Encapsulated microelectronic devices
Abstract
An encapsulated microelectronic device. The device includes a semiconductor substrate, microelectronic device adjacent to the semiconductor substrate, and at least one first barrier stack adjacent to the microelectronic device. The barrier stack encapsulates the microelectronic device. It includes at least one first barrier layer and at least one first polymer layer. The encapsulated microelectronic device optionally includes at least one second barrier stack located between the semiconductor substrate and the microelectronic device. The second barrier stack includes at least one second barrier layer and at least one second polymer layer. A method for making an encapsulated microelectronic device is also disclosed.
Term
Term ended
Projected expiry passed 1 March 2021, 5.6 years ago.
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117 members in 10 offices
Priority claims2
| Document | Office | Kind | Date |
|---|---|---|---|
| 57164900 | United States of America | A | |
| 0106562 | United States of America | W |
Members117
| Document | Office | Kind | |
|---|---|---|---|
| WO0036665A1 | World Intellectual Property Organization (WIPO) | A1 | |
| TW439308B | Taiwan Province of China | B | |
| US6268695B1 | United States of America | B1 | |
| US2001015620A1 | United States of America | A1 | |
| EP1145338A1 | European Patent Office (EPO) | A1 | |
| WO0181649A1 | World Intellectual Property Organization (WIPO) | A1 | |
| WO0182389A1 | World Intellectual Property Organization (WIPO) | A1 | |
| AU4189301A | Australia | A | |
| AU4349801A | Australia | A | |
| KR20010101231A | Republic of Korea | A | |
| WO0189006A1 | World Intellectual Property Organization (WIPO) | A1 | |
| AU3996901A | Australia | A | |
| TW493290B | Taiwan Province of China | B | |
| US6413645B1 | United States of America | B1 | |
| US2002125822A1 | United States of America | A1 | |
| JP2002532850A | Japan | A | |
| US2002150745A1 | United States of America | A1 | |
| WO02083411A1 | World Intellectual Property Organization (WIPO) | A1 | |
| US6497598B2 | United States of America | B2 | |
| EP1279197A1 | European Patent Office (EPO) | A1 | |
| EP1282922A1 | European Patent Office (EPO) | A1 | |
| US6522067B1 | United States of America | B1 | |
| US2003064171A1 | United States of America | A1 | |
| WO03028903A2 | World Intellectual Property Organization (WIPO) | A2 | |
| AU2002330080A1 | Australia | A1 | |
| US6548912B1 | United States of America | B1 | |
| US6570325B2 | United States of America | B2 | |
| US6573652B1 | United States of America | B1 | |
| US2003104753A1 | United States of America | A1 | |
| CN1426605A | China | A | |
| CN1429412A | China | A | |
| US6623861B2 | United States of America | B2 | |
| JP2003532260A | Japan | A | |
| JP2003533892A | Japan | A | |
| US2003215575A1 | United States of America | A1 | |
| TW575671B | Taiwan Province of China | B | |
| WO03028903A3 | World Intellectual Property Organization (WIPO) | A3 | |
| EP1432528A2 | European Patent Office (EPO) | A2 | |
| TWI222189B | Taiwan Province of China | B | |
| US2004265508A9 | United States of America | A9 | |
| JP2005504652A | Japan | A | |
| US6866901B2 | United States of America | B2 | |
| EP1524708A2 | European Patent Office (EPO) | A2 | |
| US2005158476A9 | United States of America | A9 | |
| US6923702B2 | United States of America | B2 | |
| US2005176181A1 | United States of America | A1 | |
| US2005202646A1 | United States of America | A1 | |
| CN1678409A | China | A | |
| US6962671B2 | United States of America | B2 | |
| EP1524708A3 | European Patent Office (EPO) | A3 | |
| CN1270374C | China | C | |
| JP2006317958A | Japan | A | |
| US7198832B2 | United States of America | B2 | |
| US2007164376A1 | United States of America | A1 | |
| CN1327974C | China | C | |
| US2007196682A1 | United States of America | A1 | |
| US2007210459A1 | United States of America | A1 | |
| CN100346495C | China | C | |
| CN101131512A | China | A | |
| JP4115130B2 | Japan | B2 | |
| JP2008181088A | Japan | A | |
| WO2008094352A1 | World Intellectual Property Organization (WIPO) | A1 | |
| WO2008094353A1 | World Intellectual Property Organization (WIPO) | A1 | |
| USRE40531E | United States of America | E | |
| EP1432528B1 | European Patent Office (EPO) | B1 | |
| AT413931T | Austria | T | |
| ATE413931T1 | Austria | T1 | |
| TW200845314A | Taiwan Province of China | A | |
| TW200845454A | Taiwan Province of China | A | |
| EP1279197B1 | European Patent Office (EPO) | B1 | |
| DE60229866D1 | Germany | D1 | |
| AT418087T | Austria | T | |
| ATE418087T1 | Austria | T1 | |
| DE60137033D1 | Germany | D1 | |
| USRE40787E | United States of America | E | |
| CN100520538C | China | C | |
| JP4303591B2 | Japan | B2 | |
| US2009191342A1 | United States of America | A1 | |
| US2009208754A1 | United States of America | A1 | |
| EP1282922B1 | European Patent Office (EPO) | B1 | |
| AT447771T | Austria | T | |
| ATE447771T1This record | Austria | T1 | |
| EP2126999A1 | European Patent Office (EPO) | A1 | |
| DE60140359D1 | Germany | D1 | |
| US7727601B2 | United States of America | B2 | |
| WO2010077544A1 | World Intellectual Property Organization (WIPO) | A1 | |
| WO2010078405A1 | World Intellectual Property Organization (WIPO) | A1 | |
| JP2010526399A | Japan | A | |
| US2010193468A1 | United States of America | A1 | |
| TW201034090A | Taiwan Province of China | A | |
| TW201034093A | Taiwan Province of China | A | |
| US2010330748A1 | United States of America | A1 | |
| JP4677649B2 | Japan | B2 | |
| KR20110091568A | Republic of Korea | A | |
| JP4750339B2 | Japan | B2 | |
| JP2011159629A | Japan | A | |
| EP2373487A1 | European Patent Office (EPO) | A1 | |
| CN102256786A | China | A | |
| JP4856313B2 | Japan | B2 | |
| US2012118855A1 | United States of America | A1 |
Numbers
- Application
- 1914602
Titles2
- English
- ENCAPSULATED MICROELECTRONIC COMPONENTS
- German
- EINGEKAPSELTE MIKROELEKTRONISCHE BAUELEMENTE
Classification
- CPC, 7
- H10W74/147
- Y02E10/549
- Y02P70/50
- Y02E60/10
- G02F1/133337
- H10K30/88
- H10W42/121
- IPC, 8
- H01L23 29
- G02F1 1333
- H01L23 00
- H01L23 31
- H01L51 52
- H01M2 08
- H10P14 68
- H10W74 01