhanced control of the current passing through the resulting chalcogenide memory, and thus, reduces the total current and energy input required to the chalcogenide active region in operation. The total current passing through the chalcogenide active region is two milliamps (mA): Thus, the current density required by the preferred embodiment is 1 x 10⁶ A/cm² to 1 x 10⁷ A/cm². Furthermore, the preferred embodiment allows the memory cells to be made smaller and thus allow the production of denser memory arrays, and allows the overall power requirements for the memory cell to be minimized.

0021Reference will now be made in detail to the present preferred embodiment of the invention, an example of which is illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like pans.

0022Turning to the drawings and referring to FIGs. 1 to 15, a preferred embodiment of a method for fabricating a small area of contact between an upper and lower electrode for chalcogenide memories will now be described. A layer 22 of conductive material, preferably polysilicon, is deposited onto a substrate 20 using conventional thin film deposition methods such as, for example, chemical vapor deposition (CVD). as illustrated in FIG. 1. The layer 22 of conductive material may have a substantially uniform thickness ranging from 5000 to 7000 Angstroms, and preferably will have a substantially uniform thickness of approximately 6500 Angstroms. Substrate 20 may also be comprised of a conductive material such as, for example, silicon, TiN, Carbon, WiSi_x, or Tungsten, and preferably will be comprised of silicon. The substrate 20 will further preferably comprise a lower electrode grid (not shown) used for accessing an array of chalcogenide memories.

0023A layer 23 of silicon oxide is deposited onto the substrate 22, preferably by CVD, and preferably will have a thickness of 500 Angstroms. A layer 24 of resist material is spun onto the silicon oxide layer 23, as illustrated in FIG. 2. The layer 24 of resist material preferably will have a substantially uniform thickness of approximately 15,000 Angstroms.

0024A contact pattern 26, is then etched in the resist layer 24 and the silicon oxide layer 23 using conventional masking, exposing, etching, and photoresist stripping techniques as shown in FIG. 3. The contact pattern 26 may be formed from the resist layer 24 and silicon oxide layer 23, for example, as a generally rectangular block as shown in FIG. 4(a), or as a substantially circular block as shown in FIG. 4(b). Contact pattern 26 is preferably formed using a conventional contact hole mask resulting in the substantially circular block shown in FIG. 4(b). The minimum lateral dimension of the contact pattern 26 preferably will be approximately 0.4 µm. The contact pattern 26 includes a generally horizontal bottom surface 28, common to the polysilicon layer 22, and generally vertical side walls 27 at its outer periphery.

0025The resist layer 24 is then removed using conventional stripping techniques after the contact 26 has been patterned in the silicon oxide layer 23, as shown in FIG. 5. Thus, the silicon oxide layer 23 remains as the contact pattern 26. The silicon oxide layer 23 contact pattern is used as a masking layer when the polysilicon layer 22 is subsequently etched.

0026The portion of the polysilicon layer 22 not covered by silicon oxide layer pattern 23 is etched, and the portions beneath silicon oxide pattern 23 are undercut, using wet etch or dry plasma etching techniques to form a frusto-conical shaped tip 30 in the polysilicon layer 22, as shown in FIG. 6. The resulting tip 30 is frusto-conical in shape preferably having a minimum frustum lateral dimension of approximately 0.1 µm. The base of the tip 30 preferably will have a base minimum lateral dimension of approximately 0.4 µm, i.e., the same dimension as the lateral dimension of the contact pattern 26. Tip 30 will preferably have a height of approximately 2000 Angstroms. The removal of the silicon oxide layer pattern 23 is accomplished using conventional wet etch techniques as shown in FIG. 7. Contact pattern 26 thus provides a means for defining the area of contact of the base of the frusto-conical tip 30 of layer 22 of 0.00785 µm² [π x (0.1/2)²].

0027A layer 32 of insulative material is deposited onto the polysilicon layer 22, including the tip 30, using conventional thin film deposition methods such as, for example, CVD, to isolate the polysilicon layer 22, including the tip 30, as illustrated in FIG. 8. The layer 32 of insulative material may have a substantially uniform thickness of approximately 2000 to 5000 Angstroms, and preferably will have a substantially uniform thickness of approximately 2000 Angstroms, i.e., the same thickness as the height of the tip 30. Layer 32 of insulative material may be comprised of silicon oxide or silicon nitride, and preferably will be comprised of silicon oxide.

0028The layer 32 of insulative material is then preferably planarized using a conventional chemical mechanical planarization (CMP) process as illustrated in FIG. 9. The CMP process is performed to expose the top surface 24 of the tip 30 formed on the polysilicon layer 22 that may also be referred to as the lower electrode.

0029The chalcogenide memory cell is then formed incorporating the tip 30 of the polysilicon layer 22 using conventional semiconductor processing techniques such as, for example, thin-film deposition, masking, and etching processes. As shown in FIG. 15, the chalcogenide memory cell preferably includes a layer 34 of chalcogenide material, a layer 36 of conductive material serving as an upper electrode, an interlayer dielectric (ILD) layer 38, and an upper conductive layer 40.

0030The chalcogenide material layer 34 may be deposited using conventional thin film deposition methods, as shown in FIG. 10. Chalcogenide material layer 34 preferably is approximately 500 Angstroms thick. Typical chalcogenide compositions for these memory cells include average concentrations of Te in the amorphous state well below 70%, typically below about 60% and ranging in general from as low as about 23% up to about 56% Te, and most preferably to about 48% to 56% Te. Concentrations of Ge are typically above about 15% and range from a low of about 17% to about 44% on average, and remain generally below 50% Ge, with the remainder of the principal constituent elements in this class being Sb. The percentages are atomic percentages which total 100% of the atoms of the constituent elements. In a particularly preferred embodiment, the chalcogenide compositions for these memory cells comprise a Te concentration of about 56%, a Ge concentration of about 22%, and a Sb concentration of about 22%. The materials are typically characterized as Te_aGe_bSb_100-(a+b), where a is equal to or less than about 70% and preferably between about 40% to about 60%, b is above about 15% and less than 50%, and preferably between about 17% to 44%, and the remainder is Sb.

0031The carbon layer 35 is preferably 600 Angstroms thick and is provided over the chalcogenide layer 34 using conventional thin film deposition techniques, as shown in FIG. 11. Layer 36 of conductive material is deposited over the carbon layer 35 using conventional deposition techniques, as further shown in FIG. 11. The layer 36 of conductive material thereby provides an upper electrode for the chalcogenide memory cell. The layer 36 of conductive material is preferably titanium nitride (TiN), but may comprise TiN or carbon, and has a thickness of approximately 500 Angstroms. Layers 34-36 are subsequently etched back using conventional masking and etching techniques, as shown in FIG. 12.

0032As shown in FIG. 13, the ILD layer 38 is then applied using conventional thin film deposition techniques. The ILD layer 38 preferably is approximately 3500 Angstroms thick, and comprises silicon oxide. The ILD layer 38 is then etched back, as shown in FIG. 14, using conventional masking and etching processes to provide access to the layer 36 of conductive material or upper electrode by the upper conductive grid 40. Upper conductive grid interconnect 40 may be formed by first applying a blanket deposition of conductive material using conventional thin film deposition processes and then by etching the conductive material to form the upper conductive grid interconnect extending above the surface of the ILD layer 38, as shown in FIG. 15. The upper conductive grid 40 material may comprise materials such as, for example, Ti, TiN, or aluminum, and preferably it will comprise aluminum.

0033In a particularly preferred embodiment, the methods described above are utilized to form an array of chalcogenide memory cells that are addressable by an X-Y grid of upper and lower conductors, i.e., electrodes. In the particularly preferred embodiment, diodes are further provided in series with the chalcogenide memory cells to permit read/write operations from/to individual chalcogenide memory cells as will be recognized by persons of ordinary skill in the art. The present invention includes the fabrication of a plurality of tips 30 on the lower electrode, i.e., the polysilicon layer 22, such that a plurality of chalcogenide memory cells may be created. The drawings show only a single tip 30 for ease of illustration of the present invention. Furthermore, while a range of materials may be utilized for each layer, the particular materials selected for each layer must be selected to provide proper selectivity during the various etching processes as will be recognized by persons of ordinary skill in the art.

0034It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.