Nova Patents
EP0240071A2

Package.

Abstract

A package containing an at least partly baked or partly fried food product to be heated in a microwave oven, comprising a steam- and microwave-permeable packaging material. Preferably the porosity of the packaging material is more than 200 ml as measured by the Bendtsen test. The package is especially suitable for reheating microwaveable parfried potato chips.

Term

Term ended

Projected expiry passed 25 March 2007, 19.5 years ago.

  1. Priority
  2. Filed
  3. Published
  4. Projected expiry
  5. Today

10 claims: 8 independent, 2 dependent

  1. 1
    A package containing an at least partly baked or partly fried food product to be heated in a microwave oven, comprising a steam- and microwave-permeable packaging material.
  2. 4
    A package according to claims 1-3, wherein the packaging material is absorbing paper.
  3. 5
    A package according to claims 1-4, wherein the packaging material is also grease resistant.
  4. 6
    A package according to claims 1-5, also comprising an outer moisture-impermeable layer to be removed before microwave heating.
  5. 7
    A package according to claims 1-6, also comprising a tray to support the food article.
  6. 8
    A package according to claims 1-7, containing a particulate parfried food product arranged in a single layer.
  7. 9
    A package according to claims 1-8, containing parfried potato chips.
  8. 10
    Method for reheating an at least partly baked or partly fried food product in a microwave oven, whereby the food product is contained in a package as described in one or more of the preceding claims.