ATE546830T1
Thermosetting Resin Compositions Containing Maleimide and/or Vinyl Compounds
Abstract
In accordance with the present invention, there are provided novel adhesive compositions which do not require solvent to provide a system having suitable viscosity for convenient handling and cure rapidly. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and good adhesion to both the substrate and the device attached thereto.
Term
Term ended
Projected expiry passed 30 August 2015, 11.1 years ago.
- Priority
- Filed
- Published
- Projected expiry
- Today
58 members in 11 offices
Priority claims2
| Document | Office | Kind | Date |
|---|---|---|---|
| 30072194 | United States of America | A | |
| 46049595 | United States of America | A |
Members58
| Document | Office | Kind | |
|---|---|---|---|
| WO9520441A1 | World Intellectual Property Organization (WIPO) | A1 | |
| US5448829A | United States of America | A | |
| CA2198745A1 | Canada | A1 | |
| WO9607691A2 | World Intellectual Property Organization (WIPO) | A2 | |
| AU3626095A | Australia | A | |
| WO9607691A3 | World Intellectual Property Organization (WIPO) | A3 | |
| EP0741614A1 | European Patent Office (EPO) | A1 | |
| EP0778857A2 | European Patent Office (EPO) | A2 | |
| JPH09508320A | Japan | A | |
| CN1158607A | China | A | |
| EP0741614B1 | European Patent Office (EPO) | B1 | |
| DE69500737D1 | Germany | D1 | |
| WO9810920A1 | World Intellectual Property Organization (WIPO) | A1 | |
| AU4074597A | Australia | A | |
| DE69500737T2 | Germany | T2 | |
| TW332211B | Taiwan Province of China | B | |
| JPH10505599A | Japan | A | |
| US5789757A | United States of America | A | |
| EP0925175A1 | European Patent Office (EPO) | A1 | |
| EP0925175A4 | European Patent Office (EPO) | A4 | |
| US6034194A | United States of America | A | |
| US6034195A | United States of America | A | |
| JP2001501230A | Japan | A | |
| US6187886B1 | United States of America | B1 | |
| US2002193541A1 | United States of America | A1 | |
| US2003055121A1 | United States of America | A1 | |
| US2003060531A1 | United States of America | A1 | |
| US2003087999A1 | United States of America | A1 | |
| US2003109666A1 | United States of America | A1 | |
| EP1344789A2 | European Patent Office (EPO) | A2 | |
| EP1359144A1 | European Patent Office (EPO) | A1 | |
| EP1344789A3 | European Patent Office (EPO) | A3 | |
| US2004077798A1 | United States of America | A1 | |
| KR100421595B1 | Republic of Korea | B1 | |
| EP0778857B1 | European Patent Office (EPO) | B1 | |
| AT271577T | Austria | T | |
| ATE271577T1 | Austria | T1 | |
| DE69533287D1 | Germany | D1 | |
| EP1453087A1 | European Patent Office (EPO) | A1 | |
| US6790597B2 | United States of America | B2 | |
| US6825245B2 | United States of America | B2 | |
| US6852814B2 | United States of America | B2 | |
| US2005136620A1 | United States of America | A1 | |
| US2005137277A1 | United States of America | A1 | |
| JP3668250B2 | Japan | B2 | |
| US6916856B2 | United States of America | B2 | |
| DE69533287T2 | Germany | T2 | |
| US6960636B2 | United States of America | B2 | |
| US7102015B2 | United States of America | B2 | |
| US7309724B2 | United States of America | B2 | |
| JP4033909B2 | Japan | B2 | |
| JP2008013772A | Japan | A | |
| CN101209987A | China | A | |
| CA2198745C | Canada | C | |
| US7645899B1 | United States of America | B1 | |
| EP1453087B1 | European Patent Office (EPO) | B1 | |
| AT546830T | Austria | T | |
| ATE546830T1This record | Austria | T1 |
Numbers
- Application
- 4005959
Titles2
- German
- MIKRO-ELEKTRONISCHER AUFBAU
- English
- MICRO-ELECTRONIC CONSTRUCTION
Classification
- CPC, 5
- C07D207/452
- C07D401/04
- C08G73/10
- C08G73/12
- C08G73/121
- IPC, 5
- C07D207 44
- C07D207 452
- C07D401 04
- C08G73 10
- C08G73 12