Flat module.
Abstract
The invention relates to a printed circuit board, which tipped from an integrated components (5) printed circuit board (7), of a connector part (3) and of a, a print on a circuit board surface exerting Andruckbauteil (4), for example a cooling device, there is. In order to prevent a deflection of the circuit board (7) by the Andruckbauteil (4) or by insertion and extraction processes causing line breaks or the like, a back pressure on the printed circuit board (7) is generated, and a resilient connection between the connector portion (3) and the circuit board (7) was prepared. For this purpose the contacting elements (18) of the connector part (3) are evenly distributed over surface area of the circuit board (7). They consist of a spring shaft for receiving a contact pin and of a on the circuit board (7) spring actuated terminal lug respectively.

Term
Term ended
Projected expiry passed 17 May 2003, 23.4 years ago.
- Priority
- Filed
- Published
- Projected expiry
- Today
8 claims: 6 independent, 2 dependent
- c-de-00011. PCB, consisting of a lamp equipped with electrical components PCB, a connector portion having a plurality of contact elements and a, a print on a circuit board surface exerting Andruckbauteil, for example, a cooling device, characterized in that on the Andruckbauteil (4) opposite side the circuit board (7) pads (8) are arranged evenly distributed, that the connector part (3) over this entire side surface, in that it above the pads openings (2) for the contact elements (9,18), which each consist of a and spring shaft (18) / formed of a as a compression spring, spring loaded in the contacting (8) adjacent connection flag (9) consist.
- c-de-00033. printed circuit board assembly according to one of the preceding claims, characterized in that the connection lugs (9) fixed to the pads (8) are connected.
- c-de-00044. PCB according to one of the preceding claims, characterized in that the Federschäfte (18) connected to each of three U-shaped with one another, a receiving channel for a pin forming side parts are made, and that at least one of the U-leg of a resilient portion for pressing having the contact pin.
- c-de-00055. printed circuit board assembly according to any one of the preceding claims, characterized in that the Federschäfte (18) are each fixed by a Einschnappverriegelung in the apertures (2).
- c-de-00066. printed circuit board assembly according to any one of the preceding claims, characterized in that the connection flags (9) are designed with respect to their dimensions such that the entire contact element (9,18) in an opening (2) is pluggable.
- c-de-00077. printed circuit board assembly according to any one of the preceding claims, characterized in that the circuit board (7) in a first recess (1) of the connector part (3) is fitted.
Independent claims6
14 paragraphs, as filed
The invention relates to a printed circuit board assembly, consisting of a lamp equipped with electrical components PCB, a connector portion having a plurality of contact elements and a, a print on a circuit board surface exerting Andruckbauteil, for example, a cooling device.
In the construction of large electronic systems, such as data processing equipment, the aim is to obtain the shortest possible signal lines with a defined wave impedance and thus to achieve high switching speeds. This can be accomplished by means of printed circuit board assemblies, which have one-or multi-layer printed circuit boards with integrated modules and which are connected via electrical connectors with a wiring board. This is in order to achieve a high density printed circuit, also carried out in multiple layers, and includes signal lines for connecting modules to each other, but also potential and supply lines. For PCBs highest density the necessary number of external connections are distributed in a confined space on the bottom, to make the connection to the PCB directly.
From US Patent 3,993,123 a printed circuit board with heat-emitting devices are known that are ankontaktiert on one side of a support plate. You are under a cooling device that it surrounds like a cap, and press from which one or more resilient parts of a heat-dissipating element on every block. The pressure thus generated is derived on the plate edges which are flanged to the cooling device, wherein the carrier can undergo deflection, however.
Since a large number of vertically projecting plug pins mounted on the support plate, impaired deflection plugging and pulling the printed circuit board, which is known to accurately mutually parallel pins requires. Otherwise there is a risk that pins are bent or broken, and that arise from faulty connections, or at least that even more plug-and pulling forces have to be applied, as they are necessary in any case because of the large number of compounds. Furthermore, with one of the mechanical stress evasive PCB risk that fissures in the affected circuit traces arise and break the connections. This can happen even more, even if the pins are firmly connected to the circuit board, and the existing deflection increases on the one hand by pulling forces with frequent change of printed circuit board and on the other hand restored by the elasticity of the board again, which can lead to fatigue of the conductor material ,
The invention was therefore based on the object to form a provided with a Steckverbihderteil PCB of the aforementioned type in such a way that from plug-and drawing operations resulting errors can be reduced. This object is achieved in that are uniformly distributed across the Andruckbauteil side of the PCB pads that extends the connector part about this whole side surface, and that above the contacting surfaces openings for the contact elements, each consisting of a spring shaft and from a formed as a compression spring, applied to the contacting under spring tension terminal lug exist. In this way, unilateral pressure forces acting on the circuit board, so that no deflection occurs. By selecting the spring constant of the connection lugs of the counter-pressure on the printed circuit board is pre-adjustable. In addition, since the contact elements are not rigidly connected to the circuit board, do not lead the forces occurring during insertion and removal to a deflection of the circuit board. Thereby, cracks and fractures in traces or in solder joints, resulting from a static or dynamic force, prevented.
According to one embodiment of the invention, the terminal lugs are constructed as curved leaf springs. If the connection lugs are firmly connected to the pads, the contact reliability is increased, which can be further improved by the fact that the Federschäfte each connected from dreLU-shape together, made a receiving channel for a pin-forming side panels, and that at least one of the U-limbs a resilient portion for pressing comprises the contact pin.
The Federschäfte the contact elements are fixed each advantageously by a Einschnappverriegelung in the openings of the connector portion. If the connection lugs formed with respect to their dimensions so that the entire contact element can be inserted into an opening, then an assignment of fasteners and pads for different PCBs are selectively performed.
Following developments of the invention, the circuit board connector part in a first recess of fastex and Andruckbauteil in a second Auss<sup>p</sup>a-tion fitted parallel to the PCB into the connector part. This leads to a compact construction of the printed circuit board assembly, and furthermore has the advantage that the entire printed circuit board is enclosed by the connector part, so that it absorbs all the forces during insertion and removal.
In the following the invention with reference to an embodiment shown in the two figures will be further explained.<ul><li>Fig.1. shows a printed circuit board assembly,</li><li>2 shows a cross section through the printed circuit board assembly according to FIG. 1</li></ul>
The printed circuit board assembly, as shown in Figure 1 is determined in its external form of a plate-like connector part 3, which is one with a first and a second, to one of the flat sides for receiving a printed circuit board opening towards recess 1.14 7 or is provided with screw 17 fixed Andruckbauteils. 4 This may for example consist of a metal plate, which serves as a cooling device for the heat-emitting components of the printed circuit board assembly. The connector part 3 has in its base 6 in the first recess 1 a plurality of grid-like distributed, rectangular apertures 2 for contact elements 9.18 on, and together with the resulting from the cutout 1.14 collar an enclosure of printed circuit board assembly.
Figure 2 shows a cross section through the printed circuit board along the dashed line II in Figure 1. In a breakthrough 2 is a Einschnappverrieglung a contact element 9.18, consisting of a spring shaft 18 and designed as a compression spring connecting lug 9 fixed. The spring shaft 18 consists of three U-shaped interconnected, a receiving channel for a contact pin (not shown) forming side parts, wherein the two U-legs have arched, funnel-shaped narrowing the receiving channel, resilient middle sections. They produce a double pressing contact when receiving a contact pin. The U-leg sit in front of the inner openings of the through-holes 2 on the first lugs 12th To lock the contact-9,18 directed to the outer opening of the through-holes 2 tongue 11 spreads on the spring shaft 18 which is engaged behind a second nose 10 in the opening. 2
The connecting tab 9 comprises a curved leaf spring, the radius of curvature and leaf width are such that the entire contact element 9.18 can be inserted into an opening. 2 The sheet is therefore not wider than the breakthrough 2, and the diameter of curvature corresponds approximately to the length of the opening 2, bearing in mind that the winding diameter can decrease under pressure. The free end of the leaf spring extends into the first recess 1 and generates a vertically acting spring pressure on it with respect to the side edges tight-fit PCB. 7
This is below the breakthroughs 2 pads 8, press to which the terminal lugs 9, etched evenly distributed. The terminal lugs 9 this could have also been a soldered connection. On the opposite side, a plurality of integrated micro blocks 5, one of which is shown, ankontaktiert via connecting wires 13 by means of a EiLmmontagetechnik. For their connection to each other and to the pads 8 extend several layers of etched conductive traces in the printed circuit board. 7
About the Andruckbauteil 4 a pressure on the blocks 5 is applied, for example, to produce a good thermal contact, which is transmitted to the printed circuit board 7 and would result in a deflection, if he were not annulled by the spring pressure of the terminal lugs. An adequate and uniform force between the terminal lugs 9 and the pads 8 is achieved in that the terminal lugs are 9 overstretched before assembly. The terminal lugs 9, and the contact elements 9, T8 are so distributed that a uniform surface pressure is generated on the circuit board. 7 Also in this manner a flexible connection between the connector part 3 and the circuit board 7 is manufactured.
2 sheets
Sheet 1 Sheet 2
Every citation, both ways
| Document | Relation | Office | Cited during |
|---|---|---|---|
| US5013255A | Cited by | United States of America | Search report |
| FR2638293A1 | Cited by | France | Search report |
| WO9115101A1 | Cited by | World Intellectual Property Organization (WIPO) | International search |
| EP0420471A2 | Cited by | European Patent Office (EPO) | Search report |
| EP0420471A3 | Cited by | European Patent Office (EPO) | Search report |
| EP0366513A1 | Cited by | European Patent Office (EPO) | Search report |
| EP0030763A2 | Cites | European Patent Office (EPO) | Search report |
| DE2253400A1 | Cites | Germany | Search report |
| FR2378423A1 | Cites | France | Search report |
| DE2446081A1 | Cites | Germany | Search report |
| US4045105A | Cites | United States of America | Search report |
| US4089575A | Cites | United States of America | Search report |
| US4346952A | Cites | United States of America | Search report |
15 members in 5 offices
Priority claims4
| Document | Office | Kind | Date |
|---|---|---|---|
| 3236325 | Germany | A | |
| 3236325 | Germany | – | |
| 3236325 | – | – | – |
| DE19823236325 | – | – | – |
Members15
| Document | Office | Kind | |
|---|---|---|---|
| DE3236325A1 | Germany | A1 | |
| EP0105083A2This record | European Patent Office (EPO) | A2 | |
| JPS5966079A | Japan | A | |
| EP0105083A3 | European Patent Office (EPO) | A3 | |
| DE3335615A1 | Germany | A1 | |
| US4516188A | United States of America | A | |
| JPS6093777A | Japan | A | |
| EP0153990A1 | European Patent Office (EPO) | A1 | |
| US4654753A | United States of America | A | |
| EP0105083B1 | European Patent Office (EPO) | B1 | |
| AT26519T | Austria | T | |
| DE3370927D1 | Germany | D1 | |
| EP0153990B1 | European Patent Office (EPO) | B1 | |
| AT32155T | Austria | T | |
| DE3468958D1 | Germany | D1 |
35 legal events, as 3 offices reported them to INPADOC
Over the term
Point at a mark for the eventEvents
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|---|---|---|---|
| Notification of lapseLapsedST | ST | FR | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Gb: european patent ceased through non-payment of renewal feeCeasedGBPC | GBPC | EP | |
| Nl: lapsed or anulled due to non-payment of the annual feeLapsedNLV4 | NLV4 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Be: lapsedLapsedBERE | BERE | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Patent ceasedCeasedPL | PL | CH | |
| Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP | PGFP | EP | |
| It: last paid annual feeITTA | ITTA | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Lapsed in a contracting state [announced via postgrant information from national office to epo]LapsedPG25 | PG25 | EP | |
| Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP | PGFP | EP | |
| Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP | PGFP | EP | |
| Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP | PGFP | EP | |
| Annual fee paid to national office [announced via postgrant information from national office to epo]GrantedPGFP | PGFP | EP | |
| No opposition filedOpposition26N | 26N | EP | |
| No opposition filed within time limitOppositionORIGINAL CODE: 0009261PLBE | PLBE | EP | |
| Information on the status of an ep patent application or granted ep patentGrantedSTATUS: NO OPPOSITION FILED WITHIN TIME LIMITSTAA | STAA | EP | |
| It: translation for a ep patent filedITF | ITF | EP | |
| It: translation for a ep patent filedITF | ITF | EP | |
| Fr: translation filedET | ET | EP | |
| Corresponds to:REF | REF | EP | |
| Designated contracting statesAK | AK | EP | |
| Corresponds to:REF | REF | EP | |
| (expected) grantORIGINAL CODE: 0009210GRAA | GRAA | EP | |
| First examination report despatched17Q | 17Q | EP | |
| Request for examination filed17P | 17P | EP | |
| Designated contracting statesAK | AK | EP | |
| Search report despatchedORIGINAL CODE: 0009013PUAL | PUAL | EP | |
| Designated contracting statesAK | AK | EP | |
| Public reference made under article 153(3) epc to a published international application that has entered the european phaseORIGINAL CODE: 0009012PUAI | PUAI | EP |
Numbers
- Publication
- 0105083
- Publication, DOCDB
- 0105083
- Publication, EPODOC
- EP0105083
- Application
- 83104867
- Application, DOCDB
- 83104867
- Application, EPODOC
- EP19830104867
Titles3
- German
- Flachbaugruppe.
- English
- Flat module.
- French
- Module plat.
Classification
- CPC, 6
- H05K7/2039
- H01R12/714
- H01R31/00
- H05K7/02
- H05K7/1038
- H05K7/1076
- IPC, 9
- H01R12 50
- H01R12 71
- H01R31 00
- H05K1 18
- H05K3 32
- H05K7 02
- H05K7 10
- H05K7 14
- H05K7 20
Designated states9
- Contracting states, 9
- Austria
- Belgium
- Switzerland
- Germany
- France
- United Kingdom
- Italy
- Liechtenstein
- Netherlands (Kingdom of the)