AT520290T
Multilayer circuit board and method for manufacturing thereof
Abstract
This record has no abstract on file.
Term
Projected expiry 23 November 2026.
- Priority
- Filed
- Granted
- Today
- Projected expiry
11 members in 4 offices
Priority claims2
| Document | Office | Kind | Date |
|---|---|---|---|
| 2005343062 | Japan | A | |
| 2006004378 | Japan | A |
Members11
| Document | Office | Kind | |
|---|---|---|---|
| EP1791409A1 | European Patent Office (EPO) | A1 | |
| US2007119541A1 | United States of America | A1 | |
| JP2007150002A | Japan | A | |
| JP2007188986A | Japan | A | |
| US2010083490A1 | United States of America | A1 | |
| EP1791409B1 | European Patent Office (EPO) | B1 | |
| AT520290TThis record | Austria | T | |
| ATE520290T1 | Austria | T1 | |
| JP4835124B2 | Japan | B2 | |
| US8188375B2 | United States of America | B2 | |
| US8530752B2 | United States of America | B2 |
1 legal event, as the office reported them to INPADOC
Events
| Event | Code | |
|---|---|---|
| Ceased as to paragraph 5 lit. 3 law introducing patent treatiesCeasedRER | RER |
Numbers
- Application
- 6256011
Titles2
- German
- MEHRSCHICHTIGE LEITERPLATTE UND VERFAHREN ZUR HERSTELLUNG DAZU
- English
- MULTILAYER CONDUCTOR PLATE AND METHOD FOR PRODUCING THEREOF
Classification
- CPC, 44
- H05K3/4652
- H01L23/49822
- H01L23/5389
- H01L24/24
- H01L24/82
- H01L2224/24226
- H01L2224/2518
- H01L2224/82039
- H01L2224/82047
- H01L2224/92
- H01L2224/92244
- H01L2924/01005
- H01L2924/01006
- H01L2924/01015
- H01L2924/01024
- H01L2924/01029
- H01L2924/0103
- H01L2924/01033
- H01L2924/01047
- H01L2924/01061
- H01L2924/01078
- H01L2924/01079
- H01L2924/014
- H01L2924/12042
- H01L2924/14
- H01L2924/19041
- H05K1/185
- H05K3/0044
- H05K3/0058
- H05K3/4602
- H05K3/4682
- H05K3/4688
- H05K2201/0358
- H05K2201/09518
- H05K2201/09527
- H05K2201/09563
- H05K2203/0152
- H05K2203/025
- H05K2203/0554
- H05K2203/1105
- H05K2203/1476
- H05K2203/1572
- Y10T29/49128
- Y10T428/24917
- IPC, 1
- H05K1 18