Data carrier with an electronic module and process for producing the same

p0001The invention relates to a single-layer or multi-layer data carrier according to the preamble of claim 1. The invention also relates to a manufacturing method for such data carriers.

p0002In the past, various IC cards have been made which are produced by different methods.

p0003Thus, for example, from the <patcit id="pcit0001" dnum="EP0140230B1"><text>EP-B1 0 140 230</text></patcit> An IC card which is constructed from several plastic layers and is produced in the so-called laminating technique. For this purpose, a structure consisting of an upper cover layer, at least one core layer and a lower cover layer is provided. An electronic module consisting of a substrate, on which an integrated circuit with contact surfaces is arranged, is placed between the upper cover layer and the core layer. This structure is connected to one another under the effect of heat and pressure, whereby the contact surfaces of the module lie in recesses of the upper cover layer and the integrated circuit lies in a recess of the core film. The composite of the plastic layers is formed by the layers softening and joining together during lamination. In the finished card, the module is embedded between the upper cover layer and the core layer.

p0004From the <patcit id="pcit0002" dnum="EP0493738A1"><text>EP-A1 0 493 738</text></patcit> An IC card is also known which is produced in the so-called assembly technique. This technique is characterized in that firstly a card body with a multi-stage recess is provided. The electronic module is then inserted into the recess and glued. This happens at the<patcit id="pcit0003" dnum="EP0493738A1"><text>EP-A1 0 493 738</text></patcit> With a thermally activatable adhesive.

p0005The card body provided can be produced, for example, by laminating a plurality of plastic layers first without a recess. In a further step, the recess is then produced, for example, by milling.

p0006From the <patcit id="pcit0004" dnum="US4417413A"><text>US-A-4417413</text></patcit> An IC card is known which essentially consists of a multi-layered paper element which forms the card core, which is laminated with elastic covering films. The cover films are used to hold the module holding the IL chip in a window of the card.

p0007From the <patcit id="pcit0005" dnum="DE4206445A"><text>DE-A-42 06 445</text></patcit> A telephone card is known which consists of a carrier in card form made of conventional plastic material. On the carrier is a replaceable telephone tag, in the form of a stamp, for example, made of paper.

p0008However, the card body can also be produced in another way. Thus, for example,<patcit id="pcit0006" dnum="DE4142392A1"><text>DE-A1 41 42 392</text></patcit> It became known to manufacture the card body by injection molding. For this purpose, an injection mold is used whose molding space corresponds to the shape of a card body. During the injection molding process, the recess is produced in the card body by means of a movable punch which can be retracted into the molding space after almost complete filling of the molding space. After completing the card body, the electronic module is glued in a second step.

p0009Alternatively, it is possible to use the movable punch directly for pressing the module into the plastic material of the plastic body which has not yet been hardened. In this case, the production of the card body and the embedding of the module are completed in one operation.

p0010IC cards manufactured in injection molding technology are also available from the <patcit id="pcit0007" dnum="EP0277854B1"><text>EP-B1 0 277 854</text></patcit> known. There, it is proposed to insert the electronic module into the injection mold during the injection process of the plastic mass. The module is fixed in the injection mold by externally applied suction air. The cast body of the module protecting the integrated circuit is obliquely shaped and is thus held securely in the card body by the surrounding injection molding material.

p0011In addition to the method steps for producing the card body and for embedding the module according to FIG <patcit id="pcit0008" dnum="DE4142392A1"><text>DE-A1 41 42 392</text></patcit> or <patcit id="pcit0009" dnum="EP0277854B1"><text>EP-B1 0 277 854</text></patcit> Further measures must be taken for the application of print images to the card surface. From the<patcit id="pcit0010" dnum="EP0412893B1"><text>EP-B1 0 412 893</text></patcit> An injection molding process for producing IC cards is known in which the IC card can also be provided with a graphic element during injection molding. For this purpose, a card-sized paper layer, which is printed on both sides, is inserted into the mold. Thereafter, a transparent plastic material is injected into the mold so that the printed image of both card pages can be seen in the finished card body. In the method, a recess for the electronic module can be produced either by a punch protruding into the mold, or else the module can be fixed directly in the mold and encapsulated.

p0012In the above-mentioned methods, the single-layer or multi-layer card body consists of plastic material. In the laminating technique, the card layers are connected to one another under the action of heat and pressure, and finally cooled again. This requires a relatively high amount of time. Although such cards are produced "packet-wise" in the stack of so-called multi-use sheets, and although the electronic module can already be laminated during the welding of the plastic layers, the throughput of the finished cards is nevertheless very limited per unit of time. This limitation is also reflected in the card price.

p0013In the case of injection molding technology, the production of the card body or of the IC card is relatively simple and can be realized with less time. However, the equipment for the production of injection moldings or injection-molding cards has a high purchase price. In addition, these systems are primarily designed for single-card production, so the throughput per unit of time remains the same as for laminated cards.

p0014From the above, it follows that a further cost reduction of the unit price of an IC card with the techniques used hitherto for manufacturing the IC card is possible, if at all, only to a small extent.

p0015It is therefore the object of the invention to propose an IC card in which the card assembly and the method for producing the card enable further cost reduction.

p0016The object is achieved by the characterizing features of the main claim.

p0017The advantages of the invention are, in particular, to be seen in the fact that the paper layers required for the card assembly, regardless of whether the card is a single-layer or multi-layer card, can be provided by the reel and the paper IC card can thus be fed into the card Endless technology. In this case, a plurality of layers can be glued very simply, since the layers bonded either cold or with the aid of thin, thermally activatable adhesives can be produced without complex waiting times. Moreover, all of the technologies known from conventional paper processing can be transferred to the manufacture of the paper IC card, both in the connection of the individual card layers as well as in the printing of the card layers. For example, the printing techniques known from paper technology can be used inexpensively, for example by roller or sheet printing of the layers. In this case, all printing qualities known from paper technology can be achieved. In contrast to the plastic card, the paper IC card is environmentally friendly and recyclable. A further advantage of the IC card is that it has a high thermostability depending on the adhesive used. Further, because of its absorbent surface, the paper IC card is easily provided with individual data, for example, an ink jet printer. Finally, the paper IC card can be provided with all the security features that have become known from the securities area. For example, it would be possible to provide one of the paper layers with a safety thread known from the banknote area and to integrate it into the card.

p0018As the state of the art shows, the entire development of the IC card, which is now almost 20 years, has been oriented as a material for the card body. This is straightforward because a plastic material has been chosen which is both long-lived and highly resistant.

p0019In the course of the development of the IC card, however, applications have also become known in which the cards are also used for shorter running times. An example of such an application is the telephone card. However, the plastic was simply adopted in the choice of the card material of telephone cards. There was, therefore, a prejudice in the professional world to consider other materials as plastic for the manufacture of integrated circuit cards, since only with this material was it possible to produce cards which would provide the necessary protection for the sensitive IC- Building block. In spite of the above-mentioned considerable advantages offered by a card made of paper or cardboard, this material has so far not been considered for producing cards with integrated circuits.

p0020In a preferred embodiment of the invention, a paper card body is first produced, into which the electronic module is subsequently glued. The card body can consist of several paper layers or a cardboard layer.

p0021In a further exemplary embodiment of the invention, the electronic module is laminated into the card body during the production of the cards. In this case, the module can either be embedded between two layers or else be glued in a recess.

p0022In a further preferred exemplary embodiment, an electronic module, which is suitable for a non-contacting data exchange, is introduced into a recess of the core layer during the laminating process of several card layers.

p0023BRIEF DESCRIPTION OF THE DRAWINGS Exemplary embodiments and further advantages of the invention are explained in more detail with reference to the following figures, in which: FIG.<dl id="dl0001"><dt>FIG</dt><dd>An IC card in top view</dd><dt>FIG</dt><dd>A cross-section through a card body layer construction</dd><dt>FIG</dt><dd>A cross-section through a card body with a recess</dd><dt>FIG</dt><dd>A layer structure for a card to be produced in laminating technology in cross-section</dd><dt>FIG</dt><dd>A layer structure of a card in the cross-section</dd><dt>FIG</dt><dd>5 a cross-section, but with a recess. FIG</dd><dt>FIG</dt><dd>A layer structure of a card before the composite of the individual layers in the cross-section</dd><dt>FIG</dt><dd>7 is a cross-sectional view of the layer structure of FIG. 7, the card layers being connected to one another</dd><dt>FIG</dt><dd>An IC card in cross-section</dd><dt>FIG</dt><dd>A card body with a recess in the cross-section</dd><dt>FIG</dt><dd>An IC card in cross-section</dd><dt>FIG</dt><dd>A layer structure for a card to be produced in laminating technology in cross-section</dd><dt>FIG</dt><dd>An IC card in cross-section</dd><dt>FIG</dt><dd>An IC card in cross-section</dd><dt>FIG</dt><dd>An IC card in cross-section</dd><dt>FIG</dt><dd>An IC card in cross-section</dd><dt>FIG</dt><dd>A method for producing an IC card</dd><dt>FIG</dt><dd>A multi-layered endless band in top view</dd><dt>FIG</dt><dd>A cross-section from FIG. 18</dd><dt>FIG</dt><dd>An IC card in top view</dd><dt>FIG</dt><dd>A stack of IC cards in cross-section.</dd></dl>

p0024FIG. 1 shows an IC card with an electronic module 1 in a card body 3 in a top view. The card body 3 has dimensions which are defined in an ISO standard with the designation ISO 7810. The electronic module 1 is embedded in the card body at a defined position, which is also defined by an ISO standard with the designation ISO 7816/2. According to the invention, the card body 3 of the IC card is made of one or more paper and / or cardboard layers.

p0025FIG. 2 shows a multi-layer card structure in the cross-section before the lamination of the individual card layers. The card structure consists of an upper cover layer 5, a core layer 7 and a lower cover layer 9. The core layer 7 is provided on both sides with a thin thermally activatable adhesive layer 11 by means of which the layers are glued. Prior to the joining of the individual layers, windows 13 and 15 are punched into the layers 5 and 7, so that a two-stage recess is formed in the card body after the three layers have been combined and bonded. When a plurality of core layers are used, it is also possible to produce a multi-stage recess in the card body, wherein the windows in the individual core layers always become smaller as viewed from the upper cover layer. Such a card assembly is particularly advantageous when the casting mass of the electronic module is configured as a droplet, as shown, for example, in FIG. 9, since the contours of the recess can then be adapted to the shape of the casting compound and the bottom region of the recess is small .

p0026The card laminate can be produced in large throughputs. Thus, the layers 5, 7, and 9 can be provided by rolls and guided for lamination by heated laminating rolls between which the thermally activatable adhesive coatings are activated. This results in an endless laminate, which is provided at corresponding intervals with the recesses for accommodating the electronic module. From this continuous laminate, the individual card bodies are punched out in a further process step. The electronic modules 1 are glued into the recess of the card body. The necessary adhesive can either be located directly on the module or inserted into the recess, for example in the form of a liquid adhesive. The module can be installed in the card body before or after the card is punched out.

p0027In order to increase the bondability between the module and the card body, instead of the thermally activatable adhesive 11 lying above the card layer, the core layer 7 can be provided with a fabric 8 impregnated with a thermally activatable adhesive. In FIG. 2 the tissue is indicated by the points in the upper thermally activatable layer 11. The fabric can be selected to provide an optimum bond strength between the electronic module and the card body. In the finished card, the tissue is thus located between the cover layer 5 and the core layer 7. By the fixed connection of the module to the tissue, the module is thus anchored between the card layers in the finished IC card. As an alternative to a fabric which is located all over the core layer 7, it is also possible to provide the core layer 7 with a fabric or a film only in the area of ​​the window 15. The above-mentioned effects can also be achieved thereby.

p0028The module shown in FIG. 2 bears on its surface 12 contact areas for the contacting contact removal. Alternatively, the IC card can also be provided with an electronic module which is suitable for non-contact data exchange. Such a module can be inserted into the window 15. In this case, the window 13 in the cover layer 5 can therefore be dispensed with, so that the module for the contactless data exchange lies in the window 15 between the cover layers 5 and 9 in the finished IC card.

p0029FIG. 3 shows the card body of a single-layer cardboard card in cross-section. The carton 17 may also be provided by a roll. Box 15 is punched into the box at corresponding intervals. Furthermore, a recess 19 of small depth, which has a larger diameter than the window 15, is produced by the deep embossing of the carton 17 in the region of the window 15. The electronic module 1 can be glued into the resulting recess of the cardboard, the bottom of the recess 19 being used as the adhesive layer. The module can in turn be glued into the recess by means of an adhesive located on the module, which can be designed as a thermo-activatable adhesive or as a pressure-sensitive adhesive, or by means of a liquid adhesive. The card can be punched out of the endless box before or after gluing. In the finished IC card, a part of the window 15, which is not filled by the module, can still be located on the rear side of the card in the module area. In order to give the card a better appearance, this part can also be closed additionally, for example by casting with a casting compound or by other means.

p0030FIG. 4 again shows a multi-layer card assembly prior to lamination in the cross-section. The layers 5, 7 and 9 are identical to those of FIG. 2. In addition to these layers, the structure also has separate adhesive layers 21 and 23, which are also provided with corresponding punches.

p0031The adhesive coatings 21 and 23 can be designed either as thermo-activatable layers or as pressure-sensitive adhesive layers. In the latter case, the windows in the layers must be produced when the layers are still coated with a silicone tape in order to avoid sticking the punching tools. After punching the windows, the silicone tapes can be rolled up from the pressure-sensitive adhesive layers and onto prepared rolls.

p0032The electronic module 1 can already be inserted into the windows of the adhesive layer 21 before the roller laminating in such a way that the contact area area rests on the adhesive layer 21 and the area of ​​the module which accommodates the integrated circuit is located in the window as shown in FIG FIG. When laminating the card layers shown, the module shown is thus glued simultaneously with the adhesive layer 21 in the recess of the card body.

p0033If the electronic module is not to be glued into the recess during lamination of the card body, it is also possible to punch out the window in the adhesive layer 21 as much as the window in the cover layer 5. In this case, the shoulder of the two- Laminating the layers free from the adhesive layer so that upon the heating of this layer no adhesive material can penetrate the surface of the card. Such an embodiment is particularly advantageous if the stamped card body is to be stored as an intermediate product. The card assembly shown in FIG. 4 is also particularly suitable for embedding a module for non-contact data exchange. In this case, again, the windows in the layers 5 and 21 can be dispensed with.

p0034FIGS. 2 and 4 show multi-layer map constructions, in which the individual layers already have windows before they are joined, which, after the layers are joined together, form a recess in the card body. In contrast, FIGS. 5-8 show exemplary embodiments in which the recess is subsequently inserted into the card body.

p0035FIG. 5 shows a card assembly consisting of a core layer 7 and the cover layers 5 and 9, the layers being connected to one another by thermally activatable adhesive coatings 11. For example, extremely thin polyethylene (PE) film or amorphous polyethylene terephthalate (APET) film, which are applied to the core layer 7 on both sides, can be used as thermally activatable adhesive coatings. In the cover layer 5, a cutting edge 43 is first produced with a cutting tool 41 which defines the edge of the first part of a two-stage recess. The two-stage recess 19 shown in FIG. 6 is then produced with a milling tool in the card body in such a way that the thermo-activatable adhesive layer 11 is uncovered on the shoulder 45.

p0036The use of a cutting tool for producing the cutting edge 43 has the advantage that a clean and optically perfect edge is produced in the visible region of the finished chip card, whereas when using a milling tool for producing a cutout in the paper, Edges "to fractions", as indicated in FIG. 6 in the edge region of the lower part of the two-stage recess. It is, of course, also possible to dispense with the use of a cutting tool and to produce the recess exclusively with a milling tool.

p0037An electronic module, as shown, for example, in FIG. 2, is inserted into the two-stage recess 19 of the card body (see FIG. 6) and glued on the shoulder 45 by means of the thermally activatable adhesive layer 11 released during the milling process. It is, of course, also possible to additionally provide the electronic module with an adhesive in order to improve the bond to the card body. This is particularly advantageous if the thermo-activatable adhesive coatings 11 are very thin and the adhesive layer 11 in the shoulder region 45 of the recess is intended or unintentionally damaged or eliminated in the milling operation.

p0038FIG. 7 shows the same layer structure as FIG. 5, but the cover layers 5 and 9 are not yet connected to the core layer 7. In the exemplary embodiment shown, the card layers are connected to one another by means of heating punches 45 and 47 under the action of heat and pressure, the heating plungers 45 and 47 having recesses 49 and 51 in the region in which the recess is subsequently produced in the card body. Thus, in the region of these recesses, the thermo-activatable layers 11 are not activated during the joining of the layers, so that no bond between the card layers is produced in this region.

p0039FIG. 8 shows the card assembly from FIG. 7, the individual card layers being now connected to one another. Due to the special design of the heating plungers, the cover layer 5 with the core layer 7 in the region 53 and the cover layer 9 with the core layer 7 in the region 55 have not joined together. With the aid of the cutting tool 41, the upper part of a two-stage recess can now be produced by first inserting the cutting tool 41 into the card body at least so far that the covering layer 5 is severed. The part of the cover layer lying within the cutting edge can then be simply removed since this part has not entered into a bond with the adhesive layer 11. The lower part of the two-stage recess 19 can be produced in an analogous manner with the cutting tool 57. Thus, a card body, as already shown in FIG. 6, is produced with a two-stage recess which, however, has clean cutting edges in the entire wall area. The process described is, of course, not restricted to the production of a two-stage recess. Rather, stepless or multi-stage recesses in the card body can also be produced in an analogous manner.

p0040The production method described in connection with FIGS. 7 and 8 is particularly suitable for card bodies which consist exclusively of paper and cardboard, since the individual paper layers are not softened during joining, as is the case with laminating plastic layers. With the aid of the heating pistons shown, the heat is only passed through the paper to the thermo-activatable adhesive coatings, which are then activated. The paper layers themselves thus remain form-stable during the entire production process, so that no distortions of the paper layers occur at the transitions to the non-heated regions (see FIG. 7). The bottom region of the two-stage recess is thus designed very flat in the finished card body.

p0041FIG. 9 shows a single-layered card body with a two-stage recess 19, into which an electronic module 1 with a liquid glue 59 is glued. In the daily use of the chip cards, bending loads occur which act on the card body also in the region of the electronic module. Due to these bending stresses, the paper in the shoulder region 45 (see FIG. 6) can split in the recess 19 directly below the liquid adhesive in the embodiment shown in FIG. 9 because of the cleavability of the paper In the course of time from the card body.

p0042Although chip cards of paper are preferably to be used for applications where the card only needs to have a short lifetime, and thus a card assembly as shown in FIG. 9 is per se durable, the interconnection between the electronic module and the card body can be thereby achieved It is necessary to provide the two-stage recess 19 with an appropriate milling tool 61 with undercuts 63, as shown in FIG.

p0043A metered quantity of liquid adhesive 59 is introduced into the two-stage recess 19, which is distributed during the insertion of the electronic module 1 in the recess 19 such that the undercuts 63 are also filled with liquid glue 59 (see FIGS. 10 and 11). Thus, the electronic module 1 is anchored in the card body and forces against forces acting perpendicular to the card surface are secured. In addition, the liquid adhesive, which now wets the entire wall area of ​​the recess, also provides good protection against the splitting of the paper in this area. Alternatively, it is, of course, also possible to dispense with the undercuts and to meter the liquid adhesive in such a way that the wall area is largely or completely wetted by the finished card.

p0044FIG. 12 again shows a multilayer card body before the lamination in the cross-section. The individual layers 5, 7 and 9 are identical to the layers shown in FIG. However, instead of the window 13, the upper cover layer 5 has two windows 25, which are separated by a web 27. Before the lamination, the electronic module 1 is inserted into the window 15 of the core layer 7, as can be seen in FIG. In the course of the roll laminating of the layers, the module 1 is glued with the layer 7 and additionally embedded between the layers 5 and 7. In the finished IC card, the contact surfaces of the module 1 are located in the windows 25, and the embedding between the layers is carried out by the bridge 27. A module which is particularly suitable for the above-mentioned production technique is described in the<patcit id="pcit0011" dnum="EP0140230B1"><text>EP-B1 0 140 230</text></patcit> Exactly described.

p0045FIGS. 13-16 show further exemplary embodiments in which the electronic module is already anchored during the production of the card in the card body by embedding parts of the module between two card layers.

p004613 shows a multilayer card assembly consisting of the cover layers 5 and 9 and the core layers 7 and 8. The electronic module 1 inserted into the card assembly shown has an anchoring frame 65 which projects beyond the cast body 67 of the module and which already existed during the casting process Production of the cards is embedded between the two card layers 5 and 7. As shown in FIG. 13, the anchoring frame 65 is surrounded on both sides by thermally activatable adhesive coatings, so that a good bond is formed between the anchoring frame and the card body. In a preferred exemplary embodiment, the anchoring frame is designed as a fabric, into which adhesive material from the adjoining adhesive layers 11 can penetrate during card manufacture. This leads to an indirect bonding of the adjoining adhesive layers 11 and to an improved anchoring of the module in the card body.

p0047FIGS. 14-16 show further exemplary embodiments in which the electronic module is embedded between two card layers. The modules in these figures all have the same structure and are generally referred to as leadframe modules. They consist of a metal plate 69 in which a contact layout is formed and on one side of which an IC module 71 is arranged, which is conductively connected to the contact surfaces of the contact layout. The IC module and the conductive connections are surrounded by a casting compound to protect against mechanical loads. In the exemplary embodiments shown, the anchoring frame is formed by extensions of the contact surfaces, which protrude beyond the actual contact layout and are embedded between two card layers.

p0048FIG. 14 shows the same card structure as FIG. 13. The anchoring frame is already cranked into the card interior during the production of the card, that is to say during the connection of the individual layers, so that the structure shown in FIG. The production thus takes place analogously to the preparation, as has already been explained in connection with FIG.

p004915 shows a chip card in the cross-section in which the anchoring frame of the leadframe module is not cranked and the contact surfaces 73 of the electronic module lie below the card surface. The contact surfaces can be provided with relief punches 75 in the transition area to the extensions which serve for the anchoring so that they remain connected to the extensions only by means of thin webs. This leads to a mechanical decoupling of the transitional area module / anchoring frame and thus to a relief in this area during bending loads of the card, so that the adhesive layer 11, for example by breaking or splitting the underlying card layer 7, Card layer.

p005016 shows the same cross-section as in FIG. 15. However, the adhesive layer 11 running below the anchoring frame leads up to the edge region of the lower part of the two-stage recess, as a result of which a larger adhesive surface for bonding the electronic module is achieved. Further, 16 is a Heizst is shown in FIG. Shown Empel 77, of which the bond between the anchoring frame and the adhesive layers 11 can be improved in a separate station again by.

p0051Finally, FIG. 17 shows a manufacturing method for a paper IC card consisting of two layers bonded by means of a pressure sensitive adhesive. In a first process step (FIG. 17 a), composite elements 33 are produced from a pressure-sensitive adhesive tape 31 coated with a silicone tape 29. This is done with methods known from the labeling art, which are familiar to a person skilled in the art and need not be explained in detail here. In addition, the creation of such composite elements from the<patcit id="pcit0012" dnum="DE4122049A"><text>DE-OS 41 22 049</text></patcit> known. The silicone band 29 provided with the composite elements 33 is combined with a paper layer 35, which is provided with a pressure-sensitive adhesive layer 37. Since the adhesion of the composite element to the pressure-sensitive adhesive layer is greater than on the silicone layer, the composite element can be transferred to the pressure-sensitive adhesive tape 37, so that the intermediate product shown in FIG. 17b results. In a further method step (FIG. 17c), electronic modules 1 are punched out of a module strip 39 and glued to the composite element 33. The intermediate product shown in FIG. 17c is combined with a pre-punched cardboard strip 17 with windows 15 in such a way that the modules attached to the paper layer 35 come to lie in the windows. Finally, as shown in FIG. 17e, the finished paper IC cards 3 are punched out of the endless belt. It is, of course, also possible to produce the paper card one by one. In this case, the individual card layers shown in the figures already have card sizes so that, after the individual layers have been joined, the card body already has the desired dimensions.

p0052The previous statements relate to exemplary embodiments in which already finished paper or cardboard webs are provided or combined and an electronic module is subsequently inserted into the card body. Alternatively, it is also possible to introduce electronic modules into the carton during the production of the carton. This method can be particularly advantageously applied to electronic modules for contactless data exchange, for example consisting of an annular coil and an integrated circuit which is conductively connected to the coil, since these modules require the positional accuracy in the finished data carrier, Than with modules for the touching data exchange. Furthermore, the electronic modules for the contactless data exchange are surrounded on all sides by cardboard and are embedded in the latter in a form-fitting manner without the need for complicated measures for producing a channel for the coil of the module. The electronic modules are preferably embedded in a matrix-like manner into the cardboard, so that ultimately a multiple-use sheet or multi-web is formed, from which individual data carriers are punched out with a module. The sheet can already be provided with position markings during the production process, by means of which the punching tool can be positioned exactly, so that the electronic module is positioned, after punching, against the outer edges of the data carrier. It is also possible to provide the sheet with a printed image before punching out, so that the data carrier is already finished after punching out. Alternatively, it is possible to provide the multiple-use sheet provided with electronic modules for the contactless data exchange with printed cover layers on both sides and to punch out the individual data carriers thereafter. In this case, the position markings for the punching tool can be provided in the printed image of a cover layer so that positional markings in the carton can be dispensed with.

p0053Various measures can be taken which are explained in connection with FIGS. 18-21, in order to prevent splitting of the paper or cardboard in the edge region of the stamped paper IC cards.

p0054FIG. 18 is a top view of a section of an endless belt which has a multilayer structure, for example the one shown in the cross-section in FIG. 5. The core layer or core layers of the multilayer card structure contain through holes 79 in the region in which the punching edge 81 of the card to be punched lies.

p0055FIG. 19 shows a cross section along the line AA of FIG. 18. When the individual card layers are joined, material from the adjacent thermo-activatable adhesive layers 11 penetrates into the through holes so that the cover layers 5 and 9 are connected indirectly to one another. If the card is then punched out along the punching edge 81 in such a way that at least a part of each through-hole 79 lies in the card body, as indicated in FIGS. 18 and 19, a card edge is obtained which alternately consists of paper in the core region Or cardboard and adhesive material from the adhesive coatings. Splitting of the core layer can thus be largely pre-determined.

p0056FIG. 20 shows a paper IC card which has already been cut out in a top view. In order to protect the edge of the card from splitting, a special protective lacquer 85 is applied to it with an applicator 83. Here, the cards can be edited either individually or in batches to several simultaneously.

p0057FIG. 21 shows a stack of card bodies 3 in the cross-section, on the edges of which the protective lacquer 85 is transferred by the transfer belt 87 by means of the heating punch 89 in the transfer process.

p0058Preferably, the edges of the paper cards are then provided with a protective lacquer if the cards have a single-layer card structure, since in this case the method explained in connection with FIGS. 18 and 19 can not be carried out. Of course, multi-layer cards can also be provided with a protective lacquer, the protective lacquer being the only or an additional protective measure before splitting the card edge. The protective lacquer can be colored and can be used as an additional identification or additional safety feature.

p0059Finally, it should be mentioned that even before the IC cards are produced, those layers which form the outer layers of the card can be provided with printing images, etc., in whole or in a range manner, whereby all common printing processes, such as preprinted, relief printing, offset printing, steel gravure printing, screen printing , High pressure, hot printing, dough printing, wallpaper printing, hectic printing processes, etc. In this case, the high print quality obtainable on paper can be further increased by the use of artificial printing paper. In the printed image, certain information (eg the credit of a new telephone card, etc.) can also be recorded in a blind spot, eg by embossing or by particularly thick ink application. In the finished card, the outer surfaces of the outer layers can be protected by a thin lacquer layer consisting of, for example, nitro lacquer, calender lacquer, UV curing lacquer, electron beam curing lacquer, etc. The varnish can be applied in the form of a gloss lacquer or a matt varnish. Further, it is possible to grain the paint layers.

p0060Individual layers can additionally be provided with security elements such as a watermark, fragrances, safety threads, fluorescent fibers in paper or in cards, color capsules in paper fibers, holograms, etc.

p0061The application of other elements such as, for example, a magnetic piste by applying a water-based magnetic lacquer or a friction-friction surface is also particularly simple with paper cards.

p0062Finally, threads can be incorporated into the thicker paper layers or cardboard layers during the production of these layers, making these layers more difficult to split. Corresponding techniques are known from paper processing and are not to be described in detail here. For the connection of the individual paper or cardboard layers, in addition to thermomo-activatable adhesives, also pressure-sensitive adhesives or liquid glues can be used. In order to prevent splitting of the paper or cardboard in the region of the recess for the module, these regions can be consolidated by fabric, liquid adhesive or resins.