Nova Patents
EP0240071A3

Package

Abstract

A package containing an at least partly baked or partly fried food product to be heated in a microwave oven, comprising a steam- and microwave-permeable packaging material. Preferably the porosity of the packaging material is more than 200 ml as measured by the Bendtsen test. The package is especially suitable for reheating microwaveable parfried potato chips.

Term

Term ended

Projected expiry passed 25 March 2007, 19.5 years ago.

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Citations
DocumentRelationOfficeCategoryCited during
US4096948ACitesUnited States of AmericaYSearch report
US4228945ACitesUnited States of AmericaASearch report
US4579743ACitesUnited States of AmericaYSearch report