DE69033908D1
High density plasma deposition and etching apparatus
Abstract
This record has no abstract on file.
Term
Term ended
Expired 12 June 2010, 16.3 years ago.
- Priority
- Filed
- Granted
- Expired
- Today
28 members in 9 offices
Priority claims1
| Document | Office | Kind | Date |
|---|---|---|---|
| 36553389 | United States of America | A |
Members28
| Document | Office | Kind | |
|---|---|---|---|
| EP0403418A2 | European Patent Office (EPO) | A2 | |
| US4990229A | United States of America | A | |
| JPH0368773A | Japan | A | |
| EP0403418A3 | European Patent Office (EPO) | A3 | |
| US5091049A | United States of America | A | |
| US5122251A | United States of America | A | |
| WO9214258A1 | World Intellectual Property Organization (WIPO) | A1 | |
| AU1352192A | Australia | A | |
| EP0570484A1 | European Patent Office (EPO) | A1 | |
| KR930703694A | Republic of Korea | A | |
| WO9409179A1 | World Intellectual Property Organization (WIPO) | A1 | |
| JPH06506084A | Japan | A | |
| US5421891A | United States of America | A | |
| US5429070A | United States of America | A | |
| JPH0814026B2 | Japan | B2 | |
| EP0570484B1 | European Patent Office (EPO) | B1 | |
| AT151569T | Austria | T | |
| ATE151569T1 | Austria | T1 | |
| DE69218924D1 | Germany | D1 | |
| ES2102497T3 | Spain | T3 | |
| DE69218924T2 | Germany | T2 | |
| KR100231221B1 | Republic of Korea | B1 | |
| EP0403418B1 | European Patent Office (EPO) | B1 | |
| AT212779T | Austria | T | |
| ATE212779T1 | Austria | T1 | |
| DE69033908D1This record | Germany | D1 | |
| JP3271765B2 | Japan | B2 | |
| DE69033908T2 | Germany | T2 |
4 legal events, as the office reported them to INPADOC
Over the term
Point at a mark for the eventEvents
| Event | Code | |
|---|---|---|
| Change in the person/name/address of the patent owner8327 | 8327 | |
| No opposition during term of oppositionOpposition8364 | 8364 | |
| Change in the person/name/address of the agent8328 | 8328 | |
| Change in the person/name/address of the agent8328 | 8328 |
Numbers
- Application
- 69033908
Titles2
- English
- Plasma deposition and etching plant with high density
- German
- Plasmadepositions- und Ätzungsanlage mit hoher Dichte
Classification
- CPC, 4
- H01J37/3211
- H01J37/321
- H01J37/3266
- H01J37/32688
- IPC, 6
- C23C16 50
- C23F4 00
- C23C14 35
- H01J37 32
- H05H1 46
- H10P14 24