ATE546830T1

Thermosetting Resin Compositions Containing Maleimide and/or Vinyl Compounds

Abstract

In accordance with the present invention, there are provided novel adhesive compositions which do not require solvent to provide a system having suitable viscosity for convenient handling and cure rapidly. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and good adhesion to both the substrate and the device attached thereto.

Term

Term ended

Projected expiry passed 30 August 2015, 11.1 years ago.

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58 members in 11 offices

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30072194United States of AmericaA
46049595United States of AmericaA

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WO9520441A1World Intellectual Property Organization (WIPO)A1
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EP0741614A1European Patent Office (EPO)A1
EP0778857A2European Patent Office (EPO)A2
JPH09508320AJapanA
CN1158607AChinaA
EP0741614B1European Patent Office (EPO)B1
DE69500737D1GermanyD1
WO9810920A1World Intellectual Property Organization (WIPO)A1
AU4074597AAustraliaA
DE69500737T2GermanyT2
TW332211BTaiwan Province of ChinaB
JPH10505599AJapanA
US5789757AUnited States of AmericaA
EP0925175A1European Patent Office (EPO)A1
EP0925175A4European Patent Office (EPO)A4
US6034194AUnited States of AmericaA
US6034195AUnited States of AmericaA
JP2001501230AJapanA
US6187886B1United States of AmericaB1
US2002193541A1United States of AmericaA1
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EP1344789A2European Patent Office (EPO)A2
EP1359144A1European Patent Office (EPO)A1
EP1344789A3European Patent Office (EPO)A3
US2004077798A1United States of AmericaA1
KR100421595B1Republic of KoreaB1
EP0778857B1European Patent Office (EPO)B1
AT271577TAustriaT
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DE69533287D1GermanyD1
EP1453087A1European Patent Office (EPO)A1
US6790597B2United States of AmericaB2
US6825245B2United States of AmericaB2
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DE69533287T2GermanyT2
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