ATE520290T1

Multilayer circuit board and method for manufacturing thereof

Abstract

This record has no abstract on file.

Term

Projected expiry 23 November 2026.

  1. Priority
  2. Filed
  3. Published
  4. Today
  5. Projected expiry

11 members in 4 offices

This recordMember, by publication datePriority claim

Priority claims2

Priority claims
DocumentOfficeKindDate
2005343062JapanA
2006004378JapanA

Members11

Family members, oldest first
DocumentOfficeKind
EP1791409A1European Patent Office (EPO)A1
US2007119541A1United States of AmericaA1
JP2007150002AJapanA
JP2007188986AJapanA
US2010083490A1United States of AmericaA1
EP1791409B1European Patent Office (EPO)B1
AT520290TAustriaT
ATE520290T1This recordAustriaT1
JP4835124B2JapanB2
US8188375B2United States of AmericaB2
US8530752B2United States of AmericaB2