Nova Patents
AT546830T

Thermosetting Resin Compositions Containing Maleimide and/or Vinyl Compounds

Abstract

The invention relates to a modified and/or vinyl compound thermosetting resin composition. According to the invention, provides not needed the solvent the novel thermosetting resin composition, provided that easily is treated is suitable for the viscosity the system. The invention claims a composition is added to the expediting is the functional. Thermosetting component and temperature to the reinforced is stable, wherein the flexible, wherein the low water content absorptions and method for use, for example, wherein the adhesive is applied, and their and connection's display device to the substrate rod bonding the) is arranged.

Term

Term ended

Expired 30 August 2015, 11.1 years ago.

  1. Priority
  2. Filed
  3. Granted
  4. Expired
  5. Today

56 members in 11 offices

This recordMember, by publication datePriority claim1 more office is in the list below

Priority claims2

Priority claims
DocumentOfficeKindDate
30072194United States of AmericaA
46049595United States of AmericaA

Members56

Family members, oldest first
DocumentOfficeKind
WO9520441A1World Intellectual Property Organization (WIPO)A1
US5448829AUnited States of AmericaA
CA2198745A1CanadaA1
WO9607691A2World Intellectual Property Organization (WIPO)A2
AU3626095AAustraliaA
WO9607691A3World Intellectual Property Organization (WIPO)A3
EP0741614A1European Patent Office (EPO)A1
EP0778857A2European Patent Office (EPO)A2
JPH09508320AJapanA
CN1158607AChinaA
EP0741614B1European Patent Office (EPO)B1
DE69500737D1GermanyD1
WO9810920A1World Intellectual Property Organization (WIPO)A1
AU4074597AAustraliaA
DE69500737T2GermanyT2
TW332211BTaiwan Province of ChinaB
JPH10505599AJapanA
US5789757AUnited States of AmericaA
EP0925175A1European Patent Office (EPO)A1
EP0925175A4European Patent Office (EPO)A4
US6034194AUnited States of AmericaA
US6034195AUnited States of AmericaA
JP2001501230AJapanA
US6187886B1United States of AmericaB1
US2002193541A1United States of AmericaA1
US2003055121A1United States of AmericaA1
US2003060531A1United States of AmericaA1
US2003087999A1United States of AmericaA1
US2003109666A1United States of AmericaA1
EP1344789A2European Patent Office (EPO)A2
EP1359144A1European Patent Office (EPO)A1
EP1344789A3European Patent Office (EPO)A3
US2004077798A1United States of AmericaA1
KR100421595B1Republic of KoreaB1
EP0778857B1European Patent Office (EPO)B1
AT271577TAustriaT
DE69533287D1GermanyD1
EP1453087A1European Patent Office (EPO)A1
US6790597B2United States of AmericaB2
US6825245B2United States of AmericaB2
US6852814B2United States of AmericaB2
US2005136620A1United States of AmericaA1
US2005137277A1United States of AmericaA1
JP3668250B2JapanB2
US6916856B2United States of AmericaB2
DE69533287T2GermanyT2
US6960636B2United States of AmericaB2
US7102015B2United States of AmericaB2
US7309724B2United States of AmericaB2
JP4033909B2JapanB2
JP2008013772AJapanA
CN101209987AChinaA
CA2198745CCanadaC
US7645899B1United States of AmericaB1
EP1453087B1European Patent Office (EPO)B1
AT546830TThis recordAustriaT